DE60041671D1 - Poliervorrichtung - Google Patents

Poliervorrichtung

Info

Publication number
DE60041671D1
DE60041671D1 DE60041671T DE60041671T DE60041671D1 DE 60041671 D1 DE60041671 D1 DE 60041671D1 DE 60041671 T DE60041671 T DE 60041671T DE 60041671 T DE60041671 T DE 60041671T DE 60041671 D1 DE60041671 D1 DE 60041671D1
Authority
DE
Germany
Prior art keywords
polisher
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60041671T
Other languages
English (en)
Inventor
Kunihiko Sakurai
Tetsuji Togawa
Nobuyuki Takada
Satoshi Wakabayashi
Kenichiro Saito
Masahiko Sekimoto
Takuji Hayama
Daisuke Koga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of DE60041671D1 publication Critical patent/DE60041671D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE60041671T 1999-03-05 2000-03-06 Poliervorrichtung Expired - Lifetime DE60041671D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5952299 1999-03-05
JP23398399 1999-08-20

Publications (1)

Publication Number Publication Date
DE60041671D1 true DE60041671D1 (de) 2009-04-09

Family

ID=26400572

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60041671T Expired - Lifetime DE60041671D1 (de) 1999-03-05 2000-03-06 Poliervorrichtung

Country Status (3)

Country Link
EP (2) EP1034887A3 (de)
DE (1) DE60041671D1 (de)
SG (1) SG97860A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001326201A (ja) * 2000-05-16 2001-11-22 Ebara Corp ポリッシング装置
US6358126B1 (en) * 2000-05-23 2002-03-19 Ebara Corporation Polishing apparatus
EP1412130B1 (de) * 2001-05-29 2013-01-09 Ebara Corporation Poliervorrichtung und polierverfahren
DE10131668B4 (de) * 2001-06-29 2006-05-18 Infineon Technologies Ag Verfahren zur abrasiven Bearbeitung von Oberflächen, auf Halbleiter-Wafern
JP2005123485A (ja) * 2003-10-17 2005-05-12 Ebara Corp 研磨装置
WO2006049269A1 (en) 2004-11-01 2006-05-11 Ebara Corporation Polishing apparatus
JP5219569B2 (ja) 2008-03-21 2013-06-26 株式会社東京精密 ウェーハ研削装置における加工良否判定方法およびウェーハ研削装置
US8795032B2 (en) 2008-06-04 2014-08-05 Ebara Corporation Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
JP5422143B2 (ja) * 2008-06-04 2014-02-19 株式会社荏原製作所 基板把持機構
US9700988B2 (en) 2014-08-26 2017-07-11 Ebara Corporation Substrate processing apparatus
CN113059453B (zh) * 2019-12-31 2024-06-18 浙江芯晖装备技术有限公司 一种抛光设备
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems
CN114226351B (zh) * 2021-08-16 2024-01-30 重庆大学 一种复合材料干切加工复杂多工况自适应除尘装置
CN113695920B (zh) * 2021-10-15 2022-07-01 潍坊华正电器设备股份有限公司 一种cnc铣削砂光机
CN118162405B (zh) * 2024-05-16 2024-07-16 山西工程技术学院 一种探针清洗装置及其使用方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4141180A (en) * 1977-09-21 1979-02-27 Kayex Corporation Polishing apparatus
JPS58196984A (ja) * 1982-05-12 1983-11-16 松下電器産業株式会社 工業用ロボツト
US5329732A (en) * 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
US5498199A (en) * 1992-06-15 1996-03-12 Speedfam Corporation Wafer polishing method and apparatus
US5827110A (en) * 1994-12-28 1998-10-27 Kabushiki Kaisha Toshiba Polishing facility
US5649854A (en) * 1994-05-04 1997-07-22 Gill, Jr.; Gerald L. Polishing apparatus with indexing wafer processing stations
DE19544328B4 (de) * 1994-11-29 2014-03-20 Ebara Corp. Poliervorrichtung
US5655954A (en) * 1994-11-29 1997-08-12 Toshiba Kikai Kabushiki Kaisha Polishing apparatus
US5830045A (en) * 1995-08-21 1998-11-03 Ebara Corporation Polishing apparatus
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
EP0793261B1 (de) * 1996-02-28 2005-01-05 Ebara Corporation Transportroboter mit Tropfwasserschutz
US5989107A (en) * 1996-05-16 1999-11-23 Ebara Corporation Method for polishing workpieces and apparatus therefor
US5893795A (en) * 1997-07-11 1999-04-13 Applied Materials, Inc. Apparatus for moving a cassette
JPH11204468A (ja) * 1998-01-09 1999-07-30 Speedfam Co Ltd 半導体ウエハの表面平坦化装置

Also Published As

Publication number Publication date
EP1738871B1 (de) 2009-02-25
EP1034887A3 (de) 2003-07-16
EP1738871A1 (de) 2007-01-03
EP1034887A2 (de) 2000-09-13
SG97860A1 (en) 2003-08-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition