CN209861471U - Transparent electromagnetic shielding film structure - Google Patents
Transparent electromagnetic shielding film structure Download PDFInfo
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- CN209861471U CN209861471U CN201920282492.6U CN201920282492U CN209861471U CN 209861471 U CN209861471 U CN 209861471U CN 201920282492 U CN201920282492 U CN 201920282492U CN 209861471 U CN209861471 U CN 209861471U
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Abstract
The utility model provides an electromagnetic shielding film structure, transparent electromagnetic shielding film structure includes: a transparent substrate; the flexible material layer is positioned on the upper surface of the transparent substrate, and a plurality of groove structures are formed on the upper surface of the flexible material layer; the magnetic conduction material layer is located the bottom of each groove structure: the conductive material layer is positioned in each groove structure and positioned on the upper surface of the magnetic conductive material layer; and the blackening treatment layer is positioned in each groove structure and positioned on the upper surface of the conductive material layer. The utility model discloses an in-situ magnetic material layer and conducting material layer of recess structure of flexible material form, can adopt the additive process to electroplate and form magnetic material layer and conducting material layer, need not adopt vacuum sputtering technology and etching process, do not need expensive equipment, can not cause the waste of material, the cost is lower, production simple process can not cause the environmental protection problem, can prepare the magnetic material layer that the line width is littleer and the conducting material layer that the line width is littleer, can realize transparently.
Description
Technical Field
The utility model belongs to the technical field of the electromagnetic shield, especially, relate to a transparent electromagnetic shield film structure.
Background
The electromagnetic shielding film is a transparent adhesive film meeting certain light transmission requirements, and when a transmission path of electromagnetic waves meets the electromagnetic shielding film, the electromagnetic shielding film can change the transmission direction of the electromagnetic waves and effectively block the transmission of various electromagnetic waves such as radio waves, infrared waves, ultraviolet waves and the like, so that the interference influence of information leakage, electronic eavesdropping and electromagnetic radiation can be successfully blocked, the normal work of equipment is ensured, and personnel are prevented from being influenced by the electromagnetic radiation.
When an EMC (electromagnetic compatibility)/EMI (electromagnetic interference) test is performed on a plurality of electronic products such as a device window, a computer display, a display of an instrument and meter, the electromagnetic radiation and electromagnetic radiation resistance requirements of the product cannot be met, and thus shielding measures need to be taken on a light transmission part of the product. On the other hand, the threat of leakage of remote eavesdropping through the glass substrate window needs to be noticed, and the eavesdropping technology can intercept electronic leakage from electronic equipment such as a computer, a printer and a PDA and steal information through complicated technologies such as a laser microphone and the like at a remote distance. The simplest and effective method for solving the problems is to use an electromagnetic shielding film, which can shield electromagnetic waves and is transparent.
The glass substrate door and window is mainly used for glass substrate doors and windows of automobiles, displays, instrument windows, meeting rooms, machine rooms, laboratories and families.
The conventional method for manufacturing the shielding layer is to sputter a metal conducting layer by adopting a vacuum sputtering process, so that the material cost is high and the production process is complex. If a transparent conductive film is required to be made, the metal grid is required to be etched through etching operation, absolute transparency is difficult to achieve with the best level of the current circuit board and the line width of 50um, and in addition, the environment-friendly problem caused by the process is also caused.
SUMMERY OF THE UTILITY MODEL
In view of the above prior art's shortcoming, the utility model aims to provide a + provide a transparent electromagnetic shield film structure for solve among the prior art because adopt vacuum sputtering technology and etching process preparation shielding layer to exist to equipment, production environment require extremely high, production technology is complicated, the cost is higher, cause the problem of a large amount of wastes of material and influence environmental protection.
In order to achieve the above objects and other related objects, the present invention provides a transparent electromagnetic shielding film structure, which includes:
a transparent substrate;
the flexible material layer is positioned on the upper surface of the transparent substrate, and a plurality of groove structures are formed on the upper surface of the flexible material layer;
the magnetic conduction material layer is positioned at the bottom of each groove structure, and the thickness of the magnetic conduction material layer is smaller than the depth of each groove structure; the magnetic conductive material layer comprises a plurality of magnetic conductive wires, and the magnetic conductive wires are positioned in the groove structures:
the conductive material layer is positioned in each groove structure and positioned on the upper surface of the magnetic conduction material layer, and the sum of the thicknesses of the conductive material layer and the magnetic conduction material layer is smaller than the depth of the groove structure; the conductive material layer comprises a plurality of conductive wires which are positioned in the groove structures;
and the blackening treatment layer is positioned in each groove structure and positioned on the upper surface of the conductive material layer.
Optionally, the transparent substrate comprises a glass substrate, a polyethylene terephthalate substrate, a polyimide substrate, a polycarbonate substrate, or a polymethylmethacrylate substrate; the flexible material layer comprises a UV resin layer; the magnetic conductive material layer comprises an iron layer, a nickel layer, an iron-nickel alloy layer or a nickel-cobalt alloy layer; the conductive material layer comprises a copper layer, a zinc layer, a tin layer, a gold layer or a silver layer; the blackening treatment layer comprises a vulcanized layer, a tin-nickel alloy layer or a carbon layer.
Optionally, each of the groove structures is independently distributed or connected with each other in a grid-shaped interconnection distribution.
Optionally, the width of the groove structure includes 2 micrometers to 50 micrometers, and the depth of the groove structure includes 2 micrometers to 50 micrometers.
The utility model also provides a preparation method of transparent electromagnetic shielding film structure, preparation method of transparent electromagnetic shielding film includes following step:
providing a transparent substrate;
forming a flexible material layer on the upper surface of the transparent substrate;
forming a plurality of groove structures on the upper surface of the flexible material layer;
forming a magnetic conduction material layer at the bottom of the groove structure, wherein the thickness of the magnetic conduction material layer is smaller than the depth of the groove structure; the magnetic conducting material layer comprises a plurality of magnetic conducting wires which are positioned in the groove structures;
forming a conductive material layer on the upper surface of the magnetic conductive material layer, wherein the sum of the thicknesses of the conductive material layer and the magnetic conductive material layer is less than the depth of the groove structure; the conductive material layer comprises a plurality of conductive wires which are positioned in the groove structures;
and forming a blackening treatment layer on the upper surface of the conductive material layer, wherein the blackening treatment layer is positioned in each groove structure.
Optionally, the forming of the plurality of groove structures on the surface of the flexible material layer includes the following steps:
providing a mould with a convex structure on the surface;
and forming a plurality of groove structures on the surface of the flexible material layer by adopting an imprinting process based on the mold.
Optionally, the forming of the magnetic conductive material layer in each of the groove structures includes the following steps:
placing magnetic conductive slurry on the surface of the flexible material layer by adopting a dispensing process;
scraping the magnetic conductive slurry into each groove structure; and forming the magnetic conductive material layer after the magnetic conductive slurry is solidified.
Optionally, an electroplating process or a chemical plating process is used to form the conductive material layer on the upper surface of the magnetic conductive material.
Optionally, a specific method for forming a blackening layer on the upper surface of the conductive material layer includes performing a vulcanization treatment on the upper surface of the conductive material layer to form a vulcanized layer on the upper surface of the conductive material layer as the blackening layer.
Optionally, a specific method of forming a blackening layer on the upper surface of the conductive material layer includes forming a tin-nickel alloy layer or a carbon layer on the upper surface of the conductive material layer as the blackening layer.
As described above, the utility model discloses a transparent electromagnetic shield film structure has following beneficial effect:
the utility model discloses a form magnetic material layer and conducting material layer in the intraformational groove structure of flexible material, can adopt the additive process to electroplate and form magnetic material layer and conducting material layer, need not adopt vacuum sputtering technology and etching process, do not need expensive equipment, can not cause the waste of material, the cost is lower, production technology is simple, be favorable to volume production technology, can not cause the environmental protection problem, can prepare the magnetic material layer that the line width is littleer and the conducting material layer that the line width is littleer, can realize transparently; meanwhile, the utility model simultaneously arranges the magnetic material layer and the conductive material layer, so that the transparent electromagnetic shielding film structure has the functions of electric conduction and magnetic conduction, and wide screen shielding can be realized; the blackening treatment layer is formed on the upper surface of the conductive material layer, so that the metal reflection color of the conductive material layer can be reduced, and the performance of the electromagnetic shielding film structure is improved.
Drawings
Fig. 1 is a flowchart illustrating a method for manufacturing a transparent electromagnetic shielding thin film structure according to a first embodiment of the present invention.
Fig. 2 to fig. 8 are schematic partial structural diagrams illustrating steps of a method for manufacturing a transparent electromagnetic shielding thin film structure according to a first embodiment of the present invention.
Description of the element reference numerals
10 transparent substrate
20 layer of flexible material
201 groove structure
21 magnetic conductive material layer
211 magnetic conductive wire
22 layer of conductive material
221 conductive line
23 blackening treatment layer
24 mould
241 convex structure
S1-S6
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.
Please refer to fig. 1 to 8. It should be noted that the drawings provided in the present embodiment are only schematic and illustrative of the basic idea of the present invention, and although the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of the components in actual implementation may be changed at will, and the layout of the components may be more complicated.
Example one
Referring to fig. 1, the present embodiment provides a method for preparing a transparent electromagnetic shielding thin film structure, where the method for preparing the transparent electromagnetic shielding thin film structure includes the following steps:
1) providing a transparent substrate;
2) forming a flexible material layer on the upper surface of the transparent substrate;
3) forming a plurality of groove structures on the upper surface of the flexible material layer;
4) forming a magnetic conduction material layer at the bottom of the groove structure, wherein the thickness of the magnetic conduction material layer is smaller than the depth of the groove structure; the magnetic conducting material layer comprises a plurality of magnetic conducting wires which are positioned in the groove structures;
5) forming a conductive material layer on the upper surface of the magnetic conductive material layer, wherein the sum of the thicknesses of the conductive material layer and the magnetic conductive material layer is less than the depth of the groove structure; the conductive material layer comprises a plurality of conductive wires which are positioned in the groove structures;
6) and forming a blackening treatment layer on the upper surface of the conductive material layer, wherein the blackening treatment layer is positioned in each groove structure.
In step 1), please refer to step S1 in fig. 1 and fig. 2, a transparent substrate 10 is provided.
As an example, the transparent substrate 10 may be a rigid substrate, which may include, but is not limited to, a glass substrate, or a flexible substrate, which includes, but is not limited to, a polyethylene terephthalate (PET) substrate, a Polyimide (PI) substrate, a Polycarbonate (PC) substrate, or a Polymethylmethacrylate (PMMA) substrate. The thickness of the transparent substrate 10 can be set according to actual needs, and is not limited herein.
In step 2), please refer to step S2 in fig. 1 and fig. 3, a flexible material layer 20 is formed on the upper surface of the transparent substrate 10.
By way of example, the flexible material layer 20 may include, but is not limited to, a UV resin layer, such as a polyacrylic UV resin layer, or the like; specifically, a spin coating method may be used to spin-coat the surface of the transparent substrate 10 to form the flexible material layer 20. The UV resin layer is also referred to as a photosensitive resin layer and an ultraviolet-curable resin layer, and can be used as a sizing material for paint, coating, ink, and the like. UV is an abbreviation for Ultraviolet Rays, English, i.e., Ultraviolet light. The ultraviolet ray is invisible to naked eyes, is a section of electromagnetic radiation except visible light, and has the wavelength ranging from 10nm to 400 nm. The curing principle of the UV resin layer is that a photoinitiator (or photosensitizer) in the UV resin generates active free radicals or cations after absorbing ultraviolet light under the irradiation of ultraviolet rays, and the polymerization, crosslinking and grafting chemical reactions of monomers are initiated, so that the UV resin layer is converted from a liquid state to a solid state within a few seconds.
It should be further noted that, in this step, the transparent flexible material layer 20 formed on the surface of the transparent substrate 10 is not irradiated by the ultraviolet light and still is in a liquid state.
In step 3), referring to S3 in fig. 1 and fig. 4 to 5, a plurality of groove structures 201 are formed on the upper surface of the flexible material layer 20.
As an example, the step 3) of forming a plurality of groove structures 201 on the upper surface of the flexible material layer 20 includes the following steps:
3-1) providing a mold 24 having a surface with raised structures 241, as shown in FIG. 4; the shape of the protruding structure 241 is completely matched with the shape of the groove structure 201 to be formed later;
3-2) forming a plurality of groove structures 201 on the upper surface of the flexible material layer 20 by an imprinting process based on the mold 24, as shown in fig. 4 and 5; specifically, the flexible material layer 20 is pressed by using the mold 24 on the side where the protruding structures 241 are formed, and the protruding structures 241 sink into the flexible material layer 20 to form the groove structures 201; the mold 24 is removed after the flexible material layer 20 is irradiated with ultraviolet light to cure the flexible material layer 20.
As an example, the groove structures 201 on the upper surface of the flexible substrate 20 may be interconnected in a grid pattern, and specifically, the shape of the groove structures 201 may be a rectangular grid pattern, a rhombic grid pattern, a triangular grid pattern, or the like. Of course, the groove structures 201 on the upper surface of the flexible substrate 20 may be distributed independently, i.e., the groove structures 201 may not be connected to each other.
As an example, the width of the groove structure 201 may be from several micrometers to several tens of micrometers, and preferably, in the present embodiment, the width of the groove structure 201 may be from 2 μm (micrometers) to 50 μm; the depth of the groove structure 201 may be set according to actual needs, and preferably, in this embodiment, the depth of the groove structure 201 may be 2 μm to 50 μm. The groove structures 201 which are uniformly distributed and have a width of only a few micrometers to tens of micrometers can be formed through an imprinting process, and then magnetic conductive wires and conductive wires which are uniformly distributed and have a smaller width (a few micrometers to tens of micrometers) can be formed in the groove structures 201, so that the subsequently formed magnetic conductive material layer and conductive material layer can be ensured to be transparent.
In step 4), please refer to S4 and fig. 6 in fig. 1, forming a magnetic conductive material layer 21 at the bottom of each of the groove structures 201, wherein the thickness of the magnetic conductive material layer 21 is smaller than the depth 201 of the groove structure; the magnetic conductive material layer 21 includes a plurality of magnetic conductive wires 211, and the magnetic conductive wires 211 are located in each of the groove structures 201.
As an example, the step of forming the magnetic conductive material layer 21 in each of the groove structures 201 includes the following steps:
4-1) placing magnetic conductive slurry (not shown) on the surface of the flexible material layer 20 by adopting a Slit Coat (Slit Coat) process; the conductive metal paste may include, but is not limited to, an iron paste, a nickel paste, an iron-nickel alloy paste, or a nickel-cobalt alloy paste, etc.;
4-2) coating the magnetic conductive slurry (not shown) into each groove structure 201; the magnetic conductive material layer 21 is formed after the magnetic conductive slurry is solidified; the magnetic permeable material layer 21 may include, but is not limited to, an iron (Fe) layer, a nickel (Ni) layer, an iron-nickel (Fe-Ni) alloy layer, or a nickel-cobalt (Ni-Co) alloy layer.
As an example, the width of each magnetically conductive wire 211 may be the same as the width of the groove structure 201, and each magnetically conductive wire 211 may be distributed independently or may be interconnected in a grid-like interconnection distribution.
In step 5), please refer to S5 in fig. 1 and fig. 7, forming a conductive material layer 22 on the upper surface of the magnetic conductive material layer 21, wherein a sum of thicknesses of the conductive material layer 22 and the magnetic conductive material layer 21 is smaller than a depth of the groove structure 201; the conductive material layer 22 includes a plurality of conductive lines 221, and the conductive lines 221 are located in the groove structures 201.
As an example, on the basis of the magnetic conductive material layer 21, an electroplating process or an electroless plating process may be used to form the conductive material layer 22.
As an example, the conductive material layer 22 may include, but is not limited to, a copper (Cu) layer, a zinc (Zn) layer, a tin (Sn) layer, a gold (Au) layer, or a silver (Ag) layer.
As an example, the width of each conductive line 221 may be the same as the width of the groove structure 201, and each conductive line 221 may be distributed independently or may be interconnected to form a grid-shaped interconnection distribution.
In step 6), referring to S6 and fig. 8 in fig. 1, a blackening layer 23 is formed on the upper surface of the conductive material 22, and the blackening layer 23 is located in each of the groove structures 201.
In one example, a specific method for forming the blackening layer 23 on the upper surface of the conductive material layer 22 includes vulcanizing the upper surface of the conductive material layer 22 to form a vulcanized layer on the upper surface of the conductive material layer 22 as the blackening layer 23.
In another example, a specific method of forming the blackening layer 23 on the upper surface of the conductive material layer 22 includes forming a tin-nickel alloy layer or a carbon layer on the upper surface of the conductive material layer 22 as the blackening layer 23.
As an example, the upper surface of the blackening treatment layer 23 may be lower than the upper surface of the flexible material layer 20, or may be flush with the upper surface of the flexible material layer 20.
By forming the blackening layer 23 on the upper surface of the conductive material layer 22, the metal reflection color of the conductive material layer 22 can be reduced, thereby improving the performance of the electromagnetic shielding thin film structure.
Example two
Referring to fig. 8 with reference to fig. 2 to 7, the present invention further provides a transparent electromagnetic shielding film structure, which can be prepared by the above-mentioned preparation method, but not limited thereto, and the transparent electromagnetic shielding film structure includes: a transparent substrate 10; the flexible material layer 20 is positioned on the upper surface of the transparent substrate 10, and a plurality of groove structures 201 are formed on the upper surface of the flexible material layer 20; the magnetic conductive material layer 21 is positioned at the bottom of each groove structure 201, and the thickness of the magnetic conductive material layer 21 is smaller than the depth of the groove structure 201; the magnetic conducting material layer 21 comprises a plurality of magnetic conducting wires 211, and the magnetic conducting wires 211 are positioned in the groove structures 201; the conductive material layer 22 is positioned in each groove structure 201 and on the upper surface of the magnetic conductive material layer 21, and the sum of the thicknesses of the conductive material layer 22 and the magnetic conductive material layer 21 is less than the depth of the groove structure; the conductive material layer 22 comprises a plurality of conductive lines 221, wherein the conductive lines 221 are located in the groove structures 201; and a blackening treatment layer 23 located in each groove structure 10 and located on the upper surface of the conductive material layer 22.
As an example, the transparent substrate 10 may be a rigid substrate, which may include, but is not limited to, a glass substrate, or a flexible substrate, which includes, but is not limited to, a polyethylene terephthalate (PET) substrate, a Polyimide (PI) substrate, a Polycarbonate (PC) substrate, or a Polymethylmethacrylate (PMMA) substrate. The thickness of the transparent substrate 10 can be set according to actual needs, and is not limited herein.
By way of example, the flexible material layer 20 may include, but is not limited to, a UV resin layer, such as a polyacrylic UV resin layer, or the like; specifically, a spin coating method may be used to spin-coat the surface of the transparent substrate 10 to form the flexible material layer 20. The UV resin layer is also referred to as a photosensitive resin layer and an ultraviolet-curable resin layer, and can be used as a sizing material for paint, coating, ink, and the like. UV is an abbreviation for Ultraviolet Rays, English, i.e., Ultraviolet light. The ultraviolet ray is invisible to naked eyes, is a section of electromagnetic radiation except visible light, and has the wavelength ranging from 10nm to 400 nm. The curing principle of the UV resin layer is that a photoinitiator (or photosensitizer) in the UV resin generates active free radicals or cations after absorbing ultraviolet light under the irradiation of ultraviolet rays, and the polymerization, crosslinking and grafting chemical reactions of monomers are initiated, so that the UV resin layer is converted from a liquid state to a solid state within a few seconds.
As an example, the groove structures 201 on the upper surface of the flexible substrate 20 may be interconnected in a grid pattern, and specifically, the shape of the groove structures 201 may be a rectangular grid pattern, a rhombic grid pattern, a triangular grid pattern, or the like. Of course, the groove structures 201 on the upper surface of the flexible substrate 20 may be distributed independently, i.e., the groove structures 201 may not be connected to each other.
As an example, the width of the groove structure 201 may be from several micrometers to several tens of micrometers, and preferably, in the present embodiment, the width of the groove structure 201 may be from 2 μm (micrometers) to 50 μm; the depth of the groove structure 201 may be set according to actual needs, and preferably, in this embodiment, the depth of the groove structure 201 may be 2 μm to 50 μm. The groove structures 201 which are uniformly distributed and have a width of only a few micrometers to a few tens of micrometers can be formed through an imprinting process, the magnetic conductive wires 211 and the conductive wires 221 which are uniformly distributed and have a smaller width (a few micrometers to a few tens of micrometers) can be formed in the groove structures 201, and therefore the magnetic conductive material layer 21 and the conductive material layer 22 which are formed subsequently can be ensured to be transparent.
By way of example, the magnetically permeable material layer 21 may include, but is not limited to, an iron (Fe) layer, a nickel (Ni) layer, an iron-nickel (Fe-Ni) alloy layer, or a nickel-cobalt (Ni-Co) alloy layer.
As an example, the width of each magnetically conductive wire 211 may be the same as the width of the groove structure 201, and each magnetically conductive wire 211 may be distributed independently or may be interconnected in a grid-like interconnection distribution.
As an example, the conductive material layer 22 may include, but is not limited to, a copper (Cu) layer, a zinc (Zn) layer, a tin (Sn) layer, a gold (Au) layer, or a silver (Ag) layer.
As an example, the width of each conductive line 221 may be the same as the width of the groove structure 201, and each conductive line 221 may be distributed independently or may be interconnected to form a grid-shaped interconnection distribution.
As an example, the blackening layer 23 may include, but is not limited to, a sulfide layer, and may also include a tin-nickel alloy layer or a carbon layer.
As an example, the upper surface of the blackening treatment layer 23 may be lower than the upper surface of the flexible material layer 20, or may be flush with the upper surface of the flexible material layer 20.
To sum up, the utility model provides a transparent electromagnetic shielding film structure, transparent electromagnetic shielding film structure includes: a transparent substrate; the flexible material layer is positioned on the upper surface of the transparent substrate, and a plurality of groove structures are formed on the upper surface of the flexible material layer; the magnetic conduction material layer is positioned at the bottom of each groove structure, and the thickness of the magnetic conduction material layer is smaller than the depth of each groove structure; the magnetic conductive material layer comprises a plurality of magnetic conductive wires, and the magnetic conductive wires are positioned in the groove structures: the conductive material layer is positioned in each groove structure and positioned on the upper surface of the magnetic conduction material layer, and the sum of the thicknesses of the conductive material layer and the magnetic conduction material layer is smaller than the depth of the groove structure; the conductive material layer comprises a plurality of conductive wires which are positioned in the groove structures; and the blackening treatment layer is positioned in each groove structure and positioned on the upper surface of the conductive material layer. The utility model discloses a form magnetic material layer and conducting material layer in the intraformational groove structure of flexible material, can adopt the additive process to electroplate and form magnetic material layer and conducting material layer, need not adopt vacuum sputtering technology and etching process, do not need expensive equipment, can not cause the waste of material, the cost is lower, production technology is simple, be favorable to volume production technology, can not cause the environmental protection problem, can prepare the magnetic material layer that the line width is littleer and the conducting material layer that the line width is littleer, can realize transparently; meanwhile, the utility model simultaneously arranges the magnetic material layer and the conductive material layer, so that the transparent electromagnetic shielding film structure has the functions of electric conduction and magnetic conduction, and wide screen shielding can be realized; the blackening treatment layer is formed on the upper surface of the conductive material layer, so that the metal reflection color of the conductive material layer can be reduced, and the performance of the electromagnetic shielding film structure is improved.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (4)
1. A transparent electromagnetic shielding film structure, comprising:
a transparent substrate;
the flexible material layer is positioned on the upper surface of the transparent substrate, and a plurality of groove structures are formed on the upper surface of the flexible material layer;
the magnetic conduction material layer is positioned at the bottom of each groove structure, and the thickness of the magnetic conduction material layer is smaller than the depth of each groove structure; the magnetic conducting material layer comprises a plurality of magnetic conducting wires which are positioned in the groove structures;
the conductive material layer is positioned in each groove structure and positioned on the upper surface of the magnetic conduction material layer, and the sum of the thicknesses of the conductive material layer and the magnetic conduction material layer is smaller than the depth of the groove structure; the conductive material layer comprises a plurality of conductive wires which are positioned in the groove structures;
and the blackening treatment layer is positioned in each groove structure and positioned on the upper surface of the conductive material layer.
2. The transparent electromagnetic shielding film structure of claim 1, wherein the transparent substrate comprises a glass substrate, a polyethylene terephthalate substrate, a polyimide substrate, a polycarbonate substrate, or a polymethyl methacrylate substrate; the flexible material layer comprises a UV resin layer; the magnetic conductive material layer comprises an iron layer, a nickel layer, an iron-nickel alloy layer or a nickel-cobalt alloy layer; the conductive material layer comprises a copper layer, a zinc layer, a tin layer, a gold layer or a silver layer; the blackening treatment layer comprises a vulcanized layer, a tin-nickel alloy layer or a carbon layer.
3. A transparent electromagnetic shielding film structure according to claim 1, wherein each of the groove structures is independently distributed or connected with each other in a grid-like interconnection distribution.
4. The transparent electromagnetic shielding film structure of claim 1, wherein the width of the groove structure comprises 2 to 50 microns and the depth of the groove structure comprises 2 to 50 microns.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109922645A (en) * | 2019-03-06 | 2019-06-21 | 苏州蓝沛光电科技有限公司 | Transparency electromagnetic wave shield film structure and preparation method thereof |
| CN112566365A (en) * | 2020-12-09 | 2021-03-26 | 浙江日久新材料科技有限公司 | Metal grid film and preparation method thereof |
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2019
- 2019-03-06 CN CN201920282492.6U patent/CN209861471U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109922645A (en) * | 2019-03-06 | 2019-06-21 | 苏州蓝沛光电科技有限公司 | Transparency electromagnetic wave shield film structure and preparation method thereof |
| CN109922645B (en) * | 2019-03-06 | 2024-04-05 | 苏州蓝沛光电科技有限公司 | Transparent electromagnetic shielding film structure and preparation method thereof |
| CN112566365A (en) * | 2020-12-09 | 2021-03-26 | 浙江日久新材料科技有限公司 | Metal grid film and preparation method thereof |
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