NL157456B - Halfgeleiderinrichting in een isolerende kunststofomhulling. - Google Patents
Halfgeleiderinrichting in een isolerende kunststofomhulling.Info
- Publication number
- NL157456B NL157456B NL6810761.A NL6810761A NL157456B NL 157456 B NL157456 B NL 157456B NL 6810761 A NL6810761 A NL 6810761A NL 157456 B NL157456 B NL 157456B
- Authority
- NL
- Netherlands
- Prior art keywords
- semi
- conductor
- conductors
- integrated circuit
- synthetic material
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL6810761.A NL157456B (nl) | 1968-07-30 | 1968-07-30 | Halfgeleiderinrichting in een isolerende kunststofomhulling. |
DE1937664A DE1937664C3 (de) | 1968-07-30 | 1969-07-24 | Halbleiterbauelement |
DK404469AA DK123553B (da) | 1968-07-30 | 1969-07-25 | Indskapslet halvlederorgan med køleelement. |
CH1141569A CH506883A (de) | 1968-07-30 | 1969-07-25 | Halbleiterbauelement |
GB37572/69A GB1271576A (en) | 1968-07-30 | 1969-07-25 | Improvements in and relating to semiconductor devices |
FR6925687A FR2014777A1 (nl) | 1968-07-30 | 1969-07-28 | |
AT726469A AT312686B (de) | 1968-07-30 | 1969-07-28 | Halbleiterbauelement mit aus Metallstreifen gebildeten Leitern und einer isolierenden Kunststoffhülle |
SE10615/69*A SE355260B (nl) | 1968-07-30 | 1969-07-28 | |
ES369959A ES369959A1 (es) | 1968-07-30 | 1969-07-28 | Un dispositivo semiconductor. |
BE736743A BE736743A (fr) | 1968-07-30 | 1969-07-29 | Dispositif semiconducteur |
US845921A US3646409A (en) | 1968-07-30 | 1969-07-29 | Heat-sinking package for semiconductor integrated circuit |
DE19702004768 DE2004768C3 (de) | 1968-07-30 | 1970-01-29 | Halbleiterbauelement |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL6810761.A NL157456B (nl) | 1968-07-30 | 1968-07-30 | Halfgeleiderinrichting in een isolerende kunststofomhulling. |
Publications (2)
Publication Number | Publication Date |
---|---|
NL6810761A NL6810761A (nl) | 1970-02-03 |
NL157456B true NL157456B (nl) | 1978-07-17 |
Family
ID=19804247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL6810761.A NL157456B (nl) | 1968-07-30 | 1968-07-30 | Halfgeleiderinrichting in een isolerende kunststofomhulling. |
Country Status (11)
Country | Link |
---|---|
US (1) | US3646409A (nl) |
AT (1) | AT312686B (nl) |
BE (1) | BE736743A (nl) |
CH (1) | CH506883A (nl) |
DE (1) | DE1937664C3 (nl) |
DK (1) | DK123553B (nl) |
ES (1) | ES369959A1 (nl) |
FR (1) | FR2014777A1 (nl) |
GB (1) | GB1271576A (nl) |
NL (1) | NL157456B (nl) |
SE (1) | SE355260B (nl) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2116353B1 (nl) * | 1970-10-19 | 1976-04-16 | Ates Componenti Elettron | |
DE2107786C3 (de) * | 1971-02-18 | 1983-01-27 | N.V. Philips' Gloeilampenfabrieken, 5621 Eindhoven | Halbleiterbauelement |
US3767839A (en) * | 1971-06-04 | 1973-10-23 | Wells Plastics Of California I | Plastic micro-electronic packages |
US3721747A (en) * | 1972-03-15 | 1973-03-20 | Coilcraft Inc | Dual in-line package |
IT960675B (it) * | 1972-06-03 | 1973-11-30 | Ates Componenti Elettron | Assemblaggio per produzione di circuiti integrati con conteni tore di resina |
US3836825A (en) * | 1972-10-06 | 1974-09-17 | Rca Corp | Heat dissipation for power integrated circuit devices |
US3801728A (en) * | 1972-10-20 | 1974-04-02 | Bell Telephone Labor Inc | Microelectronic packages |
US3922712A (en) * | 1974-05-01 | 1975-11-25 | Gen Motors Corp | Plastic power semiconductor flip chip package |
DE2712543C2 (de) * | 1976-03-24 | 1982-11-11 | Hitachi, Ltd., Tokyo | Anordnung eines Halbleiterbauelements auf einer Montageplatte |
IN148328B (nl) * | 1977-04-18 | 1981-01-17 | Rca Corp | |
JPS53132975A (en) * | 1977-04-26 | 1978-11-20 | Toshiba Corp | Semiconductor device |
JPS592364B2 (ja) * | 1979-04-27 | 1984-01-18 | 富士通株式会社 | 集合抵抗モジユ−ル |
US4642419A (en) * | 1981-04-06 | 1987-02-10 | International Rectifier Corporation | Four-leaded dual in-line package module for semiconductor devices |
IT1218271B (it) * | 1981-04-13 | 1990-04-12 | Ates Componenti Elettron | Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento |
US4496965A (en) * | 1981-05-18 | 1985-01-29 | Texas Instruments Incorporated | Stacked interdigitated lead frame assembly |
EP0206771B1 (en) * | 1985-06-20 | 1992-03-11 | Kabushiki Kaisha Toshiba | Packaged semiconductor device |
US5049976A (en) * | 1989-01-10 | 1991-09-17 | National Semiconductor Corporation | Stress reduction package and process |
US5596231A (en) * | 1991-08-05 | 1997-01-21 | Asat, Limited | High power dissipation plastic encapsulated package for integrated circuit die |
US6613978B2 (en) * | 1993-06-18 | 2003-09-02 | Maxwell Technologies, Inc. | Radiation shielding of three dimensional multi-chip modules |
US5872395A (en) * | 1996-09-16 | 1999-02-16 | International Packaging And Assembly Corporation | Bent tip method for preventing vertical motion of heat spreaders during injection molding of IC packages |
DE19638438A1 (de) * | 1996-09-19 | 1998-04-02 | Siemens Ag | Durch Feldeffekt steuerbares, vertikales Halbleiterbauelement |
US6368899B1 (en) * | 2000-03-08 | 2002-04-09 | Maxwell Electronic Components Group, Inc. | Electronic device packaging |
US7382043B2 (en) * | 2002-09-25 | 2008-06-03 | Maxwell Technologies, Inc. | Method and apparatus for shielding an integrated circuit from radiation |
US7191516B2 (en) * | 2003-07-16 | 2007-03-20 | Maxwell Technologies, Inc. | Method for shielding integrated circuit devices |
TWI268732B (en) * | 2004-12-16 | 2006-12-11 | Au Optronics Corp | Organic light emitting device |
DE102019115500A1 (de) * | 2019-06-07 | 2020-12-10 | OSRAM CONTINENTAL GmbH | Anordnung und Verfahren zur Herstellung einer Anordnung |
-
1968
- 1968-07-30 NL NL6810761.A patent/NL157456B/nl unknown
-
1969
- 1969-07-24 DE DE1937664A patent/DE1937664C3/de not_active Expired
- 1969-07-25 GB GB37572/69A patent/GB1271576A/en not_active Expired
- 1969-07-25 DK DK404469AA patent/DK123553B/da unknown
- 1969-07-25 CH CH1141569A patent/CH506883A/de not_active IP Right Cessation
- 1969-07-28 SE SE10615/69*A patent/SE355260B/xx unknown
- 1969-07-28 FR FR6925687A patent/FR2014777A1/fr not_active Withdrawn
- 1969-07-28 ES ES369959A patent/ES369959A1/es not_active Expired
- 1969-07-28 AT AT726469A patent/AT312686B/de not_active IP Right Cessation
- 1969-07-29 BE BE736743A patent/BE736743A/fr unknown
- 1969-07-29 US US845921A patent/US3646409A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
BE736743A (fr) | 1970-01-29 |
CH506883A (de) | 1971-04-30 |
FR2014777A1 (nl) | 1970-04-17 |
DK123553B (da) | 1972-07-03 |
DE1937664C3 (de) | 1978-11-30 |
NL6810761A (nl) | 1970-02-03 |
US3646409A (en) | 1972-02-29 |
AT312686B (de) | 1974-01-10 |
GB1271576A (en) | 1972-04-19 |
ES369959A1 (es) | 1971-07-16 |
SE355260B (nl) | 1973-04-09 |
DE1937664B2 (de) | 1973-11-22 |
DE1937664A1 (de) | 1970-02-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
VJC | Lapsed due to non-payment of the due maintenance fee for the patent or patent application | ||
NL80 | Abbreviated name of patent owner mentioned of already nullified patent |
Owner name: PHILIPS |