DE602005012028D1 - Nichtflüchtige Halbleiterspeicheranordnung und Leseverfahren - Google Patents

Nichtflüchtige Halbleiterspeicheranordnung und Leseverfahren

Info

Publication number
DE602005012028D1
DE602005012028D1 DE602005012028T DE602005012028T DE602005012028D1 DE 602005012028 D1 DE602005012028 D1 DE 602005012028D1 DE 602005012028 T DE602005012028 T DE 602005012028T DE 602005012028 T DE602005012028 T DE 602005012028T DE 602005012028 D1 DE602005012028 D1 DE 602005012028D1
Authority
DE
Germany
Prior art keywords
memory device
semiconductor memory
volatile semiconductor
reading method
reading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005012028T
Other languages
English (en)
Inventor
Hidechika Kawazoe
Yukio Tamai
Atsushi Shimaoka
Hidenori Morimoto
Nobuyoshi Awaya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of DE602005012028D1 publication Critical patent/DE602005012028D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0007Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising metal oxide memory material, e.g. perovskites
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0023Address circuits or decoders
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/004Reading or sensing circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/30Resistive cell, memory material aspects
    • G11C2213/31Material having complex metal oxide, e.g. perovskite structure
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/77Array wherein the memory element being directly connected to the bit lines and word lines without any access device being used
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/79Array wherein the access device being a transistor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Semiconductor Memories (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Read Only Memory (AREA)
DE602005012028T 2004-07-28 2005-07-27 Nichtflüchtige Halbleiterspeicheranordnung und Leseverfahren Active DE602005012028D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004219810 2004-07-28
JP2005193329A JP4189395B2 (ja) 2004-07-28 2005-07-01 不揮発性半導体記憶装置及び読み出し方法

Publications (1)

Publication Number Publication Date
DE602005012028D1 true DE602005012028D1 (de) 2009-02-12

Family

ID=35311289

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005012028T Active DE602005012028D1 (de) 2004-07-28 2005-07-27 Nichtflüchtige Halbleiterspeicheranordnung und Leseverfahren

Country Status (6)

Country Link
US (1) US7535746B2 (de)
EP (1) EP1622163B1 (de)
JP (1) JP4189395B2 (de)
KR (1) KR100745516B1 (de)
DE (1) DE602005012028D1 (de)
TW (1) TWI277973B (de)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6962648B2 (en) * 2003-09-15 2005-11-08 Global Silicon Net Corp. Back-biased face target sputtering
US20060171200A1 (en) 2004-02-06 2006-08-03 Unity Semiconductor Corporation Memory using mixed valence conductive oxides
US7082052B2 (en) 2004-02-06 2006-07-25 Unity Semiconductor Corporation Multi-resistive state element with reactive metal
US20060081467A1 (en) * 2004-10-15 2006-04-20 Makoto Nagashima Systems and methods for magnetron deposition
US7425504B2 (en) * 2004-10-15 2008-09-16 4D-S Pty Ltd. Systems and methods for plasma etching
US20060081466A1 (en) * 2004-10-15 2006-04-20 Makoto Nagashima High uniformity 1-D multiple magnet magnetron source
KR100576369B1 (ko) * 2004-11-23 2006-05-03 삼성전자주식회사 전이 금속 산화막을 데이타 저장 물질막으로 채택하는비휘발성 기억소자의 프로그램 방법
US20130082232A1 (en) 2011-09-30 2013-04-04 Unity Semiconductor Corporation Multi Layered Conductive Metal Oxide Structures And Methods For Facilitating Enhanced Performance Characteristics Of Two Terminal Memory Cells
US8314024B2 (en) 2008-12-19 2012-11-20 Unity Semiconductor Corporation Device fabrication
US20070084717A1 (en) * 2005-10-16 2007-04-19 Makoto Nagashima Back-biased face target sputtering based high density non-volatile caching data storage
US20070084716A1 (en) * 2005-10-16 2007-04-19 Makoto Nagashima Back-biased face target sputtering based high density non-volatile data storage
US7366040B2 (en) * 2005-10-28 2008-04-29 Elite Semicondutor Memory Technology, Inc. Method of reducing settling time in flash memories and improved flash memory
JP4901763B2 (ja) * 2006-02-02 2012-03-21 ルネサスエレクトロニクス株式会社 半導体装置
US8395199B2 (en) * 2006-03-25 2013-03-12 4D-S Pty Ltd. Systems and methods for fabricating self-aligned memory cell
US7606075B2 (en) * 2006-04-19 2009-10-20 Micron Technology, Inc. Read operation for NAND memory
US8896045B2 (en) * 2006-04-19 2014-11-25 Infineon Technologies Ag Integrated circuit including sidewall spacer
US20080011603A1 (en) * 2006-07-14 2008-01-17 Makoto Nagashima Ultra high vacuum deposition of PCMO material
US7932548B2 (en) 2006-07-14 2011-04-26 4D-S Pty Ltd. Systems and methods for fabricating self-aligned memory cell
US8454810B2 (en) * 2006-07-14 2013-06-04 4D-S Pty Ltd. Dual hexagonal shaped plasma source
JP2008033788A (ja) * 2006-07-31 2008-02-14 Matsushita Electric Ind Co Ltd 不揮発性記憶装置、データ記憶システム、およびデータ記憶方法
US8003972B2 (en) 2006-08-30 2011-08-23 Micron Technology, Inc. Bottom electrode geometry for phase change memory
US8308915B2 (en) 2006-09-14 2012-11-13 4D-S Pty Ltd. Systems and methods for magnetron deposition
KR101258983B1 (ko) 2006-09-19 2013-04-29 삼성전자주식회사 가변저항 소자를 이용한 반도체 메모리 장치 및 그 동작방법
KR100819099B1 (ko) * 2006-10-02 2008-04-03 삼성전자주식회사 가변저항 반도체 메모리 장치
KR101133832B1 (ko) * 2006-11-08 2012-04-06 시메트릭스 주식회사 저항 스위칭 집적 회로 메모리, 저항 스위칭 메모리의 형성 방법 및 비휘발성 저항 스위칭 집적 회로 메모리의 제조 방법
US7852662B2 (en) * 2007-04-24 2010-12-14 Magic Technologies, Inc. Spin-torque MRAM: spin-RAM, array
US7701791B2 (en) * 2007-07-26 2010-04-20 Unity Semiconductor Corporation Low read current architecture for memory
US8737151B2 (en) 2007-07-26 2014-05-27 Unity Semiconductor Corporation Low read current architecture for memory
JP5159224B2 (ja) * 2007-09-21 2013-03-06 株式会社東芝 抵抗変化メモリ装置
JP2009117003A (ja) 2007-11-09 2009-05-28 Toshiba Corp 不揮発性メモリ装置のデータ読み出し方法
US8194433B2 (en) * 2008-02-20 2012-06-05 Ovonyx, Inc. Method and apparatus for accessing a bidirectional memory
US7952928B2 (en) * 2008-05-27 2011-05-31 Sandisk Il Ltd. Increasing read throughput in non-volatile memory
JP5268481B2 (ja) * 2008-07-31 2013-08-21 株式会社東芝 不揮発性半導体記憶装置
US8553444B2 (en) 2008-08-20 2013-10-08 Panasonic Corporation Variable resistance nonvolatile storage device and method of forming memory cell
US8159858B2 (en) * 2008-12-19 2012-04-17 Unity Semiconductor Corporation Signal margin improvement for read operations in a cross-point memory array
CN102084429B (zh) 2009-04-10 2013-12-25 松下电器产业株式会社 非易失性存储元件的驱动方法和非易失性存储装置
JP5347806B2 (ja) * 2009-07-29 2013-11-20 ソニー株式会社 抵抗変化型メモリデバイスおよびその動作方法
CN103367452B (zh) * 2009-09-11 2015-11-25 中芯国际集成电路制造(上海)有限公司 绿色晶体管、电阻随机存储器及其驱动方法
US8638636B2 (en) * 2009-09-21 2014-01-28 Macronix International Co., Ltd. Word line decoder circuit apparatus and method
KR101094918B1 (ko) * 2009-12-23 2011-12-15 주식회사 하이닉스반도체 글로벌 비트 라인을 구비한 상변화 메모리 장치 및 그 구동방법
JP2011138571A (ja) * 2009-12-26 2011-07-14 Elpida Memory Inc 不揮発性半導体メモリ装置及び不揮発性半導体メモリ装置の制御方法
US9450177B2 (en) * 2010-03-10 2016-09-20 Tohoku University Magnetoresistive element and magnetic memory
JP5725735B2 (ja) 2010-06-04 2015-05-27 株式会社日立製作所 磁気抵抗効果素子及び磁気メモリ
US8934293B1 (en) * 2010-06-29 2015-01-13 Contour Semiconductor, Inc. Means and method for operating a resistive array
WO2012102734A1 (en) * 2011-01-28 2012-08-02 Hewlett-Packard Development Company, L.P. Methods, systems and apparatus for resistive memory
DE102011012738B3 (de) * 2011-02-24 2012-02-02 Forschungszentrum Jülich GmbH Verfahren zum nichtdestruktiven Auslesen resistiver Speicherelemente und Speicherelement
US8482955B2 (en) * 2011-02-25 2013-07-09 Micron Technology, Inc. Resistive memory sensing methods and devices
WO2012120401A1 (en) * 2011-03-10 2012-09-13 International Business Machines Corporation Cell-state determination in phase-change memory
JP5404683B2 (ja) 2011-03-23 2014-02-05 株式会社東芝 抵抗変化メモリ
US10333064B2 (en) * 2011-04-13 2019-06-25 Micron Technology, Inc. Vertical memory cell for high-density memory
EP2751807A4 (de) * 2011-09-02 2015-02-18 Hewlett Packard Development Co Vorrichtung zur speicherung von daten und verfahren zum lesen von speicherzellen
JP5763004B2 (ja) * 2012-03-26 2015-08-12 株式会社東芝 不揮発性半導体記憶装置
WO2014100024A1 (en) * 2012-12-18 2014-06-26 The Regents Of The University Of Michigan Resistive memory structure for single or multi-bit data storage
KR102115427B1 (ko) * 2013-02-28 2020-05-28 에스케이하이닉스 주식회사 반도체 장치, 프로세서, 시스템 및 반도체 장치의 동작 방법
US9343133B1 (en) * 2014-10-27 2016-05-17 Micron Technology, Inc. Apparatuses and methods for setting a signal in variable resistance memory
US10074421B2 (en) * 2015-03-03 2018-09-11 Nec Corporation Crossbar switch type memory circuit, look-up table circuit, and programming method
US9997239B1 (en) * 2017-05-02 2018-06-12 Everspin Technologies, Inc. Word line overdrive in memory and method therefor
US10074436B1 (en) * 2017-06-13 2018-09-11 Winbound Electronics Corp. Memory device and data reading method thereof
KR102401183B1 (ko) * 2017-12-05 2022-05-24 삼성전자주식회사 메모리 장치 및 그 동작 방법
WO2019191393A1 (en) * 2018-03-28 2019-10-03 University Of Cincinnati Systems and methods for gated-insulator reconfigurable non-volatile memory devices
JP2020149736A (ja) * 2019-03-11 2020-09-17 キオクシア株式会社 半導体記憶装置

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3761896A (en) * 1972-04-18 1973-09-25 Ibm Memory array of cells containing bistable switchable resistors
US5312684A (en) * 1991-05-02 1994-05-17 Dow Corning Corporation Threshold switching device
US6259644B1 (en) 1997-11-20 2001-07-10 Hewlett-Packard Co Equipotential sense methods for resistive cross point memory cell arrays
US6181450B1 (en) * 1998-05-12 2001-01-30 Harris Corporation System and method for free space optical communications
US6204139B1 (en) 1998-08-25 2001-03-20 University Of Houston Method for switching the properties of perovskite materials used in thin film resistors
US6072716A (en) * 1999-04-14 2000-06-06 Massachusetts Institute Of Technology Memory structures and methods of making same
US20030168223A1 (en) 2000-07-03 2003-09-11 Bergren Frank Edward Method and system for stepwisevarying fluid flow in well
JP4656720B2 (ja) * 2000-09-25 2011-03-23 ルネサスエレクトロニクス株式会社 薄膜磁性体記憶装置
US6473332B1 (en) 2001-04-04 2002-10-29 The University Of Houston System Electrically variable multi-state resistance computing
JP4731041B2 (ja) * 2001-05-16 2011-07-20 ルネサスエレクトロニクス株式会社 薄膜磁性体記憶装置
US6759249B2 (en) * 2002-02-07 2004-07-06 Sharp Laboratories Of America, Inc. Device and method for reversible resistance change induced by electric pulses in non-crystalline perovskite unipolar programmable memory
US6903965B2 (en) * 2002-07-18 2005-06-07 Renesas Technology Corp. Thin film magnetic memory device permitting high precision data read
US6850429B2 (en) * 2002-08-02 2005-02-01 Unity Semiconductor Corporation Cross point memory array with memory plugs exhibiting a characteristic hysteresis
JP4187148B2 (ja) * 2002-12-03 2008-11-26 シャープ株式会社 半導体記憶装置のデータ書き込み制御方法
JP4355136B2 (ja) * 2002-12-05 2009-10-28 シャープ株式会社 不揮発性半導体記憶装置及びその読み出し方法
JP4205938B2 (ja) * 2002-12-05 2009-01-07 シャープ株式会社 不揮発性メモリ装置
JP4124635B2 (ja) * 2002-12-05 2008-07-23 シャープ株式会社 半導体記憶装置及びメモリセルアレイの消去方法
JP4285082B2 (ja) * 2003-05-27 2009-06-24 ソニー株式会社 記憶装置
JP2005032401A (ja) * 2003-06-17 2005-02-03 Sharp Corp 不揮発性半導体記憶装置及びその書き込み方法と消去方法
CN1717748A (zh) * 2003-06-25 2006-01-04 松下电器产业株式会社 驱动非易失性存储器的方法
JP4365737B2 (ja) * 2004-06-30 2009-11-18 シャープ株式会社 可変抵抗素子の駆動方法及び記憶装置
DE102004041330B3 (de) * 2004-08-26 2006-03-16 Infineon Technologies Ag Speicherschaltung mit ein Widerstandsspeicherelement aufweisenden Speicherzellen
JP2006099866A (ja) * 2004-09-29 2006-04-13 Sony Corp 記憶装置及び半導体装置
JP2006185477A (ja) * 2004-12-27 2006-07-13 Fujitsu Ltd 磁気メモリ装置並びにその読み出し方法及び書き込み方法
US7289351B1 (en) * 2005-06-24 2007-10-30 Spansion Llc Method of programming a resistive memory device
US7233520B2 (en) * 2005-07-08 2007-06-19 Micron Technology, Inc. Process for erasing chalcogenide variable resistance memory bits

Also Published As

Publication number Publication date
EP1622163B1 (de) 2008-12-31
JP2006066052A (ja) 2006-03-09
KR100745516B1 (ko) 2007-08-02
EP1622163A1 (de) 2006-02-01
TWI277973B (en) 2007-04-01
JP4189395B2 (ja) 2008-12-03
KR20060053918A (ko) 2006-05-22
US7535746B2 (en) 2009-05-19
US20060023497A1 (en) 2006-02-02
TW200620276A (en) 2006-06-16

Similar Documents

Publication Publication Date Title
DE602005012028D1 (de) Nichtflüchtige Halbleiterspeicheranordnung und Leseverfahren
DE602004008833D1 (de) Nichtflüchtige Halbleiterspeichervorrichtung und deren Steuerungsverfahren
DE60326116D1 (de) Nichtflüchtige Speicherzelle und nichtflüchtige Halbleiterspeicheranordnung
DE602005009411D1 (de) Halbleiterspeichervorrichtung
DE60332081D1 (de) Nichtflüchtige Halbleiterspeicheranordnung
DE602005006197D1 (de) Halbleiterspeicherbaustein
TWI346954B (en) Nonvolatile semiconductor memory device
DE602004007173D1 (de) Nichtflüchtiger Halbleiterspeicher
DE602006011803D1 (de) Zeilenlayoutstruktur, Halbleiterspeichervorrichtung und Layoutverfahren
DE602004016283D1 (de) Integrierter Daten-Flash-Speicher und Programmcode-Flash-Speicher
DE602005018561D1 (de) Halbleiterspeicherbauelement und dessen Herstellungsverfahren
DE602006001026D1 (de) Integriertes Schaltgerät, Flash-Speicherarray, nichtflüchtige Speichervorrichtung und Betriebsverfahren
TWI316254B (en) Semiconductor memory device and a data read method thereof
DE602005019383D1 (de) Halbleiterspeicher und Systemvorrichtung
DE60314068D1 (de) Nichtflüchtiger Halbleiterspeicher
DE60324614D1 (de) Speicherzelle und Speichervorrichtung
DE60328764D1 (de) Halbleiterspeicherelement und integrierter Halbleiterschaltkreis
DE602007000219D1 (de) Nichtflüchtige Speichervorrichtung und Betriebsverfahren dafür
EP1866964A4 (de) Speicherelement, speicherbaustein und halbleiterbaustein
DE602006011684D1 (de) Nichtflüchtiger Halbleiterspeicher mit drei Zuständen und dessen Betriebsverfahren
DE602005013212D1 (de) Halbleiter-speicherkarte
DE602005009583D1 (de) Vorspannungsanlegeschaltung und Halbleiterspeicheranordnung
TWI371101B (en) Methods for erasing and programming memory devices and semiconductor device
DE602005007798D1 (de) Halbleiterspeichervorrichtung und Signalverarbeitungssystem
SG113506A1 (en) Nonvolatile semiconductor memory device

Legal Events

Date Code Title Description
8364 No opposition during term of opposition