TW201637812A - Resin molding die, resin molding method, and method for producing resin molded article - Google Patents

Resin molding die, resin molding method, and method for producing resin molded article Download PDF

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Publication number
TW201637812A
TW201637812A TW105103420A TW105103420A TW201637812A TW 201637812 A TW201637812 A TW 201637812A TW 105103420 A TW105103420 A TW 105103420A TW 105103420 A TW105103420 A TW 105103420A TW 201637812 A TW201637812 A TW 201637812A
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Taiwan
Prior art keywords
resin
cavity
mold
molding die
resin molding
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TW105103420A
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Chinese (zh)
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TWI657910B (en
Inventor
Hideaki Nakazawa
Kenji Nakajima
Masashi Okamoto
Tomokazu Takahashi
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Apic Yamada Corp
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Priority claimed from JP2015020206A external-priority patent/JP6404734B2/en
Priority claimed from JP2015216406A external-priority patent/JP6397808B2/en
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Publication of TW201637812A publication Critical patent/TW201637812A/en
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Publication of TWI657910B publication Critical patent/TWI657910B/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The present invention addressed the problem of providing a technique that makes it possible to improve molding quality. As a solution, a resin molding die (210) is provided with an upper and lower pair of dies (11, 12) having a cavity (13), it being possible for the dies (11, 12) to be opened and closed. The resin molding die (210) is provided with a base (18), which is provided on the upper die (11) and which is moved in a relative manner so as to come closer to the lower die (12) when the dies are closed and to move away when the dies are opened, and a plurality of plungers (17) arranged around the cavity (13) as viewed from above, and provided on the base (18).

Description

樹脂成形模具、樹脂成形方法、及成形品的製造方法 Resin molding die, resin molding method, and method of manufacturing the molded article

本發明係有關一種適用於樹脂成形模具、樹脂成形方法、及成形品的製造方法有效的技術。 The present invention relates to a technique which is effective for a resin molding die, a resin molding method, and a manufacturing method of a molded article.

日本特開2004-179345號公報(以下，稱為「專利文獻1」。)記載一種有關在壓縮成形中吸收在模腔內的樹脂消耗量變化時的過剩樹脂的過剩樹脂吸收機構之技術(特別參照其說明書段落〔0059〕~〔0061〕及圖10)。 Japanese Laid-Open Patent Publication No. 2004-179345 (hereinafter referred to as "Patent Document 1") describes a technique for an excessive resin absorption mechanism of excess resin when the amount of resin consumed in the cavity is absorbed during compression molding (particularly Refer to paragraphs [0059] to [0061] and Figure 10) of the specification.

日本特開2012-166432號公報(以下，稱為「專利文獻2」。)記載一種有關樹脂成形模具之技術，該樹脂成形模具具有：在分模面開口之設於模腔凹部底面的罐(pot)；及以在其罐內因應鎖模動作相對地往復移動的方式設置之柱塞(特別參照其請求項1)。 Japanese Laid-Open Patent Publication No. 2012-166432 (hereinafter referred to as "Patent Document 2") describes a technique relating to a resin molding die having a can opening on a bottom surface of a cavity concave portion which is opened at a parting surface ( And a plunger provided in a manner of relatively reciprocating movement in the tank in response to the mode-locking action (see, in particular, claim 1).

日本特開2002-283388號公報(以下，稱為「專利文獻3」。)記載一種藉由驅動手段上昇的供給棒從半導體晶圓的外緣供給樹脂之技術(特別參照其說明書段落〔0060〕)。又，專利文獻3記載一種研磨樹脂的表面使電極露出之技術(特別參照其說明書段落〔0080〕)。 JP-A-2002-283388 (hereinafter referred to as "Patent Document 3") describes a technique of supplying a resin from the outer edge of a semiconductor wafer by a supply rod that is raised by a driving means (see, in particular, paragraph [0060] of the specification) ). Further, Patent Document 3 describes a technique for exposing an electrode to the surface of a resin (see, in particular, paragraph [0080] of the specification).

日本特開2003-45906號公報(以下，稱為「專 利文獻4」。)記載一種設置在成為模腔的凹部的底部之罐內的柱塞上昇，將半導體晶圓的表面進行樹脂密封之技術(特別參照其說明書段落〔0012〕、〔0023〕)。又，專利文獻4記載一種形成有導電柱的半導體晶圓的表面被樹脂密封，藉研磨使導電柱的前端露出之技術(特別參照其說明書段落〔0019〕、〔0036〕)。 Japanese Patent Laid-Open Publication No. 2003-45906 (hereinafter, referred to as "Special Li Wen 4". A technique in which a plunger provided in a tank which is a bottom portion of a concave portion of a cavity is raised and a surface of a semiconductor wafer is resin-sealed is described (refer to paragraphs [0012] and [0023] of the specification). Further, Patent Document 4 describes a technique in which the surface of a semiconductor wafer on which a conductive pillar is formed is sealed with a resin, and the tip end of the conductive post is exposed by polishing (see, in particular, paragraphs [0019] and [0036] of the specification).

日本特開2013-43391號公報(以下，稱為「專利文獻5」。)記載一種將位在一模具的模腔凹部的底部之推壓銷推抵於載置在另一模具之工件的技術(特別參照其請求項1)。 Japanese Laid-Open Patent Publication No. 2013-43391 (hereinafter referred to as "Patent Document 5") describes a technique of pushing a push pin positioned at the bottom of a cavity concave portion of a mold against a workpiece placed on another mold. (Special reference to its request 1).

日本特開2013-187351號公報(以下，稱為「專利文獻6」。)記載一種使以倒裝晶片方式接合於基板的半導體晶片的反基板面側表面露出並進行樹脂密封之技術(特別參照其請求項7、8及圖5)。 Japanese Laid-Open Patent Publication No. 2013-187351 (hereinafter referred to as "Patent Document 6") discloses a technique for exposing a surface of a counter substrate surface of a semiconductor wafer bonded to a substrate by flip chip bonding and performing resin sealing (see It claims items 7, 8 and Figure 5).

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2004-179345號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-179345

[專利文獻2]日本特開2012-166432號公報 [Patent Document 2] Japanese Laid-Open Patent Publication No. 2012-166432

[專利文獻3]日本特開2002-283388號公報 [Patent Document 3] Japanese Patent Laid-Open Publication No. 2002-283388

[專利文獻4]日本特開2003-45906號公報 [Patent Document 4] Japanese Patent Laid-Open Publication No. 2003-45906

[專利文獻5]日本特開2013-43391號公報 [Patent Document 5] Japanese Patent Laid-Open Publication No. 2013-43391

[專利文獻6]日本特開2013-187351號公報 [Patent Document 6] Japanese Laid-Open Patent Publication No. 2013-187351

就一般的壓縮成形法而言，樹脂成形模具持續進行閉模使模腔內被填充樹脂、壓縮而成形。壓縮成形法，例如係用在將封裝於如晶圓級封裝(WLP：Wafer Level Package)大尺寸的晶圓或基板上的零件以樹脂密封的情況(例如參照專利文獻1、2)。在基板上的封裝零件是被樹脂整體密封的情況中，要讓封裝零件的表面露出有必要在模塑後研削或研磨模塑面(例如參照專利文獻3、4)。此處，當封裝零件的表面殘留樹脂時，朝銲球、散熱片、屏蔽板等之接續構件的接續性降低。因此，作為成形品的品質會降低。 In the general compression molding method, the resin molding die is continuously closed, and the cavity is filled with a resin and compressed to be molded. The compression molding method is used, for example, in a case where a component packaged on a wafer or a substrate having a large size such as a wafer level package (WLP: Wafer Level Package) is sealed with a resin (for example, refer to Patent Documents 1 and 2). In the case where the packaged component on the substrate is integrally sealed by the resin, it is necessary to expose or polish the molded surface after molding to expose the surface of the packaged component (for example, refer to Patent Documents 3 and 4). Here, when the resin remains on the surface of the packaged component, the continuity of the joining member such as the solder ball, the heat sink, and the shield plate is lowered. Therefore, the quality as a molded article is lowered.

專利文獻6所記載之技術為，在對既定溫度的樹脂成形模具(模腔的內底面)供給樹脂後，使模腔的內底面與半導體晶片(封裝零件)的表面(反基板側表面)接觸者。然而，可想像在樹脂被供給的時點因模具溫度而熔融並開始擴展，於模腔的內底面與半導體晶片的表面(反基板側表面)接觸前，樹脂附著於半導體晶片的表面。在此種情況，會有在表面產生樹脂毛邊[溢料(flash)]之虞。 According to the technique described in Patent Document 6, after the resin is supplied to the resin molding die (the inner bottom surface of the cavity) of a predetermined temperature, the inner bottom surface of the cavity is brought into contact with the surface (the counter substrate side surface) of the semiconductor wafer (package part). By. However, it is conceivable that the resin melts and starts to expand at the time when the resin is supplied, and the resin adheres to the surface of the semiconductor wafer before the inner bottom surface of the cavity contacts the surface of the semiconductor wafer (the counter substrate side surface). In this case, there is a possibility that a resin burr [flash] is generated on the surface.

就產生樹脂毛邊而言，例如，因為散熱片、屏蔽板等的接續構件對半導體晶片的表面之接續性降低，故成形品質降低(亦即，被視為不良品處理)。因此，需要除去樹脂毛邊的工序，導致成形品的生產性降低。此外，專利文獻1~5中關於在露出封裝零件的一部份之際的樹脂毛邊未記載亦未暗示，特別是專利文獻1、2所記載之技術係未露出封裝零件下進行密封者。 In the case where the resin burrs are generated, for example, since the connection member such as the heat sink or the shield plate has a reduced connection property to the surface of the semiconductor wafer, the molding quality is lowered (that is, it is regarded as a defective product treatment). Therefore, the process of removing the resin burrs is required, and the productivity of the molded article is lowered. Further, in Patent Documents 1 to 5, it is not described that the resin burrs are exposed when a part of the packaged component is exposed, and in particular, the techniques described in Patent Documents 1 and 2 are sealed without exposing the packaged component.

本發明之目的在於提供可提升成形品質的技 術。從本說明書的記述及附件圖面當可明瞭本發明之前述及其他目的與新穎特徵。 The object of the present invention is to provide a technique for improving the forming quality. Surgery. The above and other objects and novel features of the present invention will become apparent from the description and appended claims.

本發明之一解決手段的樹脂成形模具，係具備具有模腔之可開閉模具的一對模具的樹脂成形模具，其特徵為具備：基座，設於一模具，以相對於另一模具，在閉模的狀態接近，在開模的狀態離開的方式相對移動；及複數個樹脂推壓部，設於前述基座，在平面視圖中排列於前述模腔的周圍。 A resin molding die according to a solution of the present invention is a resin molding die provided with a pair of molds having mold cavity openable and closable molds, and is characterized in that: a susceptor is provided on one mold to be opposed to the other mold The state of the closed mold is close to each other, and is relatively moved in a state in which the mold is opened; and a plurality of resin pressing portions are provided on the susceptor and arranged in a plan view around the cavity.

又，本發明之一解決手段的樹脂成形方法之特徵為包含：(a)準備一樹脂成形模具的工序，前述樹脂成形模具係具備具有模腔之可開閉模的一對模具的樹脂成形模具，其具備：基座，設於一模具，以相對於另一模具，在閉模的狀態接近，在開模的狀態離開的方式相對移動；及複數個樹脂推壓部，設於前述基座，在平面視圖中排列於前述模腔的周圍；(b)在開模的狀態，於平面視圖中和構成前述樹脂成形模具所具備的前述模腔之模腔件相對的位置，在前述模腔件側面向封裝零件地安裝具有前述封裝零件的工件之工序；(c)在開模的狀態，在平面視圖中和前述樹脂推壓部相對的位置安裝樹脂之工序；(d)持續進行閉模，以前述樹脂成形模具所具備的前述模腔件的周圍的夾持器進行模具夾持之工序； (e)藉由前述(d)工序進一步持續進行閉模，將前述模腔件抵住前述封裝零件的工序；及(f)藉由前述(e)工序進一步持續進行閉模，以前述樹脂推壓部推壓樹脂，對前述模腔內填充樹脂的工序。 Moreover, the resin molding method according to one aspect of the present invention is characterized in that: (a) a step of preparing a resin molding die, wherein the resin molding die is a resin molding die having a pair of molds having a mold cavity openable and closable mold, The pedestal is provided on a mold, and is relatively close to the other mold in a state of closing the mold, and is relatively moved in a state of being opened; and a plurality of resin pressing portions are provided on the susceptor. Arranged in the plan view around the cavity; (b) in the state of the mold opening, in a plan view, at a position opposite to the cavity member constituting the cavity of the resin molding die, in the cavity member a step of mounting a workpiece having the aforementioned packaged component to the package component on the side; (c) a step of mounting the resin at a position opposite to the resin pressing portion in a plan view in a state where the mold is opened; (d) continuing the mold closing, a step of clamping a mold by a holder around the cavity member provided in the resin molding die; (e) further continuing the mold closing by the step (d), the step of holding the cavity member against the package component; and (f) further continuing the mold closing by the step (e), and pushing the resin The pressing portion presses the resin to fill the cavity with a resin.

據此，與在平面視圖中樹脂從模腔周圍的一部位朝模腔被推壓(注入)的情況相較下，可縮短樹脂在模腔內流動的距離。當樹脂流動的距離變長，先流動者與後流動者在硬化的時序上產生偏差，會有導致樹脂所含有的填料偏析，內部存在空隙(氣泡)之虞。於是，藉由從模腔周圍的複數部位朝模腔推壓(注入)樹脂，縮短樹脂在模腔內流動的距離，可防止填料偏析或氣泡產生。亦即，可提升成形品質。 According to this, the distance in which the resin flows in the cavity can be shortened as compared with the case where the resin is pressed (injected) from a portion around the cavity toward the cavity in plan view. When the distance in which the resin flows becomes long, the first flower and the rear flower are deviated in the timing of hardening, and the filler contained in the resin is segregated, and voids (bubbles) are present inside. Thus, by pushing (injecting) the resin from the plurality of portions around the cavity toward the cavity, the distance in which the resin flows in the cavity is shortened, and segregation of the filler or generation of bubbles can be prevented. That is, the forming quality can be improved.

又，在對具有封裝零件的工件進行樹脂成形之情況，在以模腔件抵住(推壓)封裝零件防止樹脂附著其表面之後，能以樹脂推壓部開始推壓樹脂。藉此，可防止在封裝零件的表面產生樹脂毛邊(成形不良)。亦即，可提升成形品質。 Further, in the case where the workpiece having the packaged part is subjected to resin molding, after the cavity member is pressed against (pressed) the packaged part to prevent the resin from adhering to the surface, the resin pressing portion can start pressing the resin. Thereby, resin burrs (forming defects) can be prevented from occurring on the surface of the packaged part. That is, the forming quality can be improved.

又，關於前述一解決手段的樹脂成形模具，更佳為：進一步具備：複數個***部，在平面視圖中從前述模腔離開般地排列在前述模腔的周圍，供前述複數個樹脂推壓部各自***；及複數個流道/澆口，設於前述一或另一模具的分模面，在平面視圖中從與前述複數個***部相對的位置分別朝向前述模腔縮窄。據此，即使是在流道/澆口殘存成形 樹脂的情況，成形樹脂的厚度薄，變得易折斷而容易除去。 Further, in the resin molding die according to the above-described solution, it is preferable to further include: a plurality of insertion portions which are arranged around the cavity from the cavity in a plan view, and the plurality of resins are pressed Each of the portions is inserted; and a plurality of runners/gates are provided on the parting surface of the one or the other mold, and are narrowed toward the cavity from a position opposite to the plurality of insertion portions in plan view. According to this, even in the runner/gate remains In the case of a resin, the thickness of the molding resin is thin, and it is easy to be broken and easily removed.

又，關於前述一解決手段的樹脂成形模具，更佳為：進一步具備：複數個***部，在平面視圖中與前述模腔相接地在前述模腔的周圍排列，供前述複數個樹脂推壓部各自***。據此，與樹脂從離開模腔的部位朝模腔推壓(注入)的情況相較下，可變更注入時序，俾提早朝模腔注入。又，可抑制產生不必要的成形樹脂。此處，更佳為：進一步具備設於前述樹脂推壓部的樹脂推壓面，朝向前述模腔變狹窄的流道/澆口。據此，即使是在***部殘存有成形樹脂的情況，成形樹脂的厚度薄，變得易折斷而容易除去。 Further, in the resin molding die according to the above-described solution, it is preferable to further include: a plurality of insertion portions which are arranged in plan view around the cavity and are arranged around the cavity to press the plurality of resins Each part is inserted. Accordingly, as compared with the case where the resin is pressed (injected) from the portion away from the cavity into the cavity, the injection timing can be changed, and the injection into the cavity is performed early. Further, generation of an unnecessary molding resin can be suppressed. Here, it is more preferable to further include a flow path/gate which is provided on the resin pressing surface of the resin pressing portion and which is narrowed toward the cavity. According to this, even when the molding resin remains in the insertion portion, the thickness of the molding resin is small, and it is easy to be broken and easily removed.

又，關於前述一解決手段的樹脂成形模具，更佳為：進一步具備：樹脂安裝部，在平面視圖中和前述樹脂推壓部相對的位置且凹設於前述一或另一模具的分模面。據此，可易於將樹脂安裝於樹脂安裝部。又，因為樹脂是在樹脂安裝部被定位，故可防止例如在推壓樹脂前樹脂朝已安裝的工件側移動、擴展。 Further, the resin molding die according to the above-described solution further preferably further includes: a resin mounting portion that is recessed in a parting surface of the one or the other mold in a position facing the resin pressing portion in plan view . According to this, it is possible to easily mount the resin to the resin mounting portion. Further, since the resin is positioned at the resin mounting portion, it is possible to prevent the resin from moving and expanding toward the mounted workpiece side, for example, before pressing the resin.

又，關於前述一解決手段的樹脂成形模具，更佳為：進一步具備彈性構件，前述樹脂推壓部隔著前述彈性構件設於前述基座。又，關於前述一解決手段的樹脂成形模具，更佳為：前述樹脂推壓部在前述基座固定地設置。據此，除了進行模具開閉的機構外，無需設 置例如驅動樹脂推壓部的驅動機構，構造變簡易可進行樹脂成形。 Further, in the resin molding die according to the above-described solution, it is more preferable to further include an elastic member, and the resin pressing portion is provided on the susceptor via the elastic member. Further, in the resin molding die according to the above-described solution, it is preferable that the resin pressing portion is fixed to the susceptor. According to this, there is no need to set up a mechanism for opening and closing the mold. For example, a drive mechanism for driving the resin pressing portion can be formed, and the structure can be simplified to perform resin molding.

又，關於前述一解決手段的樹脂成形模具，更佳為：進一步具備：溢流腔，以在平面視圖中從前述模腔離開般設置在前述模腔的周圍；及流道，設在前述一或另一模具的分模面，於平面視圖中從與前述溢流腔相對的位置朝向前述模腔。 Further, in the resin molding die according to the above-described solution, it is preferable to further include: an overflow chamber provided around the cavity in a plan view away from the cavity; and a flow path provided in the foregoing Or the parting surface of the other mold, in a plan view, from a position opposite to the aforementioned overflow chamber toward the aforementioned mold cavity.

據此，即使是捲入會成為空隙(void)的空氣而樹脂在模腔內流動的情況，亦可將含有該空氣的樹脂朝溢流腔推出，可提升在模腔內之樹脂的填充性。 According to this, even if the air which is void is caught and the resin flows in the cavity, the resin containing the air can be pushed out toward the overflow chamber, and the filling property of the resin in the cavity can be improved. .

又，關於前述一解決手段的樹脂成形模具，更佳為：進一步具備：薄膜，覆蓋前述一或另一模具的至少任一者的分模面。據此，在對具有封裝零件的工件進行樹脂成形之情況，可使成形後的工件容易從樹脂成形模具脫模。 Further, the resin molding die according to the above-described solution means preferably further comprising: a film covering a parting surface of at least one of the one or the other of the molds. According to this, in the case where the workpiece having the packaged part is subjected to resin molding, the formed workpiece can be easily released from the resin molding die.

本發明的其他解決手段的樹脂成形方法之特徵為包含：(a)準備一樹脂成形模具的工序，該樹脂成形模具具備可開閉模具的一對模具，在一或另一至少任一者的模具的分模面設有模腔凹部，前述模腔凹部的底部是含有推壓樹脂的樹脂推壓部、及推壓以和該模腔凹部對向的方式安裝的工件的封裝零件之零件推壓部所構成；(b)在使開模的狀態，安裝前述工件之工序；(c)在使開模的狀態，在和前述樹脂推壓部對向的部 位安裝樹脂之工序；(d)持續進行閉模，將已安裝的前述工件的前述封裝零件以前述零件推壓部推壓的工序；(e)將前述封裝零件以前述零件推壓部一邊推壓一邊以前述樹脂推壓部對前述工件持續進行推壓前述樹脂，對前述模腔凹部內以熔融的前述樹脂填充的工序；及(f)使在前述模腔凹部內填充的前述樹脂熱硬化之工序。 The resin molding method according to another solution of the present invention is characterized by comprising: (a) a step of preparing a resin molding die having a pair of molds capable of opening and closing the mold, and at least one of the molds of one or the other The parting surface of the cavity is provided with a cavity recess, and the bottom of the cavity recess is a resin pressing portion containing a pressing resin, and a pressing part of a package part of the workpiece which is pressed to be opposed to the cavity concave portion (b) a step of attaching the workpiece in a state in which the mold is opened, and (c) a portion facing the resin pressing portion in a state in which the mold is opened. (d) a step of continuously closing the mold, and pressing the packaged component of the workpiece to be pressed by the component pressing portion; (e) pushing the package component by the component pressing portion Pressing the resin against the workpiece by the resin pressing portion, and filling the resin in the cavity concave portion with a molten resin; and (f) thermally hardening the resin filled in the cavity concave portion Process.

據此，在封裝零件的表面(被零件推壓部推壓的表面)用零件推壓部推壓以防止樹脂附著於其表面之後，能以樹脂推壓部開始推壓樹脂，故可防止產生樹脂毛邊(成形不良)。亦即，可提升成形品質。 According to this, after the surface of the package component (the surface pressed by the component pressing portion) is pressed by the component pressing portion to prevent the resin from adhering to the surface thereof, the resin pressing portion can start to press the resin, so that generation can be prevented. Resin burrs (poor molding). That is, the forming quality can be improved.

關於前述其他解決手段的樹脂成形方法，更佳為：在前述(a)工序中，準備一前述樹脂成形模具，該前述樹脂成形模具係前述樹脂推壓部被支撐部所支撐，前述零件推壓部隔著彈簧構件被前述支撐部支撐，在前述(e)工序中，對於前述零件推壓部使前述樹脂推壓部相對可動以推壓前述樹脂。據此，樹脂成形模具的構成變簡易，可進行樹脂成形。 In the resin molding method of the other solution, it is preferable that in the step (a), the resin molding die is provided, wherein the resin pressing portion is supported by the support portion, and the component is pressed The portion is supported by the support portion via a spring member, and in the step (e), the resin pressing portion is relatively movable with respect to the component pressing portion to press the resin. According to this, the structure of the resin molding die is simplified, and resin molding can be performed.

關於前述其他解決手段的樹脂成形方法，更佳為：在前述(a)工序中，準備一前述樹脂成形模具，該前述樹脂成形模具係前述零件推壓部在第1零件推壓部及第2零件推壓部分割地設置，前述第1零件推壓部及前述第2零件推壓部各自獨立地對前述樹脂推壓部可進退移動地設置， 在前述(b)工序中，安裝封裝有作為前述封裝零件之高度相異的第1及第2封裝零件的前述工件，在前述(d)工序中，以前述第1零件推壓部推壓前述第1封裝零件，以前述第2零件推壓部推壓前述第2封裝零件。 In the resin molding method of the other solution, it is preferable that in the step (a), the resin molding die is provided, wherein the resin molding die is the first component pressing portion and the second component pressing portion. The component pressing portion is provided in a divided manner, and the first component pressing portion and the second component pressing portion are independently provided to the resin pressing portion so as to be movable forward and backward. In the step (b), the workpiece in which the first and second package components having different heights of the package component are mounted is mounted, and in the step (d), the first component pressing portion is pressed by the first component pressing portion. In the first package component, the second package component is pressed by the second component pressing portion.

據此，即使為封裝零件高度相異者，以分別對應的第1零件推壓部及第2零件推壓部推壓而可防止樹脂附著於封裝零件的表面。 According to this, even if the height of the package components is different, the first component pressing portion and the second component pressing portion are pressed to prevent the resin from adhering to the surface of the package component.

關於前述其他解決手段的樹脂成形方法，更佳為：在前述(a)工序中，準備一前述樹脂成形模具，該前述樹脂成形模具係沿著前述模腔凹部的底部的平面視圖形狀的外形配置複數個前述樹脂推壓部。據此，可防止樹脂未填充於模腔凹部中。 In the resin molding method according to the other solution, it is preferable that in the step (a), the resin molding die is disposed, and the resin molding die is disposed along an outer shape of a plan view shape of a bottom portion of the cavity concave portion. A plurality of the aforementioned resin pressing portions. According to this, it is possible to prevent the resin from being filled in the cavity concave portion.

關於前述其他解決手段的樹脂成形方法，更佳為：在前述(c)工序中，在前述樹脂方面，安裝比前述封裝零件的高度還高的第1樹脂，在除了安裝有前述第1樹脂的部位及封裝有前述封裝零件的部位以外之前述工件的部位，安裝比前述封裝零件的高度還低的第2樹脂。據此，例如即便為大面積的工件，亦可防止樹脂未填充於模腔凹部中。 In the resin molding method of the above-mentioned other means, in the step (c), the first resin having a height higher than the height of the package component is attached to the resin, and the first resin is attached. A second resin having a height lower than a height of the package component is attached to a portion of the workpiece other than the portion where the package component is packaged. According to this, for example, even in the case of a large-area workpiece, it is possible to prevent the resin from being filled in the cavity concave portion.

關於前述其他解決手段的樹脂成形方法，更佳為：在前述(a)工序中，準備一備有設於前述零件推壓部的橡膠構件之前述樹脂成形模具，在前述(d)工序中，將前述封裝零件以前述橡膠構件推壓並將該橡膠構件的部位作為前述零件推壓部發揮機 能，在前述(e)工序中，以作為前述零件推壓部發揮機能的前述橡膠構件的部位一邊推壓前述封裝零件，一邊將前述模腔凹部內的前述樹脂以前述橡膠構件推壓並將該橡膠構件的部位作為前述樹脂推壓部發揮機能。或者，關於前述一解決手段的樹脂成形方法，更佳為：在前述(a)工序中，準備一備有設於前述模腔凹部的底部的橡膠構件之前述樹脂成形模具，在前述(d)工序中，將前述封裝零件以前述橡膠構件推壓並將該橡膠構件的部位作為前述零件推壓部發揮機能，在前述(e)工序中，以作為前述零件推壓部發揮機能的前述橡膠構件的部位一邊推壓前述封裝零件，一邊將前述模腔凹部內的前述樹脂以前述橡膠構件推壓並將該橡膠構件的部位作為前述樹脂推壓部發揮機能。據此，例如，藉由橡膠構件的彈性可吸收過剩樹脂，因而安裝多於成形樹脂量之樹脂，可防止樹脂未填充於模腔凹部中。 In the resin molding method of the above-mentioned other means, in the step (a), the resin molding die provided with the rubber member provided in the component pressing portion is further provided, and in the step (d), Pushing the aforementioned package member against the rubber member and using the portion of the rubber member as the component pressing portion In the step (e), the resin in the cavity concave portion is pressed by the rubber member while pressing the package member as a portion of the rubber member that functions as the component pressing portion. The portion of the rubber member functions as the resin pressing portion. Alternatively, in the resin molding method according to the above-described solution, it is preferable that in the step (a), the resin molding die provided with the rubber member provided at the bottom of the cavity concave portion is provided in the above (d) In the step, the rubber component is pressed by the rubber member, and the rubber component is used as the component pressing portion. In the step (e), the rubber component functions as the component pressing portion. While pressing the package component, the resin in the cavity concave portion is pressed by the rubber member, and a portion of the rubber member functions as the resin pressing portion. According to this, for example, the excess resin can be absorbed by the elasticity of the rubber member, and thus the resin having a larger amount than the molding resin can be attached, and the resin can be prevented from being filled in the cavity concave portion.

關於前述其他解決手段的樹脂成形方法，更佳為：在前述(a)工序中，準備一前述樹脂成形模具，該前述樹脂成形模具具備一薄膜，其覆蓋包含前述模腔凹部在內的前述分模面，且和該分模面相反側的面具有黏著性，在前述(d)工序中，使前述薄膜黏著於前述封裝零件並以前述零件推壓部推壓前述封裝零件。據此，可更加防止樹脂附著於封裝零件的表面。 In the resin molding method of the other solution, it is preferable that in the step (a), the resin molding die is provided, and the resin molding die includes a film covering the aforementioned portion including the cavity concave portion. The mold surface has adhesiveness on the surface opposite to the parting surface, and in the step (d), the film is adhered to the package component, and the package component is pressed by the component pressing portion. According to this, it is possible to further prevent the resin from adhering to the surface of the package part.

以下簡單說明本案所揭示的發明中具代表性者可獲得之效果。依據本發明之一解決手段的樹脂成形模具，可提升成形品質。 The effects obtainable by the representative of the invention disclosed in the present invention will be briefly described below. The resin molding die according to one of the solutions of the present invention can improve the forming quality.

210‧‧‧樹脂成形模具 210‧‧‧Resin forming mold

11‧‧‧上模 11‧‧‧上模

12‧‧‧下模 12‧‧‧Down

13‧‧‧模腔(模腔凹部) 13‧‧‧ cavity (cavity recess)

17‧‧‧柱塞(樹脂推壓部) 17‧‧‧Plunger (resin pushing part)

18‧‧‧基座 18‧‧‧ Pedestal

圖1係本發明實施形態1的樹脂成形模具之示意剖面圖。 Fig. 1 is a schematic cross-sectional view showing a resin molding die according to a first embodiment of the present invention.

圖2係繼圖1之後的動作中的樹脂成形模具之示意剖面圖。 Fig. 2 is a schematic cross-sectional view showing a resin molding die in the operation subsequent to Fig. 1.

圖3係繼圖2之後的動作中的樹脂成形模具之示意剖面圖。 Fig. 3 is a schematic cross-sectional view showing a resin molding die in the operation subsequent to Fig. 2;

圖4係繼圖3之後的動作中的樹脂成形模具之示意剖面圖。 Fig. 4 is a schematic cross-sectional view showing a resin molding die in the operation subsequent to Fig. 3.

圖5係圖1所示之樹脂成形模具的上模的分模面之示意平面圖。 Fig. 5 is a schematic plan view showing a parting surface of an upper mold of the resin molding die shown in Fig. 1.

圖6係圖1所示之樹脂成形模具的下模的分模面之示意平面圖。 Fig. 6 is a schematic plan view showing a parting surface of a lower mold of the resin molding die shown in Fig. 1.

圖7係以和圖1不同的工件W為處理對象的樹脂成形模具之示意剖面圖。 Fig. 7 is a schematic cross-sectional view showing a resin molding die to which a workpiece W different from Fig. 1 is to be processed.

圖8係本發明實施形態2的樹脂成形模具的上模的分模面之示意平面圖。 Fig. 8 is a schematic plan view showing a parting surface of an upper mold of a resin molding die according to a second embodiment of the present invention.

圖9係本發明實施形態2的樹脂成形模具的下模的分模面之示意平面圖。 Fig. 9 is a schematic plan view showing a parting surface of a lower mold of a resin molding die according to a second embodiment of the present invention.

圖10係本發明實施形態3的樹脂成形模具之示意剖 面圖。 Figure 10 is a schematic cross-sectional view showing a resin molding die according to a third embodiment of the present invention. Surface map.

圖11係本發明實施形態4的樹脂成形模具之示意剖面圖。 Figure 11 is a schematic cross-sectional view showing a resin molding die according to a fourth embodiment of the present invention.

圖12係本發明實施形態5的樹脂成形模具之示意剖面圖。 Figure 12 is a schematic cross-sectional view showing a resin molding die according to a fifth embodiment of the present invention.

圖13係圖12所示之樹脂成形模具的上模的分模面之示意平面圖。 Figure 13 is a schematic plan view showing a parting surface of an upper mold of the resin molding die shown in Figure 12 .

圖14係本發明實施形態6的樹脂成形模具之示意剖面圖。 Figure 14 is a schematic cross-sectional view showing a resin molding die according to a sixth embodiment of the present invention.

圖15係本發明實施形態7的樹脂成形模具之示意剖面圖。 Figure 15 is a schematic cross-sectional view showing a resin molding die according to a seventh embodiment of the present invention.

圖16係本發明實施形態8的樹脂成形模具之示意剖面圖。 Figure 16 is a schematic cross-sectional view showing a resin molding die according to an eighth embodiment of the present invention.

圖17係本發明實施形態9的樹脂成形模具之示意剖面圖。 Figure 17 is a schematic cross-sectional view showing a resin molding die according to a ninth embodiment of the present invention.

圖18係本發明實施形態10的樹脂成形模具之示意剖面圖。 Figure 18 is a schematic cross-sectional view showing a resin molding die according to a tenth embodiment of the present invention.

圖19係本發明實施形態11的動作中的樹脂成形模具之示意剖面圖。 Fig. 19 is a schematic cross-sectional view showing a resin molding die in the operation of the eleventh embodiment of the present invention.

圖20係繼圖19之後的動作中的樹脂成形模具之示意剖面圖。 Fig. 20 is a schematic cross-sectional view showing a resin molding die in the operation subsequent to Fig. 19.

圖21係繼圖20之後的動作中的樹脂成形模具之示意剖面圖。 Fig. 21 is a schematic cross-sectional view showing a resin molding die in the operation subsequent to Fig. 20.

圖22係繼圖21之後的動作中的樹脂成形模具之示意剖面圖。 Fig. 22 is a schematic cross-sectional view showing the resin molding die in the operation subsequent to Fig. 21.

圖23係繼圖22之後的動作中的樹脂成形模具之示意剖面圖。 Fig. 23 is a schematic cross-sectional view showing the resin molding die in the operation subsequent to Fig. 22;

圖24係圖19所示之樹脂成形模具的上模的分模面之示意平面圖。 Fig. 24 is a schematic plan view showing a parting surface of an upper mold of the resin molding die shown in Fig. 19.

圖25係圖19所示之樹脂成形模具的下模的分模面之示意平面圖。 Fig. 25 is a schematic plan view showing a parting surface of a lower mold of the resin molding die shown in Fig. 19.

圖26係成形品的要部示意剖面圖。 Fig. 26 is a schematic cross-sectional view of an essential part of a molded article.

圖27係各種工件的要部示意剖面圖。 Figure 27 is a schematic cross-sectional view of an essential part of various workpieces.

圖28係本發明實施形態12的樹脂成形模具之示意剖面圖。 Figure 28 is a schematic cross-sectional view showing a resin molding die according to a twelfth embodiment of the present invention.

圖29係本發明實施形態13的樹脂成形模具之示意剖面圖。 Figure 29 is a schematic cross-sectional view showing a resin molding die according to a thirteenth embodiment of the present invention.

圖30係本發明實施形態14的樹脂成形模具之示意剖面圖。 Figure 30 is a schematic cross-sectional view showing a resin molding die according to a fourteenth embodiment of the present invention.

圖31係本發明實施形態15的樹脂成形模具之示意剖面圖。 Figure 31 is a schematic cross-sectional view showing a resin molding die according to a fifteenth embodiment of the present invention.

圖32係本發明實施形態16的樹脂成形模具之示意剖面圖。 Figure 32 is a schematic cross-sectional view showing a resin molding die according to a sixteenth embodiment of the present invention.

圖33係本發明實施形態17的樹脂成形模具之示意剖面圖。 Figure 33 is a schematic cross-sectional view showing a resin molding die according to a seventeenth embodiment of the present invention.

圖34係圖33所示之樹脂成形模具的下模的分模面之示意平面圖。 Figure 34 is a schematic plan view showing a parting surface of a lower mold of the resin molding die shown in Figure 33.

圖35係圖33所示之樹脂成形模具所用的樹脂之示意平面圖。 Figure 35 is a schematic plan view showing a resin used in the resin molding die shown in Figure 33.

圖36係本發明實施形態18的樹脂成形模具之示意剖 面圖。 Figure 36 is a schematic cross-sectional view showing a resin molding die according to Embodiment 18 of the present invention. Surface map.

圖37係本發明實施形態19的樹脂成形模具所用的樹脂之示意平面圖。 Figure 37 is a schematic plan view showing a resin used in a resin molding die according to Embodiment 19 of the present invention.

圖38係本發明實施形態20的樹脂成形模具之示意剖面圖。 Figure 38 is a schematic cross-sectional view showing a resin molding die according to a twentieth embodiment of the present invention.

圖39係本發明實施形態20的樹脂成形模具之其他的示意剖面圖。 Figure 39 is another schematic cross-sectional view showing a resin molding die according to Embodiment 20 of the present invention.

在以下本發明的實施形態中，按必要的情況分成複數個部份等作說明，但原則上，其等並非彼此沒有關係，而係一者為另一者的一部份或全部的變形例、詳細等之關係。因此，全圖中具有同一機能的構件賦予同一符號，省略其反復說明。又，關於構成要素之數(包含個數、數值、量、範圍等)，除非特別明示的情況或原理上明確限定特定之數的情況等以外，並不侷限於其特定之數，亦可為特定之數以上或以下。又，在提及構成要素等之形狀時，除了特別明示的情況及考量在原理上不那麼明確的情況等以外，係包含實質和該形狀等近似或類似者。 In the following embodiments of the present invention, it is divided into a plurality of parts as necessary, and the like, but in principle, they are not related to each other, and one or a part of the other is a modification of the other. Relationship, detail, etc. Therefore, members having the same function in the entire drawings are given the same reference numerals, and repeated description thereof will be omitted. In addition, the number of components (including the number, the numerical value, the quantity, the range, and the like) is not limited to the specific number unless specifically stated or the case where the specific number is clearly defined in principle, and may be More than a certain number or less. In addition, when a shape of a component or the like is mentioned, it is similar or similar to the shape and the like except for the case where the case is specifically indicated and the case where the consideration is not so clear in principle.

(實施形態1) (Embodiment 1)

針對本實施形態的樹脂成形模具210(樹脂成形模具機構)，參照圖1~圖6作說明。圖1~圖4係動作中的樹脂成形模具210之示意剖面圖。又，圖5係上模11的分模面11a(亦稱為夾持面、模具面。)之示意平面圖。又，圖6係下模12的分模面12a(亦稱為夾持面、模具面。)之示意 平面圖。此外，圖4顯示利用樹脂成形模具210進行樹脂成形後的成形品100(成形後的工件W)。 The resin molding die 210 (resin molding die mechanism) of the present embodiment will be described with reference to Figs. 1 to 6 . 1 to 4 are schematic cross-sectional views of the resin molding die 210 in operation. 5 is a schematic plan view of the parting surface 11a (also referred to as a clamping surface and a mold surface) of the upper mold 11. 6 is a schematic view of the parting surface 12a of the lower mold 12 (also referred to as a clamping surface and a mold surface). Floor plan. In addition, FIG. 4 shows the molded article 100 (the workpiece W after molding) which is resin-molded by the resin molding die 210.

樹脂成形模具210係具備具有模腔13(以下，亦稱為模腔凹部13)之一對的模具(上模11及下模12)，依此等離開、接近而可開閉模具。本實施形態中，作成將一模具設為上模11，另一模具設為下模12。此樹脂成形模具210中，使用未圖示之公知的模具開閉機構(壓機機構)。可作成藉此模具開閉機構，例如將上模11設為固定模，下模12設為可動模而可開閉模具的構成，亦可作成將上模11設為可動模，下模12設為固定模，亦可上模11和下模12均設為可動模。此外，樹脂成形模具210亦可為不使用模具開閉機構而手動進行開閉之模具。 The resin molding die 210 is provided with a mold (the upper die 11 and the lower die 12) having one pair of the cavity 13 (hereinafter, also referred to as a cavity concave portion 13), and can be opened and closed by being separated and approached. In the present embodiment, one mold is set as the upper mold 11, and the other mold is set as the lower mold 12. In the resin molding die 210, a known mold opening and closing mechanism (press mechanism) (not shown) is used. The mold opening and closing mechanism can be formed, for example, the upper mold 11 is a fixed mold, the lower mold 12 is a movable mold, and the mold can be opened and closed. The upper mold 11 can be used as a movable mold, and the lower mold 12 can be fixed. For the mold, the upper mold 11 and the lower mold 12 are both set as movable molds. Further, the resin molding die 210 may be a die that is manually opened and closed without using a mold opening and closing mechanism.

樹脂成形模具210中，在上模11設有(形成有)模腔凹部13。模腔凹部13係以從上模11的分模面11a凹陷的方式設置，被閉模後構成模腔13。樹脂成形模具210具備覆蓋包含此模腔凹部13的內面在內的上模11的分模面11a之離型薄膜F(以下，亦有僅稱為「薄膜」。)。藉由設置薄膜F，可使成形後的工件W易於從樹脂成形模具210脫模。 In the resin molding die 210, a cavity recess 13 is provided (formed) in the upper die 11. The cavity concave portion 13 is provided so as to be recessed from the parting surface 11a of the upper mold 11, and is closed to form the cavity 13. The resin molding die 210 includes a release film F (hereinafter, simply referred to as a "film") that covers the parting surface 11a of the upper mold 11 including the inner surface of the cavity concave portion 13. By providing the film F, the formed workpiece W can be easily released from the resin molding die 210.

又，樹脂成形模具210具備公知的減壓機構，藉由此減壓機構可進行模腔凹部13的脫氣。例如，減壓機構係具備：在夾持器15的下端面(上模11的分模面11a)連通模腔凹部13和外部之通氣溝(未圖示)；及在外部側和通氣溝接續之減壓裝置(例如，真空泵)。 Further, the resin molding die 210 includes a known pressure reducing mechanism, and the decompression mechanism can perform deaeration of the cavity concave portion 13. For example, the pressure reducing mechanism includes a lower end surface of the holder 15 (the parting surface 11a of the upper mold 11) that communicates with the cavity concave portion 13 and an external ventilation groove (not shown); and the outer side and the ventilation groove are connected to each other. A pressure reducing device (for example, a vacuum pump).

又，樹脂成形模具210中，於下模12設有供工 件W安裝(配置)的安裝部14。安裝部14係建構成設於下模12的分模面12a且可從未圖示的吸引路吸引並保持工件W。安裝部14中，工件W被安裝成與模腔凹部13對向。又，樹脂成形模具210中，設有在安裝部14的周圍排列且複數個樹脂R[本實施形態中為錠(tablet)樹脂]分別安裝(配置)於下模12的分模面12a的複數個樹脂安裝部29。此外，安裝部14及樹脂安裝部29亦能以分別收容工件W及樹脂R的方式設置從下模12的分模面12a凹陷的凹部。 Further, in the resin molding die 210, the lower mold 12 is provided with a workmanship. The mounting portion 14 of the device W is mounted (configured). The mounting portion 14 is configured to form a parting surface 12a provided on the lower mold 12, and can suck and hold the workpiece W from a suction path (not shown). In the mounting portion 14, the workpiece W is mounted to face the cavity concave portion 13. Further, the resin molding die 210 is provided with a plurality of resin R (in the present embodiment, a tablet resin) which are arranged around the mounting portion 14 and are attached (arranged) to the parting surface 12a of the lower mold 12, respectively. Resin mounting portion 29. Further, the mounting portion 14 and the resin mounting portion 29 can also provide recesses recessed from the parting surface 12a of the lower mold 12 so as to accommodate the workpiece W and the resin R, respectively.

工件W具備基板101及複數個封裝零件102。基板101在平面視圖中為圓形。工件W係整體在平面視圖中為圓形的板狀體，可謂之具有複數個封裝零件102。複數個封裝零件102呈矩陣狀排列並封裝(搭載)於基板101的表面(參照圖6)。此封裝零件102係具有被封裝之側的基板面102a和其相反面102b的表面。此外，配合工件W的平面視圖形狀(參照圖6)，模腔凹部13的平面視圖形狀(參照圖5)係圓形。 The workpiece W includes a substrate 101 and a plurality of package components 102. The substrate 101 is circular in plan view. The workpiece W is a circular plate-like body as a whole in plan view, and can be said to have a plurality of packaged parts 102. A plurality of package parts 102 are arranged in a matrix and packaged (mounted) on the surface of the substrate 101 (see FIG. 6). This package part 102 has a surface of the substrate face 102a and its opposite face 102b on the side of the package. Further, in accordance with the plan view shape of the workpiece W (refer to FIG. 6), the plan view shape (see FIG. 5) of the cavity recess 13 is circular.

此處，工件W(基板101)的平面視圖形狀不限於圓形，例如亦可為矩形。又，基板101，例如可為晶圓或配線基板，亦可為內包有將代表eWLB(embedded Wafer Level Ball Grid Array；嵌入式晶圓級球閘陣列)的半導體晶片暫時接著搭載的一般板狀的載具、玻璃基板或半導體晶片等的電子零件之已完成樹脂密封的基板。又，封裝零件102係例如為半導體晶片或電子零件等的能動零件或受動零件，此外亦可為導線架等之需露出端子的配線圖案或配線塊體。 Here, the plan view shape of the workpiece W (substrate 101) is not limited to a circular shape, and may be, for example, a rectangular shape. Further, the substrate 101 may be, for example, a wafer or a wiring substrate, or may have a general plate shape in which a semiconductor wafer representing an eWLB (embedded Wafer Level Ball Grid Array) is temporarily mounted. A resin-sealed substrate of an electronic component such as a carrier, a glass substrate, or a semiconductor wafer. Further, the package component 102 is, for example, an active component or a driven component such as a semiconductor wafer or an electronic component, and may be a wiring pattern or a wiring block in which a terminal such as a lead frame is to be exposed.

又，樹脂成形模具210係具備未圖示的加熱器，可加熱到既定溫度(例如180℃)的構成。樹脂成形模具210中，藉由上模11與下模12閉塞模腔凹部13(形成模腔13)，使填充、壓縮於模腔凹部13內的樹脂R在保壓的狀態下熱硬化以進行將成形品100(參照圖4)成形(製造)的處理。 Further, the resin molding die 210 is provided with a heater (not shown) and can be heated to a predetermined temperature (for example, 180 ° C). In the resin molding die 210, the cavity concave portion 13 (forming the cavity 13) is closed by the upper die 11 and the lower die 12, and the resin R filled and compressed in the cavity concave portion 13 is thermally cured in a state of holding pressure. The process of forming (manufacturing) the molded article 100 (see FIG. 4).

其次，針對樹脂成形模具210的上模11具體作說明。上模11係具備夾持器15、模腔件16、柱塞17(樹脂推壓部)、及基座18(有在上模11者係賦予符號18a，而在下模12者係賦予符號18b的情況。)，組裝此等模具塊所構成。本實施形態中，夾持器15、模腔件16、及基座18(基座18a)係分別由板狀的模具塊構成，柱塞17是由圓柱狀的模具塊構成。 Next, the upper mold 11 of the resin molding die 210 will be specifically described. The upper mold 11 includes a holder 15, a cavity member 16, a plunger 17 (resin pressing portion), and a susceptor 18 (the symbol 18a is provided in the upper mold 11 and the symbol 18b is given in the lower mold 12). The case.), the assembly of these mold blocks. In the present embodiment, the holder 15, the cavity member 16, and the susceptor 18 (base 18a) are each formed of a plate-shaped mold block, and the plunger 17 is formed of a cylindrical mold block.

在上模11的平面視圖(分模面視圖)中，夾持器15其中央部形成沿厚度方向(模具開閉方向)設置之圓形的貫通孔15a。模腔件16被***此貫通孔15a並隔著彈簧構件21設於基座18。此外，柱塞17亦可如後述，直接固定於基座18。又，於夾持器15，在上模11的平面視圖(分模面視圖)中，圓形的貫通孔15b於厚度方向(模具開閉方向)設置形成複數個。複數個柱塞17被***此等複數個貫通孔15b的每一個並隔個彈簧構件19設於基座18。如此，貫通孔15b亦是供柱塞17***之***部。此貫通孔15b係於平面視圖中比貫通孔15a還小徑，且從模腔件16(貫通孔15a)離開般地等間隔排列在模腔件16的周圍。此外，在欲朝一方引起樹脂流動之情況等係未必需要等間隔。 In the plan view (partitioned surface view) of the upper mold 11, the holder 15 has a circular through hole 15a formed in the thickness direction (the mold opening and closing direction) at the center portion thereof. The cavity member 16 is inserted into the through hole 15a and is provided to the base 18 via the spring member 21. Further, the plunger 17 may be directly fixed to the base 18 as will be described later. Further, in the gripper 15, in the plan view (partitioning surface view) of the upper mold 11, a plurality of circular through holes 15b are formed in the thickness direction (the mold opening and closing direction). A plurality of plungers 17 are inserted into each of the plurality of through holes 15b and are provided to the base 18 via a spring member 19. Thus, the through hole 15b is also an insertion portion into which the plunger 17 is inserted. The through holes 15b are smaller than the through holes 15a in plan view, and are arranged at equal intervals from the cavity member 16 (through holes 15a) around the cavity member 16. Further, it is not necessary to have an equal interval in the case where the resin is to be caused to flow toward one side.

又，在夾持器15的構成上模11的分模面11a之端面，形成設置複數個從複數個貫通孔15b各自朝向模腔凹部13(貫通孔15a)縮窄的流道/澆口28(樹脂路)。柱塞17係通過流道/澆口28朝模腔凹部13推壓(注入)樹脂R。亦即，就樹脂成形模具210而言，以於平面視圖中，樹脂R從模腔凹部13的外周部朝中央部流動的方式在模腔凹部13的周圍設置複數個柱塞17、複數個貫通孔15b及複數個流道/澆口28。此外，將流道/澆口28設在上模，但藉由在下模12設置殘料廢品[(cull)未圖示]，亦可將流道/澆口28設在下模12。在此情況，藉由設置脫模用之公知的頂出機構亦可進行成形後的脫模。 Further, in the end surface of the parter surface 11a of the upper mold 11 of the holder 15, a plurality of flow paths/gates 28 which are narrowed from the plurality of through holes 15b toward the cavity concave portion 13 (through hole 15a) are formed. (Resin Road). The plunger 17 presses (injects) the resin R toward the cavity recess 13 through the flow path/gate 28. In other words, in the resin molding die 210, a plurality of plungers 17 and a plurality of through-holes are provided around the cavity concave portion 13 so that the resin R flows from the outer peripheral portion of the cavity concave portion 13 toward the central portion in plan view. Hole 15b and a plurality of runners/gates 28. Further, the flow path/gate 28 is provided in the upper mold, but the flow path/gate 28 may be provided in the lower mold 12 by providing a scrap residue [(cull) not shown in the lower mold 12]. In this case, demolding after forming can also be performed by providing a well-known ejector mechanism for demolding.

據此，與樹脂R從模腔凹部13周圍的一部位朝模腔凹部13注入的情況相較下，可縮短樹脂R在模腔凹部13內流動的距離。當樹脂R流動的距離變長，先流動者與後流動者在硬化的時序上產生偏差，會有導致樹脂R所含有的填料偏析，內部存在空隙(氣泡)之虞。於是，藉由從模腔凹部13周圍的複數部位朝模腔凹部13注入樹脂R，縮短樹脂R在模腔凹部13內流動的距離，可防止填料偏析或氣泡產生。 Accordingly, as compared with the case where the resin R is injected from the portion around the cavity concave portion 13 toward the cavity concave portion 13, the distance in which the resin R flows in the cavity concave portion 13 can be shortened. When the distance in which the resin R flows becomes long, the first flower and the rear flower are deviated in the timing of hardening, and the filler contained in the resin R is segregated, and voids (bubbles) are present inside. Then, by injecting the resin R from the plurality of portions around the cavity concave portion 13 toward the cavity concave portion 13, the distance in which the resin R flows in the cavity concave portion 13 is shortened, and segregation of the filler or generation of bubbles can be prevented.

如此，夾持器15、模腔件16、及柱塞17係隔著各個彈簧構件組裝於基座18。亦即，夾持器15、模腔件16、及柱塞17係隔著各個彈簧構件被保持於基座18。此處，在樹脂成形模具210的模具開閉之際，上模11(一模具)對下模12(另一模具)相對地離開、接近。因此，本實施形態中，基座18以相對於下模12，在閉模的狀態接 近、開模的狀態離開的方式相對地移動。 In this manner, the holder 15, the cavity member 16, and the plunger 17 are assembled to the base 18 via the respective spring members. That is, the holder 15, the cavity member 16, and the plunger 17 are held by the base 18 via the respective spring members. Here, when the mold of the resin molding die 210 is opened and closed, the upper die 11 (one die) is relatively separated from and close to the lower die 12 (the other die). Therefore, in the present embodiment, the susceptor 18 is connected to the lower mold 12 in a closed state. The manner in which the near, open mode exits relatively moves.

模腔件16係設於基座18的下模12側。而且，模腔件16係構成模腔凹部13的裏部(底部)。亦即，模腔件16的下模12側的端面成為平面視圖中圓形的模腔凹部13的內底面。本實施形態中，此模腔件16係在閉模的狀態抵住封裝零件102(參照圖3)。又，模腔件16係隔著彈簧構件21(第1彈性構件)設於基座18的下模12側。因此，模腔件16係從基座18藉由彈簧構件21而被吊掛。 The cavity member 16 is attached to the lower mold 12 side of the base 18. Moreover, the cavity member 16 constitutes the inner portion (bottom portion) of the cavity recess 13. That is, the end surface of the cavity member 16 on the lower mold 12 side becomes the inner bottom surface of the circular cavity concave portion 13 in plan view. In the present embodiment, the cavity member 16 is placed against the package component 102 in a closed state (see Fig. 3). Further, the cavity member 16 is provided on the lower mold 12 side of the susceptor 18 via the spring member 21 (first elastic member). Therefore, the cavity member 16 is suspended from the base 18 by the spring member 21.

又，夾持器15係設於基座18的下模12側。而且，夾持器15係包圍模腔件16而構成模腔凹部13的側部。亦即，夾持器15的貫通孔15a的內壁面成為模腔凹部13的內側面。此夾持器15係在閉模的狀態抵住下模12(參照圖2)。又，夾持器15係隔著彈簧構件20(第2彈性構件，圖5中以虛線表示)設置在基座18的下模12側。因此，模腔件16係從基座18藉由彈簧構件20而被吊掛。本實施形態中，為了防止在以柱塞17推壓樹脂R之際的樹脂漏洩，如圖5所示，於平面視圖中在柱塞17(樹脂安裝部29)的周圍設有複數個彈簧構件20。具體言之，沿著夾持器15的上端面(基座18側的端面)的外緣部設置複數個彈簧構件20。 Further, the holder 15 is provided on the lower mold 12 side of the base 18. Moreover, the holder 15 surrounds the cavity member 16 to form a side portion of the cavity recess 13. That is, the inner wall surface of the through hole 15a of the holder 15 becomes the inner side surface of the cavity concave portion 13. This holder 15 is placed against the lower mold 12 in a closed mold (see Fig. 2). Further, the holder 15 is provided on the lower mold 12 side of the susceptor 18 via the spring member 20 (second elastic member, indicated by a broken line in FIG. 5). Therefore, the cavity member 16 is suspended from the base 18 by the spring member 20. In the present embodiment, in order to prevent leakage of the resin when the resin R is pressed by the plunger 17, as shown in FIG. 5, a plurality of spring members are provided around the plunger 17 (resin mounting portion 29) in plan view. 20. Specifically, a plurality of spring members 20 are provided along the outer edge portion of the upper end surface (the end surface on the base 18 side) of the holder 15.

如此，夾持器15係對模腔件16可於模具開閉方向相對移動(可進退移動)地設於基座18的下模12側。例如，在藉由閉模使夾持器15抵住下模12後(參照圖2)，當進一步進行持續閉模時，則在夾持器15抵住下模12的狀態下彈簧構件20被附能。而且，模腔件16係接近下模 12，抵住封裝零件102(參照圖3)。 In this manner, the holder 15 is provided on the lower mold 12 side of the base 18 so that the cavity member 16 can relatively move in the mold opening and closing direction (movable forward and backward). For example, after the holder 15 is pressed against the lower mold 12 by closing the mold (refer to FIG. 2), when the mold is continuously closed, the spring member 20 is held in a state where the holder 15 is pressed against the lower mold 12. Attached to the energy. Moreover, the cavity member 16 is close to the lower mold 12, against the package part 102 (refer to Figure 3).

又，柱塞17係設於基座18的下模12側。此柱塞17係在閉模的狀態朝模腔凹部13推壓(注入)樹脂R。又，柱塞17係隔著彈簧構件19(第3彈性構件)設於基座18的下模12側。因此，柱塞17係從基座18藉由彈簧構件19而被吊掛。 Further, the plunger 17 is provided on the lower mold 12 side of the base 18. This plunger 17 presses (injects) the resin R toward the cavity concave portion 13 in a state where the mold is closed. Further, the plunger 17 is provided on the lower mold 12 side of the susceptor 18 via the spring member 19 (third elastic member). Therefore, the plunger 17 is suspended from the base 18 by the spring member 19.

如此，柱塞17係對模腔件16及夾持器15可於模具開閉方向相對移動(可進退移動)地設於基座18的下模12側。藉此，例如，在模腔件16因閉模而抵住封裝零件102後(參照圖3)，當進一步進行持續閉模時，則在夾持器15抵住下模12的狀態下彈簧構件20被附能，又，在模腔件16抵住封裝零件102的狀態下彈簧構件21被附能。然後，柱塞17係接近下模12，開始推壓樹脂R，當進一步進行持續閉模時，彈簧構件19被附能(參照圖4)。亦即，本實施形態中的順序為，隨著進行持續閉模，夾持器15下面抵住下模12上面，模腔件16下面抵住封裝零件102上面，然後柱塞17推壓樹脂R。 In this manner, the plunger 17 is provided on the lower mold 12 side of the susceptor 18 so that the cavity member 16 and the holder 15 can relatively move in the mold opening and closing direction (movable forward and backward). Thereby, for example, after the cavity member 16 is pressed against the package member 102 by the mold closing (refer to FIG. 3), when the mold is continuously closed, the spring member is in a state where the holder 15 is pressed against the lower mold 12. 20 is energized, and in addition, the spring member 21 is energized in a state in which the cavity member 16 is pressed against the package member 102. Then, the plunger 17 is brought close to the lower mold 12 to start pressing the resin R, and when the mold is continuously closed, the spring member 19 is energized (refer to Fig. 4). That is, the order in this embodiment is that as the mold is continuously closed, the lower portion of the holder 15 abuts against the upper mold 12, and the lower surface of the cavity member 16 abuts against the package member 102, and then the plunger 17 pushes the resin R. .

如此，依據樹脂成形模具210，針對柱塞17的動作，可提供伴隨模具開閉之簡易的構造，而非使用複雜的機構(例如，油壓缸或馬達等之別的驅動之致動器)。又，後面將述及，依據樹脂成形模具210，因為在用模腔件16抵住(推壓)封裝零件102防止樹脂R附著於其表面之後，能以柱塞17開始推壓樹脂R，故可防止產生樹脂毛邊(成形不良)。亦即，可提升成形品質。 As described above, according to the resin molding die 210, it is possible to provide an easy structure for opening and closing the mold with respect to the operation of the plunger 17, instead of using a complicated mechanism (for example, an actuator driven by a hydraulic cylinder or a motor). Further, as will be described later, according to the resin molding die 210, since the resin member R is pressed against the surface of the package member 102 after the cavity member 16 is pressed (pressed), the resin R can be pushed by the plunger 17, so It can prevent the occurrence of resin burrs (formation defects). That is, the forming quality can be improved.

其次，針對作為本實施形態的壓縮成形的樹 脂成形模具210之動作(樹脂成形方法之工序)進行說明。首先，如圖1所示，準備一具有前述可開閉模具的一對模具(上模11及下模12)之樹脂成形模具210。 Next, for the compression-formed tree as the present embodiment The operation of the grease molding die 210 (the process of the resin molding method) will be described. First, as shown in Fig. 1, a resin molding die 210 having a pair of molds (the upper die 11 and the lower die 12) having the above-described mold opening and closing mold is prepared.

接著，在使樹脂成形模具210已開模的狀態中，在模具開閉方向且和模腔件16相對的(對向的)位置安裝(供給)成形前的工件W(被成形品)。具體言之，工件W藉由未圖示的裝載器搬送到下模12的分模面12a，使工件W(更具體言之，使封裝零件102向模腔件16側的狀態之基板101)被安裝於安裝部14。此工件W係藉由利用形成於下模12的吸引路(未圖示)之公知的吸引裝置(例如，真空泵)吸附保持並安裝於安裝部14。 Then, in a state in which the resin molding die 210 has been opened, the workpiece W (formed product) before molding is attached (sold) in a (opposing) position facing the cavity member 16 in the mold opening and closing direction. Specifically, the workpiece W is conveyed to the parting surface 12a of the lower mold 12 by a loader (not shown) to cause the workpiece W (more specifically, the substrate 101 in a state in which the packaged part 102 is on the side of the cavity member 16). It is attached to the mounting portion 14. This workpiece W is suction-held and attached to the mounting portion 14 by a known suction device (for example, a vacuum pump) formed in a suction path (not shown) formed in the lower mold 12.

又，在使樹脂成形模具210已開模的狀態中，在模具開閉方向且和柱塞17相對的(對向的)位置安裝(供給)樹脂R。具體言之，錠狀的樹脂R(錠樹脂)藉由未圖示的裝載器搬送到模具內部，複數個樹脂安裝部29的每一個被安裝樹脂R。 Moreover, in a state in which the resin molding die 210 has been opened, the resin R is attached (supplied) to the (opposing) position facing the plunger 17 in the mold opening and closing direction. Specifically, the ingot-shaped resin R (ingot resin) is conveyed to the inside of the mold by a loader (not shown), and the resin R is attached to each of the plurality of resin mounting portions 29.

又，在使樹脂成形模具210已開模的狀態中，將薄膜F以覆蓋包含模腔凹部13的內面在內的上模11的分模面11a般地作安裝。具體言之，在上模11中，薄膜F以從纏繞成滾筒狀的抽出滾筒拉出並通過上模11的分模面11a朝纏繞滾筒纏繞的方式設置。此薄膜F係例如藉由利用夾持器15的貫通孔15a的內壁面與模腔件16的外側面之間隙、夾持器15的貫通孔15b的內壁面與柱塞17的外側面之間隙的公知的吸引裝置(例如，真空泵)吸附保持並貼附於包含模腔凹部13的內面在內的上模11的分模面 11a。薄膜F係為具有可耐樹脂成形模具210的加熱溫度之耐熱性，容易自上模11的分模面11a剝離者，且具有柔軟性、伸展性的薄膜材。薄膜F方面，例如，適合使用PTFE、ETFE、PET、FEP、氟含浸玻璃布、聚丙烯、聚偏二氯乙烯(polyvinylidene chloride)等。 Moreover, in a state in which the resin molding die 210 has been opened, the film F is attached so as to cover the parting surface 11a of the upper mold 11 including the inner surface of the cavity concave portion 13. Specifically, in the upper mold 11, the film F is pulled out from the take-up drum wound in a roll shape and wound around the winding drum by the split surface 11a of the upper mold 11. This film F is used, for example, by the gap between the inner wall surface of the through hole 15a of the holder 15 and the outer side surface of the cavity member 16, the inner wall surface of the through hole 15b of the holder 15 and the outer side surface of the plunger 17. A known suction device (for example, a vacuum pump) adsorbs and adheres to the parting surface of the upper mold 11 including the inner surface of the cavity concave portion 13. 11a. The film F is a film material which has heat resistance to the heating temperature of the resin molding die 210 and is easily peeled off from the parting surface 11a of the upper mold 11, and has flexibility and stretchability. As the film F, for example, PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidene chloride or the like is suitably used.

接著，開始閉模動作，如圖2所示，樹脂成形模具210進行持續閉模(使上模11和下模12持續接近)，將夾持器15隔著薄膜F抵於下模12(亦即，進行模具夾持)。此時，上模11的基座18與下模12之距離變窄。因而，模腔凹部13的開口部被下模12的分模面12a所閉塞。又，本實施形態中，因為工件W(基板101)在平面視圖的尺寸比起模腔凹部13在平面視圖的尺寸還小，故成為工件W收納在模腔凹部13內的狀態。另一方面，此處，作成柱塞17未抵住樹脂R(未接觸)。而且，模腔凹部13的空間係藉由形成於夾持器15的下端面之通氣溝(未圖示)開始減壓。此外，如圖7所示，於工件W(基板101)在平面視圖的尺寸是比模腔凹部13在平面視圖的尺寸還大之情況，亦可藉由夾持器15夾持(包夾)被安裝於下模12的基板101。於此情況，在夾持器15需有基板101厚度之階差供脫逃。此階差的必要性在其他實施例中亦是相同。 Then, the mold closing operation is started. As shown in FIG. 2, the resin molding die 210 continues to mold (the upper mold 11 and the lower mold 12 are kept in close proximity), and the holder 15 is pressed against the lower mold 12 via the film F (also That is, mold clamping is performed). At this time, the distance between the base 18 of the upper mold 11 and the lower mold 12 is narrowed. Therefore, the opening portion of the cavity concave portion 13 is closed by the parting surface 12a of the lower mold 12. Further, in the present embodiment, since the size of the workpiece W (substrate 101) in plan view is smaller than the size of the cavity concave portion 13 in plan view, the workpiece W is housed in the cavity concave portion 13. On the other hand, here, the plunger 17 is not made to abut against the resin R (not in contact). Further, the space of the cavity concave portion 13 is decompressed by a ventilation groove (not shown) formed in the lower end surface of the holder 15. Further, as shown in FIG. 7, in the case where the size of the workpiece W (substrate 101) in plan view is larger than the size of the cavity concave portion 13 in plan view, it can also be clamped (clamped) by the holder 15. The substrate 101 is mounted on the lower mold 12. In this case, the holder 15 is required to have a step difference in the thickness of the substrate 101 for escape. The necessity of this step is the same in other embodiments.

接著，將樹脂成形模具210進一步進行持續閉模，如圖3所示，模腔件16抵於封裝零件102。此時，上模11的基座18與下模12之距離變更窄。因而，被安裝於安裝部14(下模12的分模面12a)的工件W的封裝零件102是隔著薄膜F被模腔件16所夾持(推壓)。且在夾持器15抵 住下模12的狀態下彈簧構件20被附能(被壓而縮短)。如此，模腔件16亦是在閉模動作中推壓封裝零件102的零件推壓部。而且，模腔凹部13的深度(高度)變淺(低)而成為成形品100的成形厚度。另一方面，此處，作成柱塞17未抵住樹脂R(未接觸)。其中，若係為樹脂R沒流出到封裝零件102(工件W)側之程度，則亦可事先將柱塞17抵住樹脂R。 Next, the resin molding die 210 is further continuously closed, and as shown in FIG. 3, the cavity member 16 is in contact with the package member 102. At this time, the distance between the susceptor 18 of the upper mold 11 and the lower mold 12 is changed to be narrow. Therefore, the package component 102 of the workpiece W attached to the mounting portion 14 (the split surface 12a of the lower mold 12) is sandwiched (pressed) by the cavity member 16 via the film F. And arrived at the gripper 15 The spring member 20 is energized (pressed and shortened) in a state where the lower mold 12 is housed. Thus, the cavity member 16 is also a component pressing portion that presses the package component 102 during the mold closing operation. Further, the depth (height) of the cavity concave portion 13 becomes shallow (low) and becomes the formed thickness of the molded article 100. On the other hand, here, the plunger 17 is not made to abut against the resin R (not in contact). However, if the resin R does not flow out to the side of the package member 102 (work W), the plunger 17 may be previously pressed against the resin R.

接著，將樹脂成形模具210進一步進行持續閉模，利用柱塞17將樹脂R經由流道/澆口28開始對模腔凹部13推壓(注入)，如圖4所示，於已閉模的狀態，對模腔凹部13內填充熔融的樹脂R。此時，上模11的基座18與下模12之距離變更窄。藉此，在複數個封裝零件102之間亦被填充樹脂R。又，在夾持器15抵住下模12，模腔件16抵住封裝零件102的狀態下彈簧構件20、21被附能(被壓而縮短)，當進一步進行持續閉模時，彈簧構件19被附能。 Next, the resin molding die 210 is further continuously closed, and the resin R is pressed (injected) into the cavity concave portion 13 via the flow path/gate 28 by the plunger 17, as shown in FIG. In the state, the molten resin R is filled in the cavity concave portion 13. At this time, the distance between the susceptor 18 of the upper mold 11 and the lower mold 12 is changed to be narrow. Thereby, the resin R is also filled between the plurality of package parts 102. Further, when the holder 15 is pressed against the lower mold 12 and the cavity member 16 is pressed against the package member 102, the spring members 20, 21 are energized (compressed and shortened), and when the mold is continuously closed, the spring member is further 19 is attached.

此處，由於藉由隔著薄膜F以模腔件16夾持封裝零件102，封裝零件102會陷入薄膜F某程度，故可防止樹脂R附著於封裝零件102的相反面102b。而且，貼附於上模11的分模面11a的薄膜F亦可為無黏著性的薄膜，但是若分模面11a的對面側(下模12側)的面是稍具黏著性者(微黏著薄膜)，則亦可維持黏著在封裝零件102以模腔件16推壓封裝零件102。據此，可更加防止樹脂R附著於封裝零件102的相反面102b。又，藉由設置薄膜F，例如，可防止樹脂R進入夾持器15和模腔件16之間隙或夾持器15和柱塞17之間隙而發生樹脂毛邊，使夾持器15、模腔 件16變得難移動。 Here, since the package member 102 is sandwiched by the cavity member 16 via the film F, the package member 102 is caught in the film F to some extent, so that the resin R can be prevented from adhering to the opposite surface 102b of the package member 102. Further, the film F attached to the parting surface 11a of the upper mold 11 may be a non-adhesive film, but if the face of the opposite side (the lower mold 12 side) of the parting surface 11a is slightly adhesive (micro Adhesive film) can also remain adhered to the package part 102 to push the package part 102 with the cavity member 16. According to this, it is possible to further prevent the resin R from adhering to the opposite surface 102b of the package member 102. Further, by providing the film F, for example, the resin R can be prevented from entering the gap between the holder 15 and the cavity member 16 or the gap between the holder 15 and the plunger 17 to cause resin burrs to cause the holder 15, the cavity Piece 16 becomes difficult to move.

接著，在使填充於模腔凹部13內的樹脂R於保壓的狀態下熱硬化後，開模並使脫模後的工件W再熱硬化(post cure)。因此，封裝零件102的相反面102b(表面)露出，大致完成其他的面(基板面102a及側面)被樹脂成形部103(樹脂R)所覆蓋(密封)的成形品100。又，在供柱塞17***的貫通孔15b(***部)或流道/澆口28殘存有不必要的成形樹脂之情況，與流道/澆口28對應之成形樹脂的厚度薄，因為容易折斷，故可除去不必要的成形樹脂。 Next, after the resin R filled in the cavity concave portion 13 is thermally cured in a state where the pressure is maintained, the mold is opened and the workpiece W after the mold release is post-cured. Therefore, the opposite surface 102b (surface) of the package member 102 is exposed, and the molded article 100 in which the other surface (the substrate surface 102a and the side surface) is covered (sealed) by the resin molded portion 103 (resin R) is substantially completed. Further, in the case where the through hole 15b (insertion portion) or the runner/gate 28 into which the plunger 17 is inserted is left with unnecessary molding resin, the thickness of the molding resin corresponding to the flow path/gate 28 is thin, because it is easy. It is broken, so that unnecessary molding resin can be removed.

如同前述，在樹脂成形模具210中，柱塞17是對夾持器15及模腔件16可於模具開閉方向相對移動地設於基座18。因此，例如，能防止封裝零件102的破損可一邊夾持封裝零件102一邊開始推壓樹脂R。藉此，可防止在封裝零件102的相反面102b產生樹脂毛邊(成形不良)。因此，依據樹脂成形模具210，可提升製造良率，又，可提升成形品100的成形品質。又，因為變得不需要除去樹脂毛邊的工序，故可削減製造成本。 As described above, in the resin molding die 210, the plunger 17 is provided to the susceptor 18 for relatively moving the holder 15 and the cavity member 16 in the mold opening and closing direction. Therefore, for example, it is possible to prevent the package member 102 from being damaged, and it is possible to start pressing the resin R while sandwiching the package member 102. Thereby, resin burrs (forming defects) can be prevented from occurring on the opposite surface 102b of the package member 102. Therefore, according to the resin molding die 210, the manufacturing yield can be improved, and the molding quality of the molded article 100 can be improved. Moreover, since the process of removing the resin burrs is unnecessary, the manufacturing cost can be reduced.

(實施形態2) (Embodiment 2)

前述實施形態1中，針對將供柱塞17***的夾持器15的貫通孔15b(***部)等間隔地在模腔凹部13全周作複數排列的樹脂成形模具210作了說明。針對與其相異之點，設置本實施形態的樹脂成形模具210A，參照圖8及圖9作說明。圖8係樹脂成形模具210A中之上模11的分模面11a之示意平面圖。又，圖9係樹脂成形模具210A中之下模12的分模面12a之示意平面圖。此外，圖8中未圖示出 彈簧構件20(參照圖5)。 In the first embodiment, the resin molding die 210 in which the through holes 15b (insertion portions) of the holder 15 into which the plungers 17 are inserted are alternately arranged in the entire circumference of the cavity concave portion 13 is described. The resin molding die 210A of the present embodiment is provided in a manner different from this, and will be described with reference to Figs. 8 and 9 . Fig. 8 is a schematic plan view of the parting surface 11a of the upper mold 11 in the resin molding die 210A. Further, Fig. 9 is a schematic plan view of the parting surface 12a of the lower mold 12 in the resin molding die 210A. In addition, not shown in FIG. Spring member 20 (see Fig. 5).

樹脂成形模具210A中，於模腔凹部13周圍的一區域排列複數個貫通孔15b，在沒有貫通孔15b的其他區域排列複數個溢流腔15c(過剩樹脂用的凹部)。本實施形態中，於樹脂成形模具210A的夾持器15，在平面視圖(分模面視圖)中的模腔凹部13的周圍設置自模腔凹部13離開並排列的複數個溢流腔15c。此外，溢流腔15c可設於貫通孔15b間(實施形態1亦相同)，亦可設於下模12。 In the resin molding die 210A, a plurality of through holes 15b are arranged in a region around the cavity concave portion 13, and a plurality of overflow cavities 15c (recessed portions for excess resin) are arranged in other regions where the through holes 15b are not provided. In the present embodiment, in the holder 15 of the resin molding die 210A, a plurality of overflow cavities 15c which are separated from the cavity concave portion 13 and arranged in a plane around the cavity concave portion 13 in plan view (partition surface view) are provided. Further, the overflow chamber 15c may be provided between the through holes 15b (the same applies to the first embodiment), or may be provided in the lower mold 12.

溢流腔15c係以從構成上模11的分模面11a之端面凹陷的方式設置，且以在下模12的分模面12a被閉塞般地閉模而構成模腔13。因此，在模具開閉方向和溢流腔15c相對的下模12的分模面12a的位置未設有樹脂安裝部29。又，於夾持器15，在構成上模11的分模面11a的端面，設置複數個從模腔凹部13(貫通孔15a)分別朝向複數個溢流腔15c的流道50(樹脂路)。 The overflow chamber 15c is provided so as to be recessed from the end surface of the parting surface 11a constituting the upper mold 11, and is closed by the mold part surface 12a of the lower mold 12 to form the cavity 13. Therefore, the resin mounting portion 29 is not provided at the position of the parting surface 12a of the lower mold 12 that faces the overflow chamber 15c in the mold opening and closing direction. Further, in the gripper 15, a plurality of flow passages 50 (resin roads) which are respectively directed from the cavity concave portion 13 (through hole 15a) toward the plurality of overflow cavities 15c are provided on the end faces of the split mold faces 11a constituting the upper mold 11. .

依據此種樹脂成形模具210A，即使是捲入會成為空隙的空氣而樹脂R在模腔凹部13內流動的情況，亦可將含有該空氣的樹脂R朝溢流腔15c推出。因此，可提升在模腔凹部13內之樹脂的填充性。 According to the resin molding die 210A, even if the resin R is caused to flow into the cavity concave portion 13 by the air which is a void, the resin R containing the air can be pushed out toward the overflow chamber 15c. Therefore, the filling property of the resin in the cavity concave portion 13 can be improved.

又，在樹脂成形模具210A中，複數個供柱塞17***的貫通孔15b(***部)匯集的區域和複數溢流腔15c個匯集的區域在平面視圖中包夾模腔凹部13的位置被分開。據此，因為樹脂R從柱塞17(貫通孔15b)朝模腔凹部13，然後朝溢流腔15c順暢流動，故可更加提升在模腔凹部13內之樹脂的填充性。 Further, in the resin molding die 210A, a plurality of regions in which the through holes 15b (insertion portions) into which the plungers 17 are inserted and a region in which the plurality of overflow chambers 15c are gathered are sandwiched in the cavity portion 13 in plan view. separate. According to this, since the resin R flows smoothly from the plunger 17 (through hole 15b) toward the cavity concave portion 13 and then toward the overflow chamber 15c, the filling property of the resin in the cavity concave portion 13 can be further enhanced.

又，在此種樹脂成形模具210A中亦是，柱塞17是以對夾持器15及模腔件16可於模具開閉方向相對移動地設於基座18。因此，和前述實施形態1同樣地，例如，能一邊夾持封裝零件102一邊開始推壓樹脂R。藉以防止在封裝零件102的相反面102b產生樹脂毛邊(成形不良)，可使相反面102b露出。 Further, in the resin molding die 210A, the plunger 17 is provided on the susceptor 18 so that the holder 15 and the cavity member 16 can relatively move in the mold opening and closing direction. Therefore, similarly to the first embodiment, for example, the resin R can be pressed while the package component 102 is sandwiched. In order to prevent resin burrs (forming defects) from occurring on the opposite surface 102b of the package member 102, the opposite surface 102b can be exposed.

(實施形態3) (Embodiment 3)

前述實施形態1中，針對僅於上模11的分模面11a覆蓋薄膜F的樹脂成形模具210作了說明。針對與其相異點，設置本實施形態的樹脂成形模具210B，參照圖10作說明。圖10係樹脂成形模具210B之示意剖面圖。 In the first embodiment, the resin molding die 210 that covers the film F only on the parting surface 11a of the upper mold 11 has been described. The resin molding die 210B of the present embodiment is provided in a different manner from the above, and will be described with reference to FIG. Fig. 10 is a schematic cross-sectional view showing a resin molding die 210B.

樹脂成形模具210B中，上模11的分模面11a及下模12的分模面12a雙方被薄膜F覆蓋。本實施形態中，因為樹脂成形模具210B的下模12的分模面12a被薄膜F覆蓋，所以工件W係隔著薄膜F被安裝於安裝部14。同樣地，樹脂R係隔著薄膜F被安裝於樹脂安裝部29。依據上模11及下模12雙方被薄膜F覆蓋的樹脂成形模具210B，在對具有封裝零件102的工件W進行樹脂成形之情況，可使成形後的工件W容易從樹脂成形模具210脫模。又，可防止樹脂從樹脂成形模具210B的分模線(上模11的分模面11a與下模12的分模面12a之交界)漏洩。 In the resin molding die 210B, both the parting surface 11a of the upper mold 11 and the parting surface 12a of the lower mold 12 are covered with the film F. In the present embodiment, since the parting surface 12a of the lower mold 12 of the resin molding die 210B is covered with the film F, the workpiece W is attached to the mounting portion 14 via the film F. Similarly, the resin R is attached to the resin mounting portion 29 via the film F. In the resin molding die 210B in which both the upper mold 11 and the lower mold 12 are covered with the film F, when the workpiece W having the package member 102 is resin-molded, the formed workpiece W can be easily released from the resin molding die 210. Further, it is possible to prevent the resin from leaking from the parting line of the resin molding die 210B (the boundary between the parting surface 11a of the upper mold 11 and the parting surface 12a of the lower mold 12).

又，樹脂成形模具210B中，作為樹脂安裝部29，在模具開閉方向與柱塞17相對(對向)的位置上設置從下模12的分模面12a凹陷的凹部。據此，可易於將樹脂R安裝於樹脂安裝部29(凹部)。又，因為樹脂R在樹脂安 裝部29被定位，故可防止例如在推壓樹脂R前樹脂R朝安裝於下模12的分模面12a的工件W側移動、擴展。又，因為樹脂安裝部29是凹部，所以流道/澆口28係亦能和樹脂安裝部29連通地設在下模12的分模面12a而不是設在上模11(夾持器15)。 Further, in the resin molding die 210B, as the resin mounting portion 29, a concave portion recessed from the parting surface 12a of the lower mold 12 is provided at a position facing (opposing) the plunger 17 in the mold opening and closing direction. According to this, the resin R can be easily attached to the resin mounting portion 29 (recessed portion). Also, because the resin R is in the resin Since the mounting portion 29 is positioned, it is possible to prevent the resin R from moving and expanding toward the workpiece W side of the parting surface 12a of the lower mold 12, for example, before the resin R is pressed. Further, since the resin mounting portion 29 is a concave portion, the flow path/gate 28 can be provided in the parting surface 12a of the lower mold 12 in communication with the resin mounting portion 29 instead of the upper mold 11 (clamp 15).

又，在此種樹脂成形模具210B中亦是，柱塞17是以對夾持器15及模腔件16可於模具開閉方向相對移動地設於基座18。因此，和前述實施形態1同樣地，例如，能一邊夾持封裝零件102一邊開始推壓樹脂R。藉以防止在封裝零件102的相反面102b產生樹脂毛邊(成形不良)，可使相反面102b露出。 Further, in the resin molding die 210B, the plunger 17 is provided on the susceptor 18 so that the holder 15 and the cavity member 16 can relatively move in the mold opening and closing direction. Therefore, similarly to the first embodiment, for example, the resin R can be pressed while the package component 102 is sandwiched. In order to prevent resin burrs (forming defects) from occurring on the opposite surface 102b of the package member 102, the opposite surface 102b can be exposed.

(實施形態4) (Embodiment 4)

前述實施形態1中，針對柱塞17隔著彈簧構件19設置在基座18的下模12側而成的樹脂成形模具210作了說明。針對與其相異點，設置本實施形態的樹脂成形模具210C，參照圖11作說明。圖11係樹脂成形模具210C之示意剖面圖。 In the first embodiment, the resin molding die 210 in which the plunger 17 is provided on the lower mold 12 side of the susceptor 18 via the spring member 19 has been described. The resin molding die 210C of the present embodiment is provided in a manner different from this, and will be described with reference to Fig. 11 . Fig. 11 is a schematic cross-sectional view showing a resin molding die 210C.

樹脂成形模具210C中，柱塞17被固定設置在基座18。本實施形態中，就樹脂成形模具210C，柱塞17(樹脂推壓部)例如藉由螺栓(未圖示)被固定設置在基座18的下模12側。此種樹脂成形模具210C中亦是，柱塞17是以對夾持器15及模腔件16可於模具開閉方向相對移動地設置在基座18。因此，和前述實施形態1同樣地，例如，可一邊夾持封裝零件102一邊開始推壓樹脂R。藉以防止在封裝零件102的相反面102b產生樹脂毛邊(成形不良) ，可使相反面102b露出。 In the resin molding die 210C, the plunger 17 is fixedly disposed on the susceptor 18. In the present embodiment, in the resin molding die 210C, the plunger 17 (resin pressing portion) is fixed to the lower mold 12 side of the susceptor 18 by, for example, a bolt (not shown). In the resin molding die 210C, the plunger 17 is provided on the susceptor 18 so that the holder 15 and the cavity member 16 can relatively move in the mold opening and closing direction. Therefore, similarly to the first embodiment, for example, the resin R can be pressed while the package component 102 is sandwiched. Therefore, resin burrs (formation defects) are prevented from occurring on the opposite surface 102b of the package member 102. The opposite surface 102b can be exposed.

(實施形態5) (Embodiment 5)

前述實施形態1中，針對供柱塞17***的貫通孔15b(***部)是以樹脂R流經流道/澆口28的方式從模腔件16朝外側偏離設置的樹脂成形模具210作了說明。針對與其相異之點，設置本實施形態的樹脂成形模具210D，參照圖12及圖13作說明。圖12係樹脂成形模具210D之示意剖面圖。圖13係樹脂成形模具210D中之上模11的分模面11a之示意平面圖。 In the first embodiment, the through hole 15b (insertion portion) into which the plunger 17 is inserted is formed by the resin molding die 210 which is disposed outwardly from the cavity member 16 so that the resin R flows through the flow path/gate 28. Description. The resin molding die 210D of the present embodiment is provided in a manner different from this, and will be described with reference to Figs. 12 and 13 . Fig. 12 is a schematic cross-sectional view showing a resin molding die 210D. Fig. 13 is a schematic plan view of the parting surface 11a of the upper mold 11 in the resin molding die 210D.

樹脂成形模具210D中，貫通孔15b(***部)與模腔件16(模腔凹部13)相接地設置。本實施形態中，在樹脂成形模具210D的夾持器15設有複數個在平面視圖(分模面視圖)排列於模腔凹部13的周圍且與模腔件16(模腔凹部13)相接(直接安裝)地供柱塞17(樹脂推壓部)***的貫通孔15b(***部)。依據此種樹脂成形模具210D，與從離開模腔凹部13的部位朝模腔凹部13推壓(注入)樹脂R的情況相較下，可變更注入時序，俾提早朝模腔凹部13注入。又，可抑制產生不必要的成形樹脂。 In the resin molding die 210D, the through hole 15b (insertion portion) is provided in contact with the cavity member 16 (cavity recess 13). In the present embodiment, the holder 15 of the resin molding die 210D is provided with a plurality of planes (partitioned surface view) arranged around the cavity recess 13 and is in contact with the cavity member 16 (cavity recess 13). (directly attached) a through hole 15b (insertion portion) into which the plunger 17 (resin pressing portion) is inserted. According to the resin molding die 210D, as compared with the case where the resin R is pressed (injected) from the portion away from the cavity concave portion 13 toward the cavity concave portion 13, the injection timing can be changed and the injection into the cavity concave portion 13 can be performed early. Further, generation of an unnecessary molding resin can be suppressed.

又，在柱塞17的樹脂推壓面(下模12側的端面)，設有朝模腔凹部13縮窄的流道/澆口28。本實施形態中，柱塞17的下端面是以模腔凹部13側可形成銳角的方式形成錐狀。據此，即使在貫通孔15b(***部)殘存有成形樹脂的情況，和錐狀對應的成形樹脂的厚度薄，變得易折斷，而容易除去殘存的成形樹脂。 Further, a flow path/gate 28 which is narrowed toward the cavity concave portion 13 is provided on the resin pressing surface of the plunger 17 (the end surface on the lower mold 12 side). In the present embodiment, the lower end surface of the plunger 17 is formed in a tapered shape so that the cavity concave portion 13 side can form an acute angle. According to this, even when the molding resin remains in the through hole 15b (insertion portion), the thickness of the molding resin corresponding to the taper is thin, and it is easy to be broken, and the remaining molding resin can be easily removed.

又，在此種樹脂成形模具210D中亦是，柱塞 17是以對夾持器15及模腔件16可於模具開閉方向相對移動地設於基座18。因此，和前述實施形態1同樣地，例如，可一邊夾持封裝零件102一邊開始推壓樹脂R。藉以防止在封裝零件102的相反面102b產生樹脂毛邊(成形不良)，可使相反面102b露出。 Moreover, in such a resin molding die 210D, the plunger is also 17 is provided on the base 18 so that the holder 15 and the cavity member 16 are relatively movable in the mold opening and closing direction. Therefore, similarly to the first embodiment, for example, the resin R can be pressed while the package component 102 is sandwiched. In order to prevent resin burrs (forming defects) from occurring on the opposite surface 102b of the package member 102, the opposite surface 102b can be exposed.

(實施形態6) (Embodiment 6)

前述實施形態1中，針對在上模11設有模腔凹部13及柱塞17的樹脂成形模具210作了說明。針對與其相異之點，設置本實施形態的樹脂成形模具210E，參照圖14作說明。圖14係樹脂成形模具210E之示意剖面圖。 In the first embodiment, the resin molding die 210 in which the cavity concave portion 13 and the plunger 17 are provided in the upper mold 11 has been described. The resin molding die 210E of the present embodiment is provided in a manner different from this, and will be described with reference to Fig. 14 . Fig. 14 is a schematic cross-sectional view showing a resin molding die 210E.

就樹脂成形模具210E而言，在上模11設有模腔凹部13，在下模12設有於平面視圖中的模腔凹部13(模腔13)的周圍排列的複數個柱塞17(樹脂推壓部)。具體言之，上模11具有基座18a、模腔件16、及夾持器15。又，下模12具有基座18b、及下模板52。實施形態1中在上模11側存在有基座18，本實施形態的情況係在上模11側存在基座18a，下模12側亦存在有基座18b。而且，下模12中，下模板52以隔著彈簧構件54設在基座18b的上模11側。 In the resin molding die 210E, a cavity recess 13 is provided in the upper die 11, and a plurality of plungers 17 are arranged in the lower die 12 around the cavity recess 13 (cavity 13) in plan view (resin push) Pressing part). Specifically, the upper mold 11 has a base 18a, a cavity member 16, and a holder 15. Further, the lower mold 12 has a base 18b and a lower die plate 52. In the first embodiment, the susceptor 18 is present on the upper mold 11 side. In the present embodiment, the susceptor 18a is present on the upper mold 11 side, and the susceptor 18b is also present on the lower mold 12 side. Further, in the lower mold 12, the lower die plate 52 is provided on the upper mold 11 side of the base 18b via the spring member 54.

又，於下模板52，在平面視圖中之模腔凹部13的外側設有複數個供柱塞17***的貫通孔52a(***部)。此貫通孔52a係形成於下模板52的厚度方向(模具開閉方向)。複數個柱塞17被***複數個貫通孔52a的每一個並隔著彈簧構件19設於基座18b。而且，在下模12之柱塞17的上端面(上模11側的端面)設有朝模腔凹部13變窄之 錐狀的流道/澆口28。 Further, in the lower die plate 52, a plurality of through holes 52a (insertion portions) through which the plungers 17 are inserted are provided on the outer side of the cavity concave portion 13 in plan view. The through hole 52a is formed in the thickness direction of the lower die plate 52 (the mold opening and closing direction). A plurality of plungers 17 are inserted into each of the plurality of through holes 52a and are provided to the base 18b via the spring member 19. Further, the upper end surface (the end surface on the upper mold 11 side) of the plunger 17 of the lower mold 12 is provided to be narrowed toward the cavity recess 13 Conical flow channel/gate 28.

此種樹脂成形模具210E中，供安裝工件W的安裝部14成為下模板52的上端面(上模11側的端面)。又，供安裝樹脂R的樹脂安裝部29成為被形成在下模板52的貫通孔52a(***部)。因此，可容易將樹脂R安裝於樹脂安裝部29(凹部)。又，因為樹脂R是在樹脂安裝部29被定位，故可防止例如在推壓樹脂R前樹脂R朝安裝於下模板52的上端面(下模12的分模面12a)的工件W側移動、擴展。 In the resin molding die 210E, the mounting portion 14 to which the workpiece W is attached is the upper end surface (the end surface on the upper mold 11 side) of the lower die plate 52. Moreover, the resin attachment portion 29 to which the resin R is attached is a through hole 52a (insertion portion) formed in the lower die plate 52. Therefore, the resin R can be easily attached to the resin mounting portion 29 (recessed portion). Further, since the resin R is positioned in the resin mounting portion 29, it is possible to prevent the resin R from moving toward the workpiece W side attached to the upper end surface of the lower die plate 52 (the split surface 12a of the lower die 12), for example, before the resin R is pressed. , expansion.

又，在此種樹脂成形模具210E中亦是，柱塞17是以對下模板52可於模具開閉方向相對移動地設於基座18b。因此，和前述實施形態1同樣地，例如，可一邊夾持封裝零件102一邊開始推壓樹脂R。藉以防止在封裝零件102的相反面102b產生樹脂毛邊(成形不良)，可使相反面102b露出。 Further, in the resin molding die 210E, the plunger 17 is provided on the susceptor 18b so that the lower stencil 52 can relatively move in the mold opening and closing direction. Therefore, similarly to the first embodiment, for example, the resin R can be pressed while the package component 102 is sandwiched. In order to prevent resin burrs (forming defects) from occurring on the opposite surface 102b of the package member 102, the opposite surface 102b can be exposed.

(實施形態7) (Embodiment 7)

前述實施形態1中，針對在上模11設有模腔凹部13的樹脂成形模具210作了說明。針對與其相異之點，設置本實施形態的樹脂成形模具210F，參照圖15作說明。圖15係樹脂成形模具210F之示意剖面圖。 In the first embodiment, the resin molding die 210 in which the cavity concave portion 13 is provided in the upper mold 11 has been described. The resin molding die 210F of the present embodiment is provided in a point different from this, and will be described with reference to Fig. 15 . Fig. 15 is a schematic cross-sectional view showing a resin molding die 210F.

就樹脂成形模具210F而言，在下模12設有模腔凹部13。本實施形態中，就樹脂成形模具210F而言，下模12具有基座18、模腔件16、夾持器15、及柱塞17(樹脂推壓部)。此外，實施形態1中在上模11側存在有基座18，但本實施形態中在下模12側存在基座18。於此下 模12，在夾持器15設置複數個從模腔件16離開並排列於模腔件16的周圍供柱塞17的貫通孔15b(***部)。而且，在下模12的夾持器15的上端面(上模11側的端面)，設置複數個從複數個貫通孔15b分別朝向模腔凹部13變狹窄的流道/澆口28。此外，雖將流道/澆口28設於下模12，但亦可在上模11設置殘料廢品(未圖示)作成上模流道/澆口。 In the resin molding die 210F, a cavity recess 13 is provided in the lower die 12. In the present embodiment, the lower mold 12 includes a susceptor 18, a cavity member 16, a holder 15, and a plunger 17 (resin pressing portion) in the resin molding die 210F. Further, in the first embodiment, the susceptor 18 is present on the upper mold 11 side, but in the present embodiment, the susceptor 18 is present on the lower mold 12 side. Under this The die 12 is provided with a plurality of through holes 15b (insertion portions) for the plunger 17 to be separated from the cavity member 16 and arranged around the cavity member 16 in the holder 15. Further, on the upper end surface (the end surface on the upper mold 11 side) of the holder 15 of the lower mold 12, a plurality of flow paths/gates 28 which are narrowed toward the cavity concave portion 13 from the plurality of through holes 15b are provided. Further, although the flow path/gate 28 is provided in the lower mold 12, a residual scrap (not shown) may be provided in the upper mold 11 to form an upper mold flow path/gate.

此種樹脂成形模具210F中，供工件W安裝的安裝部14成為下模12的模腔件16的上端面(上模11側的端面)。又，供樹脂R安裝的樹脂安裝部29成為被形成在下模12的夾持器15之貫通孔15b(***部)。又，因為樹脂R是在樹脂安裝部29被定位，故可防止例如在推壓樹脂R前樹脂R朝安裝於下模12的分模面12a的工件W側移動、擴展。 In the resin molding die 210F, the mounting portion 14 to which the workpiece W is attached is the upper end surface (the end surface on the upper mold 11 side) of the cavity member 16 of the lower mold 12. Moreover, the resin attachment portion 29 to which the resin R is attached is a through hole 15b (insertion portion) formed in the holder 15 of the lower mold 12. Further, since the resin R is positioned in the resin mounting portion 29, it is possible to prevent the resin R from moving and expanding toward the workpiece W side of the parting surface 12a attached to the lower mold 12, for example, before the resin R is pressed.

在此種樹脂成形模具210F中亦是，柱塞17是以對夾持器15及模腔件16可於模具開閉方向相對移動地設於基座18。因此，和前述實施形態1同樣地，例如，可一邊夾持封裝零件102一邊開始推壓樹脂R。藉以防止在封裝零件102的相反面102b產生樹脂毛邊(成形不良)，可使相反面102b露出。 In the resin molding die 210F, the plunger 17 is provided on the susceptor 18 so that the holder 15 and the cavity member 16 can relatively move in the mold opening and closing direction. Therefore, similarly to the first embodiment, for example, the resin R can be pressed while the package component 102 is sandwiched. In order to prevent resin burrs (forming defects) from occurring on the opposite surface 102b of the package member 102, the opposite surface 102b can be exposed.

(實施形態8) (Embodiment 8)

前述實施形態7中，針對在下模12設有模腔凹部13，在模腔凹部13設有安裝部14而成的樹脂成形模具210F作了說明。針對與其相異之點，設置本實施形態的樹脂成形模具210G，參照圖16作說明。圖16係樹脂成形模具 210G之示意剖面圖。 In the seventh embodiment, the resin molding die 210F in which the cavity concave portion 13 is provided in the lower mold 12 and the mounting portion 14 is provided in the cavity concave portion 13 will be described. The resin molding die 210G of the present embodiment is provided in a manner different from this, and will be described with reference to Fig. 16 . Figure 16 is a resin molding die A schematic cross-sectional view of 210G.

樹脂成形模具210G中，在上模11設有安裝部14。本實施形態中，以覆蓋上模11的分模面11a的方式設置薄膜F，但可使此薄膜F具黏著性將工件W黏著並安裝於安裝部14。此外，亦可在不使用薄膜F下藉由利用設於上模11的分模面11a的吸引路之公知的吸引裝置(例如，真空泵)將工件W吸引並保持。 In the resin molding die 210G, the mounting portion 14 is provided in the upper die 11. In the present embodiment, the film F is provided so as to cover the parting surface 11a of the upper mold 11, but the film F can be adhered to the mounting portion 14 with adhesiveness. Further, the workpiece W may be sucked and held by a known suction device (for example, a vacuum pump) using a suction path provided on the parting surface 11a of the upper mold 11 without using the film F.

此處，在圖16中一點鏈線左側的樹脂成形模具210G中，柱塞17是隔著彈簧構件19設於基座18。供此柱塞17***的貫通孔15b係成為樹脂安裝部29，被安裝作為樹脂R的錠樹脂。另一方面，在圖16中的一點鏈線右側的樹脂成形模具210G中，柱塞17被故設於基座18。此外，複數個柱塞17可以是全都藉由彈簧構件19可移動的構成，亦可為全都被固定的構成，亦可為一部份藉由彈簧構件19而其他部份是固定的混和存在之構成。 Here, in the resin molding die 210G on the left side of the one-dot chain line in FIG. 16, the plunger 17 is provided in the susceptor 18 via the spring member 19. The through hole 15b into which the plunger 17 is inserted is a resin mounting portion 29, and is mounted as an ingot resin of the resin R. On the other hand, in the resin molding die 210G on the right side of the one-dot chain line in FIG. 16, the plunger 17 is disposed on the susceptor 18. In addition, the plurality of plungers 17 may be configured to be movable by the spring member 19, or may be all fixed, or may be partially mixed by the spring member 19 and other portions being fixed. Composition.

又，供柱塞17***的貫通孔15b係成為樹脂安裝部29，被安裝作為樹脂R的顆粒樹脂。此外，樹脂R的形狀不限於錠狀、顆粒狀、液狀，亦可為粉狀。再者亦可為開設有封裝零件形狀的孔之薄片狀樹脂。 Moreover, the through hole 15b into which the plunger 17 is inserted is the resin mounting portion 29, and the pellet resin as the resin R is attached. Further, the shape of the resin R is not limited to a tablet shape, a pellet shape, or a liquid state, and may be powdery. Further, it may be a sheet-like resin in which a hole having a shape of a package part is opened.

(實施形態9) (Embodiment 9)

針對本實施形態的樹脂成形模具210H，參照圖17說明和前述實施形態8相異之點。圖17係樹脂成形模具210H之示意剖面圖。 The resin molding die 210H of the present embodiment will be described with reference to Fig. 17 in comparison with the above-described eighth embodiment. Fig. 17 is a schematic cross-sectional view showing a resin molding die 210H.

樹脂成形模具210H中，於下模12，在夾持器15設有複數個在模腔件16的周圍排列且與模腔件16相接 地供柱塞17***的貫通孔15b(***部)。而且，在下模12之柱塞17的上端面(上模11側的端面)設置朝模腔凹部13變窄之錐狀的流道/澆口28。此外，和下模12同樣地，在上模11可有薄膜F，但沒有亦無妨(在圖17中並沒有)。 In the resin molding die 210H, in the lower die 12, a plurality of the holders 15 are arranged around the cavity member 16 and are in contact with the cavity member 16. A through hole 15b (insertion portion) into which the plunger 17 is inserted is provided. Further, a tapered flow path/gate 28 which is narrowed toward the cavity concave portion 13 is provided on the upper end surface (the end surface on the upper mold 11 side) of the plunger 17 of the lower mold 12. Further, similarly to the lower mold 12, the film F may be present in the upper mold 11, but it is not necessary (not shown in Fig. 17).

(實施形態10) (Embodiment 10)

針對本實施形態的樹脂成形模具210I，參照圖18說明與前述實施形態6相異之點。圖18係樹脂成形模具210I之示意剖面圖。 The resin molding die 210I of the present embodiment will be described with reference to Fig. 18 in comparison with the above-described sixth embodiment. Fig. 18 is a schematic cross-sectional view showing a resin molding die 210I.

樹脂成形模具210I中，上模11的夾持器15不隔著彈簧構件而是隔著固定塊56被固定於基座18a。又，流道/澆口28是設在上模11的夾持器15的下端面(上模11的分模面11a)且和下模12的柱塞17對向的位置。又，使樹脂成形後殘存於流道/澆口28的成形樹脂從下模12脫模用的頂出銷機構(未圖示)被設置在下模12。又，制動件58設於下模12的基座18b的上面，俾下模板52於閉模之際會在某程度的位置被卡止。此外，和上模11同樣地，在下模12可有或沒有薄膜F(圖18中沒有薄膜)。 In the resin molding die 210I, the holder 15 of the upper mold 11 is fixed to the base 18a via the fixing block 56 without interposing the spring member. Further, the flow path/gate 28 is a position provided on the lower end surface of the holder 15 of the upper mold 11 (the split surface 11a of the upper mold 11) and opposed to the plunger 17 of the lower mold 12. Moreover, the ejector pin mechanism (not shown) for releasing the molding resin remaining in the flow path/gate 28 after the resin molding from the lower mold 12 is provided in the lower mold 12. Further, the brake member 58 is provided on the upper surface of the base 18b of the lower mold 12, and the underarm template 52 is locked at a certain position at the time of closing the mold. Further, similarly to the upper mold 11, the lower mold 12 may or may not have the film F (there is no film in Fig. 18).

(實施形態11) (Embodiment 11)

針對本實施形態的樹脂成形模具10(樹脂成形模具機構)，參照圖19~圖26作說明。圖19~圖23係動作中(製程中)的樹脂成形模具10之示意剖面圖。又，圖24及圖25係分別為上模11及下模12的分模面(亦稱為夾持面、模具面。)之示意平面圖。圖26係成形品100(成形後的工件W)的要部示意剖面圖。 The resin molding die 10 (resin molding die mechanism) of the present embodiment will be described with reference to Figs. 19 to 26 . 19 to 23 are schematic cross-sectional views of the resin molding die 10 during operation (in the process). 24 and 25 are schematic plan views of the parting faces (also referred to as clamping faces and die faces) of the upper die 11 and the lower die 12, respectively. Fig. 26 is a schematic cross-sectional view of an essential part of a molded article 100 (worked workpiece W).

如圖19所示，樹脂成形模具10係建構成：具 備一對的模具(一及另一模具)，藉由此等的接觸離開動作而可開閉模具。實施形態1~10係柱塞17於平面視圖中配置在模腔凹部13外，但在以下的實施形態中記載配置在模腔凹部13內之實施形態。前述實施形態1中，針對將供柱塞17***之夾持器15的貫通孔15b(***部)在模腔凹部13全周作複數排列的樹脂成形模具210作了說明。針對與其相異之點，以本實施形態的樹脂成形模具10作說明，實施形態11中在模腔件16的中央部(中心C)設置貫通孔16a，配置柱塞17。此外，圖19中柱塞17被固定在基座18，但如同實施形態1~10使彈簧構件介設在基座18與柱塞17間亦可。 As shown in Fig. 19, the resin molding die 10 is constructed as follows: A pair of molds (one and the other mold) are provided, and the mold can be opened and closed by the contact and separation operation. In the first to tenth embodiments, the plunger 17 is disposed outside the cavity concave portion 13 in plan view. However, in the following embodiments, the embodiment is disposed in the cavity concave portion 13. In the first embodiment, the resin molding die 210 in which the through holes 15b (insertion portions) of the holder 15 into which the plungers 17 are inserted are arranged in the entire circumference of the cavity concave portion 13 is described. In the eleventh embodiment, the resin molding die 10 of the present embodiment will be described. In the eleventh embodiment, the through hole 16a is provided in the center portion (center C) of the cavity member 16, and the plunger 17 is placed. Further, although the plunger 17 is fixed to the susceptor 18 in Fig. 19, the spring member may be interposed between the susceptor 18 and the plunger 17 as in the first to tenth embodiments.

樹脂成形模具10的處理對象即工件W及薄膜F係和實施形態1~10相同。此外，後面將述及，因為要在基板101的中央部(中心C)安裝(配置)樹脂R，所以封裝零件102未被封裝於其位置的基板101上。本實施形態中，配合工件W的平面視圖形狀(參照圖25)，模腔凹部13的平面視圖形狀(參照圖24)是作成圓形。此外，工件W的平面視圖形狀不限於圓形，例如亦可為矩形。 The workpiece W and the film F which are processing targets of the resin molding die 10 are the same as those of the first to tenth embodiments. Further, as will be described later, since the resin R is to be mounted (arranged) in the central portion (center C) of the substrate 101, the package member 102 is not packaged on the substrate 101 at its position. In the present embodiment, the plan view shape of the cavity concave portion 13 (see Fig. 24) is rounded in accordance with the plan view shape of the workpiece W (see Fig. 25). Further, the plan view shape of the workpiece W is not limited to a circular shape, and may be, for example, a rectangular shape.

當此工件W為成形品100(參照圖26)時，與基板101側的基板面102a(基板側表面)對向之相反側的相反面102b(反基板側表面)被露出，其他的面(基板面102a及側面)被樹脂成形部103所覆蓋。亦即，封裝零件102的相反面102b成為夾持面並被夾持，封裝零件的基板面102a及側面在模腔凹部13內被樹脂密封。此外，本實施形態中，要以工件W(基板101)在平面視圖的尺寸比模腔 凹部13的平面視圖之尺寸還大者作說明，但亦可為比其還小者，此情況成為連基板101的側面都被樹脂成形部103所覆蓋。 When the workpiece W is the molded product 100 (see FIG. 26), the opposite surface 102b (the counter substrate side surface) opposite to the substrate surface 102a (substrate side surface) on the substrate 101 side is exposed, and the other surface ( The substrate surface 102a and the side surface are covered by the resin molded portion 103. That is, the opposite surface 102b of the package member 102 is sandwiched and held, and the substrate surface 102a and the side surface of the package component are resin-sealed in the cavity concave portion 13. Further, in the present embodiment, the size of the workpiece W (substrate 101) in plan view is larger than that of the cavity. The size of the plan view of the recessed portion 13 is also larger, but may be smaller than this. In this case, the side surface of the substrate 101 is covered by the resin molded portion 103.

在模腔凹部13的底部(參照圖24)，藉由模腔件16和柱塞17而分割成夾持封裝零件102的區域與加壓樹脂R的區域。本實施形態中，柱塞17、模腔件16及夾持器15係於平面視圖中各自的外形成為同心狀。亦即，在模腔凹部13的底部的中央部設有柱塞17俾使樹脂R從模腔凹部13的底部的中央部朝外周部流動。 At the bottom of the cavity recess 13 (refer to FIG. 24), the cavity member 16 and the plunger 17 are divided into a region where the package member 102 is sandwiched and a region where the resin R is pressed. In the present embodiment, the plunger 17, the cavity member 16, and the holder 15 are concentric in shape in plan view. That is, the plunger 17 is provided at the center portion of the bottom portion of the cavity concave portion 13 so that the resin R flows from the central portion of the bottom portion of the cavity concave portion 13 toward the outer peripheral portion.

樹脂成形模具10係例如和前述實施形態1同樣地，關於柱塞17的可動方面，並不使用複雜的機構，而是藉由合併模具開閉機構作使用而成為簡易的構造。此外，關於柱塞17的可動方面亦可使用油壓缸或馬達等之別的驅動的致動器。 In the resin molding die 10, for example, similarly to the first embodiment, the movable mechanism of the plunger 17 is a simple structure by using a mold opening/closing mechanism without using a complicated mechanism. Further, as the movable portion of the plunger 17, an actuator driven by a hydraulic cylinder or a motor or the like may be used.

如此，在樹脂成形模具10中，於模腔凹部13的底部，分割將封裝零件102的相反面102b推壓並夾持封裝零件102之機能(模腔件16)與推壓並壓縮(加壓)樹脂R之機能(柱塞17)使之獨立。因為各自的機能獨立地作用，所以例如，能防止封裝零件102的破損以適切的壓力一邊夾持封裝零件102，防止產生樹脂毛邊並加壓樹脂R。亦即，可提升使用樹脂成形模具10進行樹脂成形的成形品100之成形品質。 Thus, in the resin molding die 10, at the bottom of the cavity concave portion 13, the function of pressing the opposite face 102b of the package member 102 and clamping the package member 102 (the cavity member 16) is pushed and compressed (pressurized) The function of the resin R (plunger 17) makes it independent. Since the respective functions independently act, for example, it is possible to prevent the breakage of the package member 102 from sandwiching the package member 102 with a proper pressure, thereby preventing generation of resin burrs and pressurization of the resin R. That is, the molding quality of the molded article 100 which is resin-molded using the resin molding die 10 can be improved.

其次，針對作為本實施形態的壓縮成形的樹脂成形模具10之動作(樹脂成形方法之工序，成形品的製造方法之工序)進行說明。首先，如圖19所示，準備一樹 脂成形模具10，其具備可開閉模具的一對模具(上模11及下模12)，以於上模11的分模面11a設有模腔凹部13，以和模腔凹部13對向的方式將供工件W安裝的安裝部14設於下模12的分模面12a。 Next, the operation of the resin molding die 10 which is compression-molded in the present embodiment (the step of the resin molding method, the step of the method for producing the molded article) will be described. First, as shown in Figure 19, prepare a tree The grease molding die 10 is provided with a pair of molds (the upper die 11 and the lower die 12) that can open and close the mold, so that the cavity concave portion 13 is provided on the parting surface 11a of the upper die 11 so as to oppose the cavity concave portion 13 In the manner, the mounting portion 14 to which the workpiece W is attached is provided on the parting surface 12a of the lower mold 12.

接著，如圖20所示，在使樹脂成形模具10已開模的狀態中，將封裝有封裝零件102的成形前之工件W(被成形品)安裝於安裝部14。具體言之，工件W藉由未圖示的裝載器搬送到下模12的分模面12a，使工件W(更具體言之，使封裝零件102向上模11側的狀態之基板101)被安裝(配置)於安裝部14。此工件W係藉由利用形成於下模12的吸引路(未圖示)之公知的吸引裝置(例如，真空泵)吸附保持並安裝於安裝部14。 Next, as shown in FIG. 20, in a state in which the resin molding die 10 is opened, the workpiece W (formed product) before molding in which the package component 102 is packaged is attached to the mounting portion 14. Specifically, the workpiece W is transported to the parting surface 12a of the lower mold 12 by a loader (not shown), and the workpiece W (more specifically, the substrate 101 in a state where the packaged part 102 is on the upper mold 11 side) is mounted. (Configuration) in the mounting portion 14. This workpiece W is suction-held and attached to the mounting portion 14 by a known suction device (for example, a vacuum pump) formed in a suction path (not shown) formed in the lower mold 12.

又，在使樹脂成形模具10已開模的狀態中，將薄膜F以覆蓋包含模腔凹部13的內面在內的上模11的分模面11a地作安裝。具體言之，在上模11中，薄膜F以從纏繞成滾筒狀的抽出滾筒拉出並通過上模11的分模面11a朝纏繞滾筒纏繞的方式設置。此外，薄膜可以是由滾筒狀切成既定長度者。此薄膜F係例如藉由利用夾持器15的貫通孔15a的內側面(貫通孔15a的內壁面)與模腔件16的外側面之間隙、模腔件16的內側面(貫通孔16a的內壁面)與柱塞17的外側面之間隙的公知的吸引裝置(例如，真空泵)吸附保持並張設於包含模腔凹部13的內面在內的上模11的分模面11a。 Moreover, in a state in which the resin molding die 10 has been opened, the film F is attached to the parting surface 11a of the upper mold 11 covering the inner surface of the cavity concave portion 13. Specifically, in the upper mold 11, the film F is pulled out from the take-up drum wound in a roll shape and wound around the winding drum by the split surface 11a of the upper mold 11. Further, the film may be cut into a predetermined length from a roll shape. The film F is formed by, for example, the inner side surface of the through hole 15a of the holder 15 (the inner wall surface of the through hole 15a) and the outer side surface of the cavity member 16, and the inner side surface of the cavity member 16 (the through hole 16a). A known suction device (for example, a vacuum pump) having a gap between the inner wall surface and the outer side surface of the plunger 17 is suction-held and stretched over the parting surface 11a of the upper mold 11 including the inner surface of the cavity concave portion 13.

藉由設置此種薄膜F，可使成形後的工件W(成形品100)容易從上模11脫模。又，由於藉由隔著薄膜F 以模腔件16推壓封裝零件102會使封裝零件102陷入薄膜F某程度，故可防止樹脂R附著於封裝零件102的相反面102b。 By providing such a film F, the formed workpiece W (molded article 100) can be easily released from the upper mold 11. Also, by being separated by a film F Pushing the package member 102 by the cavity member 16 causes the package member 102 to sink into the film F to some extent, so that the resin R can be prevented from adhering to the opposite face 102b of the package member 102.

接著，如圖20及圖25所示，在使樹脂成形模具10開模的狀態中，被安裝於安裝部14的工件W之和柱塞17對向的部位安裝(載置)樹脂R。圖25係平面圖，為了清楚說明，於樹脂R附上影線。具體言之，錠狀的樹脂R(錠樹脂)藉由未圖示的裝載器搬送到模具內部，樹脂R供至工件W的既定部位(和柱塞17對向的部位)。在樹脂R是設為比封裝零件102還高背的背高樹脂(例如，錠樹脂)的情況，即使安裝區域狹窄亦可確保所期望的成形樹脂量。 Then, as shown in FIG. 20 and FIG. 25, in a state in which the resin molding die 10 is opened, the resin R attached to the portion of the workpiece W attached to the mounting portion 14 and the plunger 17 is mounted (mounted). Figure 25 is a plan view with hatching attached to the resin R for clarity of illustration. Specifically, the ingot-shaped resin R (ingot resin) is conveyed to the inside of the mold by a loader (not shown), and the resin R is supplied to a predetermined portion of the workpiece W (a portion opposed to the plunger 17). In the case where the resin R is a back-high resin (for example, an ingot resin) which is higher than the package member 102, the desired amount of the molding resin can be secured even if the mounting region is narrow.

此外，如圖33~圖34所示，除了比例如錠樹脂那樣的封裝零件102還高背的樹脂R(背高樹脂Rh)以外，亦可預先在封裝零件102間，例如安裝(載置或塗布)比顆粒樹脂、液狀樹脂、薄片樹脂那樣的封裝零件102還低背的樹脂R(背低樹脂Rl)。例如即使是大面積的工件且成形樹脂量需求多的情況，亦可防止樹脂R未填充於模腔凹部13中。 Further, as shown in FIG. 33 to FIG. 34, in addition to the resin R (back high resin Rh) which is higher than the package component 102 such as a resin, it is also possible to mount (mounting or mounting) between the package components 102 in advance. The resin R (back low resin R1) having a lower back than the package component 102 such as a particulate resin, a liquid resin or a sheet resin is applied. For example, even in the case of a large-area workpiece and a large amount of molding resin is required, it is possible to prevent the resin R from being filled in the cavity concave portion 13.

接著，開始閉模動作，如圖21所示，樹脂成形模具10進行持續閉模(使上模11與下模12接近)，隔著薄膜F以上模11(夾持器15)和下模12夾持工件W(基板101)。因而，模腔凹部13的開口部被工件W(基板101)所閉塞。但此時的模腔凹部13的深度(高度)係比用以作成成形品100的成形厚度之深度還深。而且，模腔凹部13 的空間係藉由形成於夾持器15的下端面之通氣溝(未圖示)開始減壓。此外，於工件W在平面視圖的尺寸是小於模腔凹部13在平面視圖的尺寸之情況，夾持器15與下模12抵接而成為閉模(模具夾持)的狀態，成為工件W收納在模腔凹部13內之狀態。 Then, the mold closing operation is started. As shown in Fig. 21, the resin molding die 10 is continuously closed (the upper die 11 is brought close to the lower die 12), and the die 11 (clamp 15) and the lower die 12 are interposed between the film F and the film. The workpiece W (substrate 101) is clamped. Therefore, the opening of the cavity concave portion 13 is closed by the workpiece W (substrate 101). However, the depth (height) of the cavity recess 13 at this time is deeper than the depth of the formed thickness of the molded article 100. Moreover, the cavity recess 13 The space is started to be decompressed by a ventilation groove (not shown) formed in the lower end surface of the holder 15. Further, in the case where the size of the workpiece W in plan view is smaller than the size of the cavity concave portion 13 in plan view, the holder 15 abuts against the lower mold 12 to be in a state of closed mold (mold clamping), and becomes a workpiece W. The state inside the cavity recess 13.

接著，將樹脂成形模具10進一步進行持續閉模，如圖22所示，將被安裝於安裝部14的工件W的封裝零件102，以在模腔凹部13的底部之模腔件16夾持並推壓。此時，由於基座18會接近夾持著工件W的夾持器15，所以其等之間的彈簧構件20被壓而縮短(換言之，附能予夾持器15)。而且，模腔凹部13的深度(高度)變淺(低)而成為成形品100的成形厚度。此外，此時並沒有利用柱塞17推壓樹脂R。或即使有推壓亦能以樹脂R不會流出到封裝零件102的程度推壓。 Next, the resin molding die 10 is further continuously closed, and as shown in FIG. 22, the package member 102 of the workpiece W attached to the mounting portion 14 is held by the cavity member 16 at the bottom of the cavity recess 13 and Push. At this time, since the susceptor 18 approaches the holder 15 holding the workpiece W, the spring member 20 between them is pressed and shortened (in other words, the holder 15 is attached). Further, the depth (height) of the cavity concave portion 13 becomes shallow (low) and becomes the formed thickness of the molded article 100. Further, at this time, the resin R is not pushed by the plunger 17. Or even if there is a push, it can be pushed to the extent that the resin R does not flow out to the package part 102.

接著，將樹脂成形模具10進一步進行持續閉模，將封裝零件102以模腔件16一邊推壓一邊以柱塞17對工件W開始推壓樹脂R，如圖23所示，於閉模的狀態中，對模腔凹部13內填充熔融的樹脂R。具體言之，由於基座18會接近於夾持著封裝零件102的模腔件16，故其等之間的彈簧構件21縮短，附能予模腔件16。此時，由於柱塞17被固定於基座18，所以相對於模腔件16，柱塞17相對地可朝下模12側移動。因此，成為柱塞17推壓模腔13內的樹脂R。 Then, the resin molding die 10 is further continuously closed, and the package member 102 is pressed against the cavity member 16 to press the resin R against the workpiece W by the plunger 17, as shown in FIG. In the cavity recess 13, the molten resin R is filled. In particular, since the susceptor 18 will be close to the cavity member 16 holding the package part 102, the spring member 21 between them is shortened and attached to the cavity member 16. At this time, since the plunger 17 is fixed to the base 18, the plunger 17 is relatively movable toward the lower mold 12 side with respect to the cavity member 16. Therefore, the plunger 17 presses the resin R in the cavity 13.

此處，圖23中，模腔件16的下端面和柱塞17的下端面成為一平面(距離基座18的下端面相同距離)， 但樹脂成形模具10中因為可於既定的成形壓(夾持壓)調整成形樹脂量，故未必會成為一平面。此乃樹脂成形模具10中，構成模腔凹部13的底部之模腔件16及柱塞17是可相對移動之構成的緣故。 Here, in FIG. 23, the lower end surface of the cavity member 16 and the lower end surface of the plunger 17 become a plane (the same distance from the lower end surface of the susceptor 18), However, since the amount of the molding resin can be adjusted at a predetermined molding pressure (nip pressure) in the resin molding die 10, it does not necessarily become a flat surface. In the resin molding die 10, the cavity member 16 and the plunger 17 which constitute the bottom portion of the cavity concave portion 13 are configured to be relatively movable.

例如，在安裝了多於成形樹脂量之樹脂量的樹脂R的情況，其過剩份量使得相對於工件W(封裝零件102的封裝面)，柱塞17的下端面是比模腔件16的下端面還遠離(後退)而進行樹脂成形。此時，有柱塞17***的貫通孔16a係當作溢流腔作用。另一方面，在安裝了少於成形樹脂量之樹脂量的樹脂R的情況，其不足份量使得相對於工件W，柱塞17的下端面是比模腔件16的下端面還靠近(進入)而進行樹脂成形。如此，在樹脂成形模具10中，因為可調整成形樹脂量，所以例如即使是被封裝的封裝零件102之數不同的工件W，亦可防止樹脂R未填充於模腔凹部13中。此外，在樹脂量調整方面，除了調整柱塞17的下端面對此種模腔件16的下端面推壓位置的調整以外，如實施形態2的圖8所示，亦可使用在夾持器15的下端面設有凹部的公知的溢流腔(過剩樹脂用的凹部)。此外，此情況的溢流腔係亦可為將調壓機構的柱塞內包的溢流腔。 For example, in the case where the resin R having a resin amount larger than the molding resin amount is installed, the excess amount thereof is such that the lower end surface of the plunger 17 is lower than the cavity member 16 with respect to the workpiece W (the package surface of the package member 102). The end face is also moved away from (retracted) to form a resin. At this time, the through hole 16a into which the plunger 17 is inserted functions as an overflow chamber. On the other hand, in the case where the resin R having a resin amount smaller than the molding resin amount is installed, the insufficient amount thereof makes the lower end surface of the plunger 17 closer to the lower end surface of the cavity member 16 with respect to the workpiece W (enter). The resin is formed. As described above, in the resin molding die 10, since the amount of the molding resin can be adjusted, for example, even if the number of the packaged parts 102 to be packaged is different, the resin R can be prevented from being filled in the cavity concave portion 13. Further, in terms of the adjustment of the amount of the resin, in addition to the adjustment of the lower end surface of the plunger 17 to adjust the pressing position of the lower end surface of the cavity member 16, as shown in FIG. 8 of the second embodiment, it is also possible to use the holder. A well-known overflow chamber (a recess for excess resin) having a concave portion is provided on the lower end surface of the lower end surface. In addition, the overflow chamber in this case may also be an overflow chamber that encloses the plunger of the pressure regulating mechanism.

接著，在使填充於模腔凹部13內的樹脂R於保壓的狀態下熱硬化後，開模並使脫模後的工件W再熱硬化(post cure)。藉此，如圖26所示，大致完成具備露出封裝零件102的相反面102b之樹脂成形部103(樹脂R)的成形品100。 Next, after the resin R filled in the cavity concave portion 13 is thermally cured in a state where the pressure is maintained, the mold is opened and the workpiece W after the mold release is post-cured. As a result, as shown in FIG. 26, the molded article 100 including the resin molded portion 103 (resin R) exposing the opposite surface 102b of the package member 102 is substantially completed.

如同前述，在樹脂成形模具10中之模腔凹部13的底部，夾持封裝零件102的模腔件16與推壓並壓縮(加壓)樹脂R的柱塞17被分割成可在模具開閉方向相對地進退移動。因此，例如，防止封裝零件102的破損以適切的壓力一邊夾持封裝零件102一邊開始推壓樹脂R，可防止在封裝零件102的相反面102b產生樹脂毛邊(成形不良)。因此，依據樹脂成形模具10，可提升製造良率，又，可提升成形品100的成形品質。又，因為變得不需要除去樹脂毛邊的工序，故可削減製造成本。 As described above, at the bottom of the cavity concave portion 13 in the resin molding die 10, the cavity member 16 that sandwiches the package member 102 and the plunger 17 that presses and compresses (presses) the resin R are divided into the mold opening and closing direction. Move forward and backward relatively. Therefore, for example, the resin component R is prevented from being pressed while sandwiching the package component 102 with appropriate pressure, and resin burrs (forming defects) are prevented from occurring on the opposite surface 102b of the package component 102. Therefore, according to the resin molding die 10, the manufacturing yield can be improved, and the molding quality of the molded article 100 can be improved. Moreover, since the process of removing the resin burrs is unnecessary, the manufacturing cost can be reduced.

使用樹脂成形模具10的樹脂成形方法係不限於前述的工件W，也可適用於圖27所示的工件W(3種類的工件W1、W2、W3)。圖27係各種工件W1、W2、W3的要部示意剖面圖。 The resin molding method using the resin molding die 10 is not limited to the above-described workpiece W, and can be applied to the workpiece W (three types of workpieces W1, W2, and W3) shown in Fig. 27 . Fig. 27 is a schematic cross-sectional view showing essential parts of various workpieces W1, W2, and W3.

工件W1係為下面104a具有凸塊105(銲球)的封裝零件104在基板101上隔著凸塊105被進行倒裝晶片封裝而成者。如同前述，藉由在以模腔件16推壓封裝零件104的上面104b之後，以柱塞17推壓樹脂R之樹脂成形方法，工件W1係因樹脂成形使得凸塊105間及基板101與下面104a之間被樹脂密封[所謂的成形底部填膠(mold underfill)]，而上面104b露出。 The workpiece W1 is a package member 104 having a bump 105 (solder ball) on the lower surface 104a, and is flip-chip packaged on the substrate 101 via the bump 105. As described above, by pressing the resin forming method of the resin R with the plunger 17 after the upper surface 104b of the package member 104 is pushed by the cavity member 16, the workpiece W1 is formed by the resin so that the bumps 105 and the substrate 101 and the lower surface are formed. The 104a is sealed by a resin [so-called mold underfill], and the upper surface 104b is exposed.

又，工件W2係為下面106a具有凸塊105、上面106b具有凸塊107及其他的封裝零件108的封裝零件106在基板101上隔著凸塊105進行倒裝晶片封裝而成者。藉由前述的樹脂成形方法，工件W2係因樹脂成形使得基板101與下面106a之間被樹脂密封，並且凸塊107的一 部份的表面露出。 Further, the workpiece W2 is a packaged component 106 in which the lower surface 106a has the bump 105, the upper surface 106b has the bump 107, and the other package component 108 is flip-chip packaged on the substrate 101 via the bump 105. According to the foregoing resin molding method, the workpiece W2 is sealed by resin between the substrate 101 and the lower surface 106a by resin molding, and one of the bumps 107 Part of the surface is exposed.

又，工件W3係為以封裝零件104、封裝零件106在基板101上被倒裝封裝，且覆蓋(包夾)此等積層者般，其他的基板109(亦是封裝零件)隔著柱110(亦是封裝零件)、封裝零件106被封裝者。藉由前述的樹脂成形方法，工件W3係因樹脂成形使得基板101與基板109之間(上下基板之間)被樹脂密封，並且基板109的上面露出。 Moreover, the workpiece W3 is flip-packed on the substrate 101 by the package component 104 and the package component 106, and the other substrate 109 (also a package component) is interposed between the pillars 110 (including the package components). It is also a packaged part), and the package part 106 is packaged. According to the resin molding method described above, the workpiece W3 is resin-sealed so that the substrate 101 and the substrate 109 (between the upper and lower substrates) are sealed by the resin, and the upper surface of the substrate 109 is exposed.

(實施形態12) (Embodiment 12)

前述實施形態11中，針對有關在上模11設有模腔凹部13而成的樹脂成形模具10之技術作了說明。本實施形態中，針對有關將其樹脂成形模具10的模具構成設為上下相反的構成且在下模12設有模腔凹部13而成的樹脂成形模具10A之技術，參照圖28作說明。圖28係樹脂成形模具10A之示意剖面圖。此情況的樹脂可為液狀、顆粒狀、粉狀、錠狀任一者。在以下的實施例全適用，故不特別記載種類。 In the eleventh embodiment, the technique of the resin molding die 10 in which the cavity concave portion 13 is provided in the upper mold 11 has been described. In the present embodiment, a technique of forming a resin molding die 10A in which the mold configuration of the resin molding die 10 is reversed and the cavity concave portion 13 is provided in the lower die 12 will be described with reference to FIG. Fig. 28 is a schematic cross-sectional view showing a resin molding die 10A. The resin in this case may be in the form of a liquid, a granule, a powder or a tablet. Since the following examples are all applicable, the types are not particularly described.

樹脂成形模具10A係具備可開閉模具的一對模具(上模11及下模12)，在下模12的分模面12a設置模腔凹部13，在上模11的分模面11a設置供安裝工件W之安裝部14。在模腔凹部13的底部，模腔件16的貫通孔16a成為罐，於此貫通孔16a(罐)內和柱塞17對向的部位(柱塞17的前端面)安裝樹脂R。以基座18的上端面為基準面，柱塞17的上端面成為比模腔件16的上端面還低位(距離變短)。因此，即使罐(貫通孔16a)被供給樹脂R，亦可防止樹脂R朝模腔凹部13的模腔件16側溢出。因此，可隔著未 有樹脂R附著的薄膜F用模腔件16推壓封裝零件102，可防止在封裝零件102的相反面102b(參照圖26)產生樹脂毛邊等之成形不良。亦即，可提升成形品質。此外，工件W在圖28中安裝於上模11，但亦可在將樹脂R搭載於下模12的貫通孔16a後，將工件W安裝於下模12的分模面12a(成為安裝部14)之上。 The resin molding die 10A includes a pair of molds (the upper die 11 and the lower die 12) that can open and close the die, and a cavity recess 13 is provided in the split surface 12a of the lower die 12, and a workpiece is mounted on the split surface 11a of the upper die 11. W mounting portion 14. At the bottom of the cavity concave portion 13, the through hole 16a of the cavity member 16 serves as a can, and the resin R is attached to the portion of the through hole 16a (can) that faces the plunger 17 (the front end surface of the plunger 17). With the upper end surface of the susceptor 18 as a reference surface, the upper end surface of the plunger 17 is lower than the upper end surface of the cavity member 16 (the distance becomes shorter). Therefore, even if the can (through hole 16a) is supplied with the resin R, the resin R can be prevented from overflowing toward the cavity member 16 side of the cavity concave portion 13. Therefore, it can be separated The film F to which the resin R adheres presses the package member 102 with the cavity member 16, and it is possible to prevent formation defects such as resin burrs from occurring on the opposite surface 102b (see FIG. 26) of the package member 102. That is, the forming quality can be improved. Further, the workpiece W is attached to the upper mold 11 in FIG. 28, but after the resin R is mounted on the through hole 16a of the lower mold 12, the workpiece W may be attached to the parting surface 12a of the lower mold 12 (becomes the mounting portion 14). Above.

(實施形態13) (Embodiment 13)

前述實施形態11中，針對有關在上模11的分模面11a設有薄膜F而成的樹脂成形模具10之技術作了說明。本實施形態中，針對在樹脂成形模具10中未設置薄膜F的樹脂成形模具10B之技術參照圖29作說明。圖29係樹脂成形模具10B之示意剖面圖。 In the eleventh embodiment, the technique of the resin molding die 10 in which the film F is provided on the parting surface 11a of the upper mold 11 has been described. In the present embodiment, the technique of the resin molding die 10B in which the film F is not provided in the resin molding die 10 will be described with reference to FIG. Fig. 29 is a schematic cross-sectional view showing a resin molding die 10B.

在樹脂成形模具10B中亦是，將工件W的封裝零件102以模腔凹部13的底部之模腔件16一邊推壓一邊以柱塞17對工件W進行持續推壓樹脂R，對模腔凹部13內填充熔融的樹脂R，使之熱硬化。藉此亦可防止在封裝零件102的相反面102b產生樹脂毛邊(成形不良)。亦即，可提升成形品質。 In the resin molding die 10B, the package member 102 of the workpiece W is pressed against the cavity member 16 at the bottom of the cavity recess 13 while the workpiece W is continuously pressed by the plunger 17 to the cavity concave portion. The molten resin R is filled in 13 to be thermally hardened. Thereby, it is also possible to prevent resin burrs (forming defects) from occurring on the opposite surface 102b of the package member 102. That is, the forming quality can be improved.

(實施形態14) (Embodiment 14)

前述實施形態11中，針對有關在模腔凹部13的底部中央設有1個柱塞17而成的樹脂成形模具10之技術作了說明。本實施形態中，針對有關設有複數個柱塞17而成的樹脂成形模具10C之技術參照圖30作說明。圖30係樹脂成形模具10C之示意剖面圖。 In the eleventh embodiment, the technique of the resin molding die 10 in which one plunger 17 is provided at the center of the bottom of the cavity concave portion 13 has been described. In the present embodiment, a technique of the resin molding die 10C in which a plurality of plungers 17 are provided will be described with reference to FIG. Fig. 30 is a schematic cross-sectional view showing a resin molding die 10C.

在樹脂成形模具10C中，如圖30所示，模腔 凹部13的底部是以藉由基座18支撐的1個板狀的模腔件16和複數個銷狀的柱塞17所構成。亦即，模腔凹部13的內底面是以模腔件16的下端面及複數個柱塞17的下端面所構成。在模腔件16，於平面視圖中的中心周圍且厚度方向(模具開閉方向)設置複數個貫通孔16a(罐)。在此等複數個貫通孔16a分別設置複數個柱塞17。此外，複數個柱塞17係沿著模腔凹部13的底部的平面視圖形狀(圓形)之外形配置。此外，未必需要是圓形，亦可為四角形狀。又，亦可與工件形狀搭配。 In the resin molding die 10C, as shown in Fig. 30, the cavity The bottom of the recess 13 is composed of a plate-shaped cavity member 16 supported by the susceptor 18 and a plurality of pin-shaped plungers 17. That is, the inner bottom surface of the cavity recess 13 is constituted by the lower end surface of the cavity member 16 and the lower end faces of the plurality of plungers 17. In the cavity member 16, a plurality of through holes 16a (tanks) are provided around the center in the plan view and in the thickness direction (the mold opening and closing direction). A plurality of plungers 17 are provided in each of the plurality of through holes 16a. Further, a plurality of plungers 17 are disposed outside the plan view shape (circular shape) of the bottom portion of the cavity concave portion 13. Further, it is not necessarily required to be a circle, and may be a square shape. Also, it can be matched with the shape of the workpiece.

在此種樹脂成形模具10C中，被安裝於安裝部14的工件W中和複數個柱塞17對向之複數個部位的每一個被安裝複數個樹脂R(錠樹脂)。此等複數個樹脂R係被安裝於繞工件W(基板101)的中心C沿著工件W的平面視圖圓形的外周形狀之部位。因此，在和工件W對向的模腔凹部13的底部，複數個柱塞17成為以描繪圓形的方式被配置。而且，因為模腔凹部13的平面視圖形狀配合工件W的平面視圖形狀是圓形，所以複數個柱塞17係配合(沿著)模腔凹部13的底部的平面視圖形狀(圓形)之外形而配置。因此，從各柱塞17到模腔凹部13的底部與側部之角部(交界部)為止的距離成為相同，因為樹脂R在此距離流動，故可提升朝向含有角部的模腔凹部13之填充性。 In the resin molding die 10C, a plurality of resins R (ingot resin) are attached to each of the plurality of portions of the workpiece W attached to the mounting portion 14 and the plurality of plungers 17 opposed thereto. These plurality of resins R are attached to a portion around the center C of the workpiece W (substrate 101) along the circular outer peripheral shape of the workpiece W. Therefore, the plurality of plungers 17 are arranged to draw a circular shape at the bottom of the cavity concave portion 13 opposed to the workpiece W. Moreover, since the plan view shape of the cavity recess 13 matches the plan view shape of the workpiece W to be circular, a plurality of plungers 17 are fitted (along) to the bottom view of the cavity recess 13 in a plan view shape (circular) shape. And configuration. Therefore, the distance from the plunger 17 to the corner portion (intersection portion) of the side portion of the cavity concave portion 13 is the same, and since the resin R flows at this distance, the cavity concave portion 13 facing the corner portion can be lifted. Filling.

又，供安裝複數個樹脂R的部位係呈矩陣狀排列並封裝的封裝零件102間(間隔間)，亦即扣除封裝零件102之工件W的部位。在將成形樹脂量設相同的情況， 以1個來說，錠樹脂大，但當為複數時則錠樹脂小即可解決。因此，與像需用以載置較大的錠樹脂之區域的前述實施形態11(參照圖25)般在工件W的中心C未設置封裝零件102的情況不同，本實施形態即使是在工件W的中心C有封裝零件102的情況亦能對應，即使是在呈矩陣狀排列的封裝零件102的間隔間那樣的狹窄區域亦可安裝樹脂R。 Further, the portion where the plurality of resins R are mounted is arranged in a matrix and packaged between the packaged parts 102 (intervals), that is, the portion of the workpiece W from which the packaged parts 102 are removed. In the case where the amount of the formed resin is set to be the same, In the case of one, the resin of the ingot is large, but when it is plural, the resin of the ingot is small. Therefore, unlike the case of the above-described Embodiment 11 (see FIG. 25) in which a large ingot resin is required to be placed, the package member 102 is not provided at the center C of the workpiece W, and the present embodiment is even in the workpiece W. The case where the center C has the package member 102 can also correspond, and the resin R can be attached even in a narrow region such as a space between the package parts 102 arranged in a matrix.

(實施形態15) (Embodiment 15)

前述實施形態11中，針對有關和封裝於工件W上的封裝零件102的高度是相同者相對應的樹脂成形模具10之技術作了說明。本實施形態中，針對有關亦可與封裝高度相異的封裝零件102(較低者的封裝零件102l、較高者的封裝零件102h)之工件W相對應的樹脂成形模具10D的技術，參照圖31作說明。圖31係樹脂成形模具10D之示意剖面圖。 In the eleventh embodiment, the technique of the resin molding die 10 corresponding to the same height as that of the package component 102 packaged on the workpiece W has been described. In the present embodiment, the technique of the resin molding die 10D corresponding to the workpiece W of the package component 102 (the lower package component 102l and the higher package component 102h) which is different from the package height is referred to the drawing. 31 for explanation. Fig. 31 is a schematic cross-sectional view showing a resin molding die 10D.

如圖31所示，樹脂成形模具10D中，模腔件16在內側部16i及外側部16o分割地設置，內側部16i及外側部16o各自獨立地設置成可對柱塞17進退移動。本圖中雖內側部16i和外側部16o係內側部16i作成內側的環狀，但不一定需為環狀，亦可在環當中之部分的矩形形狀的內側部被分割。內側部16i及外側部16o係各自藉由彈簧構件21i及彈簧構件21o(例如，彈簧)被組裝在基座18，設置成可於模具開閉方向進退移動。 As shown in FIG. 31, in the resin molding die 10D, the cavity member 16 is provided in the inner portion 16i and the outer portion 16o, and the inner portion 16i and the outer portion 16o are independently provided to move the plunger 17 forward and backward. In the figure, the inner portion 16i and the outer portion 16o are formed in an inner annular shape, but the inner portion 16i is not necessarily annular, and may be divided into a rectangular inner portion of the ring. The inner portion 16i and the outer portion 16o are assembled to the base 18 by a spring member 21i and a spring member 21o (for example, a spring), and are provided to be movable forward and backward in the mold opening and closing direction.

此種樹脂成形模具10D中，在開模的狀態下，安裝封裝有高度相異的封裝零件102l、102h的工件W ，封裝零件102l在內側部16i被推壓，封裝零件102h在外側部16o被推壓。據此，即使被封裝於工件W者是高度相異的封裝零件102l、102h，還是被各自對應的模腔件16(內側部16i及外側部16o)所推壓。因此，可防止樹脂R附著於封裝零件102l、102h的表面(和基板101相反側的面)。 In such a resin molding die 10D, a workpiece W in which package parts 1021 and 102h having different heights are packaged is mounted in a state where the mold is opened. The package part 102l is pressed by the inner side portion 16i, and the package part 102h is pressed at the outer side portion 16o. Accordingly, even if the packages W are highly packaged components 1011 and 102h, they are pressed by the corresponding cavity members 16 (the inner portion 16i and the outer portion 16o). Therefore, it is possible to prevent the resin R from adhering to the surface of the package parts 102l, 102h (the surface on the opposite side to the substrate 101).

(實施形態16) (Embodiment 16)

前述實施形態11中，針對有關設於基座18的彈簧構件21附能予模腔件16而推壓封裝零件102的樹脂成形模具10的技術作了說明。本實施形態中，針對有關具備楔形機構22，防止模腔件16浮起而固定模腔件16之樹脂成形模具10E的技術，參照圖32作說明。圖32係樹脂成形模具10E之示意剖面圖。 In the eleventh embodiment, the technique of attaching the cavity member 16 to the spring member 21 provided on the susceptor 18 to press the resin molding die 10 of the package component 102 has been described. In the present embodiment, a technique for providing the resin molding die 10E for fixing the cavity member 16 by the wedge mechanism 22 and preventing the cavity member 16 from floating will be described with reference to FIG. Fig. 32 is a schematic cross-sectional view showing a resin molding die 10E.

楔形機構22具備：在基座18與藉彈簧構件21吊掛支撐的模腔件16之間相重疊的間隔部23；及錐部24、25。錐部24、25係以在和模具開閉方向交叉的方向上厚度相異，整體的厚度在其方向上成為均一的方式，錐面彼此(錐部24的下端面、錐部25的上端面)相重疊。楔形機構22中，此上下段重疊的錐部24、25中一者是成為藉由氣缸、馬達等的驅動源而可滑動的構造。雖然楔形機構22相對於一體的模腔件16畫了2組，但只要對工件W平衡佳地配置即可，亦可為將3組或4組等配合模腔形狀作均等配置的情況。 The wedge mechanism 22 includes a spacer portion 23 that overlaps between the susceptor 18 and the cavity member 16 suspended by the spring member 21, and tapered portions 24 and 25. The tapered portions 24 and 25 have different thicknesses in a direction intersecting the mold opening and closing direction, and the overall thickness is uniform in the direction thereof, and the tapered surfaces are opposite to each other (the lower end surface of the tapered portion 24 and the upper end surface of the tapered portion 25). Overlapping. In the wedge mechanism 22, one of the tapered portions 24 and 25 in which the upper and lower sections overlap is a structure that is slidable by a driving source such as a cylinder or a motor. Although the wedge mechanism 22 is formed in two sets with respect to the integrated cavity member 16, the workpiece W may be disposed in a well-balanced manner, and three or four or the like may be equally arranged in the cavity shape.

楔形機構22係以藉由相互的錐面滑動般使錐部24、25相對移動而改變此等積疊的整體厚度，使成形品100的成形厚度成為所期望的厚度之方式固定模腔件 16。例如，在施加被填充於模腔凹部13內的樹脂R之保壓等樹脂壓之際，模腔件16隔著工件W藉由下模12抵抗彈簧構件21的附能力而被推回基座18側。此時，因為模腔件16的上端面是在既定的成形位置抵接楔形機構22(錐部25的下端面)，故可將模腔件16設為固定。因此，能將成形品100的成形厚度維持一定。此外，亦可將前述實施形態15的模腔件16分割成可動的內側部16i或外側部16o其中一方設為本實施形態16的楔形機構22。 The wedge mechanism 22 fixes the cavity member in such a manner that the thickness of the stacked portions is changed by relatively moving the tapered portions 24, 25 by sliding the tapered surfaces, and the formed thickness of the molded article 100 is a desired thickness. 16. For example, when a resin pressure such as a holding pressure of the resin R filled in the cavity concave portion 13 is applied, the cavity member 16 is pushed back to the pedestal by the lower mold 12 against the attachment force of the spring member 21 via the workpiece W. 18 sides. At this time, since the upper end surface of the cavity member 16 abuts against the wedge mechanism 22 (the lower end surface of the tapered portion 25) at a predetermined molding position, the cavity member 16 can be fixed. Therefore, the molded thickness of the molded article 100 can be maintained constant. Further, the cavity member 16 of the above-described Embodiment 15 may be divided into a movable inner portion 16i or an outer portion 16o, and one of the wedge members 22 of the present embodiment 16 may be used.

(實施形態17) (Embodiment 17)

前述實施形態11中，針對有關設有對推壓封裝零件102的模腔件16可相對移動之柱塞17的樹脂成形模具10之技術作了說明。本實施形態中，針對有關將橡膠構件30(彈性構件)連同柱塞17一起設於模腔件16且具備向橡膠構件30推壓封裝零件102的機能(零件推壓部40)和推壓樹脂R的機能(樹脂推壓部41)之樹脂成形模具10G之技術，參照圖33~圖35作說明。圖33係樹脂成形模具10G之示意剖面圖。圖34係樹脂成形模具10G的下模12的分模面12a之示意平面圖，顯示被供給於工件W上的樹脂R(背高樹脂Rh及背低樹脂Rl)。圖35係顯示樹脂成形模具10G所用的樹脂R(背低樹脂Rl)之示意平面圖。圖33~圖34顯示作為背高樹脂Rh的錠樹脂，作為背低樹脂Rl的顆粒樹脂(參照圖33)或液狀樹脂(參照圖34)，圖35表示作為背低樹脂Rl的薄片樹脂。於圖35所示的背低樹脂Rl之薄片樹脂，在被安裝的工件W的和封裝零件102對應的部位形成有貫通孔31a，在和柱塞17(被安裝的背高樹脂Rh)對應的 部位形成有貫通孔31b。此外，本實施形態中，在樹脂R方面，併用背高樹脂Rh及背低樹脂Rl。 In the eleventh embodiment, the technique of the resin molding die 10 provided with the plunger 17 for relatively moving the cavity member 16 for pressing the package member 102 has been described. In the present embodiment, the rubber member 30 (elastic member) is provided to the cavity member 16 together with the plunger 17, and the function (the component pressing portion 40) for pressing the package member 102 to the rubber member 30 and the pressing resin are provided. The technique of the resin molding die 10G of the function of R (resin pressing portion 41) will be described with reference to Figs. 33 to 35. Fig. 33 is a schematic cross-sectional view showing a resin molding die 10G. Fig. 34 is a schematic plan view showing the parting surface 12a of the lower mold 12 of the resin molding die 10G, and shows the resin R (the back high resin Rh and the back low resin R1) supplied onto the workpiece W. Fig. 35 is a schematic plan view showing the resin R (back low resin R1) used for the resin molding die 10G. 33 to 34 show an ingot resin as the back-high resin Rh, a pellet resin (see FIG. 33) or a liquid resin (see FIG. 34) as the back-low resin R1, and FIG. 35 shows a sheet resin as the back-low resin R1. In the sheet resin of the back-low resin R1 shown in FIG. 35, a through hole 31a is formed in a portion corresponding to the package member 102 of the workpiece W to be mounted, and corresponds to the plunger 17 (the back-high resin Rh to be mounted). A through hole 31b is formed in the portion. Further, in the present embodiment, in terms of the resin R, the back high resin Rh and the back low resin R1 are used in combination.

樹脂成形模具10G具備：設於模腔件16的橡膠構件30(彈性構件)；及覆蓋橡膠構件30的方式被張設在含有模腔凹部13的分模面11a之薄膜F。具體言之，使用配合模腔件16的平面視圖形狀(例如，環狀)之橡膠構件30，與模腔件16的下端面相接地設置橡膠構件30。因此，配合模腔件16的貫通孔16a亦於橡膠構件30形成貫通孔。此橡膠構件30係具有推壓封裝零件102之機能(以下，稱為零件推壓部40)和推壓樹脂R之機能(以下，稱為樹脂推壓部41)。此外，圖33中，以虛線表示，俾對應封裝零件102的橡膠構件30的部位(零件推壓部40)及對應背低樹脂Rl的橡膠構件30的部位(樹脂推壓部41)可明確。 The resin molding die 10G includes a rubber member 30 (elastic member) provided in the cavity member 16 and a film F that is stretched over the parting surface 11a including the cavity recess 13 so as to cover the rubber member 30. Specifically, the rubber member 30 is provided in contact with the lower end surface of the cavity member 16 using the rubber member 30 of the plan view shape (for example, an annular shape) of the cavity member 16. Therefore, the through hole 16a of the cavity member 16 is also formed with a through hole in the rubber member 30. This rubber member 30 has a function of pressing the packaged component 102 (hereinafter referred to as a component pressing portion 40) and a function of pressing the resin R (hereinafter referred to as a resin pressing portion 41). In addition, in FIG. 33, the part corresponding to the rubber member 30 of the package component 102 (the component pressing part 40) and the part corresponding to the rubber member 30 of the back low resin R1 (the resin pressing part 41) are clear.

針對本實施形態的樹脂成形模具10G之動作進行說明。首先，在開模的狀態下，於安裝部14安裝封裝有封裝零件102的工件W。接著，於開模的狀態中，在工件W的和柱塞17對向的部位安裝背高樹脂Rh(錠樹脂)，在工件W的和樹脂推壓部41對向的部位(亦即，被安裝之工件W的封裝零件102間)安裝背低樹脂Rl(顆粒樹脂、液狀樹脂或薄片樹脂)。 The operation of the resin molding die 10G of the present embodiment will be described. First, the workpiece W to which the packaged part 102 is packaged is mounted on the mounting portion 14 in a state where the mold is opened. Then, in the state of the mold opening, the back-high resin Rh (ingot resin) is attached to the portion of the workpiece W that faces the plunger 17, and the portion of the workpiece W that faces the resin pressing portion 41 (that is, is The back-low resin R1 (particle resin, liquid resin or sheet resin) is attached between the package parts 102 of the mounted workpiece W.

接著，進行持續閉模，將被安裝於安裝部14的工件W的封裝零件102，以模腔凹部13的底部中推壓封裝零件102的橡膠構件30的部位(零件推壓部40)推壓。此時，因為將背低樹脂Rl設成比封裝零件102低，故防止在零件推壓部40接觸於封裝零件102之前，樹脂推壓部41 和背低樹脂Rl接觸。 Then, the package member 102 that is attached to the workpiece W of the mounting portion 14 is pressed, and the portion (the component pressing portion 40) that presses the rubber member 30 of the package member 102 in the bottom portion of the cavity concave portion 13 is pressed. . At this time, since the back low resin R1 is set lower than the package part 102, the resin pressing portion 41 is prevented from being before the part pressing portion 40 comes into contact with the package part 102. It is in contact with the low-back resin R1.

接著，將封裝零件102以零件推壓部40一邊推壓一邊以柱塞17開始推壓背高樹脂Rh，且以樹脂推壓部41開始推壓背低樹脂Rl，於模腔凹部13內填充熔融的樹脂R(背高樹脂Rh及背低樹脂Rl)。接著，使填充於模腔凹部13內的樹脂R在保壓的狀態下熱硬化，於脫模後使之再熱硬化(post cure)，藉此大致完成具備露出封裝零件102的相反面102b的樹脂成形部103(樹脂R)之成形品100(參照圖26)。依據此種樹脂成形模具10G，藉由橡膠構件30的彈性，防止樹脂R附著於封裝零件102的相反面102b可使過剩樹脂吸收。因此，即使是安裝比成形樹脂量還多的樹脂R之情況，亦可防止樹脂R未填充於模腔凹部13中。 Then, the package member 102 is pushed by the component pressing portion 40 while the backing high resin Rh is pressed by the plunger 17, and the resin pressing portion 41 starts to press the back low resin R1 to be filled in the cavity concave portion 13. Molten resin R (back high resin Rh and back low resin R1). Then, the resin R filled in the cavity concave portion 13 is thermally cured in a state of holding pressure, and is post-cured after demolding, thereby substantially completing the opposite surface 102b having the exposed package component 102. The molded article 100 of the resin molded portion 103 (resin R) (see Fig. 26). According to the resin molding die 10G, the resin R can be prevented from adhering to the opposite surface 102b of the package member 102 by the elasticity of the rubber member 30, so that the excess resin can be absorbed. Therefore, even in the case where the resin R is added in a larger amount than the amount of the molding resin, the resin R can be prevented from being filled in the cavity concave portion 13.

(實施形態18) (Embodiment 18)

前述實施形態11中，針對有關設有對推壓封裝零件102的模腔件16可相移動的柱塞17的樹脂成形模具10之技術作了說明。本實施形態中，針對有關在未設置柱塞17下於模腔件16設置橡膠構件30(彈性構件)且具備向橡膠構件30推壓封裝零件102之機能(零件推壓部40)和推壓樹脂R之機能(樹脂推壓部41)的樹脂成形模具10H之技術，參照圖36作說明。圖36係樹脂成形模具10H之示意剖面圖。 In the eleventh embodiment, the technique of the resin molding die 10 provided with the plunger 17 that can move the cavity member 16 that presses the package component 102 is described. In the present embodiment, the rubber member 30 (elastic member) is provided to the cavity member 16 without providing the plunger 17, and the function (the component pressing portion 40) for pressing the package member 102 to the rubber member 30 and the pressing force are provided. The technique of the resin molding die 10H of the function of the resin R (resin pressing portion 41) will be described with reference to FIG. Fig. 36 is a schematic cross-sectional view showing a resin molding die 10H.

樹脂成形模具10H的上模11係具備夾持器15、模腔件32、及基座18，組裝此等模具塊所構成。夾持器15係隔著彈簧構件20(彈性構件)組裝於基座18，設置成可於模具開閉方向進退移動。在夾持器15，於厚度方 向形成有貫通孔15a，在此貫通孔15設有模腔件32。模腔件32係固定於基座18而被支撐。模腔凹部13的側部是以夾持器15構成，模腔凹部13的底部是以模腔件32構成。而且，模腔凹部13的內底面是以模腔件32的下端面構成。 The upper mold 11 of the resin molding die 10H includes a holder 15, a cavity member 32, and a susceptor 18, and is assembled by assembling the mold blocks. The holder 15 is assembled to the base 18 via a spring member 20 (elastic member), and is provided to be movable forward and backward in the mold opening and closing direction. In the holder 15, in the thickness side A through hole 15a is formed, and a cavity member 32 is provided in the through hole 15. The cavity member 32 is fixed to the base 18 to be supported. The side of the cavity recess 13 is constituted by a holder 15, and the bottom of the cavity recess 13 is constituted by a cavity member 32. Further, the inner bottom surface of the cavity recess 13 is constituted by the lower end surface of the cavity member 32.

樹脂成形模具10H係具備設於模腔凹部13的底部，亦即模腔件16的橡膠構件30(彈性構件)。具體言之，使用配合模腔件16的平面視圖形狀(例如，圓形)之橡膠構件30，與模腔件16的下端面相接地設置橡膠構件30。此橡膠構件30具有推壓封裝零件102之機能(零件推壓部40)和推壓樹脂R之機能(樹脂推壓部41)。此外，在樹脂成形模具10H中，薄膜F以覆蓋接於模腔件16的下端面之橡膠構件30的方式張設於模腔凹部13。 The resin molding die 10H includes a rubber member 30 (elastic member) provided at the bottom of the cavity concave portion 13, that is, the cavity member 16. Specifically, the rubber member 30 is provided in contact with the lower end surface of the cavity member 16 using the rubber member 30 that fits the plan view shape (for example, a circular shape) of the cavity member 16. This rubber member 30 has a function of pressing the package member 102 (the component pressing portion 40) and a function of pressing the resin R (the resin pressing portion 41). Further, in the resin molding die 10H, the film F is stretched over the cavity concave portion 13 so as to cover the rubber member 30 attached to the lower end surface of the cavity member 16.

針對本實施形態的樹脂成形模具10H之動作進行說明。首先，在使開模的狀態，於安裝部14安裝封裝有封裝零件102的工件W。接著，在使開模的狀態中，在工件W的和樹脂推壓部41對向的部位(亦即，被安裝之工件W的封裝零件102間)安裝背低樹脂Rl(顆粒樹脂、液狀樹脂或薄片樹脂)。 The operation of the resin molding die 10H of the present embodiment will be described. First, the workpiece W to which the packaged component 102 is packaged is attached to the mounting portion 14 in a state where the mold is opened. Next, in the state in which the mold is opened, the back-low resin R1 (particle resin, liquid) is attached to the portion of the workpiece W that faces the resin pressing portion 41 (that is, between the packaged parts 102 of the workpiece W to be mounted). Resin or sheet resin).

接著，進行持續閉模，將被安裝於安裝部14的工件W的封裝零件102，以模腔凹部13的底部中推壓封裝零件102的橡膠構件30的部位(零件推壓部40)推壓。此時，因為將背低樹脂Rl設比封裝零件102還低，故可防止在零件推壓部40接觸於封裝零件102之前，樹脂推壓部41和背低樹脂Rl接觸。 Then, the package member 102 that is attached to the workpiece W of the mounting portion 14 is pressed, and the portion (the component pressing portion 40) that presses the rubber member 30 of the package member 102 in the bottom portion of the cavity concave portion 13 is pressed. . At this time, since the back low resin R1 is set lower than the package member 102, it is possible to prevent the resin pressing portion 41 from coming into contact with the back low resin R1 before the component pressing portion 40 comes into contact with the package member 102.

接著，將封裝零件102以零件推壓部40一邊推 壓一邊以樹脂推壓部41開始推壓背低樹脂Rl，對模腔凹部13內填充熔融的樹脂R(背低樹脂Rl)。接著，使填充於模腔凹部13內的樹脂R在保壓的狀態下熱硬化，藉此大致完成具備露出封裝零件102的相反面102b的樹脂成形部103(樹脂R)之成形品100(參照圖26)。依據此種樹脂成形模具10H，因為可利用橡膠構件30的彈性吸收過剩樹脂，故安裝多於成形樹脂量之樹脂R，可防止樹脂R未填充於模腔凹部13中。 Next, the package component 102 is pushed by the component pressing portion 40. The resin lower pressing portion 41 starts pressing the back low resin R1, and the cavity concave portion 13 is filled with the molten resin R (back low resin R1). Then, the resin R filled in the cavity concave portion 13 is thermally cured in a state where the pressure is maintained, whereby the molded article 100 having the resin molded portion 103 (resin R) having the opposite surface 102b of the packaged component 102 is substantially completed (see Figure 26). According to the resin molding die 10H, since the excess resin can be absorbed by the elasticity of the rubber member 30, the resin R having a larger amount of the molding resin is attached, and the resin R is prevented from being filled in the cavity concave portion 13.

在樹脂成形模具10H中，除使用厚度均一的橡膠構件30外，如圖36所示，亦可使用橡膠構件30的厚度在對應零件推壓部40的部位薄於對應樹脂推壓部41的部位之橡膠構件33。具體言之，設於模腔件32的橡膠構件33係工件W(封裝零件102)側的面設為平坦，於模腔件32側的面，在和零件推壓部40對應的部位形成凹部並將厚度設薄。而且，嵌入此凹部的凸部被形成於模腔件32的下端面。據此，例如，因為藉由具有厚度的橡膠構件33之彈性可吸收過剩樹脂，故安裝多於成形樹脂量之樹脂R，可防止樹脂R未填充於模腔凹部13中。 In the resin molding die 10H, in addition to the rubber member 30 having a uniform thickness, as shown in FIG. 36, the thickness of the rubber member 30 may be thinner than the portion corresponding to the resin pressing portion 41 at the portion corresponding to the component pressing portion 40. Rubber member 33. Specifically, the surface of the rubber member 33 of the cavity member 32 on the side of the workpiece W (package part 102) is flat, and the surface on the side of the cavity member 32 is formed with a concave portion at a portion corresponding to the component pressing portion 40. And set the thickness thin. Moreover, a convex portion embedded in the concave portion is formed on the lower end surface of the cavity member 32. According to this, for example, since the excess resin can be absorbed by the elasticity of the rubber member 33 having the thickness, the resin R having more than the molding resin amount is attached, and the resin R can be prevented from being filled in the cavity concave portion 13.

此外，亦可於模腔件32的下端面維持平坦之狀態藉由在和零件推壓部40對應的部位使用具有凹部的橡膠構件33，藉其凹部形成空間。依據具有空間(凹部)的零件推壓部40，在推壓封裝零件102之際其空間狹窄，藉由其作用可使樹脂推壓部41被推出以推壓樹脂R。 Further, in a state in which the lower end surface of the cavity member 32 is maintained flat, a rubber member 33 having a concave portion is used at a portion corresponding to the component pressing portion 40, and a space is formed by the concave portion. According to the component pressing portion 40 having the space (concave portion), the space is narrowed when the package member 102 is pushed, and the resin pressing portion 41 can be pushed out to push the resin R by the action thereof.

(實施形態19) (Embodiment 19)

前述實施形態18中，針對有關在基座18固定地設有 模腔件32的樹脂成形模具10H之技術作了說明。本實施形態中，針對有關於基座18設有可於模具開閉方向進退移動的模腔件32之樹脂成形模具10I之技術，參照圖37作說明。圖37係樹脂成形模具10I之示意剖面圖。 In the above-described eighteenth embodiment, the base 18 is fixedly provided. The technique of the resin molding die 10H of the cavity member 32 is explained. In the present embodiment, a technique of the resin molding die 10I in which the cavity member 32 is provided with the cavity member 32 that can move forward and backward in the mold opening and closing direction is described with reference to FIG. Fig. 37 is a schematic cross-sectional view showing a resin molding die 10I.

模腔件32係經介彈簧構件34(彈性構件)被吊掛支撐於基座18，設置成在夾持器15的貫通孔15a內可於模具開閉方向進退移動。而且，與模腔件32的下面相接地設置橡膠構件30(彈性構件)。橡膠構件30具有推壓封裝零件102的機能(零件推壓部40)與推壓樹脂R的機能(樹脂推壓部41)，藉由彈簧構件34的彈性作用，此等機能變得容易發揮。因此，可防止在封裝零件102的相反面102b(參照圖26)產生樹脂毛邊等之成形不良。亦即，可提升成形品質。 The cavity member 32 is suspended and supported by the base 18 via the dielectric spring member 34 (elastic member), and is provided to move forward and backward in the mold opening and closing direction in the through hole 15a of the holder 15. Further, a rubber member 30 (elastic member) is provided in contact with the lower surface of the cavity member 32. The rubber member 30 has a function of pressing the package member 102 (the component pressing portion 40) and a function of pressing the resin R (the resin pressing portion 41), and these functions are easily exerted by the elastic action of the spring member 34. Therefore, it is possible to prevent formation defects such as resin burrs from occurring on the opposite surface 102b (see FIG. 26) of the package member 102. That is, the forming quality can be improved.

(實施形態20) (Embodiment 20)

前述實施形態11~19中，針對模腔凹部13是設在上模11或下模12任一的技術作了說明。本實施形態中，針對有關在上模11及下模12各自上設有模腔凹部13的樹脂成形模具10J之技術，參照圖38~圖39作說明。圖38~圖39係樹脂成形模具10J之示意剖面圖。 In the above-described Embodiments 11 to 19, the technique in which the cavity concave portion 13 is provided in either the upper mold 11 or the lower mold 12 has been described. In the present embodiment, the technique of the resin molding die 10J in which the cavity concave portion 13 is provided in each of the upper mold 11 and the lower mold 12 will be described with reference to FIGS. 38 to 39. 38 to 39 are schematic cross-sectional views of the resin molding die 10J.

圖38~圖39中，雖未圖示但在下模12的基座18的上端面，設有在閉模之際會抵接下模12的夾持器15的下端面以限制移動的制動件。此外，組合在前述實施形態11~19已說明的模腔構造，亦可作成在圖38~圖39所示的上模11及下模12各自上具有模腔凹部13的樹脂成形模具10J。 In FIGS. 38 to 39, the upper end surface of the base 18 of the lower mold 12 is provided with a stopper that abuts against the lower end surface of the holder 15 of the lower mold 12 to restrict movement when the mold is closed. Further, in combination with the cavity structure described in the above-described Embodiments 11 to 19, the resin molding die 10J having the cavity concave portion 13 in each of the upper mold 11 and the lower mold 12 shown in Figs. 38 to 39 may be formed.

針對作為本實施形態的壓縮成形的樹脂成形模具10J之動作(樹脂成形方法的工序、成形品的製造方法之工序)，以圖38所示者為代表作說明。此外，圖39係顯示取代圖38所示那樣的柱塞17之作為使用別的驅動的致動器之例的柱塞27。首先，準備一樹脂成形模具10J，該樹脂成形模具10J具備可開閉模具的一對模具(上模11及下模12)，於上模11的分模面11a設有模腔凹部13，在下模12的分模面12a設有模腔凹部13。樹脂成形模具10J中，上模11及下模12各自的模腔凹部13的底部是包含有推壓樹脂R的樹脂推壓部17(柱塞)、及推壓以與模腔凹部13對向的方式安裝之工件W的封裝零件102之零件推壓部16(模腔件)所構成。此外，本實施形態所示的工件W係在基板101的兩面(上下面)封裝有複數個封裝零件102。 The operation of the resin molding die 10J (the process of the resin molding method and the process of the production method of the molded article) of the compression molding of the present embodiment will be described with reference to FIG. 38. Further, Fig. 39 shows a plunger 27 as an example of an actuator using another drive instead of the plunger 17 shown in Fig. 38. First, a resin molding die 10J having a pair of molds (the upper die 11 and the lower die 12) that can open and close the mold is provided, and a cavity concave portion 13 is provided on the split surface 11a of the upper die 11, and the lower die is provided. The parting face 12a of 12 is provided with a cavity recess 13. In the resin molding die 10J, the bottom portion of the cavity concave portion 13 of each of the upper mold 11 and the lower mold 12 is a resin pressing portion 17 (plunger) including the pressing resin R, and is pressed against the cavity concave portion 13 The component pressing portion 16 (cavity member) of the packaged part 102 of the workpiece W is mounted. Further, in the workpiece W shown in the present embodiment, a plurality of package parts 102 are packaged on both surfaces (upper and lower surfaces) of the substrate 101.

接著，在使樹脂成形模具10J開模的狀態中，將含有上模11的模腔凹部13的內面之分模面11a及含有下模12的模腔凹部13的內面之分模面12a各自覆蓋地安裝薄膜F。接著，在使開模的狀態，將要在下模12的模腔13填充之下模用樹脂R安裝於下模12的和樹脂推壓部17對向的部位(樹脂推壓部17的前端面)。 Then, in a state in which the resin molding die 10J is opened, the parting surface 11a of the inner surface of the cavity concave portion 13 including the upper mold 11 and the parting surface 12a of the inner surface of the cavity concave portion 13 including the lower mold 12 are formed. The film F is mounted on each cover. Then, in a state where the mold is opened, the mold resin R to be filled in the cavity 13 of the lower mold 12 is attached to the portion of the lower mold 12 that faces the resin pressing portion 17 (the front end surface of the resin pressing portion 17). .

又，在使樹脂成形模具10J已開模的狀態，將工件W安裝於安裝部14。在樹脂成形模具10J中，於下模12的分模面12a(下模12的夾持器15的上端面)設有安裝工件W的安裝部14。於此安裝部14安裝有工件W的狀態，在下模12的模腔凹部13收容被封裝於工件W(基板101)的單側面(下面)之複數個封裝零件102。接著，在使樹脂成 形模具10J已開模的狀態，將要在上模11的模腔13填充的上模用樹脂R安裝於和已安裝的工件W的和樹脂推壓部17對向的部位。此外，亦可為在將上模用樹脂R安裝於工件W的狀態，在安裝部14安裝工件W。 Moreover, the workpiece W is attached to the mounting portion 14 in a state where the resin molding die 10J has been opened. In the resin molding die 10J, the mounting portion 14 on which the workpiece W is attached is provided on the parting surface 12a of the lower mold 12 (the upper end surface of the holder 15 of the lower mold 12). In the state in which the workpiece W is attached to the mounting portion 14, the plurality of package components 102 that are packaged on one side (lower surface) of the workpiece W (substrate 101) are housed in the cavity recess 13 of the lower mold 12. Next, in making the resin In the state in which the mold 10J has been opened, the upper mold resin R to be filled in the cavity 13 of the upper mold 11 is attached to a portion facing the resin pressing portion 17 of the mounted workpiece W. Further, the workpiece W may be attached to the mounting portion 14 in a state where the upper mold resin R is attached to the workpiece W.

接著，使樹脂成形模具10J持續進行閉模，將已安裝的工件W的一側(上面側)的封裝零件102以上模11的零件推壓部16推壓。又，將已安裝的工件W的另一側(下面側)的封裝零件102以下模12的零件推壓部16推壓。 Then, the resin molding die 10J is continuously closed, and the package member 102 on the one side (upper side) of the mounted workpiece W is pressed against the component pressing portion 16 of the die 11 . Further, the package member 102 on the other side (lower side) of the mounted workpiece W is pressed by the component pressing portion 16 of the lower mold 12.

接著，將樹脂成形模具10J進一步持續進行閉模，將工件W的一側的封裝零件102以上模11的零件推壓部16一邊推壓，一邊使上模11的樹脂推壓部17相對於上模11的零件推壓部16可動地，以上模11的樹脂推壓部17將上模用樹脂R進行持續推壓。藉以，對上模11的模腔凹部13內填充熔融的上模用樹脂R。又，將工件W的另一側的封裝零件102以下模12的零件推壓部16一邊推壓一邊使下模12的樹脂推壓部17對下模12的零件推壓部16相對可動，以下模12的樹脂推壓部17將下模用樹脂R進行持續推壓。藉此，對下模12的模腔凹部13內填充熔融的下模用樹脂R。 Then, the resin molding die 10J is further closed, and the component pressing part 16 of the die 11 of the upper part 11 is pressed against the component pressing part 16 of the die 11 of the workpiece W, and the resin pressing portion 17 of the upper die 11 is opposed to the upper side. The component pressing portion 16 of the mold 11 is movable, and the resin pressing portion 17 of the upper mold 11 continuously presses the upper mold resin R. Therefore, the molten cavity resin R is filled in the cavity concave portion 13 of the upper mold 11. Further, the component pressing portion 16 of the lower mold 12 is pressed against the component pressing portion 16 of the lower mold 12 of the other side of the workpiece W, and the resin pressing portion 17 of the lower mold 12 is relatively movable to the component pressing portion 16 of the lower mold 12, The resin pressing portion 17 of the mold 12 continuously presses the resin R for the lower mold. Thereby, the molten cavity lower mold 13 is filled with the molten lower mold resin R.

接著，在使填充於上模11的模腔凹部13內的上模用樹脂R與填充於下模12的模腔凹部13內的下模用樹脂R熱硬化後，開模並使脫模後的工件W再熱硬化(post cure)。藉此，大致完成在工件W(基板101)的兩面(上下面)具備露出圖26所示那樣的封裝零件102的相反面102b的樹脂成形部103之成形品100。 Then, the upper mold resin R filled in the cavity concave portion 13 of the upper mold 11 and the lower mold resin R filled in the cavity concave portion 13 of the lower mold 12 are thermally cured, and then the mold is opened and released. The workpiece W is post-cured. By this, the molded article 100 of the resin molded portion 103 in which the opposite surface 102b of the package component 102 as shown in FIG. 26 is exposed is provided on both surfaces (upper and lower surfaces) of the workpiece W (substrate 101).

以上，已基於實施形態具體地說明了本發明，但本發明不限於前述實施形態，當然可在不逸脫其要旨的範圍作各種選擇、變更。 The present invention has been specifically described above based on the embodiments, but the present invention is not limited to the embodiments described above, and various modifications and changes can be made without departing from the scope of the invention.

例如，可以是組合實施形態1和實施形態11將樹脂安裝於模腔凹部13內與夾持器15雙方之組合，兩面成形的情況亦可在實施形態1組合實施形態12的下模而作成實施形態20那樣。亦可選擇使用任一實施形態。 For example, in the first embodiment and the eleventh embodiment, the resin may be attached to the cavity concave portion 13 and the holder 15 may be combined. When the both surfaces are formed, the lower mold of the second embodiment may be combined and implemented in the first embodiment. Form 20 is the same. Alternatively, any embodiment can be used.

例如，前述實施形態1中，針對作為工件是在基板上封裝有封裝零件者作了說明。惟不侷限於此，例如，亦可為在基板上隔著凸塊將封裝零件進行倒裝晶片封裝者。即使是此種情況，亦可進行在基板與封裝零件之間(凸塊間)以樹脂填充的所謂成形底部填膠。 For example, in the first embodiment, a description has been given of a case where a package is mounted on a substrate as a workpiece. However, it is not limited thereto. For example, the packaged component may be flip-chip packaged on the substrate via bumps. Even in this case, a so-called formed underfill which is filled with a resin between the substrate and the packaged member (between the bumps) can be performed.

例如，前述實施形態1中，針對將模腔件抵住封裝零件的相反面(表面)並進行樹脂成形並使其相反面露出的情況作了說明。惟不侷限於此，以模腔件相對於基座不比一定間隔低(不接近於基座)般，例如於模腔件上部設置抵住夾持器上面之顎部的制動機構，亦可在未將模腔件抵住封裝零件的相反面進行樹脂成形。亦即，可將含有其相反面的封裝零件整體密封。此情況，成為封裝零件的相反面被樹脂所覆蓋。 For example, in the first embodiment, the case where the cavity member is placed against the opposite surface (surface) of the package component and the resin is molded and exposed to the opposite surface is described. However, the present invention is not limited thereto, and the cavity member is not lower than a certain interval (not close to the base), for example, a brake mechanism that is disposed on the upper portion of the cavity member against the upper portion of the holder, or The cavity member is not resin-formed against the opposite side of the packaged part. That is, the packaged part containing the opposite side can be integrally sealed. In this case, the opposite side of the packaged part is covered with the resin.

11‧‧‧上模 11‧‧‧上模

11a‧‧‧分模面 11a‧‧‧分模面

12‧‧‧下模 12‧‧‧Down

12a‧‧‧分模面 12a‧‧‧分模面

13‧‧‧模腔 13‧‧‧ cavity

14‧‧‧安裝部 14‧‧‧Installation Department

15‧‧‧夾持器 15‧‧‧Clamps

15a‧‧‧貫通孔 15a‧‧‧through hole

15b‧‧‧貫通孔 15b‧‧‧through hole

16‧‧‧模腔件 16‧‧‧ cavity parts

17‧‧‧柱塞 17‧‧‧Plunger

18‧‧‧基座 18‧‧‧ Pedestal

18a‧‧‧基座 18a‧‧‧Base

19‧‧‧彈簧構件 19‧‧‧Spring components

21‧‧‧彈簧構件 21‧‧‧Spring components

28‧‧‧流道/澆口 28‧‧‧Runner/gate

29‧‧‧樹脂安裝部 29‧‧‧Resin Installation Department

101‧‧‧基板 101‧‧‧Substrate

102‧‧‧封裝零件 102‧‧‧Package parts

102a‧‧‧基板面 102a‧‧‧Substrate surface

102b‧‧‧相反面 102b‧‧‧ opposite side

210‧‧‧樹脂成形模具 210‧‧‧Resin forming mold

R‧‧‧樹脂 R‧‧‧Resin

W‧‧‧工件 W‧‧‧Workpiece

F‧‧‧薄膜 F‧‧‧film

Claims (20)

一種樹脂成形模具，係具備具有模腔之可開閉模的一對模具的樹脂成形模具，其特徵為具備：基座，設於一模具，以相對於另一模具，在閉模的狀態接近，在開模的狀態離開的方式相對移動；及複數個樹脂推壓部，設於前述基座，在平面視圖中排列於前述模腔的周圍。 A resin molding die which is a resin molding die having a pair of molds having a mold cavity openable and closable mold, and is characterized in that: a susceptor is provided in a mold so as to be close to the other mold in a closed state; The mode of moving away from the mold is relatively moved; and a plurality of resin pressing portions are provided on the susceptor and arranged in a plan view around the cavity. 如請求項1之樹脂成形模具，其中進一步具備：複數個***部，在平面視圖中從前述模腔離開般地排列在前述模腔的周圍，供前述複數個樹脂推壓部各自***；及複數個流道/澆口，設於前述一或另一模具的分模面，在平面視圖中從與前述複數個***部相對的位置分別朝向前述模腔縮窄。 The resin molding die according to claim 1, further comprising: a plurality of insertion portions which are arranged around the cavity from the cavity in a plan view, wherein the plurality of resin pressing portions are respectively inserted; and plural The flow path/gate is provided on the parting surface of the one or the other mold, and is narrowed in a plan view from a position opposite to the plurality of insertion portions toward the cavity. 如請求項1之樹脂成形模具，其中進一步具備：複數個***部，在平面視圖中與前述模腔相接地在前述模腔的周圍排列，供前述複數個樹脂推壓部各自***。 The resin molding die according to claim 1, further comprising: a plurality of insertion portions which are arranged in a plan view to be arranged around the cavity, and to be inserted into each of the plurality of resin pressing portions. 如請求項3之樹脂成形模具，其中進一步具備：流道/澆口，設在前述樹脂推壓部的樹脂推壓面且朝向前述模腔縮窄。 The resin molding die according to claim 3, further comprising: a flow path/gate formed on the resin pressing surface of the resin pressing portion and narrowed toward the cavity. 如請求項1之樹脂成形模具，其中進一步具備：樹脂安裝部，在平面視圖中和前述樹脂推壓部相對的位置且凹設於前述一或另一模具的分模面。 The resin molding die according to claim 1, further comprising: a resin mounting portion that is recessed in a parting surface of the one or the other mold in a position facing the resin pressing portion in plan view. 如請求項1之樹脂成形模具，其中 進一步具備彈性構件，前述樹脂推壓部隔著前述彈性構件設於前述基座。 A resin forming mold according to claim 1, wherein Further, an elastic member is provided, and the resin pressing portion is provided on the susceptor via the elastic member. 如請求項1之樹脂成形模具，其中前述樹脂推壓部在前述基座固定地設置。 The resin molding die according to claim 1, wherein the resin pressing portion is fixedly disposed on the base. 如請求項1之樹脂成形模具，其中進一步具備：溢流腔，以在平面視圖中從前述模腔離開般設置在前述模腔的周圍；及流道，設在前述一或另一模具的分模面，於平面視圖中從與前述溢流腔相對的位置朝向前述模腔。 A resin molding die according to claim 1, further comprising: an overflow chamber disposed around the mold cavity in a plan view away from the mold cavity; and a flow path provided in the one or the other mold The die face faces the aforementioned cavity from a position opposite to the aforementioned overflow cavity in plan view. 如請求項1至8中任一項之樹脂成形模具，其中進一步具備：薄膜，覆蓋前述一或另一模具的至少任一者的分模面。 The resin molding die according to any one of claims 1 to 8, further comprising: a film covering a parting surface of at least one of the one or the other of the molds. 一種樹脂成形方法，其特徵為包含：(a)準備一樹脂成形模具的工序，前述樹脂成形模具係具備具有模腔之可開閉模的一對模具的樹脂成形模具，其具備：基座，設於一模具，以相對於另一模具，在閉模的狀態接近，在開模的狀態離開的方式相對移動；及複數個樹脂推壓部，設於前述基座，在平面視圖中排列於前述模腔的周圍；(b)在開模的狀態，於平面視圖中和構成前述樹脂成形模具所具備的前述模腔之模腔件相對的位置，在前述模腔件側面向封裝零件地安裝具有前述封裝零件的工件之工序；(c)在開模的狀態，在平面視圖中和前述樹脂推壓部相 對的位置安裝樹脂之工序；(d)持續進行閉模，以前述樹脂成形模具所具備的前述模腔件的周圍的夾持器進行模具夾持之工序；(e)藉由前述(d)工序進一步持續進行閉模，將前述模腔件抵住前述封裝零件的工序；及(f)藉由前述(e)工序進一步持續進行閉模，以前述樹脂推壓部推壓樹脂，對前述模腔內填充樹脂的工序。 A resin molding method comprising: (a) a step of preparing a resin molding die, wherein the resin molding die is a resin molding die having a pair of molds having mold cavities and molds, and a base: a mold is relatively moved in a closed mold state relative to the other mold, and moved away in a mold opening state; and a plurality of resin pressing portions are provided on the susceptor and arranged in a plan view in the foregoing (b) in a state of being opened, in a plane view, at a position opposing the cavity member constituting the cavity of the resin molding die, and mounting on the side of the cavity member to the package component The step of encapsulating the workpiece of the part; (c) in the state of the mold opening, in the plan view and the resin pressing portion (d) continuously performing mold closing, and performing a mold clamping process by a holder around the cavity member provided in the resin molding die; (e) by the aforementioned (d) Further, the step of continuously closing the mold, the step of holding the cavity member against the package component; and (f) further continuing the mold closing by the step (e), pressing the resin with the resin pressing portion, and the mold The process of filling the cavity with a resin. 一種樹脂成形方法，其特徵為包含：(a)準備一樹脂成形模具的工序，該樹脂成形模具具備可開閉模具的一對模具，在一或另一至少任一者的模具的分模面設有模腔凹部，前述模腔凹部的底部是含有推壓樹脂的樹脂推壓部、及推壓以和該模腔凹部對向的方式安裝的工件的封裝零件之零件推壓部所構成；(b)在使開模的狀態，安裝前述工件之工序；(c)在使開模的狀態，在和前述樹脂推壓部對向的部位安裝樹脂之工序；(d)持續進行閉模，將已安裝的前述工件的前述封裝零件以前述零件推壓部推壓的工序；(e)將前述封裝零件以前述零件推壓部一邊推壓一邊以前述樹脂推壓部對前述工件持續進行推壓前述樹脂，對前述模腔凹部內以熔融的前述樹脂填充的工序；及(f)使在前述模腔凹部內填充的前述樹脂熱硬化之工序。 A resin molding method comprising: (a) a step of preparing a resin molding die having a pair of molds that can open and close a mold, and a parting surface of one or another mold of at least one of the molds a cavity concave portion, wherein a bottom portion of the cavity concave portion is a resin pressing portion including a pressing resin, and a component pressing portion for pressing a package part of the workpiece mounted to face the concave portion of the cavity; b) a step of attaching the workpiece in a state in which the mold is opened; (c) a step of attaching a resin to a portion facing the resin pressing portion in a state where the mold is opened; (d) continuing the mold closing, a step of pressing the package component of the mounted workpiece by the component pressing portion; (e) pressing the component to be pressed by the component pressing portion while continuously pressing the workpiece with the resin pressing portion The resin is a step of filling the molten resin in the cavity concave portion; and (f) a step of thermally curing the resin filled in the cavity concave portion. 如請求項11之樹脂成形方法，其中在前述(a)工序中，準備一前述樹脂成形模具，該前述樹脂成形模具係前述樹脂推壓部被支撐部所支撐，前述零件推壓部隔著彈簧構件被前述支撐部支撐，在前述(e)工序中，對於前述零件推壓部使前述樹脂推壓部相對可動以推壓前述樹脂。 The resin molding method according to claim 11, wherein in the step (a), the resin molding die is prepared, wherein the resin pressing portion is supported by the support portion, and the component pressing portion is sandwiched by a spring The member is supported by the support portion, and in the step (e), the resin pressing portion is relatively movable with respect to the component pressing portion to press the resin. 如請求項11之樹脂成形方法，其中在前述(a)工序中，準備一前述樹脂成形模具，該前述樹脂成形模具係前述零件推壓部在第1零件推壓部及第2零件推壓部分割地設置，前述第1零件推壓部及前述第2零件推壓部各自獨立地對前述樹脂推壓部可進退移動地設置，在前述(b)工序中，安裝封裝有作為前述封裝零件之高度相異的第1及第2封裝零件的前述工件，在前述(d)工序中，以前述第1零件推壓部推壓前述第1封裝零件，以前述第2零件推壓部推壓前述第2封裝零件。 The resin molding method according to claim 11, wherein in the step (a), the resin molding die is prepared, wherein the resin molding die is the first component pressing portion and the second component pressing portion. In the secant setting, the first component pressing portion and the second component pressing portion are independently provided to the resin pressing portion so as to be movable up and down, and in the step (b), the height of the package component is mounted and packaged. In the step (d), in the step (d), the first component pressing portion presses the first package component, and the second component pressing portion presses the first component 2 package parts. 如請求項11之樹脂成形方法，其中在前述(a)工序中，準備一前述樹脂成形模具，該前述樹脂成形模具係沿著前述模腔凹部的底部的平面視圖形狀的外形配置複數個前述樹脂推壓部。 The resin molding method according to claim 11, wherein in the step (a), a resin molding die is prepared, wherein the resin molding die is provided with a plurality of the foregoing resins along an outer shape of a plan view shape of a bottom portion of the cavity concave portion. Pushing department. 如請求項11之樹脂成形方法，其中在前述(c)工序中，在前述樹脂方面，安裝比前述封裝零件的高度還高的第1樹脂，在除了安裝有前述第1樹脂的部位及封裝有前述封裝零件的部位以外之前 述工件的部位，安裝比前述封裝零件的高度還低的第2樹脂。 The resin molding method according to claim 11, wherein in the step (c), in the resin, a first resin having a height higher than a height of the package component is mounted, and a portion in which the first resin is attached and a package are provided Before the part of the aforementioned packaged part A second resin having a height lower than the height of the package component is attached to the portion of the workpiece. 如請求項11之樹脂成形方法，其中在前述(a)工序中，準備一備有設於前述零件推壓部的橡膠構件之前述樹脂成形模具，在前述(d)工序中，將前述封裝零件以前述橡膠構件推壓並將該橡膠構件的部位作為前述零件推壓部發揮機能，在前述(e)工序中，以作為前述零件推壓部發揮機能的前述橡膠構件的部位一邊推壓前述封裝零件，一邊將前述模腔凹部內的前述樹脂以前述橡膠構件推壓並將該橡膠構件的部位作為前述樹脂推壓部發揮機能。 The resin molding method according to claim 11, wherein in the step (a), the resin molding die provided with the rubber member provided in the component pressing portion is prepared, and in the step (d), the package component is The rubber member is pressed and the portion of the rubber member functions as the component pressing portion. In the step (e), the package is pressed by the portion of the rubber member that functions as the component pressing portion. In the component, the resin in the cavity concave portion is pressed by the rubber member, and a portion of the rubber member functions as the resin pressing portion. 如請求項11之樹脂成形方法，其中在前述(a)工序中，準備一備有設於前述模腔凹部的底部的橡膠構件之前述樹脂成形模具，在前述(d)工序中，將前述封裝零件以前述橡膠構件推壓並將該橡膠構件的部位作為前述零件推壓部發揮機能，在前述(e)工序中，以作為前述零件推壓部發揮機能的前述橡膠構件的部位一邊推壓前述封裝零件，一邊將前述模腔凹部內的前述樹脂以前述橡膠構件推壓並將該橡膠構件的部位作為前述樹脂推壓部發揮機能。 The resin molding method according to claim 11, wherein in the step (a), the resin molding die having a rubber member provided at a bottom portion of the cavity concave portion is prepared, and in the step (d), the package is The part is pressed by the rubber member, and the part of the rubber member functions as the component pressing portion. In the step (e), the part of the rubber member that functions as the component pressing portion is pressed. In the packaged component, the resin in the cavity concave portion is pressed by the rubber member, and a portion of the rubber member functions as the resin pressing portion. 如請求項11至17中任一項之樹脂成形方法，其中在前述(a)工序中，準備一前述樹脂成形模具，該前述樹脂成形模具具備一薄膜，其覆蓋包含前述模腔 凹部在內的前述分模面，且和該分模面相反側的面具有黏著性，在前述(d)工序中，使前述薄膜黏著於前述封裝零件並以前述零件推壓部推壓前述封裝零件。 The resin molding method according to any one of claims 11 to 17, wherein in the step (a), a resin molding die is provided, the resin molding die having a film covering the cavity The parting surface of the recessed portion has adhesiveness on a surface opposite to the parting surface, and in the step (d), the film is adhered to the package component, and the package is pressed by the component pressing portion. Components. 一種樹脂成形模具，其特徵為：具備可開閉模具的一對模具，在一或另一至少任一者的模具的分模面設有模腔凹部，前述模腔凹部的底部是含有推壓樹脂的樹脂推壓部、及推壓以和該模腔凹部對向的方式安裝的工件的封裝零件之零件推壓部所構成，將已安裝的前述工件的前述封裝零件以前述零件推壓部一邊推壓一邊以前述樹脂推壓部進行持續推壓前述樹脂，藉以對前述模腔凹部內填充熔融的前述樹脂並使之熱硬化。 A resin molding die characterized by comprising: a pair of molds capable of opening and closing a mold, wherein a mold cavity is provided on a parting surface of one or the other of the molds, and a bottom portion of the cavity concave portion contains a pressing resin The resin pressing portion and the component pressing portion for pressing the packaged part of the workpiece mounted to face the concave portion of the cavity, and the packaged part of the mounted workpiece is pressed by the component The resin is continuously pressed by the resin pressing portion while pressing, and the molten resin is filled in the cavity concave portion and thermally cured. 一種成形品的製造方法，其特徵為包含：(a)準備一樹脂成形模具之工序，該樹脂成形模具具備可開閉模具的一對模具，在一或另一至少任一者的模具的分模面設有模腔凹部，前述模腔凹部的底部是含有推壓樹脂的樹脂推壓部、及推壓以和該模腔凹部對向的方式安裝的工件的封裝零件之零件推壓部所構成；(b)在使開模的狀態，安裝前述工件之工序；(c)在使開模的狀態，在和前述樹脂推壓部對向的部位安裝樹脂之工序； (d)持續進行閉模，將已安裝的前述工件的前述封裝零件以前述零件推壓部推壓的工序；(e)將前述封裝零件以前述零件推壓部一邊推壓一邊以前述樹脂推壓部對前述工件持續進行推壓前述樹脂，對前述模腔凹部內以熔融的前述樹脂填充之工序；及(f)使填充於前述模腔凹部內的樹脂熱硬化，將密封被前述零件推壓部推壓的表面露出之前述封裝零件的樹脂成形部形成於前述工件之工序。 A method for producing a molded article, comprising: (a) a step of preparing a resin molding die having a pair of molds capable of opening and closing a mold, and parting of a mold of at least one of the other a cavity concave portion is provided on the surface, and a bottom portion of the cavity concave portion is a resin pressing portion including a pressing resin, and a component pressing portion that presses a package component of the workpiece mounted to face the cavity concave portion (b) a step of attaching the workpiece in a state in which the mold is opened, and (c) a step of attaching a resin to a portion opposed to the resin pressing portion in a state where the mold is opened; (d) continually closing the mold, and pressing the packaged component of the mounted workpiece on the component pressing portion; (e) pushing the package component by the component pressing portion while pushing the resin The pressing portion continuously presses the resin on the workpiece, and fills the cavity in the cavity concave portion with a molten resin; and (f) thermally hardens the resin filled in the cavity concave portion, and pushes the seal by the component The step of forming the resin molded portion of the package component exposed by the surface pressed by the pressing portion on the workpiece.
TW105103420A 2015-02-04 2016-02-03 Resin molding die, resin molding method, and method for manufacturing molded product TWI657910B (en)

Applications Claiming Priority (4)

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