CN206932465U - A kind of porous heat dissipation type circuit board - Google Patents
A kind of porous heat dissipation type circuit board Download PDFInfo
- Publication number
- CN206932465U CN206932465U CN201720563015.8U CN201720563015U CN206932465U CN 206932465 U CN206932465 U CN 206932465U CN 201720563015 U CN201720563015 U CN 201720563015U CN 206932465 U CN206932465 U CN 206932465U
- Authority
- CN
- China
- Prior art keywords
- substrate
- conductive layer
- heat dissipation
- circuit board
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a kind of porous heat dissipation type circuit board, including substrate, heat dissipation cavity is provided with the middle part of the substrate, the substrate both sides are provided with square heat emission hole, the substrate upper end is provided with Upper conductive layer, the Upper conductive layer upper end is provided with upper-layer insulation film, the substrate lower end is provided with underlying conductive layer, the underlying conductive layer lower end is provided with underlying insulating layer, the substrate corner is provided with guide hole, the substrate surrounding is provided with installation fixing hole, the Upper conductive layer and the underlying conductive layer surface are provided with pad, via is provided with the middle part of the pad, arc heat emission hole is provided with around the pad, the utility model is simple in construction, the square heat emission hole is set, the heat dissipation cavity, the arc heat emission hole, form inner ventilation road, radiated using porous venting, improve the heat dispersion of device.
Description
Technical field
Circuit board technology field is the utility model is related to, specially a kind of porous heat dissipation type circuit board.
Background technology
The title of circuit board has：Wiring board, pcb board, aluminium base, high frequency plate, thick copper coin, impedance plate, PCB, ultra-thin circuit
Plate, ultrathin circuit board, printing (copper lithographic technique) circuit board etc..Circuit board is mainly by pad, via, mounting hole, wire, first device
Part, connector, filling, electrical boundary etc. form.Current circuit board is solid plate, can only carry out external cooling, can not realize
Inner ventilation radiates, and heat dispersion is undesirable, and easily the service behaviour of circuit board is impacted.
Utility model content
The purpose of this utility model is to provide a kind of porous heat dissipation type circuit board, simple in construction, sets described square scattered
Hot hole, the heat dissipation cavity, the arc heat emission hole, inner ventilation road is formed, is radiated using porous venting, improves the radiating of device
Performance.
To achieve the above object, the utility model provides following technical scheme：A kind of porous heat dissipation type circuit board, including base
Plate, the substrate middle part are provided with heat dissipation cavity, and the substrate both sides are provided with square heat emission hole, and the substrate upper end is provided with
Layer conductive layer, the Upper conductive layer upper end are provided with upper-layer insulation film, and the substrate lower end is provided with underlying conductive layer, described
Underlying conductive layer lower end is provided with underlying insulating layer, and the substrate corner is provided with guide hole, and the substrate surrounding is provided with installation
Fixing hole, the Upper conductive layer and the underlying conductive layer surface are provided with pad, are provided with via in the middle part of the pad, institute
State and arc heat emission hole is provided with around pad.
Preferably, the substrate is made of resin plastic, punching press, and the heat dissipation cavity is when the substrate punching press is made one
Body chemical conversion type, the square heat emission hole is molded over the substrate both sides by mach mode, and is connected with the heat dissipation cavity
It is logical.
Preferably, the Upper conductive layer is molded over the substrate upper end, the upper-layer insulation film by way of lamination
The Upper conductive layer upper end is molded over by way of lamination.
Preferably, the underlying conductive layer is molded over the substrate lower end, the underlying insulating layer by way of lamination
The underlying conductive layer lower end is molded over by way of lamination.
Preferably, the guide hole is molded over the substrate corner by mach mode, and the installation fixing hole passes through
Mach mode is molded over the substrate surrounding.
Preferably, the pad is molded over the Upper conductive layer and the underlying conductive layer table by way of corrosion
Face, the via is molded in the middle part of the pad by mach mode, and penetrates the substrate, and the arc heat emission hole leads to
Cross mach mode to be molded over around the pad, and be connected with the heat dissipation cavity.
Compared with prior art, the beneficial effects of the utility model are as follows：
The utility model is simple in construction, sets the square heat emission hole, the heat dissipation cavity, the arc heat emission hole, forms
Inner ventilation road, is radiated using porous venting, improves the heat dispersion of device.
Brief description of the drawings
Fig. 1 is stereogram of the present utility model；
Fig. 2 is section enlarged diagram of the present utility model；
Fig. 3 is close-up schematic view of the present utility model.
In figure：1-substrate, 2-guide hole, 3-installation fixing hole, 4-pad, 5-square heat emission hole, the insulation of 6-upper strata
Layer, 7-Upper conductive layer, 8-heat dissipation cavity, 9-underlying insulating layer, 10-underlying conductive layer, 11-arc heat emission hole, 12-mistake
Hole.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Fig. 1-3 are referred to, the utility model provides a kind of technical scheme：A kind of porous heat dissipation type circuit board, including substrate
1, the middle part of substrate 1 is provided with heat dissipation cavity 8, and the both sides of substrate 1 are provided with square heat emission hole 5, and the upper end of substrate 1 is provided with Upper conductive layer
7, the upper end of Upper conductive layer 7 is provided with upper-layer insulation film 6, and the lower end of substrate 1 is provided with underlying conductive layer 10, under underlying conductive layer 10
End is provided with underlying insulating layer 9, and 1 four jiaos of substrate is provided with guide hole 2, and the surrounding of substrate 1 is provided with installation fixing hole 3, Upper conductive
Layer 7 and the surface of underlying conductive layer 10 are provided with pad 4, and the middle part of pad 4 is provided with via 12, and being provided with arc around pad 4 dissipates
Hot hole 11.
Preferably, substrate 1 is made of resin plastic, punching press, the integrated molding when the punching press of substrate 1 is made of heat dissipation cavity 8,
Square heat emission hole 5 is molded over the both sides of substrate 1 by mach mode, and is connected with heat dissipation cavity 8, and Upper conductive layer 7 passes through
The mode of lamination is molded over the upper end of substrate 1, and upper-layer insulation film 6 is molded over the upper end of Upper conductive layer 7, lower floor by way of lamination
Conductive layer 10 is molded over the lower end of substrate 1 by way of lamination, and underlying insulating layer 9 is molded over underlying conductive by way of lamination
10 lower end of layer, guide hole 2 are molded over 1 four jiaos of substrate by mach mode, and installation fixing hole 3 is molded by mach mode
In the surrounding of substrate 1, pad 4 is molded over Upper conductive layer 7 and the surface of underlying conductive layer 10 by way of corrosion, and via 12 passes through
Mach mode is molded over the middle part of pad 4, and penetrates substrate 1, and arc heat emission hole 11 is molded over weldering by mach mode
Around disk 4, and it is connected with heat dissipation cavity 8.
Operation principle：A kind of porous heat dissipation type circuit board, substrate 1 are made of resin plastic, punching press, heat dissipation cavity 8 and base
The integrated molding of plate 1, heat dissipation cavity 8 are internal cavities, provide possibility for heat dissipation ventilation, square heat emission hole 5 is connected with heat dissipation cavity 8
It is logical, the heat dissipation ventilation wind path of horizontal direction is formed, the ventilation and heat of horizontal direction can be realized, improve heat dispersion, arc
Heat emission hole 11 is connected with heat dissipation cavity 8, forms the heat dissipation ventilation wind path of vertical direction, can realize that the ventilation of vertical direction dissipates
Heat, heat dispersion is improved, realize the radiating in dual direction, good heat dissipation effect, be favorably improved the service behaviour of device.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from principle of the present utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of porous heat dissipation type circuit board, including substrate (1), it is characterised in that：Heat dissipation cavity is provided with the middle part of the substrate (1)
(8), substrate (1) both sides are provided with square heat emission hole (5), and substrate (1) upper end is provided with Upper conductive layer (7), institute
State Upper conductive layer (7) upper end and be provided with upper-layer insulation film (6), substrate (1) lower end is provided with underlying conductive layer (10), institute
State underlying conductive layer (10) lower end and be provided with underlying insulating layer (9), substrate (1) corner is provided with guide hole (2), the substrate
(1) surrounding is provided with installation fixing hole (3), and the Upper conductive layer (7) and the underlying conductive layer (10) surface are provided with weldering
Disk (4), pad (4) middle part are provided with via (12), arc heat emission hole (11) are provided with around the pad (4).
A kind of 2. porous heat dissipation type circuit board according to claim 1, it is characterised in that：The substrate (1) uses resin
Plasticity, punching press are made, the heat dissipation cavity (8) integrated molding, square heat emission hole when the substrate (1) punching press is made
(5) substrate (1) both sides are molded over by mach mode, and be connected with the heat dissipation cavity (8).
A kind of 3. porous heat dissipation type circuit board according to claim 1, it is characterised in that：The Upper conductive layer (7) is logical
The mode for crossing lamination is molded over the substrate (1) upper end, and the upper-layer insulation film (6) is molded on described by way of lamination
Layer conductive layer (7) upper end.
A kind of 4. porous heat dissipation type circuit board according to claim 1, it is characterised in that：The underlying conductive layer (10) is logical
The mode for crossing lamination is molded over the substrate (1) lower end, the underlying insulating layer (9) be molded over by way of lamination it is described under
Layer conductive layer (10) lower end.
A kind of 5. porous heat dissipation type circuit board according to claim 1, it is characterised in that：The guide hole (2) is added by machine
The mode of work is molded over the substrate (1) corner, and the installation fixing hole (3) is molded over the substrate by mach mode
(1) surrounding.
A kind of 6. porous heat dissipation type circuit board according to claim 1, it is characterised in that：The pad (4) passes through corrosion
Mode be molded over the Upper conductive layer (7) and the underlying conductive layer (10) surface, the via (12) passes through machining
Mode be molded in the middle part of the pad (4), and penetrate the substrate (1), the arc heat emission hole (11) is by mach
Mode is molded over around the pad (4), and is connected with the heat dissipation cavity (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720563015.8U CN206932465U (en) | 2017-05-19 | 2017-05-19 | A kind of porous heat dissipation type circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720563015.8U CN206932465U (en) | 2017-05-19 | 2017-05-19 | A kind of porous heat dissipation type circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206932465U true CN206932465U (en) | 2018-01-26 |
Family
ID=61352431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720563015.8U Expired - Fee Related CN206932465U (en) | 2017-05-19 | 2017-05-19 | A kind of porous heat dissipation type circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206932465U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225891A (en) * | 2020-01-21 | 2021-08-06 | 鹏鼎控股(深圳)股份有限公司 | Circuit board with heat dissipation structure and manufacturing method thereof |
-
2017
- 2017-05-19 CN CN201720563015.8U patent/CN206932465U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225891A (en) * | 2020-01-21 | 2021-08-06 | 鹏鼎控股(深圳)股份有限公司 | Circuit board with heat dissipation structure and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203289746U (en) | Copper substrate structure with direct radiating copper-based boss | |
| CN202977519U (en) | Electric appliance element substrate with high heat transfer efficiency | |
| CN206932465U (en) | A kind of porous heat dissipation type circuit board | |
| CN203167514U (en) | Integrated circuit integrated structure | |
| CN202889779U (en) | Single side printed wiring board with superelevation heat-conducting property | |
| CN204046918U (en) | One heat dissipation type circuit board | |
| CN204887685U (en) | Printed circuit board and terminal with heat radiation structure | |
| CN103199068A (en) | Integration circuit integrated structure | |
| CN206365131U (en) | A kind of circuit board of quick heat radiating | |
| CN207369392U (en) | A kind of folder paper tinsel base circuit board with heat sink material | |
| CN107683016A (en) | A kind of quick heat radiating PCB | |
| CN210379021U (en) | Battery protection board | |
| CN206932463U (en) | A kind of high-temp resistant type circuit board | |
| CN207766643U (en) | A kind of high-speed high frequency circuit board with SHD figure layers | |
| CN205051965U (en) | Compound heat conduction circuit board | |
| CN207382669U (en) | A kind of double-sided PCB board with radiator structure | |
| CN204578883U (en) | Novel flexible wiring board | |
| CN206490896U (en) | A kind of novel circuit board | |
| CN205202355U (en) | Copper base copper -clad plate of ceramic film structure | |
| CN206042505U (en) | Novel PCB (printed circuit board) | |
| CN206932466U (en) | A kind of antistatic formula circuit board | |
| CN206575656U (en) | Concentrate heat radiating type reinforced circuit board | |
| CN206879209U (en) | A kind of 4G network lines plate | |
| CN203340419U (en) | Flexible circuit board | |
| CN207617230U (en) | A kind of copper-clad plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180126 Termination date: 20200519 |