WO2007137486A1 - Electromagnetic shielded film and its manufacturing method - Google Patents

Electromagnetic shielded film and its manufacturing method Download PDF

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Publication number
WO2007137486A1
WO2007137486A1 PCT/CN2007/001545 CN2007001545W WO2007137486A1 WO 2007137486 A1 WO2007137486 A1 WO 2007137486A1 CN 2007001545 W CN2007001545 W CN 2007001545W WO 2007137486 A1 WO2007137486 A1 WO 2007137486A1
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WIPO (PCT)
Prior art keywords
film
layer
metal
film substrate
electromagnetic wave
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PCT/CN2007/001545
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French (fr)
Chinese (zh)
Inventor
Panting Hsueh
Original Assignee
72G International Company Limited
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Publication of WO2007137486A1 publication Critical patent/WO2007137486A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked

Definitions

  • Electromagnetic wave shielding film and manufacturing method thereof are Electromagnetic wave shielding film and manufacturing method thereof.
  • the present invention relates to a shielding technique for electromagnetic radiation, and more particularly to a highly transparent electromagnetic wave shielding film suitable for suppressing electromagnetic wave leakage of a display device and a method of manufacturing the same. Background technique
  • various electronic products such as cathode ray tube (CRT) displays, liquid crystal displays, plasma TV sets, etc.
  • CTR cathode ray tube
  • LCD liquid crystal displays
  • plasma TV sets etc.
  • This radiation can cause harm to the human body, especially if it is close to the radiation source for a long time, which may lead to various physiological diseases, such as increased cytopathic conditions, malignant diseases such as cancer, swollen gland enlargement, leukemia, and eyes. Dryness and neck push disease.
  • a highly transparent film that shields the electromagnetic radiation from the surface of the screen.
  • a cured adhesive having a thickness of, for example, about 10 ⁇ m
  • an electrolytic copper film having a thickness of more than 6 ⁇ m
  • an optical grade transparent poly pair having a high light transmittance (for example, 90% or more).
  • PET ethylene terephthalate
  • a copper film metal etching is then performed to form a metal lattice layer on the surface of the PET film.
  • the thickness is generally 8 micrometers to 12 micrometers or more, which is far beyond the thickness of the metal layer required for electromagnetic wave shielding, wasting resources. And increased costs.
  • the curing adhesive used to bond the metal film to the PET film releases organic volatiles that pollute the environment due to the increase in heat during production and later use, thereby adversely affecting human health.
  • Another type of electromagnetic wave shielding film uses a mesh material woven from a polymer material, which is coated with a metallized outer layer by "electroless plating" and adhered to the optically transparent PET with a curing adhesive. An electromagnetic wave shielding film is formed on the film.
  • An object of the present invention is to provide an electromagnetic wave shielding film which can reduce the amount of shielding metal and the environmental pollution caused by organic volatiles such as curing glue.
  • An electromagnetic wave shielding film comprising:
  • a metal mesh layer on at least one surface of the film substrate.
  • the film substrate is a plastic film having a light transmittance of 87% or more and a thickness of 1 to 500 ⁇ m.
  • the metal mesh layer is made of a single metal or alloy, has a thickness of 2.5 to 4 ⁇ m, and is covered with an oxidation resistant layer.
  • the above electromagnetic wave shielding film further comprising a release paper coated on the other surface of the film substrate and covering the surface of the adhesive film layer.
  • Another object of the present invention is to provide a method of manufacturing an electromagnetic wave shielding film which can reduce the environmental pollution caused by the amount of the shielding metal and the organic volatile matter contained in the curing glue used between the shielding metal and the film substrate.
  • a method of manufacturing an electromagnetic wave shielding film comprising the steps of:
  • a metal mesh pattern is formed on the film substrate by a photolithography process.
  • a method for manufacturing an electromagnetic wave shielding film comprising the steps of: forming a metal layer on a film substrate having a conductive layer deposited on a surface thereof by using an electroplating process;
  • a metal mesh pattern is formed on the film substrate by a photolithography process.
  • the conductive layer and the metal layer are composed of copper
  • the step of forming the metal mesh pattern includes:
  • a metal layer and a conductive layer region not covering the photoresist on the film substrate are etched to form the metal mesh pattern.
  • the film substrate is a plastic film having a light transmittance of 87% or more and a thickness of 1 to 500 ⁇ m, and the conductive layer and the metal layer are composed of a single metal or alloy, and the total thickness is 2. 5 ⁇ 4 microns.
  • the following steps are included between the step of forming the metal layer and the step of forming a metal mesh pattern:
  • the film substrate plated with the metal layer is contacted with an antioxidant to form an oxidation resistant layer on the surface of the metal layer;
  • the release film is covered on the surface of the adhesive film layer.
  • Still another object of the present invention is to provide a display device which can reduce leakage of electromagnetic radiation.
  • a display device comprising:
  • the electromagnetic wave shielding film covers the surface of the display screen. It is still another object of the present invention to provide an electronic device that reduces leakage of electromagnetic radiation.
  • An electronic device comprising a display screen, further comprising the above-mentioned electromagnetic wave shielding film covering the surface of the display screen.
  • the present invention can reduce the process cost, and can also reduce the process steps, in addition to the advantages of reducing the metal consumption of the electromagnetic wave shielding and avoiding the use of the curing glue between the metal layer and the PET film. Effectively reduce industrial production costs and increase production efficiency.
  • the thickness of the metal layer of the present invention is reduced to 1/2 to 1/3 of the original, which reduces the time required for etching into a mesh pattern structure, thereby facilitating suppression of metal etching due to pickling time. A trapezoidal phenomenon that is too long.
  • Figure 1 is a cross-sectional view showing an electromagnetic wave shielding film in accordance with a preferred embodiment of the present invention
  • Fig. 2 is a view showing the pattern of the metal layer in the electromagnetic wave shielding film shown in Fig. 1.
  • Figs. 3a and 3b are the results of electromagnetic wave shielding performance test of the electromagnetic wave shielding film shown in Fig. 1. detailed description
  • the electromagnetic wave shielding film 1 is a composite layer structure mainly comprising a film substrate 11, a metal mesh layer 12 on one surface of the film substrate 11, an oxidation resistant layer 13 covering the surface of the metal mesh layer 12, and coating.
  • the adhesive film layer 14 on the other surface of the film substrate 11 and the release paper 15 covering the surface of the adhesive film layer 14 are provided.
  • the film substrate 11 functions as a substrate of the electromagnetic wave shielding film, and functions as a supporting metal layer and a backing film layer. Further, when used for a display screen of a display device, the film substrate 11 should have sufficient optical transmittance.
  • PET polyethylene terephthalate
  • the plastic film has a light transmittance of greater than or equal to 87% and a thickness of between 1 and 500 microns.
  • the metal mesh layer 12 is formed on the surface of the film substrate 11, and its formation will be described in detail below.
  • Fig. 2 shows a pattern of the metal mesh layer 12 in the electromagnetic wave shielding film shown in Fig. 1.
  • the middle of the metal mesh layer 12 is a mesh region 12a composed of metal wires interlaced in different directions, wherein the wire diameter of the metal wires is less than or equal to 30 micrometers, and the spacing between the metal wires is less than or equal to 420. Micron.
  • the mesh area is surrounded by a metal frame 12b (indicated by a thick line in the figure).
  • the metal mesh layer 12 can be made of a single metal or alloy. Generally, when the thickness of the layer is 2.
  • a single metal or alloy includes, but is not limited to, copper, aluminum, gold, nickel, and a Mendel alloy (copper-nickel alloy).
  • Mendel alloy copper-nickel alloy
  • an anti-oxidation layer 13 is formed on the metal mesh layer 12, for example, by coating a copper anti-oxidant on the metal mesh layer 12.
  • a transparent layer of the adhesive film layer 14 is applied on the surface of the film substrate 11 where the metal layer is not formed by the gluing device, and then covered with a release paper 15 (for example, a silicon-containing release paper).
  • Adhesive film layer 14 When in use, the release paper 15 is uncovered and the side of the electromagnetic shielding film 1 coated with the adhesive film layer 14 is attached to the surface of the display screen (for example, the inner surface) such that the display screen is opposite to the aforementioned mesh region, the metal Block 12a is grounded.
  • the thickness of the metal mesh layer is 3. 5 microns
  • the thickness of the metal mesh layer is 3. 5 microns
  • the thickness of the metal mesh layer is 3. 5 microns
  • the thickness of the metal mesh layer is 3. 5 microns
  • the result shown in Fig. 3b corresponds to the thickness of the metal mesh layer.
  • the electromagnetic radiation shielding film of the present embodiment has electromagnetic radiation intensity lower than the horizontal line under the two wire diameters, that is, the electromagnetic radiation intensity specified by the national standard GB9254-98 is not exceeded.
  • the metal mesh layer is formed only on one side of the PET film, and in order to enhance the electromagnetic wave shielding effect, a metal mesh layer may be formed on both surfaces of the PET film.
  • a conductive layer is formed on the surface of the PET film substrate.
  • the formation method can be performed by physical vapor deposition (physical vapor deposit ion) technique in a vacuum environment by magnetron sputtering continuous plating on the PET film substrate.
  • the surface of the material is attached to a copper or tin indium alloy (IT0) having a thickness less than ⁇ ⁇ ⁇ ⁇ .
  • IT0 copper or tin indium alloy
  • a metal copper layer is used as the conductive layer.
  • two rolls of PET film can be stretched and wound forward at the same time during vacuum plating, and the two sides of the film are subjected to single-layer vacuum magnetron sputtering on both sides of the film, so at the same time Simultaneous production of two rolls of PET roll film with a single-sided conductive layer.
  • both sides of the single roll film may be simultaneously subjected to vacuum magnetron sputtering to form a conductive layer.
  • the electromagnetic shielding film is used for the display screen, a certain transparency should be ensured.
  • a transparent PET roll film having a light transmittance of 87% or more can be used, and the thickness is from 1 ⁇ m to 500 ⁇ m.
  • step 2 the thick metal is electroplated on the film substrate of the single-sided conductive metal layer obtained in step 1 by using the existing continuous electrolytic plating process, so that the total thickness of the metal layer is increased to the desired thickness.
  • the thickness is 2. 5 microns ⁇ 4 microns.
  • step 3 the electroplated film is immersed in an antioxidant solution to form an oxidation resistant layer on the surface of the metal layer.
  • a transparent adhesive film layer is continuously coated on one side of the unplated metal layer of the PET film substrate by using a gluing device.
  • a layer of silicon-containing release paper is applied over the adhesive film layer.
  • step 6 seal the PET with waterproof sticker tape The film substrate covers the surface of the release paper.
  • step 7 a photoresist of a thickness of about 1 mm is applied to the surface of the metal layer of the PET film substrate.
  • step 8 the negative film having a printing dot number of more than 12,000 ppi is placed on the exposure machine glass sheet by vacuum adsorption, and the film is printed with a mesh pattern, for example, as shown in FIG. Border pattern.
  • step 9 using a deep ultraviolet light source with a shorter wavelength to scan the glass sheet of the lithography machine to achieve planar exposure development, and the chemical inhibitors in the photoresist which are not blocked by the film will be changed into a sensitizer by deep ultraviolet rays. These sensitizers are washed by the developer to form an invisible mesh pattern of the same thickness as the negative film used for exposure.
  • step 10 the package film processed in step 9 is continuously or cut into a single piece and then placed in an etching apparatus to etch away areas directly exposing the copper metal, thereby forming a desired metal mesh pattern or FIG. The metal mesh layer shown.
  • a film substrate having a surface on which a conductive layer is previously formed can also be obtained from the market, and therefore, in another embodiment of the present invention, step 1 can be omitted.
  • the substrate on which the conductive layer is preliminarily formed includes, for example, a transparent PET roll film having a thickness of 125 ⁇ m, which is manufactured by Shandong Tiannuo Photoelectric Material Co., Ltd., Jinan, China, and is numbered TN-PET1-125-35-DNC.
  • a backing film layer may be coated on one side of the unplated metal layer of the PET film substrate by a common screen printing method, and the film layer has the above Step 10 etches the same pattern of metal mesh patterns formed, the wire diameter is comparable to or even finer than the etched metal lines, and the film thickness is generally less than 10 microns.
  • the conductive layer and the metal layer are both made of copper, but the conductive layer may also be made of tin-indium alloy ( ⁇ 0), which is transparent, so in step 9, only the metal layer can be etched away and remain as conductive. A layer of tin indium alloy.
  • the present invention does not interfere with the effect of electromagnetic wave shielding regardless of whether it is used in front of or behind the display screen (for example, a screen glass or a flexible film). If a higher shielding value standard is required, the PET film with high optical transmittance (87% or more) can be formed on both sides.
  • Metal mesh pattern Specifically, a metal copper layer may be formed on both surfaces of the PET film by using the above steps 1 to 3, and then a metal mesh pattern is formed by using the above steps 7 to 10, and finally one of the metal meshes is used in the above steps 4 and 5. A backing layer and a release paper are formed on the pattern.
  • the plating process can be used to avoid bonding any metal layer and the film substrate by using any adhesive curing agent, which is advantageous for reducing the volatilization of organic substances. .
  • the transparency of the electromagnetic shielding film is improved without the use of an adhesive curing agent, so that the optical transmittance of the PET film can be lowered.
  • the present invention does not have to use a PET film film having a light transmittance of 92% or more, and it is only required to use an optical grade PET film having a light transmittance of 87 - 87% to satisfy the transparency requirement.
  • an electromagnetic wave shielding film according to the present invention may be coated on the screen surface of an electric or electronic product.
  • an adhesive material may be formed on the surface of the electromagnetic wave shielding film of the present invention (e.g., the entire surface or a region close to the periphery) and covered with a release film. When you want to cover the surface of the screen, just peel off the release film and then attach the surface of the adhesive material to the screen.
  • the electromagnetic wave shielding film of the present invention contains a metal mesh layer structure, leakage of electromagnetic radiation can be effectively prevented.
  • the conductor such as the electrostatic discharge pen can be touched and connected to any position of the metal mesh layer at any time, thereby accumulating The static electricity on the surface of the screen is quickly released.

Abstract

A kind of electromagnetic wave shielding film includes: a film substrate (11) with transparency on optical degree more than or equal to 87% and layers of metal net (12) at least on one surface of the film substrate (11). A method for manufacturing a electromagnetic wave shielding film includes the following steps: first, a conductive layer is formed on the surface of the film substrate (11) by a method of physical vapor deposition; next, a metal layer is shaped on the conductive layer by the technique of plating; then, metal reticular pattern comes into being on such film substrate by laser-cutting technique. This invention can not only reduce the consumption of metal for electromagnetic shielding and avoid the use of solidifying glue between the layers of metal and film substrate, but also decrease the process steps to lower the cost of industrial production and increase productivity effectively.

Description

电磁波屏蔽薄膜及其制造方法 技术领域  Electromagnetic wave shielding film and manufacturing method thereof
本发明涉及电磁辐射的屏蔽技术， 特别涉及一种适用于抑 制显示设备的电磁波泄漏的高透明度电磁波屏蔽薄膜及其制造 方法。 背景技术  The present invention relates to a shielding technique for electromagnetic radiation, and more particularly to a highly transparent electromagnetic wave shielding film suitable for suppressing electromagnetic wave leakage of a display device and a method of manufacturing the same. Background technique
目前已知各种电子类产品（例如阴极射线管（CRT)显示器、 液晶显示器和等离子电视机等）在使用过程中会透过外壳或显示 屏幕发射出对人体有害的各种波长的电磁辐射， 这种辐射将对 人体产生伤害， 特别是如果长时间靠近辐射源， 可能会导致各 种生理疾病， 例如细胞病变程度加大、 诸如癌症之类的恶性疾 病、 曱状腺肿大、 白血病、 眼睛干涩和颈推疾病等。  At present, various electronic products (such as cathode ray tube (CRT) displays, liquid crystal displays, plasma TV sets, etc.) are known to emit electromagnetic radiation of various wavelengths harmful to the human body through the outer casing or the display screen during use. This radiation can cause harm to the human body, especially if it is close to the radiation source for a long time, which may lead to various physiological diseases, such as increased cytopathic conditions, malignant diseases such as cancer, swollen gland enlargement, leukemia, and eyes. Dryness and neck push disease.
为了防止显示器的电磁辐射泄漏， 目前做法都在屏幕表面 覆盖或形成一层可屏蔽电磁幅射的高透明薄膜。 例如其中一种 方式是利用固化胶（其厚度例如为 10微米左右）将厚度超过 6微 米的压延铜膜或电解铜膜粘贴在透光率较高（例如 90%以上）的光 学级透明聚对苯二甲酸乙二酯（PET)薄膜上， 之后再做铜膜网状 金属蚀刻， 以在 PET 薄膜表面形成金属格状层。 这种方式虽然 可行， 但是由于工业化生产的压延铜膜及电解铜膜非常昂贵， 其厚度一般要达到 8微米- 12微米或更厚， 远远超出电磁波屏 蔽所需的金属层厚度， 浪费了资源并增加了成本。 此外， 将金 属膜与 PET 薄膜间粘合在一起所用的固化胶在生产过程及以后 使用中都会因热量升高而释放出污染环境的有机挥发物， 从而 对人体健康产生有害的影响。  In order to prevent leakage of electromagnetic radiation from the display, current practices cover or form a highly transparent film that shields the electromagnetic radiation from the surface of the screen. For example, one way is to use a cured adhesive (having a thickness of, for example, about 10 μm) to adhere a rolled copper film or an electrolytic copper film having a thickness of more than 6 μm to an optical grade transparent poly pair having a high light transmittance (for example, 90% or more). On the ethylene terephthalate (PET) film, a copper film metal etching is then performed to form a metal lattice layer on the surface of the PET film. Although this method is feasible, since the industrially produced rolled copper film and electrolytic copper film are very expensive, the thickness is generally 8 micrometers to 12 micrometers or more, which is far beyond the thickness of the metal layer required for electromagnetic wave shielding, wasting resources. And increased costs. In addition, the curing adhesive used to bond the metal film to the PET film releases organic volatiles that pollute the environment due to the increase in heat during production and later use, thereby adversely affecting human health.
另一种电磁波屏蔽薄膜采用一种由聚合物材料编织成的网 纱， 该网纱上采用 "化学镀"的方法镀上金属化的外层， 并用固 化胶将其贴在光学透明级的 PET 薄膜上以构成电磁波屏蔽膜。  Another type of electromagnetic wave shielding film uses a mesh material woven from a polymer material, which is coated with a metallized outer layer by "electroless plating" and adhered to the optically transparent PET with a curing adhesive. An electromagnetic wave shielding film is formed on the film.
- 1 - 确 认 本 但是"化学镀"被公认为会对环境造成重大危害， 而且需要消耗 大量的水力资源和电力。 另外， 这种方法生产的网纱需使用含 有有机挥发物的固化胶粘贴着在高透光率的光学 PET膜上， 也 释放出的有害环境及人体的有机挥发物。 最后， 聚合物编织的 网紗受材料线径的限制并且编织的纱线形状呈柱状体， 因此就 算金属化后仍制约并影响了电磁辐射屏蔽效果及视觉效果。 发明内容 - 1 - Confirmation However, "electroless plating" is recognized as a major hazard to the environment and requires a large amount of water resources and electricity. In addition, the mesh produced by this method needs to be adhered to a high-transmittance optical PET film using a curing adhesive containing organic volatiles, and also releases harmful environmental effects and organic volatiles of the human body. Finally, the polymer woven mesh is limited by the wire diameter of the material and the shape of the woven yarn is columnar, so even after metallization, it restricts and affects the electromagnetic radiation shielding effect and visual effect. Summary of the invention
本发明的一个目的是提供一种电磁波屏蔽薄膜， 其可减少 屏蔽金属的用量和固化胶水之类有机挥发物对环境造成的污 染。  SUMMARY OF THE INVENTION An object of the present invention is to provide an electromagnetic wave shielding film which can reduce the amount of shielding metal and the environmental pollution caused by organic volatiles such as curing glue.
本发明的上述目的通过下列技术方案实现：  The above object of the present invention is achieved by the following technical solutions:
一种电磁波屏蔽薄膜， 包含：  An electromagnetic wave shielding film comprising:
薄膜基材； 以及  Film substrate;
位于所述薄膜基材至少一个表面的金属网层。  a metal mesh layer on at least one surface of the film substrate.
优选地， 在上述电磁波屏蔽薄膜中， 所述薄膜基材为透光 率大于或等于 87 %的塑料薄膜， 厚度为 1 ~ 500微米。  Preferably, in the electromagnetic wave shielding film, the film substrate is a plastic film having a light transmittance of 87% or more and a thickness of 1 to 500 μm.
优选地， 在上述电磁波屏蔽薄膜中， 所述金属网层由单一 金属或合金制成， 厚度为 2. 5 ~ 4微米， 并且表面覆盖有抗氧化 层。  Preferably, in the above electromagnetic wave shielding film, the metal mesh layer is made of a single metal or alloy, has a thickness of 2.5 to 4 μm, and is covered with an oxidation resistant layer.
优选地， 在上述电磁波屏蔽薄膜中， 进一步包含涂覆在所 述薄膜基材另一个表面和覆盖在该背胶膜层表面的离型纸。  Preferably, in the above electromagnetic wave shielding film, further comprising a release paper coated on the other surface of the film substrate and covering the surface of the adhesive film layer.
本发明的另一个目的是提供一种制造电磁波屏蔽薄膜的方 法， 其可减少屏蔽金属的用量和屏蔽金属与薄膜基材之间使用 的固化胶水所含有机挥发物对环境造成的污染。  Another object of the present invention is to provide a method of manufacturing an electromagnetic wave shielding film which can reduce the environmental pollution caused by the amount of the shielding metal and the organic volatile matter contained in the curing glue used between the shielding metal and the film substrate.
本发明的上述目的通过下列技术方案实现：  The above object of the present invention is achieved by the following technical solutions:
一种制造电磁波屏蔽薄膜的方法， 包含以下步骤：  A method of manufacturing an electromagnetic wave shielding film, comprising the steps of:
利用物理气相沉积法在薄膜基材表面形成导电层；  Forming a conductive layer on the surface of the film substrate by physical vapor deposition;
利用电镀工艺在所述导电层上形成金属层； 以及 以光刻工艺在所述薄膜基材上形成金属网状图案。 Forming a metal layer on the conductive layer using an electroplating process; A metal mesh pattern is formed on the film substrate by a photolithography process.
本发明的上述目的还通过下列技术方案实现：  The above object of the present invention is also achieved by the following technical solutions:
一种制造电磁波屏蔽薄膜的方法， 包含以下步骤： 利用电镀工艺在表面沉积有导电层的薄膜基材上形成金属 层； 以及  A method for manufacturing an electromagnetic wave shielding film, comprising the steps of: forming a metal layer on a film substrate having a conductive layer deposited on a surface thereof by using an electroplating process;
以光刻工艺在所述薄膜基材上形成金属网状图案。  A metal mesh pattern is formed on the film substrate by a photolithography process.
优选地， 在上述方法中， 所述导电层和金属层由铜构成， 所述形成金属网状图案的步驟包括：  Preferably, in the above method, the conductive layer and the metal layer are composed of copper, and the step of forming the metal mesh pattern includes:
在所述金属层表面形成光刻胶层；  Forming a photoresist layer on the surface of the metal layer;
将印制有网格状图案的胶片覆盖在所述光刻胶层表面； 使所述光刻胶层曝光显影以形成与所述网状图案对应的图 案； 以及  Covering a surface of the photoresist layer with a film printed with a grid pattern; exposing and developing the photoresist layer to form a pattern corresponding to the mesh pattern;
对所述薄膜基材上未覆盖所述光刻胶的金属层和导电层区 域进行刻蚀以形成所述金属网状图案。  A metal layer and a conductive layer region not covering the photoresist on the film substrate are etched to form the metal mesh pattern.
优选地， 在上述方法中， 所述薄膜基材为透光率大于或等 于 87 %的塑料薄膜， 厚度为 1 ~ 500微米， 所述导电层和金属层 由单一金属或合金构成， 总厚度为 2. 5 ~ 4微米。  Preferably, in the above method, the film substrate is a plastic film having a light transmittance of 87% or more and a thickness of 1 to 500 μm, and the conductive layer and the metal layer are composed of a single metal or alloy, and the total thickness is 2. 5 ~ 4 microns.
优选地， 在上述方法中， 在形成所述金属层的步骤与形成 金属网状图案的步骤之间包含下列步骤：  Preferably, in the above method, the following steps are included between the step of forming the metal layer and the step of forming a metal mesh pattern:
使电镀有所述金属层的薄膜基材与抗氧化剂接触， 以在所 述金属层表面形成抗氧化层；  The film substrate plated with the metal layer is contacted with an antioxidant to form an oxidation resistant layer on the surface of the metal layer;
在所述薄膜基材未沉积所述导电层的表面或所述金属层上 涂覆背胶膜层； 以及  Applying a backing film layer on a surface of the film substrate on which the conductive layer is not deposited or on the metal layer;
在所述背胶膜层表面覆盖离型纸。  The release film is covered on the surface of the adhesive film layer.
本发明还有一个目的是提供一种显示设备， 其可减少电磁 辐射的泄漏。  Still another object of the present invention is to provide a display device which can reduce leakage of electromagnetic radiation.
本发明的上述目的通过下列技术方案时限：  The above object of the present invention is limited by the following technical solutions:
一种显示设备， 包含：  A display device comprising:
显示屏； 以及  Display screen;
上述电磁波屏蔽薄膜， 覆盖在所述显示屏表面。 本发明还有一个目的是提供一种电子设备， 其可减少电磁 辐射的泄漏。 The electromagnetic wave shielding film covers the surface of the display screen. It is still another object of the present invention to provide an electronic device that reduces leakage of electromagnetic radiation.
本发明的上述目的通过下列技术方案实现：  The above object of the present invention is achieved by the following technical solutions:
一种电子设备， 包含显示屏幕， 其中， 进一步包含上述电 磁波屏蔽薄膜， 覆盖在所述显示屏幕表面。  An electronic device comprising a display screen, further comprising the above-mentioned electromagnetic wave shielding film covering the surface of the display screen.
与前述现有的电磁波屏蔽薄膜及其制造方法相比， 本发明 除了具有减少电磁波屏蔽的金属耗用量和避免在金属层与 PET 膜间使用固化胶的优点以外， 还可以减少工艺步骤， 从而有效 降低工业生产成本及提高生产效率。 此外， 与现有技术相比， 本发明的金属层厚度减少到原先的 1/2至 1/3, 减少了蚀刻成网 状图案结构所需的时间， 因此有利于抑制金属蚀刻因酸洗时间 过长而产生的梯形现象。 附图简述  Compared with the foregoing conventional electromagnetic wave shielding film and the manufacturing method thereof, the present invention can reduce the process cost, and can also reduce the process steps, in addition to the advantages of reducing the metal consumption of the electromagnetic wave shielding and avoiding the use of the curing glue between the metal layer and the PET film. Effectively reduce industrial production costs and increase production efficiency. In addition, compared with the prior art, the thickness of the metal layer of the present invention is reduced to 1/2 to 1/3 of the original, which reduces the time required for etching into a mesh pattern structure, thereby facilitating suppression of metal etching due to pickling time. A trapezoidal phenomenon that is too long. BRIEF DESCRIPTION OF THE DRAWINGS
以下借助较佳实施例和附图对本发明作更为充分的阐述， 其中：  The invention will now be more fully described by means of the preferred embodiments and the accompanying drawings, in which:
图 1 为按照本发明一个较佳实施例的电磁波屏蔽薄膜的剖 面视图；  BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view showing an electromagnetic wave shielding film in accordance with a preferred embodiment of the present invention;
图 2示出了图 1所示电磁波屏蔽薄膜中的金属层的图案； 图 3a和 3b为图 1 所示电磁波屏蔽薄膜的电磁波屏蔽性能 测试结果。 具体实施方式  Fig. 2 is a view showing the pattern of the metal layer in the electromagnetic wave shielding film shown in Fig. 1. Figs. 3a and 3b are the results of electromagnetic wave shielding performance test of the electromagnetic wave shielding film shown in Fig. 1. detailed description
以下借助图 1 描述按照本发明一个较佳实施例的电磁波屏 蔽薄膜， 假设本实施例被用于屏蔽显示屏的电磁辐射。  DETAILED DESCRIPTION OF THE INVENTION An electromagnetic wave shielding film in accordance with a preferred embodiment of the present invention will now be described with reference to Fig. 1, which is assumed to be used to shield electromagnetic radiation from a display screen.
参见图 1， 电磁波屏蔽薄膜 1为一个复合层结构， 主要包含 薄膜基材 11、 位于薄膜基材 11 其中一个表面的金属网层 12、 覆盖在金属网层 12表面的抗氧化层 13、 涂覆在薄膜基材 11另 一个表面的背胶膜层 14 以及覆盖在该背胶膜层 14表面的离型 纸 15。 薄膜基材 11作为电磁波屏蔽薄膜的衬底， 起着支承金属层 和背胶膜层的作用， 此外， 当用于显示设备的显示屏时， 薄膜 基材 11应当具有足够的光学透光率， 为此可采用聚对苯二甲酸 乙二酯（PET)薄膜或其它能够达到同样性能的塑料薄膜。 比较好 的是， 塑料薄膜的透光率大于或等于 87 %， 厚度在 1 ~ 500微米 之间。 Referring to Fig. 1, the electromagnetic wave shielding film 1 is a composite layer structure mainly comprising a film substrate 11, a metal mesh layer 12 on one surface of the film substrate 11, an oxidation resistant layer 13 covering the surface of the metal mesh layer 12, and coating. The adhesive film layer 14 on the other surface of the film substrate 11 and the release paper 15 covering the surface of the adhesive film layer 14 are provided. The film substrate 11 functions as a substrate of the electromagnetic wave shielding film, and functions as a supporting metal layer and a backing film layer. Further, when used for a display screen of a display device, the film substrate 11 should have sufficient optical transmittance. For this purpose, polyethylene terephthalate (PET) films or other plastic films which achieve the same properties can be used. Preferably, the plastic film has a light transmittance of greater than or equal to 87% and a thickness of between 1 and 500 microns.
金属网层 12 形成于薄膜基材 11 的表面， 其形成方式将在 下面作详细的描述。 图 2 示出了图 1 所示电磁波屏蔽薄膜中的 金属网层 12的图案。 如图 2所示， 金属网层 12 的中间为沿不 同方向交织的金属线构成的网状区域 12a， 其中， 金属线的线径 小于或等于 30微米， 金属线之间的间距小于或等于 420微米。 网状区域由金属框 12b (图中以粗框线表示）包围。 金属网层 12 可由单一金属或合金制成， 一般而言， 当该层厚度为 2. 5 ~ 4微 米时即可满足电磁波屏蔽要求。 值得指出的是， 在本发明中， 单一金属或合金包括但不限于铜、 铝、 金、 镍和孟得尔合金（铜 镍合金）。 金属种类的选择依赖于其与薄膜基材的结合强度、 电 磁波屏蔽效果等因素。  The metal mesh layer 12 is formed on the surface of the film substrate 11, and its formation will be described in detail below. Fig. 2 shows a pattern of the metal mesh layer 12 in the electromagnetic wave shielding film shown in Fig. 1. As shown in FIG. 2, the middle of the metal mesh layer 12 is a mesh region 12a composed of metal wires interlaced in different directions, wherein the wire diameter of the metal wires is less than or equal to 30 micrometers, and the spacing between the metal wires is less than or equal to 420. Micron. The mesh area is surrounded by a metal frame 12b (indicated by a thick line in the figure). The metal mesh layer 12 can be made of a single metal or alloy. Generally, when the thickness of the layer is 2. 5 to 4 micrometers, the electromagnetic wave shielding requirement can be satisfied. It is worth noting that in the present invention, a single metal or alloy includes, but is not limited to, copper, aluminum, gold, nickel, and a Mendel alloy (copper-nickel alloy). The choice of metal type depends on factors such as the bonding strength with the film substrate, the electromagnetic wave shielding effect, and the like.
为了防止金属氧化， 在本实施例中， 例如可通过将铜抗氧 化剂涂覆在金属网层 12 上， 在金属网层 12 上形成一层抗氧化 层 13。  In order to prevent metal oxidation, in the present embodiment, an anti-oxidation layer 13 is formed on the metal mesh layer 12, for example, by coating a copper anti-oxidant on the metal mesh layer 12.
在本实施例中， 利用涂胶设备在薄膜基材 11 未形成金属层 的表面涂覆透明的一层背胶膜层 14， 而后再用离型纸 15 (例如 含硅离型纸）覆盖住背胶膜层 14。 当使用时， 揭开离型纸 15 并 将电磁波屏蔽薄膜 1涂覆有背胶膜层 14的那一面贴在显示屏的 表面（例如内表面），使得显示屏与前述网状区域相对，金属框 12a 接地。  In the present embodiment, a transparent layer of the adhesive film layer 14 is applied on the surface of the film substrate 11 where the metal layer is not formed by the gluing device, and then covered with a release paper 15 (for example, a silicon-containing release paper). Adhesive film layer 14. When in use, the release paper 15 is uncovered and the side of the electromagnetic shielding film 1 coated with the adhesive film layer 14 is attached to the surface of the display screen (for example, the inner surface) such that the display screen is opposite to the aforementioned mesh region, the metal Block 12a is grounded.
图 3a 和 3b 为按照本实施例的电磁波屏蔽薄膜的电磁波屏 蔽性能测试结果， 其中， 测试方法由中国国家标准 GB9254-98 规定， 图 3a所示的结果对应于金属网层厚度为 3. 5微米并且金 属线径为 10微米的情形， 图 3b 所示的结果对应于金属网层厚 度为 3. 5微米并且金属线径为 30微米的情形， 图中的横坐标为 频率， 纵坐标为电磁辐射强度。 如图所示， 本实施例的电磁波 屏蔽薄膜在两种线径下的电磁辐射强度都低于水平线之下， 也 即未超过国标 GB9254-98规定的电磁辐射强度。 5微米之间。 The thickness of the metal mesh layer is 3. 5 microns, the thickness of the metal mesh layer is 3. 5 microns, the thickness of the metal mesh layer is 3. 5 microns And the case where the metal wire diameter is 10 μm, the result shown in Fig. 3b corresponds to the thickness of the metal mesh layer. The case where the degree is 3.5 μm and the wire diameter is 30 μm, the abscissa in the figure is the frequency, and the ordinate is the electromagnetic radiation intensity. As shown in the figure, the electromagnetic radiation shielding film of the present embodiment has electromagnetic radiation intensity lower than the horizontal line under the two wire diameters, that is, the electromagnetic radiation intensity specified by the national standard GB9254-98 is not exceeded.
在上述实施例中， 仅在 PET 薄膜的单面形成金属网层， 为 了加强电磁波屏蔽效果， 也可在 PET 薄膜的两个表面形成金属 网层。  In the above embodiment, the metal mesh layer is formed only on one side of the PET film, and in order to enhance the electromagnetic wave shielding effect, a metal mesh layer may be formed on both surfaces of the PET film.
以下描述上述电磁波屏蔽薄膜的制造方法。  A method of manufacturing the above electromagnetic wave shielding film will be described below.
首先在步骤 1 中， 在 PET 薄膜基材表面形成导电层， 形成 方法可以采用物理气相沉积法（phys ical vapor depos i t ion)技 术， 在真空环境下以磁控溅射连续镀方式在 PET 薄膜基材表面 附着厚度小于 Ι ΟΟθΑ的铜或者锡铟合金（IT0)。 在本实施例中， 为了方便后续的光刻工艺， 这里采用金属铜层作为导电层。 为 了提高生产效率， 在真空镀时可使两卷 PET 薄膜同时向前拉伸 卷绕， 双面同步对这两卷薄膜向外的一面做单层真空磁控溅射 镀， 因此在同一时间内同步生产出两卷皆具有单面导电层的 PET 卷装薄膜。 如果要在薄膜的两个表面都形成金属网层， 可将单 卷薄膜的两面同时进行真空磁控溅射镀以形成导电层。 当电磁 波屏蔽薄膜用于显示屏时， 应保证一定的透明度， 为此可采用 透光率大于或等于 87%的透明 PET卷状薄膜， 厚度介于 1微米 ~ 500微米。  First, in step 1, a conductive layer is formed on the surface of the PET film substrate. The formation method can be performed by physical vapor deposition (physical vapor deposit ion) technique in a vacuum environment by magnetron sputtering continuous plating on the PET film substrate. The surface of the material is attached to a copper or tin indium alloy (IT0) having a thickness less than Ι ΟΟ θ 。. In this embodiment, in order to facilitate the subsequent photolithography process, a metal copper layer is used as the conductive layer. In order to improve the production efficiency, two rolls of PET film can be stretched and wound forward at the same time during vacuum plating, and the two sides of the film are subjected to single-layer vacuum magnetron sputtering on both sides of the film, so at the same time Simultaneous production of two rolls of PET roll film with a single-sided conductive layer. If a metal mesh layer is to be formed on both surfaces of the film, both sides of the single roll film may be simultaneously subjected to vacuum magnetron sputtering to form a conductive layer. When the electromagnetic shielding film is used for the display screen, a certain transparency should be ensured. For this purpose, a transparent PET roll film having a light transmittance of 87% or more can be used, and the thickness is from 1 μm to 500 μm.
接着在步骤 2中， 利用现有的连续式电解电镀工艺在步骤 1 得到的单面已有导电金属层的薄膜基材上再电镀加厚金属， 使 金属层的总厚度增加至所需的厚度， 在本实施例中该厚度为 2. 5 微米 ~ 4微米。  Then, in step 2, the thick metal is electroplated on the film substrate of the single-sided conductive metal layer obtained in step 1 by using the existing continuous electrolytic plating process, so that the total thickness of the metal layer is increased to the desired thickness. 5微米至4微米。 In this embodiment, the thickness is 2. 5 microns ~ 4 microns.
随后进入步骤 3， 使电镀后的薄膜浸入抗氧化剂溶液中以在 金属层表面形成抗氧化层。  Subsequently, the process proceeds to step 3, where the electroplated film is immersed in an antioxidant solution to form an oxidation resistant layer on the surface of the metal layer.
接着进入步骤 4， 利用涂胶设备连续在 PET薄膜基材未电镀 金属层的一面涂上透明的背胶膜层。 在步骤 5 中， 在背胶膜层 上覆盖一层含硅离型纸。 在步骤 6中， 用防水贴纸胶带封住 PET 薄膜基材覆盖离型纸的表面。 Next, proceeding to step 4, a transparent adhesive film layer is continuously coated on one side of the unplated metal layer of the PET film substrate by using a gluing device. In step 5, a layer of silicon-containing release paper is applied over the adhesive film layer. In step 6, seal the PET with waterproof sticker tape The film substrate covers the surface of the release paper.
随后， 在步骤 7 中， 在 PET薄膜基材的金属层表面涂覆厚 度约为 1 毫米左右的光阻胶。 在步骤 8 中， 以真空吸附方式使 印刷点数在 12, 000 ppi 以上的负片胶片平整地置放在曝光机玻 璃片上， 该胶片上印制有网状图案， 例如如图 2 所示的交叉及 边框图案。  Subsequently, in step 7, a photoresist of a thickness of about 1 mm is applied to the surface of the metal layer of the PET film substrate. In step 8, the negative film having a printing dot number of more than 12,000 ppi is placed on the exposure machine glass sheet by vacuum adsorption, and the film is printed with a mesh pattern, for example, as shown in FIG. Border pattern.
接着进入步骤 9 , 使用波长较短的深紫外线光源扫描光刻机 的玻璃片以实现平面曝光显影， 那些未被胶片遮挡的光阻胶内 的化学抑制剂将被深紫外线改变成一种感光剂， 这些感光剂被 显影剂冲洗后就形成与曝光所使用负片菲林相同的粗细线条的 隐形网状图案。  Then proceed to step 9, using a deep ultraviolet light source with a shorter wavelength to scan the glass sheet of the lithography machine to achieve planar exposure development, and the chemical inhibitors in the photoresist which are not blocked by the film will be changed into a sensitizer by deep ultraviolet rays. These sensitizers are washed by the developer to form an invisible mesh pattern of the same thickness as the negative film used for exposure.
随后进入步骤 10， 将经过步骤 9处理的卷装薄膜连续或切 割成单片后放进蚀刻设备中以腐蚀掉那些直接暴露铜金属的区 域， 从而形成所需的金属网状图案或图 1所示的金属网层。  Then proceeding to step 10, the package film processed in step 9 is continuously or cut into a single piece and then placed in an etching apparatus to etch away areas directly exposing the copper metal, thereby forming a desired metal mesh pattern or FIG. The metal mesh layer shown.
也可以从市场上获得表面预先形成有导电层的薄膜基材， 因此在本发明的另外一个实施例中， 步骤 1 可以省略。 这种预 先形成导电层的基材例如包括由位于中国济南的山东天诺光电 材料有限公司生产的编号为 TN-PET1- 125-35- DNC 的厚度为 125 微米的透明 PET卷状薄膜。  A film substrate having a surface on which a conductive layer is previously formed can also be obtained from the market, and therefore, in another embodiment of the present invention, step 1 can be omitted. The substrate on which the conductive layer is preliminarily formed includes, for example, a transparent PET roll film having a thickness of 125 μm, which is manufactured by Shandong Tiannuo Photoelectric Material Co., Ltd., Jinan, China, and is numbered TN-PET1-125-35-DNC.
在上述实施例的步骤 4 中， 为提高电磁波屏蔽薄膜的透明 度， 也可以用普通的丝网印刷方法在 PET 薄膜基材未电镀金属 层的一面涂覆背胶膜层， 该膜层具有与上述步骤 10蚀刻形成的 金属网状图案相同的图案， 线径与蚀刻的金属线相当甚至更细， 膜层厚度一般小于 10微米。  In step 4 of the above embodiment, in order to improve the transparency of the electromagnetic wave shielding film, a backing film layer may be coated on one side of the unplated metal layer of the PET film substrate by a common screen printing method, and the film layer has the above Step 10 etches the same pattern of metal mesh patterns formed, the wire diameter is comparable to or even finer than the etched metal lines, and the film thickness is generally less than 10 microns.
此外， 上述实施例中导电层和金属层皆由铜构成， 但是导 电层也可以采用锡铟合金（ΙΤ0)， 该合金是透明的， 因此在步骤 9中可仅腐蚀掉金属层而保留作为导电层的锡铟合金层。  In addition, in the above embodiments, the conductive layer and the metal layer are both made of copper, but the conductive layer may also be made of tin-indium alloy (ΙΤ0), which is transparent, so in step 9, only the metal layer can be etched away and remain as conductive. A layer of tin indium alloy.
本发明不论使用在显示屏（例如屏幕玻璃或柔性薄膜）的前 方或后方， 皆无碍于电磁波屏蔽的效果。 如果要求更高的屏蔽 值标准， 则可以将光学级高透光率（87%以上）的 PET膜双面都形 成金属网状图案。 具体而言， 可以利用上述步骤 1 ~ 3在 PET薄 膜的两个表面都形成金属铜层， 然后利用上述步骤 7 ~ 10 形成 金属网状图案， 最后利用上述步骤 4 和 5 在其中一个金属网状 图案上形成背胶层和离型纸。 The present invention does not interfere with the effect of electromagnetic wave shielding regardless of whether it is used in front of or behind the display screen (for example, a screen glass or a flexible film). If a higher shielding value standard is required, the PET film with high optical transmittance (87% or more) can be formed on both sides. Metal mesh pattern. Specifically, a metal copper layer may be formed on both surfaces of the PET film by using the above steps 1 to 3, and then a metal mesh pattern is formed by using the above steps 7 to 10, and finally one of the metal meshes is used in the above steps 4 and 5. A backing layer and a release paper are formed on the pattern.
由上可见， 在本发明中， 薄膜基材表面由于形成导电层， 因此可利用电镀工艺而避免使用任何胶黏性固化剂将金属层与 薄膜衬底粘合在一起， 有利于减少有机物的挥发。 此外， 不需 使用胶黏性固化剂还提高了电磁波屏蔽薄膜的透明度， 因此可 以降低对 PET 薄膜光学透光率的要求。 例如本发明不一定要使 用透光率 92%以上的 PET薄膜膜而只需使用 87 - 87%透光率的光 学级 PET薄膜即可满足透明度的要求。  As can be seen from the above, in the present invention, since the surface of the film substrate is formed by a conductive layer, the plating process can be used to avoid bonding any metal layer and the film substrate by using any adhesive curing agent, which is advantageous for reducing the volatilization of organic substances. . In addition, the transparency of the electromagnetic shielding film is improved without the use of an adhesive curing agent, so that the optical transmittance of the PET film can be lowered. For example, the present invention does not have to use a PET film film having a light transmittance of 92% or more, and it is only required to use an optical grade PET film having a light transmittance of 87 - 87% to satisfy the transparency requirement.
以下描述按照本发明的电磁波屏蔽薄膜的应用。  The application of the electromagnetic wave shielding film according to the present invention will be described below.
对于等离子屏幕（Plasma Di splay)、 液晶屏幕（TFT- LCD Display)、 有机发光二极管显示器（Organic Light Emi t t ing Display)或者其它带显示屏幕的电器及电子类产品来说， 一方 面会电磁辐射会透过屏幕泄漏出来， 另一方面还会在屏幕表面 形成静电荷， 由此导致灰尘被吸附在表面。 但是目前全球范围 内所使用的电子及电器产品中， 特别是与现代人类日常生活及 工作分不开的计算机屏幕窗口表面， 包括笔记型计算机、 液晶 显示屏、 等离子显示屏及手机屏幕窗口表面等 各种电子设备及 产品与人类日常作习做近距离接触的屏幕表面却并无任何静电 吸附及释放应做的安全设计。  For Plasma Di splay, TFT-LCD Display, Organic Light Emi tt ing Display or other electrical and electronic products with display screens, on the one hand, electromagnetic radiation will Leaking through the screen, on the other hand, forms an electrostatic charge on the surface of the screen, which causes dust to be adsorbed on the surface. However, the electronic and electrical products used in the world, especially the surface of computer screen windows that are inseparable from the daily life and work of modern humans, include notebook computers, liquid crystal displays, plasma display screens, and mobile phone screen window surfaces. The screen surface of various electronic devices and products that are in close contact with human daily practice does not have any safety design for electrostatic adsorption and release.
为解决上述问题， 可在电器或电子类产品的屏幕表面覆盖 一层按照本发明的电磁波屏蔽薄膜。 具体而言， 可在本发明的 电磁波屏蔽薄膜表面 （例如整个表面或靠近四周的区域） 形成 胶粘剂材料， 并用离型膜覆盖。 当要覆盖住屏幕表面时， 只要 撕掉离型膜， 然后将其形成胶粘剂材料的表面贴覆在屏幕即可。  In order to solve the above problems, an electromagnetic wave shielding film according to the present invention may be coated on the screen surface of an electric or electronic product. Specifically, an adhesive material may be formed on the surface of the electromagnetic wave shielding film of the present invention (e.g., the entire surface or a region close to the periphery) and covered with a release film. When you want to cover the surface of the screen, just peel off the release film and then attach the surface of the adhesive material to the screen.
由于本发明的电磁波屏蔽薄膜包含金属网层结构， 因此可 有效阻止电磁辐射的泄漏。 与此同时， 可以随时将静电释放笔 之类的导体与金属网层的任何一个位置触碰连接， 从而使积累 在屏幕表面的静电快速释放。 Since the electromagnetic wave shielding film of the present invention contains a metal mesh layer structure, leakage of electromagnetic radiation can be effectively prevented. At the same time, the conductor such as the electrostatic discharge pen can be touched and connected to any position of the metal mesh layer at any time, thereby accumulating The static electricity on the surface of the screen is quickly released.
以上借助具体实施例对本发明作了描述， 但是应当理解的 是， 对于本领域内的普通技术人员而言， 在阅读上述说明书描 述的基础上， 无需创造性的劳动即可在不偏离本发明精神和实 质的前提下， 就上述实例作出各种变化和修改， 因此本发明的 保护范围由所附权利要求限定。  The present invention has been described above by way of specific embodiments, but it should be understood that those skilled in the art, without departing from the scope of the invention, Various changes and modifications are possible in the above examples, and the scope of the invention is defined by the appended claims.

Claims

权 利 要 求 Rights request
1、 一种电磁波屏蔽薄膜， 其特征在于， 包含： An electromagnetic wave shielding film, comprising:
薄膜基材； 以及  Film substrate;
位于所述薄膜基材至少一个表面的金属网层。  a metal mesh layer on at least one surface of the film substrate.
2、 如权利要求 1 所述的电磁波屏蔽薄膜， 其中， 所述薄膜 基材为透光率大于或等于 87 %的塑料薄膜， 厚度为 1 ~ 500微 米。  The electromagnetic wave shielding film according to claim 1, wherein the film substrate is a plastic film having a light transmittance of 87% or more and a thickness of 1 to 500 μm.
3、 如权利要求 1 所述的电磁波屏蔽薄膜， 其中， 所述金属 网层由单一金属或合金制成， 厚度为 2. 5 - 4微米， 并且表面覆 盖有抗氧化层。  The electromagnetic wave shielding film according to claim 1, wherein the metal mesh layer is made of a single metal or alloy, has a thickness of 2.5 - 4 μm, and is coated with an oxidation resistant layer.
4、 如权利要求 1 所述的电磁波屏蔽薄膜， 其中， 进一步包 含涂覆在所述薄膜基材一个表面或所述金属层上的背胶膜层和 覆盖在该背胶膜层表面的离型纸。  4. The electromagnetic wave shielding film according to claim 1, further comprising a backing film layer coated on one surface of the film substrate or the metal layer and a release film covering the surface of the backing film layer paper.
5、 一种显示设备， 其特征在于， 包含：  5. A display device, comprising:
显示屏； 以及  Display screen;
如权利要求 1 - 4 中任意一项所述的电磁波屏蔽薄膜， 覆盖 在所述显示屏表面。  The electromagnetic wave shielding film according to any one of claims 1 to 4, covering the surface of the display screen.
6、 一种电子设备， 包含显示屏幕， 其特征在于， 进一步包 含如权利要求 1 - 4 中任意一项所述的电磁波屏蔽薄膜， 覆盖在 所述显示屏幕表面。  An electronic device comprising a display screen, characterized by further comprising the electromagnetic wave shielding film according to any one of claims 1 to 4, covering the surface of the display screen.
7、 一种制造电磁波屏蔽薄膜的方法， 其特征在于， 包含以 下步骤：  7. A method of manufacturing an electromagnetic wave shielding film, comprising the steps of:
利用物理气相沉积法在薄膜基材表面形成导电层；  Forming a conductive layer on the surface of the film substrate by physical vapor deposition;
利用电镀工艺在所述导电层上形成金属层； 以及  Forming a metal layer on the conductive layer using an electroplating process;
以光刻工艺在所述薄膜基材上形成金属网状图案。  A metal mesh pattern is formed on the film substrate by a photolithography process.
8、 一种制造电磁波屏蔽薄膜的方法， 其特征在于， 包含以 下步骤：  8. A method of manufacturing an electromagnetic wave shielding film, comprising the steps of:
利用电镀工艺在表面沉积有导电层的薄膜基材上形成金属 层； 以及 以光刻工艺在所述薄膜基材上形成金属网状图案。 Forming a metal layer on the film substrate having the conductive layer deposited on the surface by an electroplating process; A metal mesh pattern is formed on the film substrate by a photolithography process.
9、 如权利要求 7或 8所述的方法， 其中， 所述形成金属网 状图案的步骤包括：  9. The method according to claim 7 or 8, wherein the step of forming a metal mesh pattern comprises:
在所述金属层表面形成光刻胶层；  Forming a photoresist layer on the surface of the metal layer;
将印制有网状图案的胶片覆盖在所述光刻胶层表面； 使所述光刻胶层曝光显影以形成与所述网状图案对应的图 案； 以及  Covering a surface of the photoresist layer with a film printed with a mesh pattern; exposing and developing the photoresist layer to form a pattern corresponding to the mesh pattern;
对所述薄膜基材上未覆盖所述光刻胶的金属层区域进行刻 蚀以形成所述金属网状图案。  A region of the metal layer on the film substrate that does not cover the photoresist is etched to form the metal mesh pattern.
10、 如权利要求 7 或 8 所述的方法， 其中， 所述薄膜基材 为透光率大于或等于 87 %的塑料薄膜， 厚度为 1 - 500微米， 所 述导电层和金属层由单一金属或合金构成， 总厚度为 2. 5 ~ 4微 米。  The method according to claim 7 or 8, wherein the film substrate is a plastic film having a light transmittance of 87% or more, a thickness of 1 - 500 μm, and the conductive layer and the metal layer are made of a single metal. 5至四微米。 The total thickness is 2. 5 ~ 4 microns.
11、 如权利要求 7 或 8 所述的方法， 其中， 在形成金属层 与形成金属网状图案的步骤之间包含下列步骤：  The method according to claim 7 or 8, wherein the step of forming the metal layer and forming the metal mesh pattern comprises the following steps:
使电镀有所述金属层的薄膜基材与抗氧化剂接触， 以在所 述金属层表面形成抗氧化层；  The film substrate plated with the metal layer is contacted with an antioxidant to form an oxidation resistant layer on the surface of the metal layer;
在所述薄膜基材未沉积所述导电层的表面或所述导电层上 涂覆背胶膜层； 以及  Coating a surface of the conductive layer on the surface of the film substrate or coating the conductive layer; and
在所述背胶膜层表面覆盖离型纸。  The release film is covered on the surface of the adhesive film layer.
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