CN220044090U - Mould pressing device and LED display screen - Google Patents
Mould pressing device and LED display screen Download PDFInfo
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- CN220044090U CN220044090U CN202320941362.5U CN202320941362U CN220044090U CN 220044090 U CN220044090 U CN 220044090U CN 202320941362 U CN202320941362 U CN 202320941362U CN 220044090 U CN220044090 U CN 220044090U
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- upper die
- lower die
- display screen
- die
- lower mould
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- 238000003825 pressing Methods 0.000 title claims description 13
- 238000000465 moulding Methods 0.000 claims abstract description 40
- 239000000084 colloidal system Substances 0.000 claims abstract description 22
- 239000003292 glue Substances 0.000 claims description 19
- 238000007789 sealing Methods 0.000 claims description 7
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 239000005341 toughened glass Substances 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims 3
- 230000004308 accommodation Effects 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract description 19
- 238000007723 die pressing method Methods 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 21
- 238000005538 encapsulation Methods 0.000 description 17
- 238000007711 solidification Methods 0.000 description 12
- 230000008023 solidification Effects 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- XUMBMVFBXHLACL-UHFFFAOYSA-N Melanin Chemical compound O=C1C(=O)C(C2=CNC3=C(C(C(=O)C4=C32)=O)C)=C2C4=CNC2=C1C XUMBMVFBXHLACL-UHFFFAOYSA-N 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 241000220259 Raphanus Species 0.000 description 1
- 235000006140 Raphanus sativus var sativus Nutrition 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 230000009295 sperm incapacitation Effects 0.000 description 1
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- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The utility model discloses a die pressing device and an LED display screen, and belongs to the technical field of LED display screen manufacturing. The die pressing device comprises an upper die assembly and a lower die assembly which are matched with each other, the upper die assembly is used for bearing a circuit board to be molded in a mode that the surface to be molded faces downwards, the lower die assembly comprises a lower die shell, a fence lower die base, an ultraviolet light source, a light-transmitting plate and a release film, the lower die shell comprises a lower die bottom surface and a lower die side wall formed by upward protrusions around the lower die bottom surface, the lower die bottom surface and the lower die side wall jointly enclose to form a lower die cavity with an upward opening, the fence lower die base is arranged on the lower die bottom surface and jointly encloses to form a die pressing cavity with the lower die bottom surface, the ultraviolet light source, the light-transmitting plate and the release film are sequentially arranged in the die pressing cavity from the lower die bottom surface upwards, and the release film is downwards sunken at a position corresponding to the light-transmitting plate to form a colloid accommodating cavity for accommodating die pressing colloid. The molding device can improve packaging efficiency, packaging effect and yield.
Description
Technical Field
The utility model relates to the technical field of manufacturing of LED display screens, in particular to a die pressing device and an LED display screen.
Background
At present, the packaging technology of the MiniLED display screen mainly uses COB (chip on Board) packaging, and because the MiniLED is required to have high precision, the MiniLED display screen is sealed and protected by using a mould pressing technology, and the common packaging glue is a thermosetting material, such as epoxy resin or silicone resin, and the curing time is long, generally the curing is divided into two sections, the initial curing is carried out for more than 4 minutes, and the curing is carried out for about 3 hours. In order to obtain a better display screen effect, sometimes a diffusion material or a melanin material is mixed in the packaging glue, and when the temperature of the packaging glue is increased, the viscosity change is larger, so that the diffusion material or the melanin material mixed in the flowing process of the glue is easily unevenly distributed, the packaging glue is uneven after solidification, and ring marks (commonly called radish lines) or flow marks are formed, thereby influencing the luminous effect.
Disclosure of Invention
Therefore, an objective of the embodiments of the present utility model is to provide a molding device and an LED display screen, so as to shorten the packaging time of the LED display screen lamp panel, improve the packaging efficiency, avoid the occurrence of ring marks or flow marks on the packaging colloid, and improve the packaging effect.
The technical scheme adopted by the utility model for solving the technical problems is as follows:
according to one aspect of the embodiment of the utility model, a molding device is provided, the molding device comprises an upper mold assembly and a lower mold assembly which are matched with each other, the upper mold assembly is used for bearing a circuit board to be molded in a mode that a surface to be molded faces downwards, the lower mold assembly comprises a lower mold shell, a fence lower mold base, an ultraviolet light source, a light-transmitting plate and a release film, the lower mold shell comprises a lower mold bottom surface and a lower mold side wall formed by upward bulge around the lower mold bottom surface, the lower mold bottom surface and the lower mold side wall jointly enclose to form a lower mold cavity with an upward opening, the fence lower mold base is arranged on the lower mold bottom surface and jointly encloses to form a mold cavity with an upward opening, and the ultraviolet light source, the light-transmitting plate and the release film are sequentially arranged upwards from the lower mold bottom surface in the mold cavity, and the release film is downwards recessed at a position corresponding to the light-transmitting plate to form a colloid accommodating cavity for accommodating molding colloid.
Optionally, the upper die assembly includes upper die casing, upper die base and upper die core, the upper die casing include the upper die bottom surface and by the upper die lateral wall that the downward bulge formed around the upper die bottom surface, the upper die bottom surface encloses jointly with the upper die lateral wall and closes and form the upper die cavity of downward opening, the upper die base sets up on the upper die bottom surface, the upper die core sets up on the upper die base, the upper die core is used for bearing wait to mould the circuit board.
Optionally, the upper mold core is detachably arranged on the upper mold base.
Optionally, the side surface of the upper mold core, which is in contact with the non-molding surface of the circuit board to be molded, is provided with an avoidance hole corresponding to a device on the non-molding surface.
Optionally, the molding device further comprises a sealing ring, wherein the bottom surface of the side wall of the upper die and the top surface of the side wall of the lower die are pressed together through the sealing ring, so that the upper die cavity is communicated with the lower die cavity, and a molding environment isolated from the outside is formed together.
Optionally, the light-transmitting panel comprises a tempered glass panel.
Optionally, the upper die holder is made of steel.
Optionally, the circuit board to be molded is a display screen lamp board.
Optionally, the display surface of the display screen lamp panel is the surface to be molded.
According to another aspect of the embodiment of the utility model, an LED display screen is provided, which includes a display screen panel, wherein a display surface of the display screen panel is cured with a leveling glue layer, and the leveling glue layer is formed by curing a preset glue on the display screen panel through the molding device.
The die pressing device and the LED display screen provided by the embodiment of the utility model comprise an upper die assembly and a lower die assembly which are matched with each other, wherein the upper die assembly is used for bearing a circuit board to be molded in a mode that the surface to be molded faces downwards, the lower die assembly comprises a lower die shell, a fence lower die base, an ultraviolet light source, a light-transmitting plate and a release film, the lower die shell comprises a lower die bottom surface and a lower die side wall formed by upwards protruding around the lower die bottom surface, the lower die bottom surface and the lower die side wall jointly enclose to form a lower die cavity with an upwards opening, the fence lower die base is arranged on the lower die bottom surface and jointly encloses to form a die pressing cavity with an upwards opening, and the ultraviolet light source, the light-transmitting plate and the release film are sequentially arranged in the die pressing cavity upwards from the lower die bottom surface, and the release film downwards sunken at a position corresponding to the light-transmitting plate to form a colloid accommodating cavity for accommodating die pressing colloid. Because this mould pressing device adopts ultraviolet curing to replace traditional thermosetting mode, consequently, the solidification process need not heat to shorten LED display screen lamp plate encapsulation time, promote encapsulation efficiency, in addition, glue also can not reduce the process that risees again earlier because of the heating through viscosity in the solidification process, thereby avoids the encapsulation colloid to appear circling seal or flow mark, can effectively promote encapsulation effect and yields.
Drawings
The utility model will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a schematic view of a molding apparatus according to an embodiment of the present utility model;
fig. 2 is a schematic view of a conventional hot press apparatus.
Detailed Description
It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
In the following description, suffixes such as "module", "component", or "unit" for representing elements are used only for facilitating the description of the present utility model, and have no specific meaning per se. Thus, "module," "component," or "unit" may be used in combination.
Example 1
In order to solve the technical problems that the packaging time of the LED display panel is long and the packaging colloid is easy to have ring marks or flow marks at present, referring to fig. 1, fig. 1 is a schematic structural diagram of a molding device provided by the embodiment of the present utility model, the molding device includes an upper mold assembly 1 and a lower mold assembly 2 that are matched with each other, the upper mold assembly is used for carrying a circuit board 3 to be molded in a manner that the surface to be molded faces down, the lower mold assembly 2 includes a lower mold shell 21, a fence lower mold base 22, an ultraviolet light source 23, a light-transmitting plate 24 and a release film 25, the lower mold shell 21 includes a lower mold bottom 211 and a lower mold sidewall 212 formed by upwardly protruding around the lower mold bottom 211, the lower mold bottom 211 and the lower mold sidewall 212 jointly enclose a lower mold cavity 213 that is opened upwards, the lower mold base 22 is disposed on the lower mold bottom 211 and jointly encloses a mold cavity that is opened upwards, in the mold cavity, the lower mold cavity 211 is provided with the upper mold cavity, the ultraviolet light source 23, the release film 24 and the release film 25 are sequentially disposed upwards from the lower mold bottom 211, and the light-transmitting plate 24 are correspondingly recessed to the mold cavity 251 are accommodated in the lower mold cavity.
Specifically, the molding device forms a molding cavity in a lower mold cavity 213 by enclosing a rail lower mold base 22 and a lower mold bottom 211, an ultraviolet light source 23, a light-transmitting plate 24 and a release film 25 are sequentially arranged in the molding cavity from bottom to top, and the release film 25 is recessed downwards at a position corresponding to the light-transmitting plate 24 to form a colloid accommodating cavity 251 for accommodating molding colloid. In use, the circuit board 3 to be molded is carried on the upper die assembly 1 in a mode that the surface to be molded faces downwards, the upper die assembly and the lower die assembly are buckled, a device to be packaged, which is arranged on the surface to be molded of the circuit board 3 to be molded, is immersed in the colloid accommodating cavity 251, the colloid is solidified on the surface of the circuit board to be molded and packaged in an ultraviolet light solidification mode, a smooth adhesive layer is formed, and then the encapsulation is completed by demolding. Because this mould pressing device adopts ultraviolet curing to replace traditional thermosetting mode, consequently, the solidification process need not heat to shorten LED display screen lamp plate encapsulation time, promote encapsulation efficiency, in addition, glue also can not reduce the process that risees again earlier because of the heating through viscosity in the solidification process, thereby avoids the encapsulation colloid to appear circling seal or flow mark, can effectively promote encapsulation effect and yields. The circuit board 3 to be molded is a circuit board that has been welded with a device to be molded, the light-transmitting board 24 may be made of tempered glass or other light-transmitting materials, and the specific materials of the light-transmitting board 24 are not limited in this embodiment.
Optionally, the circuit board 3 to be molded is a display screen lamp board, that is, the molding device may be used for packaging the display screen lamp board.
Further optionally, the display surface of the display screen lamp panel is the surface to be molded, that is, the molding device can be used for packaging the display surface of the display screen lamp panel, so that the packaging time of the LED display screen lamp panel is shortened, the packaging efficiency is improved, in addition, the glue in the curing process can not be reduced and then increased in viscosity due to heating, thereby avoiding the occurrence of ring marks or flow marks of packaging colloid, and effectively improving the packaging effect and yield.
In one embodiment, the upper die assembly 1 includes an upper die housing 11, an upper die holder 12 and an upper die core 13, the upper die housing 11 includes an upper die bottom surface 111 and an upper die side wall 112 formed by downward protrusions around the upper die bottom surface 111, the upper die bottom surface 111 and the upper die side wall 112 jointly enclose to form an upper die cavity 113 with a downward opening, the upper die holder 12 is disposed on the upper die bottom surface 111, the upper die core 13 is disposed on the upper die holder 12, and the upper die core 13 is used for bearing the circuit board 3 to be molded.
In this embodiment, the circuit board 3 to be molded is carried on the upper mold core 13 in a manner that the surface to be molded faces downward, the upper mold core 13 is fixed on the upper mold base 12, and the upper mold base 12 is fixed on the upper mold shell 11, so as to improve the positioning accuracy of the circuit board 3 to be molded, and further improve the accuracy of the molding device. As will be appreciated by those skilled in the art, the structure of the conventional hot press apparatus is shown in fig. 2, and fig. 2 is a schematic structural diagram of the conventional hot press apparatus, where the conventional hot press apparatus includes an upper mold shell 11, an upper mold base 12, an upper mold core 13, an upper mold heating module (not shown in the drawing), a lower mold shell 21, a flat lower mold base 26, a groove-shaped lower mold core 27, a lower mold heating module (not shown in the drawing), a release film 25 and a sealing ring 4, and in order to save costs, the conventional hot press apparatus may be configured such that the upper heating module and the lower heating module are omitted, the flat lower mold base 26 is changed into a rail lower mold base 22, the groove-shaped lower mold core 27 is changed into a transparent plate 24, and then an ultraviolet light source 23 is added below the transparent plate 24.
Optionally, the upper die holder 12 is made of steel. Those skilled in the art will appreciate that the upper die holder 12 is fabricated from conventional steel materials because the uv curing process does not require any heating.
Optionally, the upper mold core 13 is detachably disposed on the upper mold base 12. Those skilled in the art will appreciate that the upper mold core 13 can be designed and manufactured according to the circuit board to be molded, the upper mold base 12 can be applied to different circuit boards, and when circuit boards of different types are required to be molded, only the upper mold core 13 needs to be replaced correspondingly.
Optionally, the upper mold core 13 is provided with a relief hole (not shown in the figure) corresponding to a device on the non-molding surface on a side surface in contact with the non-molding surface of the circuit board 3 to be molded, so as to avoid damage to the device due to molding.
In one embodiment, the molding device further includes a sealing ring 4, and the bottom surface of the upper mold sidewall 112 and the top surface of the lower mold sidewall 212 are pressed together by the sealing ring 4, so that the upper mold cavity 113 is communicated with the lower mold cavity 213, and together form a molding environment isolated from the outside.
The molding device in this embodiment includes an upper mold assembly 1 and a lower mold assembly 2 that cooperate with each other, the upper mold assembly is used for carrying a circuit board 3 to be molded in a manner that a surface to be molded faces downward, the lower mold assembly 2 includes a lower mold housing 21, a rail lower mold base 22, an ultraviolet light source 23, a light-transmitting plate 24 and a release film 25, the lower mold housing 21 includes a lower mold bottom surface 211 and a lower mold side wall 212 formed by upward protrusions around the lower mold bottom surface 211, the lower mold bottom surface 211 and the lower mold side wall 212 jointly enclose to form a lower mold cavity 213 that is opened upward, the rail lower mold base 22 is disposed on the lower mold bottom surface 211 and jointly encloses with the lower mold bottom surface 211 to form a mold cavity that is opened upward, the ultraviolet light source 23, the light-transmitting plate 24 and the release film 25 are sequentially disposed upward from the lower mold bottom surface 211, and the release film 25 is recessed downward at a position corresponding to the light-transmitting plate 24 to form a colloid accommodating cavity 251 for accommodating molding colloid. Because this mould pressing device adopts ultraviolet curing to replace traditional thermosetting mode, consequently, the solidification process need not heat to shorten LED display screen lamp plate encapsulation time, promote encapsulation efficiency, in addition, glue also can not reduce the process that risees again earlier because of the heating through viscosity in the solidification process, thereby avoids the encapsulation colloid to appear circling seal or flow mark, can effectively promote encapsulation effect and yields.
Example two
The embodiment provides an LED display screen, this LED display screen includes the display screen lamp plate, the display surface solidification of display screen lamp plate has the smooth glue film, the smooth glue film is for predetermineeing the colloid and is in through above-mentioned mould pressing device solidification is in the display screen lamp plate is last to form. Because the smooth glue film of the display surface of this LED display screen adopts ultraviolet light curing mode to form, consequently, the solidification process need not heat to shorten LED display screen lamp plate encapsulation time, promote encapsulation efficiency, in addition, glue also can not reduce the process that risees again earlier because of the heating through viscosity in the solidification process, thereby avoids the encapsulation colloid to appear circling seal or flow mark, can effectively promote encapsulation effect and yields.
The specific structure of the molding device is as described in the first embodiment, and will not be described herein.
The corresponding technical features in the above embodiments can be used mutually without causing contradiction between schemes or incapacitation.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing embodiment numbers of the present utility model are merely for the purpose of description, and do not represent the advantages or disadvantages of the embodiments.
The embodiments of the present utility model have been described above with reference to the accompanying drawings, but the present utility model is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present utility model and the scope of the claims, which are to be protected by the present utility model.
Claims (10)
1. The utility model provides a mould pressing device, its characterized in that, mould pressing device includes mould subassembly and lower mould subassembly that mutually support, it is used for carrying the circuit board that waits to mould pressing with waiting for the mode that the moulding surface is downward to go up the mould subassembly, lower mould subassembly includes lower mould casing, rail die holder, ultraviolet light source, light-transmitting plate and from the type membrane, lower mould casing includes the lower mould bottom surface and by the lower mould lateral wall that the lower mould bottom surface upwards protrudes the formation down mould lateral wall, the lower mould bottom surface encloses jointly with the lower mould lateral wall and closes and form the lower die cavity of upwards opening, rail die holder sets up on the lower mould bottom surface and encloses jointly with the lower mould bottom surface and form the mould pressing intracavity upward sets gradually from the lower mould bottom surface ultraviolet light source, light-transmitting plate and from the type membrane, from the type membrane is at the position that corresponds with the light-transmitting plate undercut forms the colloid accommodation chamber that is used for holding the mould pressing colloid.
2. The molding apparatus of claim 1, wherein the upper die assembly comprises an upper die housing, an upper die base and an upper die core, the upper die housing comprises an upper die bottom surface and an upper die side wall formed by downward protrusions around the upper die bottom surface, the upper die bottom surface and the upper die side wall are jointly enclosed to form an upper die cavity with a downward opening, the upper die base is arranged on the upper die bottom surface, the upper die core is arranged on the upper die base, and the upper die core is used for bearing the circuit board to be molded.
3. The molding apparatus of claim 2, wherein said upper mold core is removably disposed on said upper mold base.
4. The molding apparatus as claimed in claim 2, wherein the upper mold core is provided with relief holes corresponding to devices on the non-molding surface on a side surface in contact with the non-molding surface of the circuit board to be molded.
5. The molding apparatus of claim 2, further comprising a sealing ring, wherein the bottom surface of the upper mold sidewall and the top surface of the lower mold sidewall are pressed together by the sealing ring, so that the upper mold cavity and the lower mold cavity are communicated to form a molding environment isolated from the outside.
6. The molding apparatus of claim 1, wherein the light-transmitting plate comprises a tempered glass plate.
7. The molding apparatus of claim 2, wherein the upper die base is steel.
8. The molding apparatus of claim 1, wherein the circuit board to be molded is a display panel.
9. The molding apparatus of claim 8, wherein the display surface of the display panel is the surface to be molded.
10. An LED display screen, wherein the LED display screen comprises a display screen panel, a display surface of the display screen panel is cured with a leveling glue layer, and the leveling glue layer is formed by curing a preset glue on the display screen panel through the mold pressing device according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320941362.5U CN220044090U (en) | 2023-04-24 | 2023-04-24 | Mould pressing device and LED display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320941362.5U CN220044090U (en) | 2023-04-24 | 2023-04-24 | Mould pressing device and LED display screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220044090U true CN220044090U (en) | 2023-11-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320941362.5U Active CN220044090U (en) | 2023-04-24 | 2023-04-24 | Mould pressing device and LED display screen |
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| Country | Link |
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| CN (1) | CN220044090U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117456854A (en) * | 2023-12-21 | 2024-01-26 | 元旭半导体科技(无锡)有限公司 | Film pressing method and device of display module and preparation method of display module |
-
2023
- 2023-04-24 CN CN202320941362.5U patent/CN220044090U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117456854A (en) * | 2023-12-21 | 2024-01-26 | 元旭半导体科技(无锡)有限公司 | Film pressing method and device of display module and preparation method of display module |
| CN117456854B (en) * | 2023-12-21 | 2024-03-05 | 元旭半导体科技(无锡)有限公司 | Film pressing method and device of display module and preparation method of display module |
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