CN210224077U - OLED packaging mold - Google Patents
OLED packaging mold Download PDFInfo
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- CN210224077U CN210224077U CN201921393535.4U CN201921393535U CN210224077U CN 210224077 U CN210224077 U CN 210224077U CN 201921393535 U CN201921393535 U CN 201921393535U CN 210224077 U CN210224077 U CN 210224077U
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Abstract
The utility model belongs to the technical field of the mould, especially, relate to an OLED packaging mold, OLED packaging mold includes: the device comprises a bottom plate, a cover plate and at least two buckles for fixing the bottom plate and the cover plate; the bottom plate is provided with a device glass groove for placing OLED device glass and an encapsulation glass groove for placing encapsulation glass; and a plurality of light holes are formed in the packaging glass groove. Laminate OLED device and encapsulation glass through bottom plate and apron, then adopt the buckle to fix bottom plate and apron, accomplish the encapsulation of OLED device, solved at the research and development in-process of OLED device, adopt manual mode to encapsulate OLED device, not only bring great error for the experiment, often can lead to the destruction of OLED device moreover, the problem of the development process of very big influence OLED research and development.
Description
Technical Field
The utility model relates to the technical field of mold, especially, relate to a OLED packaging mold.
Background
At present, Organic Light-Emitting diodes (OLEDs) are known as fourth generation lighting technologies and have great potential for development. The OLED lighting has the advantages of no blue light harm, soft light, flexibility, foldability, no stroboflash, high color development quality and the like, and is widely concerned, so that a great amount of manpower and material resources are put into the OLED field by domestic and foreign research institutions and companies.
However, in the development process of the OLED device, the OLED device is usually packaged manually, which not only brings great errors to the experiment, but also often results in the destruction of the OLED device, and greatly affects the development process of the OLED development.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an OLED packaging mold aims at solving at the research and development in-process of OLED device, adopts manual mode to encapsulate the OLED device, not only brings great error for the experiment, often can lead to the destruction of OLED device moreover, the problem of the development process of very big influence OLED research and development.
The embodiment of the utility model provides an OLED packaging mold, OLED packaging mold includes: the device comprises a bottom plate, a cover plate and at least two buckles for fixing the bottom plate and the cover plate;
the bottom plate is provided with a device glass groove for placing OLED device glass and an encapsulation glass groove for placing encapsulation glass;
and a plurality of light holes are formed in the packaging glass groove.
Optionally, at least two side surfaces of the bottom plate are provided with bottom plate grooves; cover plate grooves are formed in at least two side faces of the cover plate;
the buckle is concave, and two sides of the buckle are respectively provided with a bulge; and the two bulges of each buckle are respectively matched with the bottom plate groove and the cover plate groove.
Optionally, the cover plate is in a convex shape, and the length and the width of the protruding portion of the cover plate are respectively consistent with those of the device glass groove.
Optionally, the package glass groove is shaped like a cuboid and is formed by four corner regions; the packaging glass groove is internally provided with four light holes which are respectively arranged in four corner areas of the packaging glass groove.
Optionally, the four light holes are all rectangular solids.
Optionally, the material of the bottom plate is polytetrafluoroethylene.
Optionally, the cover plate is made of polytetrafluoroethylene.
Optionally, the length of the device glass groove is 35mm, the width of the device glass groove is 35mm, and the depth of the device glass groove is 2 mm.
Optionally, the length of the package glass groove is 33mm, the width of the package glass groove is 29mm, and the depth of the package glass groove is 1 mm.
Optionally, the length of the bottom plate is 50mm, and the width of the bottom plate is 50 mm.
The utility model provides a OLED packaging mold, OLED packaging mold includes: the device comprises a bottom plate, a cover plate and at least two buckles for fixing the bottom plate and the cover plate; the bottom plate is provided with a device glass groove for placing OLED device glass and an encapsulation glass groove for placing encapsulation glass; and a plurality of light holes are formed in the packaging glass groove. Laminate OLED device and encapsulation glass through bottom plate and apron, then adopt the buckle to fix bottom plate and apron, accomplish the encapsulation of OLED device, solved at the research and development in-process of OLED device, adopt manual mode to encapsulate OLED device, not only bring great error for the experiment, often can lead to the destruction of OLED device moreover, the problem of the development process of very big influence OLED research and development.
Drawings
Fig. 1 is a schematic view of an OLED encapsulation mold according to an embodiment of the present invention;
fig. 2 is a schematic view of a cover plate according to an embodiment of the present invention;
fig. 3 is a schematic view of a bottom plate according to an embodiment of the present invention;
fig. 4 is an encapsulation schematic diagram of the OLED device encapsulated by the OLED encapsulation mold provided by the embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it is to be understood that the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
Fig. 1 is the structural schematic diagram of the OLED packaging mold in the embodiment of the present invention, as shown in fig. 1, the OLED packaging mold in this embodiment includes: the base plate 10, the cover plate 20 and at least two buckles 30 for fixing the base plate 10 and the cover plate 20; a device glass groove 101 for placing OLED device glass and a packaging glass groove 102 for placing packaging glass are arranged on the bottom plate 10; a plurality of light holes 103 are arranged in the packaging glass groove 102.
In this embodiment, the package glass groove 102 is disposed at the lowest layer of the groove of the bottom plate 10, the device glass groove 101 is disposed on the second layer of the groove, the area of the device glass groove 101 is larger than the panel of the package glass groove 102, in the package application, the package glass is disposed in the package glass groove 102, then the device glass is disposed, at this time, the device glass is supported by the device glass groove 101, the device layer is prevented from being damaged in the pressing process, and finally, the package glass and the device glass are packaged and fixed by the buckle 30 and the cover plate 20. Further, after the pressing, the glue between the packaging glass and the device glass is cured through the light hole 103 in an ultraviolet curing manner, so that the packaging is completed quickly.
In one embodiment, at least two sides of the base plate 10 are provided with base plate grooves 104; at least two side surfaces of the cover plate 20 are provided with cover plate grooves 202; the buckle 30 is concave, and two sides of the buckle 30 are respectively provided with a bulge; the two protrusions of each clip 30 mate with the base plate recess 104 and cover plate recess 202, respectively.
In this embodiment, two protrusions are formed on two sides of the clip 30, and the two protrusions are respectively matched with the bottom plate groove 104 and the cover plate groove 202, for example, the protrusion on the first side is embedded in the bottom plate groove 104, and the protrusion on the second side is embedded in the cover plate groove 202.
In one embodiment, referring to FIG. 2, the cover plate 20 is "convex" in shape, and the length and width of the protruding portion 201 of the cover plate 20 correspond to the length and width of the device glass channel 101, respectively.
In this embodiment, the size of the protrusion 201 of the cover plate 20 is matched to the size of the device glass groove 101 in the base plate 10, so that the device glass is fixed in the encapsulation mold during the encapsulation process, and the OLED device is prevented from being displaced during the encapsulation process.
In one embodiment, the device glass channel 101 is square in shape.
In one embodiment, referring to fig. 3, the package glass channel 102 is rectangular parallelepiped in shape and is formed by four corner regions; four light holes 103 are arranged in the packaging glass groove 102, and the four light holes 103 are respectively arranged in four corner regions of the packaging glass groove 102.
In this embodiment, the shape of the packaging glass groove 102 is a cuboid, and a light hole 103 is respectively arranged in four corner regions, so that ultraviolet irradiation can be performed on the ultraviolet curing adhesive coated on the packaging glass through the light hole 103 in the packaging process, and the packaging speed of the OLED device is increased.
In one embodiment, the package glass channel 102 is square in shape.
In one embodiment, referring to fig. 3, the bottom plate grooves 104 formed on both sides of the bottom plate 10 may have two depths, and correspondingly, the protrusions formed on the clip 30 on one side corresponding to the bottom plate grooves 104 also have two depths, and by providing two depths corresponding to the clips 30 in the bottom plate grooves 104, the displacement of the clips 30 during the packaging process can be prevented.
In one embodiment, the four light-transmissive holes 103 are each rectangular parallelepiped in shape. In this embodiment, since the uv-curable adhesive is coated on the edge region of the package glass, the uv-curable adhesive can be increased in the uv-irradiation area by setting the shape of the light transmission hole 103 to a rectangular parallelepiped.
In one embodiment, the material of the base plate 10 is polytetrafluoroethylene.
In one embodiment, the material of the cover plate 20 is polytetrafluoroethylene. In the present embodiment, by preparing the base plate 10 and the cover plate 20 using the teflon material, the package glass and the device glass can be prevented from being crushed.
In one embodiment, the device glass channel 101 has a length of 35mm, the device glass channel 101 has a width of 35mm, and the device glass channel 101 has a depth of 2 mm. In the present embodiment, cover plate 20 boss 201 is used to fit into device glass well 101 at the time of packaging, and the size of cover plate 20 boss 201 matches the size of device glass well 101, wherein in one embodiment, the height of cover plate 20 boss 201 is 0.8 mm.
In one embodiment, the length of the package glass groove 102 is 33mm, the width of the package glass groove 102 is 29mm, and the depth of the package glass groove 102 is 1 mm.
In one embodiment, the height of the base plate 10 is equal to the height of the cover plate 20.
In one embodiment, the length of the base plate 10 is 50mm and the width of the base plate 10 is 50 mm.
In an embodiment, when the package mold provided in this embodiment is used to package a device, the following steps may also be adopted: firstly, the packaging glass is put into the packaging glass groove 102 of the mold base plate 10 (if the packaging glass is provided with a groove, the placing direction is that the side with the groove faces upwards), then the ultraviolet curing glue is evenly coated on the edge position of the packaging glass, and the drying agent is evenly coated in the groove of the packaging glass. After the glue is coated on the packaging glass, the device glass (the device layer is formed on the surface of the device glass) is placed in the device glass groove 101, and the device glass is placed in a downward direction with the device layer facing downwards. After the device glass is put into the base plate 10, the mold cover plate 20 is closed in the direction in which the boss 201 faces downward, and then the left and right snaps 30 are fitted, as shown in fig. 4. Because the relative positions of the device glass and the packaging glass are limited by the device glass groove 101 and the packaging glass groove 102, relative movement cannot occur, and the stability of the OLED device is improved.
Further, when the uv curing process is performed, the entire mold is first irradiated upside down for 20 minutes, and then the device is taken out of the mold and the uv curing process is performed again. During the first ultraviolet curing, besides the gravity of the bottom plate 10, the stress of the deformation of the polytetrafluoroethylene applied by the buckle 30 presses the device glass and the packaging glass, so that the combination of the device glass and the packaging glass is more compact. During the second uv curing process, the four corners of the cover plate 20 are completely cured, so that the relative position between the package glass and the device glass is not changed during the second uv irradiation.
The utility model provides a OLED packaging mold, OLED packaging mold includes: the base plate 10, the cover plate 20 and at least two buckles 30 for fixing the base plate 10 and the cover plate 20; a device glass groove 101 for placing OLED device glass and a packaging glass groove 102 for placing packaging glass are arranged on the bottom plate 10; a plurality of light holes 103 are arranged in the packaging glass groove 102. Laminate OLED device and encapsulation glass through bottom plate 10 and apron 20, then adopt buckle 30 to fix bottom plate 10 and apron 20, accomplish the encapsulation of OLED device, solved in the research and development process of OLED device, adopt manual mode to encapsulate the OLED device, not only bring great error for the experiment, can lead to the destruction of OLED device moreover often, the problem of the development process of very big influence OLED research and development.
The above description is only an alternative embodiment of the present invention, and should not be construed as limiting the present invention, and any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. An OLED encapsulation mold, comprising: the device comprises a bottom plate, a cover plate and at least two buckles for fixing the bottom plate and the cover plate;
the bottom plate is provided with a device glass groove for placing OLED device glass and an encapsulation glass groove for placing encapsulation glass;
and a plurality of light holes are formed in the packaging glass groove.
2. The OLED encapsulation mold of claim 1, wherein at least two sides of the backplane are provided with backplane grooves; cover plate grooves are formed in at least two side faces of the cover plate;
the buckle is concave, and two sides of the buckle are respectively provided with a bulge; and the two bulges of each buckle are respectively matched with the bottom plate groove and the cover plate groove.
3. The OLED encapsulation mold of claim 1, wherein the cover plate is "convex" in shape, and the length and width of the protruding portion of the cover plate correspond to the length and width of the device glass channel, respectively.
4. The OLED encapsulation mold according to claim 1, wherein the encapsulation glass channel is shaped as a cuboid and is formed by four corner regions; the packaging glass groove is internally provided with four light holes which are respectively arranged in four corner areas of the packaging glass groove.
5. The OLED packaging mold of claim 4, wherein the four light holes are each rectangular parallelepiped in shape.
6. The OLED packaging mold of claim 4, wherein the material of the backplane is polytetrafluoroethylene.
7. The OLED encapsulation mold of claim 1, wherein the cover plate is polytetrafluoroethylene.
8. The OLED encapsulation mold of claim 7, wherein the device glass channel has a length of 35mm, a width of 35mm, and a depth of 2 mm.
9. The OLED encapsulation mold according to claim 8, wherein the length of the encapsulation glass channel is 33mm, the width of the encapsulation glass channel is 29mm, and the depth of the encapsulation glass channel is 1 mm.
10. The OLED encapsulation mold of claim 9, wherein the length of the backplane is 50mm and the width of the backplane is 50 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921393535.4U CN210224077U (en) | 2019-08-26 | 2019-08-26 | OLED packaging mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921393535.4U CN210224077U (en) | 2019-08-26 | 2019-08-26 | OLED packaging mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210224077U true CN210224077U (en) | 2020-03-31 |
Family
ID=69920007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921393535.4U Active CN210224077U (en) | 2019-08-26 | 2019-08-26 | OLED packaging mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210224077U (en) |
-
2019
- 2019-08-26 CN CN201921393535.4U patent/CN210224077U/en active Active
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