CN205864954U - The emi shielding film of high-transmission height shield effectiveness - Google Patents
The emi shielding film of high-transmission height shield effectiveness Download PDFInfo
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- CN205864954U CN205864954U CN201620789466.9U CN201620789466U CN205864954U CN 205864954 U CN205864954 U CN 205864954U CN 201620789466 U CN201620789466 U CN 201620789466U CN 205864954 U CN205864954 U CN 205864954U
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Abstract
The utility model discloses the emi shielding film of a kind of high-transmission height shield effectiveness, gained emi shielding film includes a polyimide layer with hole, a metal level has been plated respectively on relative two surfaces of polyimide layer, two metal layers is respectively defined as the first metal layer and the second metal level, the surface of the first metal layer is rough surface, and on the first metal layer surface, it is coated with an ink protective layer, the surface of the second metal level is also rough surface, and on the second layer on surface of metal, it is coated with one without the adhesive layer of metal conductive particles, and on ink protective layer, also it is covered with the first release film layer, the second release film layer also it is covered with on adhesive layer surface；Compared to prior art, this utility model gained emi shielding film has that flexibility is good, electrical characteristic is good, flexibility is good, transmission quality and speed is high, color masking is good and shield effectiveness high, well be applicable to the application such as mobile phone, panel computer.
Description
Technical field
This utility model relates to emi shielding film technical field, concrete provides one to have excellent chemical resistance, electric
Characteristic, for the emi shielding film of high-transmission height shield effectiveness of printed circuit board (PCB) of high flexible.
Background technology
Under the market demand that electronics and communication product tend to multi-functional complication, the structure of circuit substrate fills to be needed gentlier,
Thin, short, little；And functionally, then need powerful and high-speed signal transmission.Therefore, line density certainly will improve, support plate circuit it
Between distance to each other increasingly nearer, and operating frequency is broadband towards height, if add configuration, connect up unreasonable
Lower electromagnetic interference situation is increasingly severe, it is therefore necessary to effectively manage electromagnetic compatibility (Electromagnetic
Compatibility, EMC), and the electromagnetic interference problem of solution assembly inside and outside, thus maintain the normal news of electronic product
Number transmission and improve reliability.Thus, the frivolous and characteristic that can arbitrarily bend so that soft board is moving towards demand portable information
Very important status is occupied in development with communication electronic industry.
Due to the most small little trend of telecommunications product, order about soft board and must carry more strong big function, on the other hand
Owing to portable electronic product moves towards microminiature, also and then drive the high demand of high density soft board technology, the most then requirement
Powerful and high shield effectiveness, high frequency, high density, graph thinning situation under, be the most proposed for film type
The screen of flexible printed wiring board (FPC), is extensively adopted in the small-sized electronic products such as mobile phone, numerical digit photographing unit, digit camera
With.In view of this, it would be highly desirable to develop a kind of novelty, the efficient material shielding electromagnetic interference.
Summary of the invention
In order to overcome drawbacks described above, this utility model provides the electromagnetic interference shield of a kind of high-transmission height shield effectiveness
Film, it has, and flexibility is good, electrical characteristic is good, chemical resistance is good, transmission loss is little, transmission quality high.
This utility model be the technical scheme is that a kind of high-transmission height shield effectiveness to solve its technical problem
Emi shielding film, including a polyimide layer with hole, relative two surfaces of described polyimide layer is plated respectively
On have layer of metal layer, two metal layers is respectively defined as the first metal layer and the second metal level, wherein said first metal
The surface of layer is rough surface, and is coated with last layer ink protective layer, described second metal on described the first metal layer surface
The surface of layer is also rough surface, and is coated with the last layer gluing without metal conductive particles on described second layer on surface of metal
Layer, and on the surface of described ink protective layer, also it is covered with one first release film layer, the surface of described adhesive layer is also covered with
One second release film layer.
As further improvement of the utility model, the thickness of described polyimide layer is 5～25 microns.
As further improvement of the utility model, the thickness of described the first metal layer and the second metal level is 0.2～5
Micron.
As further improvement of the utility model, the surface roughness of described the first metal layer is 2.5～4 microns；Institute
The surface roughness stating the second metal level is 5～7 microns.
As further improvement of the utility model, described ink protective layer is the resin bed containing color masterbatch additive, and
The thickness of described ink protective layer is 3～25 microns.
As further improvement of the utility model, described adhesive layer is the resin bed containing fluorine additive, and described glue
The thickness of glutinous layer is 5～15 microns.
As further improvement of the utility model, described first release film layer and the second release film layer are respectively respectively selected from
PET fluorine moulds at least one in mould release membrance, PET silicate-containing oil mould release membrance, PET Asia light mould release membrance and PE mould release membrance；
And the thickness of described first release film layer and the second release film layer is 25～100 microns.
The beneficial effects of the utility model are: the emi shielding film obtained by this utility model have flexibility good,
Chemical resistance is good, electrical characteristic is good, flexibility is good, transmit quality and speed high, is much better than traditional PI protecting film (thin glue
Thin PI), photosensitive type PI (or acryl system) protecting film, non-photo-sensing type PI protecting film (photoresistance need to be gone up) and general screened film
(single-layer metal conductor layer or only one layer of omnibearing conductive adhesive structure etc.), particularly, the electromagnetism obtained by this utility model is done
Disturb screened film also to there is the highest shield effectiveness, the high shield effectiveness requirement of more than 80dB can be reached, and have the best
Color masking (i.e. extinction), can well be applicable to mobile phone, panel computer etc. and contain a lot of antenna (bluetooth, Wi-
Fi, cellular communication and GPS etc.) handheld device field, be allowed in the least space interference-free from each other, thus effectively
Instead of general barrier film material.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of the emi shielding film of high-transmission height shield effectiveness described in the utility model.
In conjunction with accompanying drawing, make the following instructions:
1 polyimide layer 2 the first metal layer
3 second metal level 4 ink protective layers
5 adhesive layer 6 first release film layers
7 second release film layers
Detailed description of the invention
By particular specific embodiment, embodiment of the present utility model being described below, people skilled in the art can be by
Content disclosed in the present specification understands other advantages of the present utility model and effect easily.
It should be clear that structure depicted in this specification institute accompanying drawings, ratio, size etc., the most only in order to coordinate description to be taken off
The content shown, understands for people skilled in the art and reads, being not limited to this utility model enforceable restriction bar
Part, therefore do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size, do not affecting
Under effect that this utility model can be generated by and the purpose that can reach, all should still fall in the technology disclosed in this utility model
In the range of Rong Suoneng is contained.Only understand for ease of narration in " first ", " second " described in this specification, and be not used to limit
Determine the enforceable scope of this utility model, being altered or modified of its relativeness, changing under technology contents without essence, when also regarding
For the enforceable category of this utility model.
Embodiment 1:
Referring to shown in accompanying drawing 1, it is the emi shielding film of high-transmission height shield effectiveness described in the utility model
The cross-sectional view of embodiment.The emi shielding film of this high-transmission height shield effectiveness includes a polyamides with hole
Imine layer 1, relative two surfaces of described polyimide layer 1 have plated layer of metal layer respectively, and two metal layers is fixed respectively
Justice is the first metal layer 2 and the second metal level 3, and the surface of wherein said the first metal layer 2 is rough surface, and described first
Being coated with last layer ink protective layer 4 on metal level 2 surface, the surface of described second metal level 3 is also rough surface, and described
The last layer adhesive layer 5 without metal conductive particles, and the surface of described ink protective layer 4 it is coated with on second metal level 3 surface
On be also covered with one first release film layer 6, the surface of described adhesive layer 5 is also covered with one second release film layer 7.
In the present embodiment, the thickness of described polyimide layer 1 is 5～25 microns.
Described the first metal layer 2 and the second metal level 3 be respectively respectively selected from silver, copper, zinc, nickel and aluminum any one, institute
The thickness stating the first metal layer 2 and the second metal level 3 is 0.2～5 micron, and the surface roughness of described the first metal layer 2
It it is 2.5～4 microns；The surface roughness of described second metal level 3 is 5～7 microns.
Described ink protective layer 4 is the resin bed containing color masterbatch additive, wherein, and the resinous wood of described ink protective layer 4
Material selected from epoxy resin, acrylic resin, amido formate system resin, silicone rubber system resin, poly-to ring diformazan benzene series resin,
At least one in BMI system resin and polyimide resin, the color masterbatch additive of described ink protective layer 4 is selected from
At least one in material with carbon element, titanium dioxide, pigment, dyestuff and toner, and nationality can manifest with this color masterbatch additive, described ink layer
For shades of colours such as black, redness, orange, yellow or bluenesss；It addition, the thickness of described ink protective layer 4 is 3～25 micro-
Rice.
Described adhesive layer 5 is the resin bed containing fluorine additive, and wherein, the resin material of described adhesive layer 5 is selected from epoxy
Resin, acrylic resin, amido formate system resin, silicone rubber system resin, poly-to ring diformazan benzene series resin, bismaleimide
At least one in amine system resin and polyimide resin；And the thickness of described adhesive layer 5 is 5～15 microns, described adhesive layer 5
Dielectric property Df be 0.003.
Described first release film layer 6 and the second release film layer 7 are respectively respectively selected from PET fluorine, and to mould mould release membrance, PET silicate-containing oil release
At least one in film, PET Asia light mould release membrance and PE mould release membrance；And described first release film layer 6 and the thickness of the second release film layer 7
Degree is 25～100 microns.
Hereinafter the preparation method of the emi shielding film of high-transmission height shield effectiveness described in the utility model is carried out in detail
Describe in detail bright.
Preparation example 1:
The preparation method of the emi shielding film of described high-transmission height shield effectiveness, including following preparation process:
Step 1): on relative two surfaces of described polyimide layer 1 with hole, plated layer of metal layer respectively,
Concrete processing technique can use sputter, electroplate, is deposited with and at least one processing mode in chemical plating；By two metal layers respectively
Being defined as the first metal layer 2 and the second metal level 3, the first metal layer 2 and the second metal level 3 are by described polyimide layer 1
Space realizes conducting, and controls to make described the first metal layer 2 and the second metal level 3 surface each also by medicinal liquid when metal cladding
It is respectively provided with certain roughness；
Step 2): on described the first metal layer 2 surface, first it is coated with last layer ink protective layer 4, and protects in described ink
One first release film layer 6 it is covered with, by selecting the first release film layer of different surface roughness to make on the surface of sheath 4
The reflective degree on described ink protective layer 4 surface is different, to reach different glossiness；
Last layer it is coated with the most again without the adhesive layer 5 of metal conductive particles on described second metal level 3 surface, and in
One second release film layer 7 it is covered with, to keep the stickiness of described adhesive layer 5, follow-up bonding on the surface of described adhesive layer 5
Use is made in circuit board or other pressing；Obtain semi-finished product；
Step 3): to above-mentioned steps 2) gained semi-finished product carry out pressing, i.e. prepare the electricity of described high-transmission height shield effectiveness
Magnetic disturbance screened film.
Additionally, when the emi shielding film of high-transmission height shield effectiveness described in the utility model is applied on circuit board
Time, its operational approach is: first removed by the second release film layer 7, and then hot pressing is together on circuit board, during hot pressing, described
The thickness of adhesive layer 5 can be thinning, and second metal level 3 with rough surface can puncture thinning adhesive layer 5 and then and circuit board
Ground connection cabling formed path circuitry；Again via making adhesive layer and ink protective layer reach fully crosslinked solidification after a period of time
With the electrical and mechanical performance that maintenance is good, so that circuit board ground resistance value lowers, reduce Electromagnetic Interference
Purpose.
In sum, the emi shielding film obtained by this utility model have that flexibility is good, chemical resistance is good, electrically special
Property good, flexibility is good, transmission quality and speed high, is much better than traditional PI protecting film (the thin PI of thin glue), photosensitive type PI
(or acryl system) protecting film, non-photo-sensing type PI protecting film (photoresistance need to be gone up) and general screened film (single-layer metal conductor layer
Or only one layer of omnibearing conductive adhesive structure etc.), particularly, the emi shielding film obtained by this utility model also has non-
The highest shield effectiveness, the high shield effectiveness requirement of more than 80dB can be reached, and there is extraordinary color masking (i.e. disappear
Photosensitiveness), can well be applicable to mobile phone, panel computer etc. and contain a lot of antenna (bluetooth, Wi-Fi, cellular communication and GPS etc.)
Handheld device field, be allowed in the least space interference-free from each other, thus effectively instead of general screened film material
Material.
Above-mentioned embodiment only illustrative effect of the present utility model, not for limiting this utility model, it should
Point out, for those skilled in the art, on the premise of without departing from this utility model know-why, also may be used
To make some improvement and modification, these improve and modification also should be regarded as in protection domain of the present utility model.Additionally, upper
State the quantity of each assembly in embodiment and be only illustrative, the most non-for limiting this utility model.
Claims (7)
1. the emi shielding film of a high-transmission height shield effectiveness, it is characterised in that: include a polyamides Asia with hole
Amine layer (1), relative two surfaces of described polyimide layer (1) have plated layer of metal layer respectively, by two metal layers respectively
Being defined as the first metal layer (2) and the second metal level (3), the surface of wherein said the first metal layer (2) is rough surface, and
Being coated with last layer ink protective layer (4) on described the first metal layer (2) surface, the surface of described second metal level (3) is also thick
Rough surface, and on described second metal level (3) surface, it is coated with the last layer adhesive layer (5) without metal conductive particles, and institute
State and on the surface of ink protective layer (4), be also covered with one first release film layer (6), the surface of described adhesive layer (5) also pastes
There is one second release film layer (7).
The emi shielding film of high-transmission height shield effectiveness the most according to claim 1, it is characterised in that: described polyamides
The thickness of imine layer (1) is 5～25 microns.
The emi shielding film of high-transmission height shield effectiveness the most according to claim 1, it is characterised in that: described first
The thickness of metal level (2) and the second metal level (3) is 0.2～5 micron.
4. according to the emi shielding film of the high-transmission height shield effectiveness described in claim 1 or 3, it is characterised in that: described
The surface roughness of the first metal layer (2) is 2.5～4 microns；The surface roughness of described second metal level (3) is 5～7 micro-
Rice.
The emi shielding film of high-transmission height shield effectiveness the most according to claim 1, it is characterised in that: described ink
Protective layer (4) is the resin bed containing color masterbatch additive, and the thickness of described ink protective layer (4) is 3～25 microns.
The emi shielding film of high-transmission height shield effectiveness the most according to claim 1, it is characterised in that: described gluing
Layer (5) is the resin bed containing fluorine additive, and the thickness of described adhesive layer (5) is 5～15 microns.
The emi shielding film of high-transmission height shield effectiveness the most according to claim 1, it is characterised in that: described first
Release film layer (6) and the second release film layer (7) be respectively respectively selected from PET fluorine mould mould release membrance, PET silicate-containing oil mould release membrance, PET Asia light from
At least one in type film and PE mould release membrance；
And the thickness of described first release film layer (6) and the second release film layer (7) is 25～100 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620789466.9U CN205864954U (en) | 2016-07-26 | 2016-07-26 | The emi shielding film of high-transmission height shield effectiveness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620789466.9U CN205864954U (en) | 2016-07-26 | 2016-07-26 | The emi shielding film of high-transmission height shield effectiveness |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205864954U true CN205864954U (en) | 2017-01-04 |
Family
ID=57648435
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620789466.9U Active CN205864954U (en) | 2016-07-26 | 2016-07-26 | The emi shielding film of high-transmission height shield effectiveness |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107660113A (en) * | 2016-07-26 | 2018-02-02 | 昆山雅森电子材料科技有限公司 | Emi shielding film of the high shield effectiveness of high-transmission and preparation method thereof |
| CN108541204A (en) * | 2017-03-01 | 2018-09-14 | 昆山雅森电子材料科技有限公司 | High shielding slimming emi shielding film of combined type and preparation method thereof |
| CN109575827A (en) * | 2018-12-26 | 2019-04-05 | 苏州诺菲纳米科技有限公司 | The preparation method and display device of electromagnetic shielding film, electromagnetic shielding film |
| CN110268812A (en) * | 2017-07-10 | 2019-09-20 | 拓自达电线株式会社 | Electromagnetic shielding film and the shielding printed wiring board for having the electromagnetic shielding film |
| CN111741595A (en) * | 2019-08-01 | 2020-10-02 | 东洋油墨Sc控股株式会社 | Electromagnetic wave shielding sheet and electromagnetic wave shielding printed circuit board |
| CN112533465A (en) * | 2020-11-27 | 2021-03-19 | 南昌正业科技有限公司 | Electromagnetic wave protective film for FPC |
-
2016
- 2016-07-26 CN CN201620789466.9U patent/CN205864954U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107660113A (en) * | 2016-07-26 | 2018-02-02 | 昆山雅森电子材料科技有限公司 | Emi shielding film of the high shield effectiveness of high-transmission and preparation method thereof |
| CN108541204A (en) * | 2017-03-01 | 2018-09-14 | 昆山雅森电子材料科技有限公司 | High shielding slimming emi shielding film of combined type and preparation method thereof |
| CN108541204B (en) * | 2017-03-01 | 2020-11-17 | 昆山雅森电子材料科技有限公司 | Composite high-shielding thin electromagnetic interference shielding film and preparation method thereof |
| CN110268812A (en) * | 2017-07-10 | 2019-09-20 | 拓自达电线株式会社 | Electromagnetic shielding film and the shielding printed wiring board for having the electromagnetic shielding film |
| CN109575827A (en) * | 2018-12-26 | 2019-04-05 | 苏州诺菲纳米科技有限公司 | The preparation method and display device of electromagnetic shielding film, electromagnetic shielding film |
| CN111741595A (en) * | 2019-08-01 | 2020-10-02 | 东洋油墨Sc控股株式会社 | Electromagnetic wave shielding sheet and electromagnetic wave shielding printed circuit board |
| CN112533465A (en) * | 2020-11-27 | 2021-03-19 | 南昌正业科技有限公司 | Electromagnetic wave protective film for FPC |
| CN112533465B (en) * | 2020-11-27 | 2023-08-01 | 南昌正业科技有限公司 | Preparation method of electromagnetic wave protective film for FPC |
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