DE60040943D1 - Doppelseitenpoliermaschine - Google Patents
DoppelseitenpoliermaschineInfo
- Publication number
- DE60040943D1 DE60040943D1 DE60040943T DE60040943T DE60040943D1 DE 60040943 D1 DE60040943 D1 DE 60040943D1 DE 60040943 T DE60040943 T DE 60040943T DE 60040943 T DE60040943 T DE 60040943T DE 60040943 D1 DE60040943 D1 DE 60040943D1
- Authority
- DE
- Germany
- Prior art keywords
- double
- polishing machine
- side polishing
- machine
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10540799A JP4256977B2 (ja) | 1999-04-13 | 1999-04-13 | 両面研磨装置システム |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60040943D1 true DE60040943D1 (de) | 2009-01-15 |
Family
ID=14406771
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60040943T Expired - Lifetime DE60040943D1 (de) | 1999-04-13 | 2000-04-12 | Doppelseitenpoliermaschine |
Country Status (6)
Country | Link |
---|---|
US (1) | US6361418B1 (de) |
EP (1) | EP1044765B1 (de) |
JP (1) | JP4256977B2 (de) |
DE (1) | DE60040943D1 (de) |
MY (1) | MY116804A (de) |
TW (1) | TW470681B (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10081456T1 (de) * | 1999-05-17 | 2001-09-27 | Kashiwara Machine Mfg | Vefahren und Vorrichtung zum doppelseitigen Polieren |
US6620257B1 (en) * | 1999-06-30 | 2003-09-16 | Hoya Corporation | Scrub cleaning method for substrate and manufacturing method for information recording medium |
JP3791302B2 (ja) * | 2000-05-31 | 2006-06-28 | 株式会社Sumco | 両面研磨装置を用いた半導体ウェーハの研磨方法 |
JP2002239895A (ja) * | 2001-01-31 | 2002-08-28 | Internatl Business Mach Corp <Ibm> | 研磨用保持部材、研磨方法および研磨装置 |
JP4620898B2 (ja) * | 2001-04-23 | 2011-01-26 | 不二越機械工業株式会社 | 研磨装置システム |
DE10228441B4 (de) * | 2001-07-11 | 2005-09-08 | Peter Wolters Werkzeugmaschinen Gmbh | Verfahren und Vorrichtung zum automatischen Beladen einer Doppelseiten-Poliermaschine mit Halbleiterscheiben |
JP2003089046A (ja) * | 2001-09-12 | 2003-03-25 | Seiko Instruments Inc | 端面研磨装置 |
EP1489649A1 (de) * | 2002-03-28 | 2004-12-22 | Shin-Etsu Handotai Co., Ltd | Doppelseitige poliereinrichtung für einen wafer und doppelseitiges polierverfahren |
JP2004106173A (ja) * | 2002-08-29 | 2004-04-08 | Fujikoshi Mach Corp | 両面研磨装置 |
JP4343020B2 (ja) * | 2003-12-22 | 2009-10-14 | 株式会社住友金属ファインテック | 両面研磨方法及び装置 |
JP4492155B2 (ja) * | 2004-02-27 | 2010-06-30 | 信越半導体株式会社 | 半導体ウエーハ用キャリアの保持孔検出装置及び検出方法並びに半導体ウエーハの研磨方法 |
JP4727218B2 (ja) * | 2004-12-10 | 2011-07-20 | 株式会社住友金属ファインテック | 両面研磨用キャリア |
ATE507031T1 (de) * | 2008-01-16 | 2011-05-15 | Wendt Gmbh | Planschleifmaschine |
CN103537981B (zh) * | 2013-07-26 | 2016-08-10 | 浙江工业大学 | 一种高精度圆柱形零件外圆的超精加工方法 |
CN108453598B (zh) * | 2018-03-02 | 2020-12-22 | 泰州永林机械有限公司 | 一种机械铁质板材表面双层同步抛光设备 |
CN109531374A (zh) * | 2018-11-20 | 2019-03-29 | 宁波中和汽配有限公司 | 滚针分选机用压块的研磨装置 |
DE102019208704A1 (de) | 2019-06-14 | 2020-12-17 | Siltronic Ag | Einrichtung und Verfahren zum Polieren von Halbleiterscheiben |
CN110340787B (zh) * | 2019-08-09 | 2021-08-10 | 衢州学院 | 蓝宝石切片立式双面研磨设备 |
CN113829223B (zh) * | 2021-11-30 | 2022-03-01 | 临沂安信电气有限公司 | 一种半导体生产用的基板加工装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58171255A (ja) * | 1982-03-29 | 1983-10-07 | Toshiba Corp | 両面鏡面研摩装置 |
JPS62176755A (ja) * | 1986-01-31 | 1987-08-03 | Yasunori Taira | 平面研磨装置 |
US5121572A (en) * | 1990-11-06 | 1992-06-16 | Timesavers, Inc. | Opposed disc deburring system |
JPH0615565A (ja) * | 1991-12-18 | 1994-01-25 | Shin Etsu Handotai Co Ltd | ウエーハ自動ラッピング装置 |
JPH09252100A (ja) | 1996-03-18 | 1997-09-22 | Shin Etsu Handotai Co Ltd | 結合ウェーハの製造方法及びこの方法により製造される結合ウェーハ |
US5679055A (en) * | 1996-05-31 | 1997-10-21 | Memc Electronic Materials, Inc. | Automated wafer lapping system |
WO1998019301A1 (en) * | 1996-10-28 | 1998-05-07 | Hmt Technology Corporation | Apparatus for polishing planar substrates between rotating plates |
JPH10202511A (ja) * | 1997-01-21 | 1998-08-04 | Fujikoshi Mach Corp | 両面研磨装置 |
JPH11207611A (ja) * | 1998-01-21 | 1999-08-03 | Shin Etsu Handotai Co Ltd | 両面研磨装置におけるワークの自動搬送装置 |
JPH11267964A (ja) * | 1998-03-20 | 1999-10-05 | Speedfam Co Ltd | 平面研磨装置及びそれに用いるキャリヤ |
-
1999
- 1999-04-13 JP JP10540799A patent/JP4256977B2/ja not_active Expired - Fee Related
-
2000
- 2000-04-12 EP EP00303063A patent/EP1044765B1/de not_active Expired - Lifetime
- 2000-04-12 MY MYPI20001553A patent/MY116804A/en unknown
- 2000-04-12 DE DE60040943T patent/DE60040943D1/de not_active Expired - Lifetime
- 2000-04-12 TW TW089106784A patent/TW470681B/zh not_active IP Right Cessation
- 2000-04-12 US US09/547,659 patent/US6361418B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6361418B1 (en) | 2002-03-26 |
MY116804A (en) | 2004-03-31 |
TW470681B (en) | 2002-01-01 |
EP1044765A3 (de) | 2003-03-26 |
JP2000296463A (ja) | 2000-10-24 |
EP1044765B1 (de) | 2008-12-03 |
EP1044765A2 (de) | 2000-10-18 |
JP4256977B2 (ja) | 2009-04-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |