DE60122124D1 - Harzkomponente zum formen einer isolierenden zwischenschicht in einer gedruckten leiterplatte, harzfolie und kupferfolie mit einem harz zur herstellung einer isolierschicht unter verwendung des harzes sowie diese verwendendes kupferkaschiertes laminat - Google Patents

Harzkomponente zum formen einer isolierenden zwischenschicht in einer gedruckten leiterplatte, harzfolie und kupferfolie mit einem harz zur herstellung einer isolierschicht unter verwendung des harzes sowie diese verwendendes kupferkaschiertes laminat

Info

Publication number
DE60122124D1
DE60122124D1 DE60122124T DE60122124T DE60122124D1 DE 60122124 D1 DE60122124 D1 DE 60122124D1 DE 60122124 T DE60122124 T DE 60122124T DE 60122124 T DE60122124 T DE 60122124T DE 60122124 D1 DE60122124 D1 DE 60122124D1
Authority
DE
Germany
Prior art keywords
resin
copper
foil
copper foil
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60122124T
Other languages
English (en)
Other versions
DE60122124T2 (de
Inventor
T Sato
T Asai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Publication of DE60122124D1 publication Critical patent/DE60122124D1/de
Application granted granted Critical
Publication of DE60122124T2 publication Critical patent/DE60122124T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE60122124T 2000-12-08 2001-12-05 Harzkomponente zum formen einer isolierenden zwischenschicht in einer gedruckten leiterplatte, harzfolie und kupferfolie mit einem harz zur herstellung einer isolierschicht unter verwendung des harzes sowie diese verwendendes kupferkaschiertes laminat Expired - Fee Related DE60122124T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000374070A JP2002179772A (ja) 2000-12-08 2000-12-08 プリント配線板の層間絶縁層構成用の樹脂化合物、その樹脂化合物を用いた絶縁層形成用樹脂シート及び樹脂付銅箔、並びにそれらを用いた銅張積層板
JP2000374070 2000-12-08
PCT/JP2001/010607 WO2002046264A1 (fr) 2000-12-08 2001-12-05 Composition a base de resine pour formation d'une couche isolante intercouches sur un carte de circuit imprime, feuille de resine et feuille de cuivre avec resine pour la realisation d'une couche isolante au moyen dudit compose a base de resine, et lamine a revetement de cuivre ainsi obtenu

Publications (2)

Publication Number Publication Date
DE60122124D1 true DE60122124D1 (de) 2006-09-21
DE60122124T2 DE60122124T2 (de) 2007-02-15

Family

ID=18843340

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60122124T Expired - Fee Related DE60122124T2 (de) 2000-12-08 2001-12-05 Harzkomponente zum formen einer isolierenden zwischenschicht in einer gedruckten leiterplatte, harzfolie und kupferfolie mit einem harz zur herstellung einer isolierschicht unter verwendung des harzes sowie diese verwendendes kupferkaschiertes laminat

Country Status (10)

Country Link
US (1) US6716530B2 (de)
EP (1) EP1273609B1 (de)
JP (1) JP2002179772A (de)
KR (1) KR100538710B1 (de)
CN (1) CN1314726C (de)
AT (1) ATE335777T1 (de)
DE (1) DE60122124T2 (de)
MY (1) MY137500A (de)
TW (1) TWI288760B (de)
WO (1) WO2002046264A1 (de)

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JP3434808B2 (ja) * 2001-05-31 2003-08-11 三井金属鉱業株式会社 樹脂付銅箔及びその樹脂付銅箔を用いたプリント配線板
JP4240448B2 (ja) * 2002-08-22 2009-03-18 三井金属鉱業株式会社 樹脂層付銅箔を用いた多層プリント配線板の製造方法
CN100551211C (zh) * 2003-12-16 2009-10-14 三井金属矿业株式会社 多层印刷布线板以及该多层印刷布线板的制造方法
JP4534802B2 (ja) * 2004-03-08 2010-09-01 Ｄｉｃ株式会社 熱硬化性組成物及びその硬化物
JP4710277B2 (ja) * 2004-08-17 2011-06-29 Ｄｉｃ株式会社 エポキシ樹脂組成物およびその硬化物
EP1863038B1 (de) * 2005-03-23 2010-09-08 Murata Manufacturing Co., Ltd. Zusammengesetztes dielektrisches blatt, verfahren zu seiner herstellung und mehrschichtige elektronische komponente
US8414962B2 (en) 2005-10-28 2013-04-09 The Penn State Research Foundation Microcontact printed thin film capacitors
JP2009155354A (ja) * 2006-03-30 2009-07-16 Ajinomoto Co Inc 絶縁層用樹脂組成物
JP2009155355A (ja) * 2006-03-30 2009-07-16 Ajinomoto Co Inc 絶縁層形成用樹脂組成物
JP5088060B2 (ja) * 2006-12-04 2012-12-05 日立化成工業株式会社 熱硬化性樹脂組成物並びにこれを用いたプリプレグ、積層板及びプリント配線板
TWI451816B (zh) 2007-03-20 2014-09-01 Mitsui Mining & Smelting Co And a resin composition for insulating layer constituting a printed circuit board
WO2009084533A1 (ja) * 2007-12-28 2009-07-09 Mitsui Mining & Smelting Co., Ltd. 樹脂付銅箔および樹脂付銅箔の製造方法
JP5636159B2 (ja) * 2007-12-28 2014-12-03 三井金属鉱業株式会社 樹脂付銅箔および樹脂付銅箔の製造方法
KR100982795B1 (ko) * 2008-07-10 2010-09-16 삼성전기주식회사 전자소자 내장형 인쇄회로기판 제조방법
JP2010270229A (ja) * 2009-05-21 2010-12-02 Nippon Steel Materials Co Ltd 耐熱樹脂組成物、強化繊維プリプレグ及び強化繊維複合材料
SG10201502708PA (en) * 2010-04-08 2015-05-28 Mitsubishi Gas Chemical Co Resin composition, prepreg, and laminated sheet
TWI401269B (zh) 2010-06-14 2013-07-11 Taiwan Union Technology Corp 環氧樹脂組成物及其製成的預浸材和印刷電路板
TWI617225B (zh) * 2010-12-24 2018-03-01 Ｌｇ伊諾特股份有限公司 印刷電路板及其製造方法
TWI542264B (zh) * 2010-12-24 2016-07-11 Ｌｇ伊諾特股份有限公司 印刷電路板及其製造方法
KR20140048564A (ko) * 2012-10-16 2014-04-24 삼성전기주식회사 코어기판, 그의 제조방법 및 메탈 비아용 구조체
US20140119703A1 (en) * 2012-10-26 2014-05-01 Cisco Technology, Inc. Printed Circuit Board Comprising Both Conductive Metal and Optical Elements
JP6098372B2 (ja) * 2013-05-30 2017-03-22 住友ベークライト株式会社 半導体装置
MY168616A (en) 2013-07-23 2018-11-14 Jx Nippon Mining & Metals Corp Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
US10257938B2 (en) 2013-07-24 2019-04-09 Jx Nippon Mining & Metals Corporation Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
JP6640567B2 (ja) 2015-01-16 2020-02-05 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板、電子機器の製造方法及びプリント配線板の製造方法
KR101852671B1 (ko) 2015-01-21 2018-06-04 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법
KR101942621B1 (ko) 2015-02-06 2019-01-25 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법
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Also Published As

Publication number Publication date
JP2002179772A (ja) 2002-06-26
CN1398274A (zh) 2003-02-19
KR100538710B1 (ko) 2005-12-23
ATE335777T1 (de) 2006-09-15
EP1273609A1 (de) 2003-01-08
KR20020080377A (ko) 2002-10-23
TWI288760B (en) 2007-10-21
WO2002046264A1 (fr) 2002-06-13
CN1314726C (zh) 2007-05-09
MY137500A (en) 2009-02-27
US6716530B2 (en) 2004-04-06
EP1273609A4 (de) 2004-10-06
EP1273609B1 (de) 2006-08-09
DE60122124T2 (de) 2007-02-15
US20020106516A1 (en) 2002-08-08

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