DE2818080C2 - Verkapselte Halbleitereinrichtung - Google Patents
Verkapselte HalbleitereinrichtungInfo
- Publication number
- DE2818080C2 DE2818080C2 DE2818080A DE2818080A DE2818080C2 DE 2818080 C2 DE2818080 C2 DE 2818080C2 DE 2818080 A DE2818080 A DE 2818080A DE 2818080 A DE2818080 A DE 2818080A DE 2818080 C2 DE2818080 C2 DE 2818080C2
- Authority
- DE
- Germany
- Prior art keywords
- fastening
- webs
- fastening part
- semiconductor device
- strips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49537—Plurality of lead frames mounted in one device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
12
h = Dicke des Steges und des flachen Teils des
b = Breite des Befestigungsteils
H(mm) | Verhältnis zur |
Steifigkeit für H - 0 | |
0.00 | I1OO |
0.20 | 2.44 |
0,25 | 3.20 |
0,30 | 4.1b |
0,40 | 6.74 |
Claims (5)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4738777A JPS53132975A (en) | 1977-04-26 | 1977-04-26 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
DE2818080A1 DE2818080A1 (de) | 1978-11-09 |
DE2818080C2 true DE2818080C2 (de) | 1985-08-01 |
Family
ID=12773684
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2818080A Expired DE2818080C2 (de) | 1977-04-26 | 1978-04-25 | Verkapselte Halbleitereinrichtung |
DE2858087A Expired DE2858087C2 (de) | 1977-04-26 | 1978-04-25 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2858087A Expired DE2858087C2 (de) | 1977-04-26 | 1978-04-25 |
Country Status (3)
Country | Link |
---|---|
US (1) | US4298883A (de) |
JP (1) | JPS53132975A (de) |
DE (2) | DE2818080C2 (de) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55113349A (en) * | 1979-02-23 | 1980-09-01 | Hitachi Ltd | Semiconductor device |
US4346396A (en) * | 1979-03-12 | 1982-08-24 | Western Electric Co., Inc. | Electronic device assembly and methods of making same |
US4439918A (en) * | 1979-03-12 | 1984-04-03 | Western Electric Co., Inc. | Methods of packaging an electronic device |
US4339768A (en) * | 1980-01-18 | 1982-07-13 | Amp Incorporated | Transistors and manufacture thereof |
FR2488445A1 (fr) * | 1980-08-06 | 1982-02-12 | Efcis | Boitier plastique pour circuits integres |
FR2490917A1 (fr) * | 1980-09-02 | 1982-03-26 | Motorola Semiconducteurs | Boitier pour circuit electrique et procede de fabrication |
JPS57111034A (en) * | 1980-12-10 | 1982-07-10 | Hitachi Ltd | Semiconductor device and its manufacture |
US4396936A (en) * | 1980-12-29 | 1983-08-02 | Honeywell Information Systems, Inc. | Integrated circuit chip package with improved cooling means |
JPS57147260A (en) * | 1981-03-05 | 1982-09-11 | Matsushita Electronics Corp | Manufacture of resin-sealed semiconductor device and lead frame used therefor |
EP0104231A4 (de) * | 1982-04-05 | 1985-10-30 | Motorola Inc | Selbstausrichtende wärmestreuungsanordnung. |
JPS5958828A (ja) * | 1982-09-28 | 1984-04-04 | Fujitsu Ltd | 樹脂封止型半導体装置のスクリ−ニング法 |
EP0121149B1 (de) * | 1983-03-31 | 1987-09-02 | Koninklijke Philips Electronics N.V. | Elektrische Kontaktanordnung für Flüssigkristall-Anzeigezellen |
US4722060A (en) * | 1984-03-22 | 1988-01-26 | Thomson Components-Mostek Corporation | Integrated-circuit leadframe adapted for a simultaneous bonding operation |
US4791473A (en) * | 1986-12-17 | 1988-12-13 | Fairchild Semiconductor Corporation | Plastic package for high frequency semiconductor devices |
US5162894A (en) * | 1988-05-24 | 1992-11-10 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit having a dummy lead and shaped inner leads |
JPH0225057A (ja) * | 1988-07-13 | 1990-01-26 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
JP2522524B2 (ja) * | 1988-08-06 | 1996-08-07 | 株式会社東芝 | 半導体装置の製造方法 |
US5015803A (en) * | 1989-05-31 | 1991-05-14 | Olin Corporation | Thermal performance package for integrated circuit chip |
US5083368A (en) * | 1990-02-14 | 1992-01-28 | Motorola Inc. | Method of forming modular power device assembly |
US4991002A (en) * | 1990-02-14 | 1991-02-05 | Motorola Inc. | Modular power device assembly |
JPH03293756A (ja) * | 1990-04-12 | 1991-12-25 | Mitsubishi Electric Corp | 半導体装置用リードフレーム及びその製造方法 |
DE4021871C2 (de) * | 1990-07-09 | 1994-07-28 | Lsi Logic Products Gmbh | Hochintegriertes elektronisches Bauteil |
US5389577A (en) * | 1992-08-31 | 1995-02-14 | Sgs-Thomson Microelectronics, Inc. | Leadframe for integrated circuits |
US5358905A (en) * | 1993-04-02 | 1994-10-25 | Texas Instruments Incorporated | Semiconductor device having die pad locking to substantially reduce package cracking |
US5683944A (en) * | 1995-09-01 | 1997-11-04 | Motorola, Inc. | Method of fabricating a thermally enhanced lead frame |
DE19639183A1 (de) * | 1996-09-24 | 1998-04-02 | Siemens Ag | Anschlußrahmen für ein mikroelektronisches Bauteil, Verfahren zu dessen Herstellung und den Anschlußrahmen umfassendes mikroelektronisches Bauteil |
US5926695A (en) * | 1997-06-10 | 1999-07-20 | National Semiconductor Corporation | Lead frame incorporating material flow diverters |
EP0895287A3 (de) * | 1997-07-31 | 2006-04-05 | Matsushita Electric Industrial Co., Ltd. | Halbleitervorrichtung und Leiterrahmen für dieselbe |
US7057273B2 (en) * | 2001-05-15 | 2006-06-06 | Gem Services, Inc. | Surface mount package |
JP4435050B2 (ja) * | 2005-05-24 | 2010-03-17 | パナソニック株式会社 | 半導体装置 |
US20120248594A1 (en) * | 2011-03-28 | 2012-10-04 | Ho Il Lee | Junction box and manufacturing method thereof |
CN104465588B (zh) * | 2013-09-25 | 2018-11-02 | 恩智浦美国有限公司 | 具有应力释放和散热器的半导体封装件 |
US20210043466A1 (en) | 2019-08-06 | 2021-02-11 | Texas Instruments Incorporated | Universal semiconductor package molds |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL258551A (de) * | 1959-12-16 | |||
DE1937664U (de) | 1966-01-18 | 1966-04-28 | Werner Bialluch | Kombinierte zigaretten-streichholzschachtel. |
US3423516A (en) * | 1966-07-13 | 1969-01-21 | Motorola Inc | Plastic encapsulated semiconductor assemblies |
US3574815A (en) * | 1966-07-13 | 1971-04-13 | Motorola Inc | Method of fabricating a plastic encapsulated semiconductor assembly |
US3577633A (en) * | 1966-12-02 | 1971-05-04 | Hitachi Ltd | Method of making a semiconductor device |
DE2004768C3 (de) * | 1968-07-30 | 1979-09-06 | N.V. Philips' Gloeilampenfabrieken, Eindhoven (Niederlande) | Halbleiterbauelement |
NL157456B (nl) * | 1968-07-30 | 1978-07-17 | Philips Nv | Halfgeleiderinrichting in een isolerende kunststofomhulling. |
DE1800213A1 (de) * | 1968-10-01 | 1970-05-14 | Telefunken Patent | Gehaeuse fuer integrierte Halbleiterschaltungen |
US3665256A (en) * | 1968-10-15 | 1972-05-23 | Rca Corp | Heat dissipation for power integrated circuits |
US3569797A (en) * | 1969-03-12 | 1971-03-09 | Bendix Corp | Semiconductor device with preassembled mounting |
US3629668A (en) * | 1969-12-19 | 1971-12-21 | Texas Instruments Inc | Semiconductor device package having improved compatibility properties |
US3651448A (en) * | 1970-03-20 | 1972-03-21 | Amp Inc | Power frame for integrated circuit |
US3786317A (en) * | 1972-11-09 | 1974-01-15 | Bell Telephone Labor Inc | Microelectronic circuit package |
US3914786A (en) * | 1974-04-19 | 1975-10-21 | Hewlett Packard Co | In-line reflective lead-pair for light-emitting diodes |
US4023053A (en) * | 1974-12-16 | 1977-05-10 | Tokyo Shibaura Electric Co., Ltd. | Variable capacity diode device |
US3930114A (en) * | 1975-03-17 | 1975-12-30 | Nat Semiconductor Corp | Integrated circuit package utilizing novel heat sink structure |
US4048670A (en) * | 1975-06-30 | 1977-09-13 | Sprague Electric Company | Stress-free hall-cell package |
-
1977
- 1977-04-26 JP JP4738777A patent/JPS53132975A/ja active Pending
-
1978
- 1978-04-25 DE DE2818080A patent/DE2818080C2/de not_active Expired
- 1978-04-25 DE DE2858087A patent/DE2858087C2/de not_active Expired
- 1978-04-25 US US05/899,820 patent/US4298883A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS53132975A (en) | 1978-11-20 |
US4298883A (en) | 1981-11-03 |
DE2818080A1 (de) | 1978-11-09 |
DE2858087C2 (de) | 1987-07-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OAP | Request for examination filed | ||
OD | Request for examination | ||
8172 | Supplementary division/partition in: |
Ref country code: DE Ref document number: 2858087 Format of ref document f/p: P |
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Q171 | Divided out to: |
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D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Free format text: KLUNKER, H., DIPL.-ING. DR.RER.NAT., PAT.-ANW., 8000 MUENCHEN |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: KABUSHIKI KAISHA TOSHIBA, KAWASAKI, KANAGAWA, JP |
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AH | Division in |
Ref country code: DE Ref document number: 2858087 Format of ref document f/p: P |
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8339 | Ceased/non-payment of the annual fee |