CN204667371U - Contact panel - Google Patents
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- CN204667371U CN204667371U CN201520328709.4U CN201520328709U CN204667371U CN 204667371 U CN204667371 U CN 204667371U CN 201520328709 U CN201520328709 U CN 201520328709U CN 204667371 U CN204667371 U CN 204667371U
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Abstract
The utility model relates to a kind of contact panel.This contact panel, comprising: transparent substrates, has viewing area and non-viewing area, and non-viewing area is provided with the binding district for binding with flexible PCB; Conductive layer, be located at transparent substrates one on the surface, comprise electrode pattern and lead-in wire, electrode pattern is positioned on viewing area, for obtaining the coordinate information of touch point, lead-in wire is connected with electrode pattern, coordinate information for being obtained by electrode pattern is spread out of by flexible PCB, and wherein, the one end be connected with electrode pattern that goes between is first end, the other end is the second end, and the second end is positioned at binding district; First transparent photosensitive resin layer, is located at conductive layer away from the surface of transparent substrates, and the formation breach and the edge of the first transparent photosensitive resin layer self-induced transparency substrate caves in, exposes to make the second end.This contact panel energy available protecting conductive layer, avoids conductive layer to be scraped off or is oxidized.
Description
Technical field
The utility model relates to technical field of touch control, particularly relates to a kind of contact panel.
Background technology
Touch-screen is as accepting the inductive arrangement touching input signal, more and more replace traditional mechanical keyboard input, be used in the consumer electronics field such as smart mobile phone, panel computer, notebook computer widely, and electronic blackboard, automatic vending machine etc. need the place of man-machine interaction.
Traditional touch-screen usually with tin indium oxide (ITO) for conductive.Concrete, when making touch-screen, first adopt the mode of magnetron sputtering to form ITO conductive layer, then adopt the mode process ITO conductive layer of etching, to make transparent electrode pattern, wherein, transparent electrode pattern is for determining the coordinate information of touch point.
In actual applications, touch-screen generally includes cover sheet, and cover sheet has relative load-bearing surface and touch-surface, and ITO conductive layer is located on load-bearing surface.And the touch-screen of some type; as OGS (OneGlass Solution; i.e. integrated touch-control) touch-screen, DITO (there is two-layer ITO layer) touch-screen etc., cover sheet side is outside exposed dorsad for its ITO conductive layer, is easily scraped off or is oxidized.
Utility model content
Based on this, be necessary the contact panel that a kind of energy available protecting conductive layer is provided.
A kind of contact panel, comprising:
Transparent substrates, has viewing area and non-viewing area, and described non-viewing area is provided with the binding district for binding with flexible PCB;
Conductive layer, be located at described transparent substrates one on the surface, comprise electrode pattern and lead-in wire, described electrode pattern is positioned on described viewing area, for obtaining the coordinate information of touch point, described lead-in wire is connected with described electrode pattern, coordinate information for being obtained by described electrode pattern is spread out of by flexible PCB, and wherein, one end that described lead-in wire is connected with described electrode pattern is first end, the other end is the second end, and described second end is positioned at described binding district; And
First transparent photosensitive resin layer, is located on the surface of described conductive layer away from described transparent substrates, and described first transparent photosensitive resin layer to cave in formation breach from the edge of described transparent substrates, exposes to make described second end.
Wherein in an embodiment; described transparent substrates is the cover sheet of described contact panel; described transparent substrates has relative touch-surface and load-bearing surface, and the skin hardness of described touch-surface is more than or equal to 3H, and described conductive layer is located on described load-bearing surface.
Wherein in an embodiment, described transparent substrates is flexible cover plate.
Wherein in an embodiment, described transparent substrates comprises plastic rubber substrate and is located at the hardening coat on described plastic rubber substrate surface, the surface of described hardening coat described plastic rubber substrate is dorsad described touch-surface, the surface of described plastic rubber substrate described hardening coat is dorsad described load-bearing surface, wherein, the thickness of described plastic rubber substrate is 0.1 ~ 0.3mm, and the thickness of described hardening coat is less than 0.05mm;
Or described transparent substrates is the plastic rubber substrate of a surface through cure process, described plastic rubber substrate is described touch-surface through the surface of cure process, and another surface is described load-bearing surface, and wherein, the thickness of described plastic rubber substrate is 0.1 ~ 0.3mm.
Wherein in an embodiment, described contact panel is the touch-screen of the support multiple spot of mutual capacitance type.
Wherein in an embodiment, the number of described conductive layer is one deck, the electrode pattern of described conductive layer comprises the first touch control electrode and the second touch control electrode, the number of described first touch control electrode and the number of described second touch control electrode and identical with the number of described lead-in wire, each lead-in wire is electrically connected with one first touch control electrode or one second touch control electrode, wherein, described first touch control electrode and described second touch control electrode are respectively used to obtain the information of X-axis coordinate and the information of Y-axis coordinate;
Or the number of described conductive layer is two-layer, is respectively the first conductive layer and the second conductive layer; Described transparent substrates, described first conductive layer, described second conductive layer and described first transparent photosensitive resin layer are cascading, and described first conductive layer and described second conductive layer mutually insulated; The electrode pattern of described first conductive layer comprises the first touch control electrode, and the lead-in wire of described first conductive layer is the first lead-in wire, and the number of described first lead-in wire is identical with the number of described first touch control electrode, and each first lead-in wire is electrically connected with one first touch control electrode; The electrode pattern of described second conductive layer comprises the second touch control electrode, and the lead-in wire of described second conductive layer is the second lead-in wire, and the number of described second lead-in wire is identical with the number of described second touch control electrode, and each second lead-in wire is electrically connected with one second touch control electrode; Wherein, described first touch control electrode and described second touch control electrode are respectively used to obtain the information of X-axis coordinate and the information of Y-axis coordinate.
Wherein in an embodiment, described contact panel also comprises ultraviolet glue-line, described ultraviolet glue-line is located at described transparent substrates one on the surface, and cover described viewing area and described non-viewing area, described ultraviolet glue-line is provided with latticed groove away from the surface of described transparent substrates, be filled with conductive material in described latticed groove, the conductive material be filled in described latticed groove forms described electrode pattern and described lead-in wire.
Wherein in an embodiment, described contact panel also comprises ultraviolet glue-line, described ultraviolet glue-line is located at described transparent substrates one on the surface, and cover described viewing area and described non-viewing area, described ultraviolet glue-line is provided with latticed groove away from the surface of described transparent substrates, described latticed groove is positioned at described viewing area, is filled with conductive material in described latticed groove, and the conductive material be filled in described latticed groove forms described electrode pattern; Described lead-in wire is located on the surface of described ultraviolet glue-line away from described transparent substrates, and is positioned at described non-viewing area.
Wherein in an embodiment, described contact panel also comprises the second transparent photosensitive resin layer, described second transparent photosensitive resin layer has relative first surface and second surface, described first surface is affixed in described transparent substrates, described second surface has been embedded in electrical-conductive nanometer silk thread, the electrical-conductive nanometer silk thread embedded in described second surface is cross-linked to form described conductive layer, and described conductive layer is patterned and forms described electrode pattern and described lead-in wire.
Wherein in an embodiment, described contact panel also comprises the second transparent photosensitive resin layer, described second transparent photosensitive resin layer has relative first surface and second surface, described first surface is affixed in described transparent substrates, described second surface has been embedded in electrical-conductive nanometer silk thread, described electrical-conductive nanometer silk thread is positioned at described viewing area, and the electrical-conductive nanometer silk thread embedded in described second surface is cross-linked to form conduction region, and described conduction region is patterned and forms described electrode pattern; Described lead-in wire is located on described second surface of transparent photosensitive resin layer away from described transparent substrates, and is positioned at described non-viewing area.
Above-mentioned first transparent feel photopolymer resin laminating is on the side of conductive layer transparent substrates dorsad, and transparent substrates side is outside exposed dorsad to avoid conductive layer, thus can available protecting electrode pattern and lead-in wire, avoids electrode pattern and lead-in wire to be scraped off or to be oxidized.
Accompanying drawing explanation
Fig. 1 is the structural representation of the contact panel of an embodiment;
Fig. 2 is the structural representation of the transparent substrates in Fig. 1;
Fig. 3 is the sectional view of the transparent substrates in Fig. 1;
Fig. 4 is the structural representation of conductive layer and the second transparent photosensitive resin layer;
Fig. 5 is the sectional view of conductive layer and the second transparent photosensitive resin layer;
Fig. 6 is the sectional view of conductive layer in another embodiment and the second transparent photosensitive resin layer;
Fig. 7 is the sectional view of transparent substrates in another embodiment and ultraviolet glue-line;
Fig. 8 is that filled conductive material forms the schematic diagram after conductive layer in the figure 7;
Fig. 9 is the structural representation of the latticed groove taking rhombus as unit formation;
Figure 10 is the structural representation of the latticed groove taking regular hexagon as unit formation;
Figure 11 is the structural representation of the latticed groove taking square as unit formation;
Figure 12 is the structural representation of the latticed groove be made up of irregular unit;
Figure 13 is the sectional view of the pending film for making the first transparent photosensitive resin layer;
Figure 14 is the schematic diagram of the roller heat-press step in the process of the transparent photosensitive resin layer of making first;
Figure 15 is the schematic diagram of the step of exposure in the process of the transparent photosensitive resin layer of making first;
Figure 16 is the schematic diagram of the development step in the process of the transparent photosensitive resin layer of making first;
Figure 17 is the schematic diagram of the curing schedule in the process of the transparent photosensitive resin layer of making first;
Figure 18 is the sectional view of the pending film for making the second transparent photosensitive resin layer and conductive layer;
Figure 19 is the schematic diagram of the roller heat-press step in the process of the transparent photosensitive resin layer of making second and conductive layer.
Embodiment
Below in conjunction with drawings and the specific embodiments, contact panel is described further.
As shown in Figure 1, the contact panel 10 of an embodiment, comprises transparent substrates 100, conductive layer 200 and the first transparent photosensitive resin layer 300.
As shown in Figure 2, transparent substrates 100 has viewing area 110 and non-viewing area 120, and non-viewing area 120 is provided with the binding district 130 for binding with flexible PCB.
Contact panel 10 needs to have cover sheet.In the present embodiment, transparent substrates 100 is also the cover sheet of contact panel 10.Also namely transparent substrates 100 has relative touch-surface 140 and load-bearing surface 150.Wherein, the skin hardness of touch-surface 140 is more than or equal to 3H (3H is pencil hardness grade), thus effectively can avoid scratch.Be appreciated that; in other embodiments; contact panel 10 also can comprise folded cover sheet, transparent substrates, conductive layer and the first transparent photosensitive resin layer established successively; also namely transparent substrates is not as the cover sheet of contact panel 10, and now transparent substrates can be PET film layer, transparent photosensitive resin layer (identical with the material of the first transparent photosensitive resin layer) etc.
Traditional contact panel 10 adopts tempered glass as cover sheet usually; also namely traditional cover sheet is rigid cover plate; and rigid, can not bend, therefore cannot meet the wearable devices such as such as intelligent watch on the horizon to the demand of flexible touch screen.In the present embodiment, transparent substrates 100 is flexible cover plate.Be appreciated that in other embodiments, transparent substrates 100 also can be tempered glass.
Further, in the present embodiment, as shown in Figure 3, transparent substrates 100 comprises plastic rubber substrate 160 and is located at the hardening coat 170 on plastic rubber substrate 160 surface, the surface of hardening coat 170 plastic rubber substrate 160 is dorsad touch-surface 140, and the surface of plastic rubber substrate 160 hardening coat 170 is dorsad load-bearing surface 150.Wherein, the thickness of plastic rubber substrate 160 is 0.1 ~ 0.3mm, and the thickness of hardening coat 170 is less than 0.05mm.Concrete, plastic rubber substrate 160 is PET (polyethylene terephthalate, polyethylene terephthalate) film material, PC (Polycarbonate, polycarbonate) one or more compounds in film material and PMMA (PolymethylMethacrylate, polymethylmethacrylate) film material.Hardening coat 170 be frp layer, silicon dioxide layer or carbon fiber with glass fibre mix staple fibre.
In other embodiments, transparent substrates 100 can be the plastic rubber substrate of a surface through cure process, and plastic rubber substrate is touch-surface 140 through the surface of cure process, and another surface is load-bearing surface 150.Wherein, the thickness of transparent substrates 100 is 0.1 ~ 0.3mm.Concrete, plastic rubber substrate can be one or more compounds in PET film material, PC film material and PMMA film material.
Further, in the present embodiment, the transmitance of transparent substrates 100 is more than or equal to 90%, and haze value is less than or equal to 1%.Concrete, in the present embodiment, the thickness of transparent substrates 100 is 0.1mm, transmitance is greater than 91%, and haze value is less than 0.55%.
As shown in Fig. 1 and Fig. 4, conductive layer 200 is located on the load-bearing surface 150 of transparent substrates 100, comprises electrode pattern 210 and lead-in wire 220.Electrode pattern 210 is positioned on viewing area 110, for obtaining the coordinate information of touch point.Lead-in wire 220 is connected with electrode pattern 210, is spread out of by flexible PCB for the coordinate information obtained by electrode pattern 210.Wherein, one end that lead-in wire 220 is connected with electrode pattern 210 is first end 222, and the other end is that the second end 224, second end 224 is positioned at binding district 130.
First transparent photosensitive resin layer 300 is located on the surface of conductive layer 200 away from transparent substrates 100, and the edge of the first transparent photosensitive resin layer 300 self-induced transparency substrate 100 caves in, formation breach 310, exposes to make the second end 224.Wherein, the thickness of the first transparent photosensitive resin layer 300 is 1 ~ 5 micron, is preferably 2.5 microns.
Above-mentioned first transparent photosensitive resin layer 300 is affixed on the side of conductive layer 200 transparent substrates 100 dorsad; transparent substrates 100 side is outside exposed dorsad to avoid conductive layer 200; thus energy available protecting electrode pattern 210 and lead-in wire 220, avoid electrode pattern 210 to be scraped off with lead-in wire 220 or to be oxidized.
In the present embodiment, contact panel 10 is the touch-screen of the support multiple spot of mutual capacitance type.Concrete, when the number of conductive layer 200 is one deck, the electrode pattern of conductive layer 200 comprises the first touch control electrode and the second touch control electrode, the number of the first touch control electrode and the number of the second touch control electrode and identical with the number of lead-in wire 220, each lead-in wire 220 is electrically connected with one first touch control electrode or one second touch control electrode.Wherein, the first touch control electrode and the second touch control electrode are respectively used to obtain the information of X-axis coordinate and the information of Y-axis coordinate.
When the number of conductive layer 200 is two-layer, be respectively the first conductive layer and the second conductive layer.Transparent substrates 100, first conductive layer, the second conductive layer and the first transparent photosensitive resin layer 300 are cascading, and the first conductive layer and the second conductive layer mutually insulated.The electrode pattern of the first conductive layer comprises the first touch control electrode, and the lead-in wire of the first conductive layer is the first lead-in wire.The number of the first lead-in wire is identical with the number of the first touch control electrode, and each first lead-in wire is electrically connected with one first touch control electrode.The electrode pattern of the second conductive layer comprises the second touch control electrode, and the lead-in wire of the second conductive layer is the second lead-in wire.The number of the second lead-in wire is identical with the number of the second touch control electrode, and each second lead-in wire is electrically connected with one second touch control electrode.Wherein, the first touch control electrode and the second touch control electrode are respectively used to obtain the information of X-axis coordinate and the information of Y-axis coordinate.
Be appreciated that in other embodiments, contact panel 10 also can be the touch-screen of the support single-point of mutual capacitance type.
As shown in Figures 4 and 5, in the present embodiment, contact panel 10 also comprises the second transparent photosensitive resin layer 400.Second transparent photosensitive resin layer 400 has relative first surface 410 and second surface 420, and first surface 410 is affixed in transparent substrates 100, and second surface 420 has been embedded in electrical-conductive nanometer silk thread 230, and electrical-conductive nanometer silk thread 230 is positioned at viewing area 110.The electrical-conductive nanometer silk thread 230 embedded in second surface 420 is cross-linked to form conduction region 240, and conduction region 240 is patterned and forms electrode pattern 210.Lead-in wire 220 is located on the second surface of transparent photosensitive resin layer 400 away from transparent substrates 100, and is positioned at non-viewing area 120.
Also namely in the present embodiment, after first forming electrode pattern 210, then lead-in wire 220 is formed.Concrete, the generation type of electrode pattern 210 is introduced in detail at further part.After forming electrode pattern 210, then on the region that the second transparent photosensitive resin layer 400 is corresponding with non-viewing area 120, adopt the mode of serigraphy to print elargol and obtain lead-in wire 220.
As shown in Figure 6, in other embodiments, contact panel 10 also comprises the second transparent photosensitive resin layer 400.Second transparent photosensitive resin layer 400 has relative first surface 410 and second surface 420, and first surface 410 is affixed in transparent substrates 100, and second surface 420 has been embedded in electrical-conductive nanometer silk thread 230.The electrical-conductive nanometer silk thread 230 embedded in second surface 420 is cross-linked to form conductive layer 200, and conductive layer 200 is patterned and forms electrode pattern 210 and lead-in wire 220.Also namely electrode pattern 210 is formed with lead-in wire 220 simultaneously, and now lead-in wire 220 is all transparent with electrode pattern 210, thus does not need the both sides of the edge printing ink layer at cover sheet, to cover opaque lead-in wire 220, thus can obtain the contact panel of Rimless.
In the present embodiment, electrical-conductive nanometer silk thread 230 is electrical-conductive nanometer filamentary silver line.The length of electrical-conductive nanometer silk thread 230 is 30 ~ 50 μm, and the diameter of electrical-conductive nanometer silk thread 230 is 30 ~ 50nm.Partially conductive nanometer silk thread 230 exposes second surface 420.
Because electrical-conductive nanometer silk thread 230 is Nano grade (Nano grade, opaque, naked eyes are invisible), when there is external voltage difference and steam, the chemical property of electrical-conductive nanometer silk thread 230 is very unstable, easily there is problem that is oxidized or generation migration, and then cause the electric conductivity of conductive layer 200 to reduce, even the problems such as open circuit occur.And the first transparent photosensitive resin layer 300 energy available protecting electrical-conductive nanometer silk thread 230, avoid the generation of the problems referred to above.
Because ITO enbrittles, can not bend, and electrical-conductive nanometer silk thread 230 has good pliability, can bend.And first transparent photosensitive resin layer 300 and the second transparent photosensitive resin layer 400 also there is pliability, can bend.When the cover sheet that transparent substrates 100 is contact panel 10, and when transparent substrates 100 is flexible cover plate, above-mentioned contact panel 10 has flexibility, can meet the wearable devices such as such as intelligent watch on the horizon to the demand of flexible touch screen.
As shown in Figures 7 and 8, in other embodiments, contact panel 10 also comprises ultraviolet glue-line 500, and ultraviolet glue-line 500 is for the replacement as the second transparent photosensitive resin layer 400.Ultraviolet glue-line 500 is located at transparent substrates 100 1 on the surface, and covers viewing area 110 and non-viewing area 120.Ultraviolet glue-line 500 is provided with latticed groove 510 away from the surface of transparent substrates 100, is filled with conductive material in latticed groove 510, and the conductive material be filled in latticed groove 510 forms electrode pattern 210 and lead-in wire 220.Namely also electrode pattern 210 is adopted with lead-in wire 220 and is formed in the same way simultaneously.
Wherein, forming electrode pattern 210 with the process of lead-in wire 220, first adopt the latticed groove 510 that the mode of impression is formed, then in latticed groove 510, adopt the mode of serigraphy or coating to be packed into conductive material formation electrode pattern 210 and lead-in wire 220.
In other embodiments, contact panel 10 also comprises ultraviolet glue-line 500, and ultraviolet glue-line 500 is located at transparent substrates 100 1 on the surface, and covers viewing area 110 and non-viewing area 120.Ultraviolet glue-line 500 is provided with latticed groove 510 away from the surface of transparent substrates 100, and latticed groove 510 is positioned at viewing area 110, and the conductive material be filled in latticed groove 510 forms electrode pattern 210.Lead-in wire 220 is located on the surface of ultraviolet glue-line 500 away from transparent substrates 100, and is positioned at 120 non-viewing areas.
Also after namely first forming electrode pattern 210, then lead-in wire 220 is formed.After forming electrode pattern 210, on the region that ultraviolet glue-line 500 is corresponding with non-viewing area 120, adopt the mode of serigraphy to print elargol and obtain lead-in wire 220.
Wherein, latticed groove 510 can be made up of rules unit, also can be made up of irregular unit.As shown in Fig. 9-Figure 12, latticed groove 510 in Fig. 9 is made up of diamond-shaped element, latticed groove 510 in Figure 10 is made up of regular hexagon unit, and the latticed groove 510 in Figure 11 is made up of square shaped cells, and the latticed groove 510 in Figure 10 is made up of irregular unit.
In the present embodiment, conductive material is nanoscale metal particles or powder, carbon nano-tube, Graphene, PEDOT (polymkeric substance of 3,4-ethylene dioxythiophene monomer) etc.Wherein, nano level metal can be nanometer metallic silver, nano-metallic copper, nano metal aluminium, Nanoalloy etc.
In the present embodiment, a kind of method for making of contact panel is also provided, comprises the steps:
Step S610, provides half one-tenth product.As shown in FIG. 13 and 14, half becomes product 700 to comprise transparent substrates and conductive layer, transparent substrates has viewing area and non-viewing area, non-viewing area is provided with the binding district for binding with flexible PCB, conductive layer is located at transparent substrates one on the surface, comprise electrode pattern and lead-in wire, electrode pattern is positioned on viewing area, for obtaining the coordinate information of touch point, lead-in wire is connected with electrode pattern, coordinate information for being obtained by electrode pattern is spread out of by flexible PCB, wherein, one end that lead-in wire is connected with electrode pattern is first end, the other end is the second end, second end is positioned at binding district.
Step S620, provides pending film.As shown in FIG. 13 and 14, pending film 800 comprise hypothallus 810 and two diaphragm 820, two diaphragms 820 be located at respectively hypothallus 810 relative two on the surface.After removing two diaphragms 820, hypothallus 810 is affixed on conductive layer away from the surface of transparent substrates, wherein, hypothallus 810 is the transparent photosensitive resin layer of semi-solid preparation.
In the present embodiment, the mode of roller hot pressing is adopted hypothallus 810 to be affixed on conductive layer away from the surface of transparent substrates.Wherein, roller 20 at the uniform velocity moves along certain orientation, and the actual conditions of roller hot pressing is: the temperature of press mold is 80 ~ 120 DEG C, and the speed of press mold is 0.5 ~ 5.0m/s, and the pressure of press mold is 0.1 ~ 0.5MPa.
Wherein, the transparent feel photopolymer resin of semi-solid preparation comprises each component of following parts by weight: 60 ~ 80 parts of film-forming resins, 1 ~ 10 part of emulsion, 5 ~ 20 parts of solvents, 0.1 ~ 5 part of stabilizing agent, 0.1 ~ 5 part of levelling agent, 0.1 ~ 5 part of defoamer, the number sum of each component is 100.
The transparent feel photopolymer resin of solidification comprises each component of following parts by weight: 30 ~ 50 parts of film-forming resins, 1 ~ 10 part of emulsion, 0.1 ~ 5 part of stabilizing agent, 0.1 ~ 5 part of levelling agent and 0.1 ~ 5 part of defoamer.
Film-forming resin is at least one in polymethylmethacrylate, linear phenolic resin, epoxy resin, crotonic acid, acrylate, vinyl ether and M Cr.Emulsion is at least one in diazobenzene quinone, diazo naphthoquinone ester, polyvinyl cinnamate, poly-Chinese cassia tree fork malonic acid glycol ester polyester, aromatic diazo salt, aromatic sulfonium salts, aromatic iodonium salt and ferrocene salt.Solvent is tetrahydrofuran, methyl ethyl ketone, cyclohexanone, propylene glycol, N, at least one in dinethylformamide, ethyl cellosolve acetate, ethyl acetate and butyl acetate, toluene, dimethylbenzene, tripropylene glycol diacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, dipentaerythrite six acrylate, 1,6-hexanediol methoxyl mono acrylic ester and ethoxylation neopentyl glycol methoxyl mono acrylic ester.Stabilizing agent is p-dihydroxy-benzene, p methoxy phenol, 1,4-benzoquinone, 2, at least one in 6 one di-t-butyl cresols, phenothiazine and anthraquinone.Levelling agent is at least one in polyacrylate, acetate butyrate fiber, nitrocellulose and polyvinyl butyral.Defoamer is phosphate, fatty acid ester and organosilyl at least one.
Wherein, the semi-cured state of transparent feel photopolymer resin has photosensitive property, and the solidification shape body of transparent feel photopolymer resin does not have photosensitive property.
Step S630, provides light shield.As shown in figure 15, light shield 900 is preset with pattern area 910, and the pattern in pattern area 910 is identical or complementary with the pattern in binding district.Light shield 900 is placed in the side of hypothallus away from conductive layer, and carries out exposure-processed and development treatment successively, obtain having the intermediate product of the breach corresponding to binding district.
In the present embodiment, the transparent feel photopolymer resin forming hypothallus 810 is negative photosensitive resin, and namely illumination place is insoluble to developer solution.Because illumination place is insoluble to developer solution, if want retention criteria pattern, the light shield 900 with the pattern area identical with standard pattern should be adopted.Figure 15 is exposure process, and adopt UV-irradiation light shield 900 away from the side of hypothallus 810, wherein, the part that hypothallus 810 is irradiated by light is area of illumination 812, and the part be not irradiated by light is non-area of illumination 814.Figure 16 is developing process, and non-area of illumination 814 is removed.
Wherein, in exposure process, uv-exposure energy is 10mj ~ 1000mj.In the process of development treatment, the weak base aqueous solution of developer solution to be concentration be 0.1wt% ~ 2.0wt%.Weak base is sal tartari, sodium carbonate, organic amine etc.
Be appreciated that in other embodiments, the transparent feel photopolymer resin forming hypothallus 810 can be also positive type photosensitive, and namely illumination place is dissolved in developer solution.Because illumination place is dissolved in developer solution, if want retention criteria pattern, the light shield 900 had with the pattern area of standard pattern complementation should be adopted.
Step S640, is cured process to intermediate product, namely obtains contact panel (also namely obtaining the first transparent photosensitive resin layer).
In the present embodiment, the mode of ultraviolet lighting is adopted to be cured process.If Figure 17 is solidification processing procedure, wherein, ultra-violet curing is 500mj ~ 1000mj.
Above-mentioned method for making adopts pending film as dielectric film to protect conductive layer, the making of the pattern on very convenient dielectric film, thus makes the making of dielectric film very simple.And adopt pending film to make the first transparent photosensitive resin layer, relative to first applying precuring again with the method for making of the obtain semi-solid preparation first transparent photosensitive resin layer, one production process (precuring operation) can be economized.And adopt pending film to make the first transparent photosensitive resin layer, better can control the thickness of the first transparent photosensitive resin layer, and the hypothallus in pending film is the transparent photosensitive resin layer of semi-solid preparation, there is the form determined, in solidification processing procedure, there will not be the situation causing surface irregularity because of contraction, thus make the thickness of the first transparent photosensitive resin layer even, surfacing, not easily produces the phenomenon causing visually seeing multicolour pattern because of the diffraction of light.
When contact panel comprises the second transparent photosensitive resin layer, provide transparent substrates and pending film.As shown in Figure 18 and Figure 19, pending film 12 comprise body 11 and two diaphragm 13, two diaphragms 13 be located at respectively body 11 relative two on the surface.The conductive layer 16 that body 11 comprises hypothallus 14 and is cross-linked to form by electrical-conductive nanometer silk thread 15.Hypothallus 14 has relative connecting surface 14a and finished surface 14b, electrical-conductive nanometer silk thread 15 embeds finished surface 14b, wherein, the region that hypothallus 14 is embedded in electrical-conductive nanometer silk thread 15 is conduction region 14c, and the region not being embedded with electrical-conductive nanometer silk thread 15 is nonconductive regions 14d.Hypothallus 14 is the transparent photosensitive resin layer of semi-solid preparation.After removing two diaphragms 13, body 11 is located in transparent substrates 100, and connecting surface 14a is near transparent substrates.
In the present embodiment, partially conductive nanometer silk thread 15 exposes finished surface 14b.By the mode of roller hot pressing, body 11 is located in transparent substrates.Nonconductive regions 14d is equivalent to tack coat and is connected in transparent substrates by conduction region 14c.
Conduction region 14c is being carried out successively to exposure-processed, development treatment and solidification process, substantially identical with the process of formation the first transparent photosensitive resin layer of these processes, the pattern of the pattern area that light shield has that different is only.When carrying out exposure-processed successively to conduction region 14c, the pattern in mask pattern district is identical with electrode pattern or complementary; Or the pattern that the pattern in mask pattern district and electrode pattern and going between is formed is identical or complementary.
The above embodiment only have expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (10)
1. a contact panel, is characterized in that, comprising:
Transparent substrates, has viewing area and non-viewing area, and described non-viewing area is provided with the binding district for binding with flexible PCB;
Conductive layer, be located at described transparent substrates one on the surface, comprise electrode pattern and lead-in wire, described electrode pattern is positioned on described viewing area, for obtaining the coordinate information of touch point, described lead-in wire is connected with described electrode pattern, coordinate information for being obtained by described electrode pattern is spread out of by flexible PCB, and wherein, one end that described lead-in wire is connected with described electrode pattern is first end, the other end is the second end, and described second end is positioned at described binding district; And
First transparent photosensitive resin layer, is located on the surface of described conductive layer away from described transparent substrates, and described first transparent photosensitive resin layer to cave in formation breach from the edge of described transparent substrates, exposes to make described second end.
2. contact panel according to claim 1; it is characterized in that; described transparent substrates is the cover sheet of described contact panel; described transparent substrates has relative touch-surface and load-bearing surface; the skin hardness of described touch-surface is more than or equal to 3H, and described conductive layer is located on described load-bearing surface.
3. contact panel according to claim 2, is characterized in that, described transparent substrates is flexible cover plate.
4. contact panel according to claim 3, it is characterized in that, described transparent substrates comprises plastic rubber substrate and is located at the hardening coat on described plastic rubber substrate surface, the surface of described hardening coat described plastic rubber substrate is dorsad described touch-surface, the surface of described plastic rubber substrate described hardening coat is dorsad described load-bearing surface, wherein, the thickness of described plastic rubber substrate is 0.1 ~ 0.3mm, and the thickness of described hardening coat is less than 0.05mm;
Or described transparent substrates is the plastic rubber substrate of a surface through cure process, described plastic rubber substrate is described touch-surface through the surface of cure process, and another surface is described load-bearing surface, and wherein, the thickness of described plastic rubber substrate is 0.1 ~ 0.3mm.
5. contact panel according to claim 1, is characterized in that, described contact panel is the touch-screen of the support multiple spot of mutual capacitance type.
6. contact panel according to claim 5, it is characterized in that, the number of described conductive layer is one deck, the electrode pattern of described conductive layer comprises the first touch control electrode and the second touch control electrode, the number of described first touch control electrode and the number of described second touch control electrode and identical with the number of described lead-in wire, each lead-in wire is electrically connected with one first touch control electrode or one second touch control electrode, wherein, described first touch control electrode and described second touch control electrode are respectively used to obtain the information of X-axis coordinate and the information of Y-axis coordinate;
Or the number of described conductive layer is two-layer, is respectively the first conductive layer and the second conductive layer; Described transparent substrates, described first conductive layer, described second conductive layer and described first transparent photosensitive resin layer are cascading, and described first conductive layer and described second conductive layer mutually insulated; The electrode pattern of described first conductive layer comprises the first touch control electrode, and the lead-in wire of described first conductive layer is the first lead-in wire, and the number of described first lead-in wire is identical with the number of described first touch control electrode, and each first lead-in wire is electrically connected with one first touch control electrode; The electrode pattern of described second conductive layer comprises the second touch control electrode, and the lead-in wire of described second conductive layer is the second lead-in wire, and the number of described second lead-in wire is identical with the number of described second touch control electrode, and each second lead-in wire is electrically connected with one second touch control electrode; Wherein, described first touch control electrode and described second touch control electrode are respectively used to obtain the information of X-axis coordinate and the information of Y-axis coordinate.
7. contact panel according to claim 1, it is characterized in that, described contact panel also comprises ultraviolet glue-line, described ultraviolet glue-line is located at described transparent substrates one on the surface, and cover described viewing area and described non-viewing area, described ultraviolet glue-line is provided with latticed groove away from the surface of described transparent substrates, is filled with conductive material in described latticed groove, and the conductive material be filled in described latticed groove forms described electrode pattern and described lead-in wire.
8. contact panel according to claim 1, it is characterized in that, described contact panel also comprises ultraviolet glue-line, described ultraviolet glue-line is located at described transparent substrates one on the surface, and cover described viewing area and described non-viewing area, described ultraviolet glue-line is provided with latticed groove away from the surface of described transparent substrates, described latticed groove is positioned at described viewing area, be filled with conductive material in described latticed groove, the conductive material be filled in described latticed groove forms described electrode pattern; Described lead-in wire is located on the surface of described ultraviolet glue-line away from described transparent substrates, and is positioned at described non-viewing area.
9. contact panel according to claim 1, it is characterized in that, described contact panel also comprises the second transparent photosensitive resin layer, described second transparent photosensitive resin layer has relative first surface and second surface, described first surface is affixed in described transparent substrates, described second surface has been embedded in electrical-conductive nanometer silk thread, and the electrical-conductive nanometer silk thread embedded in described second surface is cross-linked to form described conductive layer, and described conductive layer is patterned and forms described electrode pattern and described lead-in wire.
10. contact panel according to claim 1, it is characterized in that, described contact panel also comprises the second transparent photosensitive resin layer, described second transparent photosensitive resin layer has relative first surface and second surface, described first surface is affixed in described transparent substrates, described second surface has been embedded in electrical-conductive nanometer silk thread, described electrical-conductive nanometer silk thread is positioned at described viewing area, the electrical-conductive nanometer silk thread embedded in described second surface is cross-linked to form conduction region, and described conduction region is patterned and forms described electrode pattern; Described lead-in wire is located on described second surface of transparent photosensitive resin layer away from described transparent substrates, and is positioned at described non-viewing area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520328709.4U CN204667371U (en) | 2015-05-20 | 2015-05-20 | Contact panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520328709.4U CN204667371U (en) | 2015-05-20 | 2015-05-20 | Contact panel |
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| Publication Number | Publication Date |
|---|---|
| CN204667371U true CN204667371U (en) | 2015-09-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520328709.4U Expired - Fee Related CN204667371U (en) | 2015-05-20 | 2015-05-20 | Contact panel |
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| Country | Link |
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| CN (1) | CN204667371U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106293172A (en) * | 2015-05-20 | 2017-01-04 | 南昌欧菲光科技有限公司 | Contact panel and preparation method thereof |
| CN106940601A (en) * | 2017-03-13 | 2017-07-11 | 深圳欧菲光科技股份有限公司 | Touch control component and preparation method thereof and contactor control device and preparation method thereof |
| WO2021169067A1 (en) * | 2020-02-28 | 2021-09-02 | 宸美（厦门）光电有限公司 | Electrode, fabrication method for electrode, and apparatus thereof |
-
2015
- 2015-05-20 CN CN201520328709.4U patent/CN204667371U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106293172A (en) * | 2015-05-20 | 2017-01-04 | 南昌欧菲光科技有限公司 | Contact panel and preparation method thereof |
| CN106293172B (en) * | 2015-05-20 | 2024-04-30 | 安徽精卓光显技术有限责任公司 | Touch panel and manufacturing method thereof |
| CN106940601A (en) * | 2017-03-13 | 2017-07-11 | 深圳欧菲光科技股份有限公司 | Touch control component and preparation method thereof and contactor control device and preparation method thereof |
| CN106940601B (en) * | 2017-03-13 | 2023-01-10 | 安徽精卓光显技术有限责任公司 | Touch element and manufacturing method thereof, and touch device and manufacturing method thereof |
| WO2021169067A1 (en) * | 2020-02-28 | 2021-09-02 | 宸美（厦门）光电有限公司 | Electrode, fabrication method for electrode, and apparatus thereof |
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