CN215550528U

CN215550528U - LED packaging mold capable of automatically demolding

Info

Publication number: CN215550528U
Application number: CN202121629423.1U
Authority: CN
Inventors: 麦强
Original assignee: Shenzhen Xingyuan Photoelectric Technology Co ltd
Current assignee: Shenzhen Xingyuan Photoelectric Technology Co ltd
Priority date: 2021-07-16
Filing date: 2021-07-16
Publication date: 2022-01-18
Anticipated expiration: 2031-07-16

Abstract

The utility model discloses an LED packaging mold capable of automatically demolding, which is used for covering packaging glue on an LED product and comprises a first mold base and a second mold base. The first die holder is provided with a die cavity, a glue inlet communicated with the die cavity and a plurality of exhaust grooves, and the die cavity is matched with the LED product and used for forming and packaging glue. The second die holder is used for fixing the LED product, and the second die holder and the first die holder are matched to form a packaging space for accommodating the LED product. The contact surface of the die cavity and the packaging adhesive is a non-adhesive surface, after the packaging adhesive is cured, the packaging adhesive can be automatically separated from the die, a release agent does not need to be sprayed, a release film is used, and the like, so that the production efficiency is improved; meanwhile, the lines on the surface of the packaging glue of each LED product packaged by the utility model are consistent, so that the consistent surface of the packaging glue of the LED display integrated package can be ensured, high contrast and high product reliability are realized, and the display effect of the LED display screen is improved.

Description

LED packaging mold capable of automatically demolding

Technical Field

The utility model relates to the technical field of semiconductor packaging, in particular to an LED packaging mold capable of automatically demolding.

Background

The LED display module generally includes a substrate (e.g., a PCB), an LED unit, a driving circuit, etc., wherein a functional area for fixing the LED unit is disposed on the substrate, and a step of covering a package adhesive in the functional area is an essential and critical step in the LED package.

In the integrated packaging process of the LED display screen, in order to make the packaging adhesive better separate from the mold, the following packaging schemes are generally adopted in the industry at present: according to the first scheme, the release agent is sprayed on the surface of the mold before the packaging adhesive is injected, the spraying release agent is usually operated manually, the quantity of the sprayed release agent cannot be controlled to be consistent, the uniformity of the sprayed release agent is not consistent, the reliability and the surface consistency of a packaged product are seriously influenced, and when the display module produced by adopting the scheme is spliced into the LED display screen, the surface reflection of the whole LED display screen is easily caused, and the light emitting effect of the whole LED display screen is influenced; and in the second scheme, a printing scheme and a dispensing self-leveling scheme are used, the processing efficiency is low, the working procedures are complex, the surface consistency of the final packaging glue is difficult to control, the surface consistency of the packaging glue of the packaging product is influenced, and the glare phenomenon is easy to form.

Therefore, it is desirable to provide a new packaging solution to solve the above-mentioned drawbacks of the existing packaging solutions.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an LED packaging mold capable of realizing automatic demolding of packaging glue.

In order to achieve the purpose, the utility model discloses an LED packaging mold capable of automatically demolding, which is used for covering packaging glue on an LED product. The LED packaging die comprises a first die holder and a second die holder. The first die holder is provided with a die cavity, a glue inlet communicated with the die cavity and a plurality of exhaust grooves, the die cavity is matched with the LED product and used for forming packaging glue, and the contact surface of the die cavity and the packaging glue is a non-adhesive surface. The second die holder is used for fixing the LED product, and the second die holder is matched with the first die holder to form a packaging space for accommodating the LED product.

Compared with the prior art, the contact surface of the die cavity and the packaging adhesive is the non-adhesive surface, after the packaging adhesive is cured, the packaging adhesive can be automatically separated from the die, a release agent does not need to be sprayed, a release film is not used, and the production efficiency is improved; meanwhile, the lines on the surface of the packaging glue of each LED product packaged by the utility model are consistent, so that the consistent surface of the packaging glue of the LED display integrated package can be ensured, high contrast and high product reliability are realized, and the display effect of the LED display screen is improved.

Specifically, the first die holder comprises a die frame and a die core, the die core is arranged in the die frame, and the die core and the die frame form the die cavity.

Specifically, the mold frame and the mold core are of an integral structure.

Specifically, the mold core comprises a main body and a non-stick adhesive layer coated on the surface of the main body, and one surface of the non-stick adhesive layer, which is far away from the main body, is the contact surface.

Specifically, the thickness of the non-stick glue layer is 0.1 mm-3.0 mm.

Specifically, the non-stick adhesive layer is epoxy adhesive, silica gel or plastic.

Specifically, the surface of the non-stick adhesive layer in contact with the packaging adhesive is a matte surface, a mirror surface or a matte surface.

Specifically, the glue inlet and the plurality of exhaust grooves are respectively arranged on two opposite sides of the mold frame

Specifically, the first die holder is provided with a plurality of positioning holes arranged at intervals, the second die holder is provided with a plurality of positioning pins respectively matched with one positioning hole, and each positioning pin penetrates through an LED product and is in plug-in fit with the corresponding positioning hole to position the LED product.

Specifically, one side of the second die holder facing the LED product is of a semi-hollow structure.

Drawings

Fig. 1 is a schematic perspective view of a first mold base according to an embodiment of the utility model.

FIG. 2 is a top view of the first die holder shown in FIG. 1.

FIG. 3 is a schematic cross-sectional view of a mold core according to an embodiment of the utility model.

Fig. 4 is a partial schematic structural view of a second mold base according to an embodiment of the utility model.

Detailed Description

The following detailed description is given with reference to the accompanying drawings for illustrating the contents, structural features, and objects and effects of the present invention.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "inside", "outside", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, and thus, are not to be construed as limiting the scope of the present invention.

Referring to fig. 1 to 4, the utility model discloses an LED package mold capable of automatically demolding, which is mainly suitable for packaging LED CHIP devices, LED integrated display products, and the like. The LED packaging die comprises a first die holder 1 and a second die holder 2. The first die holder 1 is provided with a die cavity 10, a glue inlet 13 communicated with the die cavity 10, and a plurality of exhaust grooves 14, wherein the die cavity 10 is adapted to an LED product (not shown) and used for molding packaging glue. The second die holder 2 is used for fixing the LED product, and the second die holder 2 is matched with the first die holder 1 to package the LED product inside. The contact surface 1221 of the mold cavity 10 and the packaging adhesive is a non-adhesive surface. Specifically, the surface treatment is performed on the mold cavity 10, so that the mold cavity 10 and the packaging adhesive have no viscosity or only slight viscosity, and the solidified packaging adhesive is automatically separated from the mold without spraying a release agent or using a release film.

The present invention will be described in detail below with reference to fig. 1 to 4 of the drawings by taking specific embodiments as examples.

Referring to fig. 1 and 2, as shown in fig. 1 and 2, the first mold base 1 includes a mold frame 11 and a mold core 12, the mold core 12 is disposed in the mold frame 11, and the mold core 12 and the mold frame 11 form a mold cavity 10. The thickness of the encapsulating glue on the final LED product depends on the depth of the mold core 12. The depth of the mold core 12 can be adjusted according to the thickness requirement of the LED product packaging adhesive, and for the LED display module, the depth of the mold core 12 is usually 0.1 mm-5.0 mm.

Referring to fig. 3, as shown in fig. 3, the mold core 12 includes a main body 121 and a non-stick layer 122 covering the surface of the main body 121, and a surface of the non-stick layer 122 facing away from the main body 121 is a contact surface 1221 between the mold cavity 10 and the packaging adhesive. Optionally, the non-stick layer 122 may be epoxy glue, silica gel, plastic, or pure teflon, and may be selected according to the requirement in the specific implementation. The contact surface 1221 of the non-stick adhesive layer 122 and the packaging adhesive can be a frosted surface, a smooth surface, a matte surface, a bright smooth surface, a bright matte surface or a matte surface, and can be selected according to requirements in specific implementation. For the LED display module, the thickness of the non-stick layer 122 may be selected to be 0.1mm to 3.0 mm.

As the preferred embodiment, the mold frame 11 and the mold core 12 are of an integral structure, the processing technology is simple, and the structure is stable and firm. Of course, in other embodiments, the mold frame 11 and the mold core 12 may be separated from each other, so the utility model should not be limited thereto.

Referring to fig. 1 and 2, as shown in fig. 1 and 2, the glue inlet 13 and the air exhaust grooves 14 are disposed on the mold frame 11, and the glue inlet 13 and the air exhaust grooves 14 are respectively disposed on two opposite sides of the mold frame 11. The liquid encapsulation adhesive enters the die cavity 10 from the adhesive inlet 13 and adheres to the LED product, and after curing, the encapsulation adhesive covering the specific area of the LED product is formed on the LED product. In the embodiment shown in fig. 1, the glue inlet 13 is disposed at the middle position of one side of the mold frame 11, and the plurality of air exhaust grooves 14 penetrate the mold frame 11 inwards to communicate with the mold cavity 10 and penetrate the mold frame 11 outwards to communicate with the outside, so as to exhaust air. Of course, the glue inlet 13 and the plurality of air discharge grooves 14 are not limited to be disposed oppositely, and may be disposed on two adjacent sides of the mold frame 11.

Referring to fig. 2 and 4, in the embodiment shown in fig. 2 and 4, the mold frame 11 is inserted and fixed with the second mold base 2. Specifically, the four corners of the mold frame 11 are respectively provided with a positioning hole 15, the four corners of the second mold base 2 are respectively provided with a positioning pin 21 correspondingly matched with the positioning hole 15, and each positioning pin 21 can penetrate through the LED product and is in insertion fit with the positioning hole 15 to position the LED product. The LED product, the second die holder 2 and the first die holder 1 are fixed by matching the positioning holes 15 and the positioning pins 21.

As shown in fig. 4, one side of the second mold base 2 facing the LED product is a semi-hollow structure to form a clearance, and the second mold base has a plurality of supporting points 22 to support the LED product. Certainly, under the condition that the LED product does not need to be avoided, a side of the second mold base 2 facing the LED product may be a complete plane, so the utility model should not be limited thereto.

The following describes the usage of the LED package mold of the present invention, taking the LED product as an LED display module as an example:

generally, the LED display module includes a substrate, an LED unit, a driving circuit, and the like, wherein a functional area for fixing the LED unit is disposed on the substrate, and correspondingly, a glue inlet 13 is disposed at a position corresponding to a position outside the functional area of the substrate on one side of the mold frame 11. The second die holder 2 is used for fixing a substrate, when an LED product is packaged, firstly, the back of the substrate is placed on the second die holder 2 downwards, and at the moment, the positioning pins 21 penetrate through corresponding through holes of the substrate; then, heating the die, aligning the positioning pin 21 of the second die holder 2 with the LED product to the positioning hole 15 of the first die holder 1 after the temperature is reached, and closing the second die holder 2 and the first die holder 1; automatically injecting liquid packaging glue through the glue inlet 13 by using an automatic glue injection system; curing the packaging adhesive after the pressing time is up; and then, separating the second die holder 2 from the first die holder 1, and at the moment, automatically demolding the packaging glue and the first die holder 1 to finish packaging.

In an embodiment, the LED package mold of the present invention is suitable for a package of an LED display module having a substrate with a length of 50mm to 300mm and a width of 50mm to 250mm, wherein the substrate may be FA4, BT, copper substrate, ceramic substrate, aluminum substrate, glass substrate, or flexible substrate.

In conclusion, the surface treatment is carried out on the mold core 12, so that the contact surface 1221 of the mold cavity 10 and the packaging adhesive is an adhesive-free surface, the packaging adhesive can be automatically separated from the mold after the packaging adhesive is cured, a release agent does not need to be sprayed, a release film is used, and the like, and the production efficiency is improved; meanwhile, the lines on the surface of the packaging glue of each LED product packaged by the utility model are consistent, so that the consistent surface of the packaging glue of the LED display integrated package can be ensured, high contrast and high product reliability are realized, and the display effect of the LED display screen is improved.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the appended claims.

Claims

1. An LED packaging mold capable of automatically demolding is used for covering packaging glue on an LED product, and is characterized by comprising:

the LED packaging mold comprises a first mold base, a second mold base and a plurality of sealing rings, wherein the first mold base is provided with a mold cavity, a glue inlet communicated with the mold cavity and a plurality of exhaust grooves, the mold cavity is matched with an LED product and is used for molding packaging glue, and the contact surface of the mold cavity and the packaging glue is a non-adhesive surface; and

the second die holder is used for fixing the LED product, and the second die holder is matched with the first die holder to form a packaging space for accommodating the LED product.

2. The LED package mold of claim 1, wherein the first mold base comprises a mold frame and a mold core, the mold core being disposed within the mold frame, the mold core and the mold frame forming the mold cavity.

3. The LED package mold of claim 2, wherein the mold frame is a unitary structure with the mold core.

4. The LED packaging mold according to claim 2, wherein the mold core comprises a main body and a non-stick layer coated on a surface of the main body, and a surface of the non-stick layer facing away from the main body is the contact surface.

5. The LED packaging mold according to claim 4, wherein the thickness of the non-stick layer is 0.1mm to 3.0 mm.

6. The LED package mold of claim 4, wherein the non-stick layer is epoxy, silicone, or plastic.

7. The LED packaging mold according to claim 4, wherein the surface of the non-stick adhesive layer in contact with the packaging adhesive is a matte surface, a mirror surface or a matte surface.

8. The LED packaging mold according to claim 2, wherein the glue inlet and the plurality of air exhaust grooves are respectively disposed on two opposite sides of the mold frame.

9. The LED packaging mold according to any one of claims 1 to 8, wherein the first mold base defines a plurality of positioning holes arranged at intervals, the second mold base defines a plurality of positioning pins respectively adapted to one of the positioning holes, and each positioning pin passes through an LED product and is inserted into and engaged with the corresponding positioning hole to position the LED product.

10. The LED packaging mold according to any one of claims 1 to 8, wherein a side of the second mold base facing the LED product is a semi-hollow structure.