CN210705625U

CN210705625U - Jig for glue pouring of LED module

Info

Publication number: CN210705625U
Application number: CN201921420201.1U
Authority: CN
Inventors: 刘强; 郑伟
Original assignee: Leyard TV Technology Co Ltd
Current assignee: Leyard TV Technology Co Ltd
Priority date: 2019-08-28
Filing date: 2019-08-28
Publication date: 2020-06-09
Anticipated expiration: 2029-08-28

Abstract

The utility model aims at providing a tool is used to LED module encapsulating, include: the first die comprises a bottom plate and a side plate, wherein the side plate is arranged along the edge of the bottom plate, and an accommodating groove is formed in the bottom plate; still be provided with the accommodation space who holds the LED module of treating the embedment between bottom plate and the curb plate, this accommodation space is located the top of holding tank. The second mold is arranged in the accommodating groove in a removable mode and is matched with the accommodating groove; the pushing structure is arranged on the first mold and can push the second mold out of the accommodating groove; and the cover plate can be covered on the end surface of the side plate. The technical scheme of the utility model the difficult problem of taking out of LED module among the embedment technology has been solved effectively among the prior art.

Description

Jig for glue pouring of LED module

Technical Field

The utility model relates to a LED field of making particularly, relates to a tool is used to LED module encapsulating.

Background

The LED module is fragile, and anti-hitting performance is poor, and is fragile when receiving great external force impact, therefore needs to be at LED module surface embedment resin material. However, currently, the LED module is directly encapsulated or placed in a mold for encapsulation. The former has low encapsulation efficiency and is difficult to ensure the thickness of each part of encapsulation and the smoothness of the encapsulation surface; the latter is not easy to take out after encapsulation.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a tool is used to LED module encapsulating to the difficult problem of taking out of LED module among the solution prior art embedment technology.

In order to realize the above-mentioned purpose, the utility model provides a tool is used in LED module encapsulating, include: the first die comprises a bottom plate and a side plate, the side plate is arranged along the edge of the bottom plate, an accommodating groove is formed in the upper surface of the bottom plate, an accommodating space for accommodating the LED module to be encapsulated is formed between the bottom plate and the side plate, and the accommodating space is located above the accommodating groove; a second mold removably disposed in the accommodating groove; the pushing structure is arranged on the first mold and can push the second mold out of the accommodating groove; and the cover plate can be covered on the end surface of the side plate.

Further, the second mold includes a frame disposed along an inner surface of the side plate and a bracket disposed in the frame.

Further, the pushing structure comprises a plurality of first through holes arranged at the bottom of the accommodating groove and a plurality of top threads arranged in one-to-one correspondence with the first through holes.

Further, the second mold further comprises a plurality of protruding portions arranged on the inner side of the frame, and the positions of the partial first through holes correspond to the positions of the protruding portions.

Furthermore, a plurality of convex ribs arranged at intervals are arranged on the bottom plate.

Furthermore, the side plates are provided with lap joint steps.

Further, be provided with the fixed slot on the curb plate, be provided with first magnet in the fixed slot, LED module is tool for encapsulating still includes the second magnet, and the second magnet can be placed on the apron, and first magnet and second magnet can the actuation.

Further, the cover plate is made of transparent glass.

Further, the jig for glue filling of the LED module further comprises a plurality of supporting columns, and the supporting columns are arranged below the bottom plate of the first die.

Furthermore, a plurality of second through holes are formed in the bottom plate, a plurality of third through holes are formed in the second die, and the fastener can fix the LED module to be subjected to glue pouring in the first die through the second through holes and the third through holes.

Use the technical scheme of the utility model, the bottom plate and the curb plate of first mould form and hold the accommodation space who treats the LED module of embedment. Before the glue filling process, the second mold is placed into the accommodating groove of the first mold, and then the LED module to be encapsulated is placed into the accommodating space in the first mold and above the second mold. Cover the apron after the completion of the surface encapsulating of LED module, the space that apron, curb plate and LED module surround and form is filled up to colloid, and the upper surface of colloid forms level and smooth even plane under the planar effect of apron simultaneously. After the glue filling process is finished, the cover plate is removed, the second die is separated from the containing groove under the action of the pushing structure, and the LED module is pushed out of the end face of the first die, so that the LED module is convenient to take out.

Drawings

The accompanying drawings, which form a part of the present application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic view showing an assembly structure of an embodiment of a jig for filling glue into an LED module according to the present invention;

fig. 2 is a schematic view illustrating an exploded structure of the jig for filling the LED module of fig. 1;

fig. 3 is a schematic structural diagram of a first mold of the jig for filling glue into the LED module in fig. 2;

FIG. 4 shows a schematic bottom view of the first mold of FIG. 3;

fig. 5 is a schematic structural diagram of a second mold of the jig for filling glue into the LED module in fig. 2;

fig. 6 is a schematic cross-sectional structural view of the jig for filling the LED module of fig. 1;

fig. 7 is a schematic view showing a partially enlarged structure at a position a of the jig for filling the LED module of fig. 6; and,

Fig. 8 shows a schematic structural diagram of an LED module to be potted.

Wherein the figures include the following reference numerals:

10. a first mold; 11. a base plate; 12. a side plate; 13. accommodating grooves; 14. a rib is protruded; 15. lapping steps; 16. a second through hole; 18. fixing grooves; 20. a second mold; 21. a frame; 22. a support; 23. a boss portion; 26. a third through hole; 30. a pushing structure; 31. a first through hole; 32. carrying out top thread; 40. a cover plate; 50. an LED module; 51. an LED lamp; 52. a PCB board; 60. fastening screws; 71. a first magnet; 72. a second magnet; 73. fixing grooves; 80. a pillar; 90. a tray.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

As shown in fig. 1 and fig. 2, the jig for filling glue into an LED module of the present embodiment includes a first mold 10, a second mold 20, a pushing structure 30 and a cover plate 40. The first mold 10 includes a bottom plate 11 and a side plate 12, the side plate 12 is disposed along an edge of the bottom plate 11, and an accommodating groove 13 is disposed on the bottom plate 11. The second mold 20 is removably disposed in the receiving groove 13, and the second mold 20 is fitted to the receiving groove 13. The pushing structure 30 is disposed on the first mold 10 and can push the second mold 20 out of the accommodating groove 13. The cover plate 40 can be provided to cover the end surfaces of the side plates 12 to form a relatively closed regular space in the first mold 10.

With the technical solution of the present embodiment, the bottom plate 11 and the side plate 12 of the first mold 10 form an accommodating space for accommodating the LED module 50. Before the glue filling process, the second mold 20 is placed into the accommodating groove 13 of the first mold 10, and then the LED module 50 to be filled is placed into the accommodating space above the second mold in the first mold 10. After the surface of the LED module 50 is filled with glue, the cover plate 40 is covered, the space formed by the cover plate 40, the side plate 12 and the LED module 50 is filled with the glue, and meanwhile, the upper surface of the glue forms a flat and uniform plane under the action of the plane of the cover plate 40. After the glue filling process is completed, the cover plate 40 is removed, the second mold 20 is separated from the accommodating groove 13 under the action of the pushing structure 30, and the LED module 50 is pushed out of the end face of the first mold 10, so that the LED module 50 is conveniently taken out.

Preferably, the cover plate 40 of this embodiment is made of a transparent material, so that an operator can monitor the glue filling condition in real time through the cover plate 40, and timely adjust the bad phenomena such as bubbles appearing in the glue, thereby avoiding the occurrence of defective products. The cover plate 40 of the present embodiment is preferably made of a coated tempered glass, so that the cured glue surface is easily separated from the cover plate 40.

As shown in fig. 8, the LED module 50 suitable for this embodiment specifically includes a PCB 52, an LED lamp 51, a component and a module bracket, etc., where the LED lamp is located on the front side of the PCB, the component and the module bracket are located on the back side of the PCB 52, and the module bracket surrounds the periphery of the component. As shown in fig. 3 and 5, the second mold 20 of the present embodiment has the same contour as the module holder of the LED module 50, so that the second mold 20 can directly act on the module holder, thereby facilitating the pushing out of the LED module 50.

As shown in fig. 2 to 7, the pushing structure 30 of the present embodiment includes a plurality of first through holes 31 disposed at the bottom of the accommodating groove 13 and a plurality of top threads 32 disposed in one-to-one correspondence with the plurality of first through holes 31. The top thread 32 penetrates through the first through hole, and the second mold 20 can be pushed out of the accommodating groove 13 by pushing the top thread 32, so that the LED module 50 can be taken out. Specifically, as shown in fig. 5, the second mold 20 of the present embodiment includes a frame 21 provided along the inner surface of the side plate 12, a bracket 22 provided in the frame 21, and a plurality of protrusions 23 provided inside the frame 21. Accordingly, a part of the first through holes 31 corresponds to the position of the frame 21, and a part of the first through holes 31 corresponds to the position of the protrusions 23, so that the effect of the jackscrews 32 on the second mold 20 is uniformly arranged in the second mold 20, facilitating smooth removal of the second mold 20.

Because the back of the LED module 50 can lead to unevenness because of the electric element, therefore, the bottom plate 11 of the first mold 10 of this embodiment is provided with a plurality of ribs 14 arranged at intervals, when the LED module 50 is arranged in the first mold 10, the components can extend into the gaps between the ribs 14, so that the front of the LED module 50 is kept horizontal, which is beneficial to glue filling.

As shown in fig. 3 to 7, the bottom plate 11 of this embodiment is further provided with a plurality of second through holes 16, the second mold 20 is provided with a plurality of third through holes 26, and the fastening screws 60 can fix the LED module to be subjected to glue filling in the first mold 10 through the second through holes 16 and the third through holes 26, so as to prevent the LED module 50 from moving in the glue filling process and affecting the glue filling effect.

As shown in fig. 6 and 7, the side plate 12 of the first mold 10 of this embodiment is provided with the overlapping step 15, the depth h of the overlapping step 15 can be determined according to actual specific process requirements, when the LED module 50 is placed in the first mold 10, the module holder of the LED module 50 is placed on the second mold 20, the edge of the PCB 52 is overlapped on the overlapping step 15, and the minimum distance between the LED module 50 and the cover plate 40 is the minimum thickness of the glue film after glue pouring. The thickness is preferably 0.07mm to 0.15mm, and more preferably 0.12 mm.

In order to facilitate production and reduce the probability of glue leakage, when the LED module 50 is placed in the first mold 10, a preset distance is provided between the side plate of the lap step 15 and the edge of the LED module 50, and the value of the single side of the preset distance is preferably between 0.05mm and 0.10mm, and more preferably 0.07 mm.

As shown in fig. 1 to 7, the side plate 12 of the present embodiment is provided with a fixing groove 73, a first magnet 71 is disposed in the fixing groove 73, a second magnet 72 is disposed on the cover plate 40 at a position corresponding to the first magnet 71, and the first magnet 71 and the second magnet 72 can be attracted. The cover plate 40 is pressed on the first die 10 by utilizing the characteristic that magnets attract oppositely, so that the disassembly and assembly operations are convenient. The fixing groove 73 includes a fixing section adapted to the first magnet 71 and an inserting section having a diameter larger than the fixing section, the inserting section having openings at both bottom and side surfaces of the first mold 10 to facilitate the insertion of the first magnet 71 into the fixing groove 73.

The concrete glue filling process can be roughly divided into:

the first magnet 71 is prepared before filling, and the south pole of the first magnet is placed in the fixing groove 73 of the first mold 10 to face upward, and then fixed by glue. The second mold 20 is first placed in the receiving groove 13 of the first mold 10, and then the LED module 50 is placed therein. The LED module 50 is fixed to the first mold 10 together with the second mold 20 by fastening screws 60, and a plurality of support posts 80 are further provided on the bottom plate 11 of the first mold 10, and the support posts 80 are fixed in fixing grooves 18 on the bottom plate 11 so that the first mold 10 can be erected in the tray 90.

And (4) performing encapsulation operation, namely filling the gap formed by the prepared epoxy resin adhesive LED module 50 and the first die 10. And putting the tray 90 into a vacuum box for vacuumizing, and standing to completely exhaust bubbles in the glue.

And taking out the product with bubbles, checking whether bubbles and impurities exist in the rubber body, and after the situation that no error exists is confirmed, using the cover plate 40 to cover the rubber surface to be flat so as to ensure that no bubbles exist in the cover plate and the rubber surface.

Since the glue surface is in a liquid state, the second magnet 72 placed on the top surface of the cover plate 40 is attracted to and fixed to the first magnet 71 preset in the first mold 10. And placing the encapsulated module with the jig into a curing workshop for standing.

After the module is cured, the second magnet 72 and the cover plate 40 are removed, the fastening screws 60 are removed, the reserved jackscrews 32 are used for ejecting the LED module 50, and the LED module 50 after glue pouring is switched to the next procedure.

From the above description, it can be seen that the above-mentioned embodiments of the present invention achieve the following technical effects:

the bottom plate and the side plate of the first die form an accommodating space for accommodating the LED module. Before the glue filling process, the second mold is placed into the accommodating groove of the first mold, and then the LED module to be filled is placed into the accommodating space in the first mold and above the second mold. After the surface of the LED module is filled with glue, the cover plate is covered, the space formed by the cover plate, the side plates and the LED module in an enclosing mode is filled with the glue, and meanwhile, the upper surface of the glue forms a flat and uniform plane under the effect of the plane of the cover plate. After the glue filling process is finished, the cover plate is moved out, the second die is separated from the containing groove under the action of the pushing structure, and then the LED module is pushed out of the end face of the first die, so that the LED module is convenient to take out.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a tool for LED module encapsulating which characterized in that includes:

the first die (10) comprises a bottom plate (11) and side plates (12), wherein the side plates (12) are arranged along the edge of the bottom plate (11), an accommodating groove (13) is formed in the upper surface of the bottom plate (11), an accommodating space for accommodating an LED module (50) to be encapsulated is further arranged between the bottom plate (11) and the side plates (12), and the accommodating space is located above the accommodating groove (13);

a second mold (20) removably disposed in the housing groove (13);

the pushing structure (30) is arranged on the first mold (10) and can push the second mold (20) out of the accommodating groove (13);

and a cover plate (40) which can be covered on the end surface of the side plate (12).

2. The jig for LED module potting of claim 1, wherein the second mold (20) comprises a frame (21) disposed along an inner surface of the side plate (12) and a bracket (22) disposed in the frame (21).

3. The jig for filling adhesive to an LED module according to claim 2, wherein the pushing structure (30) comprises a plurality of first through holes (31) disposed at the bottom of the accommodating groove (13) and a plurality of top screws (32) disposed corresponding to the first through holes (31) one to one.

4. The jig for filling glue to an LED module according to claim 3, wherein the second mold (20) further comprises a plurality of protrusions (23) disposed inside the frame (21), and the positions of some of the first through holes (31) correspond to the positions of the protrusions (23).

5. The jig for filling glue to an LED module according to claim 1, wherein a plurality of ribs (14) are arranged on the bottom plate (11) at intervals.

6. The jig for glue filling of LED modules according to claim 1, characterized in that the side plate (12) is provided with a lap step (15).

7. The jig for LED module potting according to claim 1, wherein a fixing groove (73) is provided on the side plate (12), a first magnet (71) is provided in the fixing groove (73), the jig for LED module potting further comprises a second magnet (72), the second magnet (72) can be placed on the cover plate (40), and the first magnet (71) and the second magnet (72) can be attracted.

8. The jig for glue filling of LED modules according to claim 1, wherein the cover plate (40) is made of transparent glass.

9. The jig for LED module potting according to claim 1, further comprising a plurality of support posts (80), wherein the plurality of support posts (80) are disposed below the bottom plate (11) of the first mold (10).

10. The jig for LED module potting according to claim 1, wherein a plurality of second through holes (16) are provided on the bottom plate (11), a plurality of third through holes (26) are provided on the second mold (20), and a fastener can fix the LED module to be potted in the first mold (10) through the second through holes (16) and the third through holes (26).