CN207369392U - A kind of folder paper tinsel base circuit board with heat sink material - Google Patents
A kind of folder paper tinsel base circuit board with heat sink material Download PDFInfo
- Publication number
- CN207369392U CN207369392U CN201721300343.5U CN201721300343U CN207369392U CN 207369392 U CN207369392 U CN 207369392U CN 201721300343 U CN201721300343 U CN 201721300343U CN 207369392 U CN207369392 U CN 207369392U
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- CN
- China
- Prior art keywords
- heat dissipation
- heat
- circuit board
- basic unit
- paper tinsel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of folder paper tinsel base circuit board with heat sink material, including heat dissipation metal basic unit, heat dissipation metal basic unit top is provided with thermal column, and heat dissipation metal basic unit top is connected with insulating heat-conductive rubber layer, heat dissipation metal basic unit inner upper end is provided with heat dissipation card slot, and it is connected with insulating heat-conductive rubber layer above heat dissipation card slot, graphite radiating column is installed inside the heat dissipation card slot, and graphite radiating top end is connected with insulating heat-conductive rubber layer, the insulating heat-conductive rubber layer top is provided with copper-foil conducting electricity line layer.The folder paper tinsel base circuit board with heat sink material increases heat transfer and heat dissipation area, and it can be radiated by multiple material and mode, improve heat transfer and the radiating efficiency of this folder paper tinsel base circuit board with heat sink material, avoid the circuit on wiring board from operating is influenced be subject to high temperature, the damage of the folder paper tinsel base circuit board with heat sink material is reduced, extends the service life of this folder paper tinsel base circuit board with heat sink material.
Description
Technical field
Technical field of environment protection equipment is the utility model is related to, is specially a kind of folder paper tinsel base circuit board with heat sink material.
Background technology
The title of circuit board has：Wiring board, pcb board, aluminum substrate, high frequency plate, PCB, ultra-thin wiring board, ultrathin circuit board and
Printing（Copper lithographic technique）Circuit board etc., circuit board make circuit miniaturization, directly perceivedization, batch production for permanent circuit and excellent
Change electrical appliance layout to play an important role.
Common folder paper tinsel base circuit board exists not comprising there is heat sink material, and heat dissipation performance is not high, the slow situation of heat transfer rate.
Utility model content
The purpose of this utility model is to provide a kind of folder paper tinsel base circuit board with heat sink material, to solve above-mentioned background skill
The common folder paper tinsel base circuit board proposed in art exists not comprising there is heat sink material, and heat dissipation performance is not high, and heat transfer rate is slow to ask
Topic.
To achieve the above object, the utility model provides following technical solution：A kind of folder paper tinsel baseline road with heat sink material
Plate, including heat dissipation metal basic unit, heat dissipation metal basic unit top is provided with thermal column, and heat dissipation metal basic unit top is connected with
Insulating heat-conductive rubber layer, heat dissipation metal basic unit inner upper end are provided with heat dissipation card slot, and are connected with absolutely above the card slot that radiates
Edge heat conductive rubber layer, is provided with graphite radiating column inside the heat dissipation card slot, and graphite radiating top end is connected with insulating heat-conductive
Rubber layer, the insulating heat-conductive rubber layer top are provided with copper-foil conducting electricity line layer.
Preferably, the insulating heat-conductive rubber layer by pressing with heat dissipation metal basic unit, thermal column and graphite radiating column without
Seam fitting.
Preferably, the heat dissipation metal base width is equal to heat dissipation card slot width, and heat dissipation metal basic unit bottom is bumps
Shape structure.
Preferably, the thermal column is truncated cone-shaped structure, and heat dissipation metal substrate surface is evenly distributed with least two heat dissipation
Column.
Preferably, the diameter of the graphite radiating column is equal to heat dissipation card slot width, and the height of radiate card slot and thermal column
The sum of be equal to graphite radiating column radius.
Compared with prior art, the beneficial effects of the utility model are：The folder paper tinsel base circuit board increase with heat sink material
Heat transfer and heat dissipation area, and can be radiated by multiple material and mode, improve this folder paper tinsel baseline with heat sink material
The heat transfer of road plate and radiating efficiency, avoid the circuit on wiring board from operating is influenced be subject to high temperature, reduces the folder with heat sink material
The damage of paper tinsel base circuit board, extends the service life of this folder paper tinsel base circuit board with heat sink material.This folder paper tinsel with heat sink material
The heat dissipation metal basic unit bottom of base circuit board is concave/convex-shaped structure, increases the heat dissipation area of this wiring board, improves this wiring board
Radiating efficiency, this with heat sink material folder paper tinsel base circuit board graphite radiating column diameter be equal to heat dissipation card slot width, heat dissipation
The sum of height of card slot and thermal column is equal to the radius of graphite radiating column so that graphite radiating column can just be stuck in heat dissipation card slot
Internal and graphite radiating column, there are gap, increase and the contact area of air, improves heat dissipation effect with heat dissipation card slot.
Brief description of the drawings
Fig. 1 is the utility model main structure diagram；
Fig. 2 is the utility model heat dissipation metal basic unit overlooking the structure diagram.
In figure：1st, copper-foil conducting electricity line layer, 2, insulating heat-conductive rubber layer, 3, heat dissipation metal basic unit, 4, thermal column, 5, graphite
Thermal column, 6, heat dissipation card slot.
Embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained, shall fall within the protection scope of the present invention.
- 2 are please referred to Fig.1, the utility model provides a kind of technical solution：A kind of folder paper tinsel base circuit board with heat sink material,
Including heat dissipation metal basic unit 3,3 top of heat dissipation metal basic unit is provided with thermal column 4, and 3 top of heat dissipation metal basic unit is connected with absolutely
Edge heat conductive rubber layer 2,3 width of heat dissipation metal basic unit is equal to heat dissipation 6 width of card slot, and 3 bottom of heat dissipation metal basic unit is concavo-convex
Structure, this structure cause the area of 3 bottom of heat dissipation metal basic unit and air contact to increase, can preferably transfer heat to sky
So as to distribute among gas, and 3 width of heat dissipation metal basic unit is equal to heat dissipation 6 width of card slot and make it that heat dissipation card slot 6 is through hole knot
Structure, heat dissipation card slot 6 rear and front end will not stop by heat dissipation metal basic unit 3, and thermal column 4 is truncated cone-shaped structure, and heat dissipation metal base
3 surface of layer are evenly distributed with least 20 thermal columns 4, this structure causes heat dissipation metal basic unit 3 to increase and insulate by thermal column 4
Contact area between heat conductive rubber layer 2, improves heat transfer efficiency, faster to radiate, inside heat dissipation metal basic unit 3
Upper end is provided with heat dissipation card slot 6, and the top of card slot 6 of radiating is connected with insulating heat-conductive rubber layer 2, and insulating heat-conductive rubber layer 2 passes through
Pressing is seamless applying with heat dissipation metal basic unit 3, thermal column 4 and graphite radiating column 5, because graphite radiating column 5 is with good scattered
Also possessing while hot has good electric conductivity, to prevent graphite radiating column 5 from producing electric current on copper-foil conducting electricity line layer 1
Circuit impacts, thus insulating heat-conductive rubber layer 2 pass through it is seamless with heat dissipation metal basic unit 3, thermal column 4 and graphite radiating column 5
It is bonded to completely cut off the electric current of three's generation, and the surface contacted with three can be transferred heat to, improves heat-transfer rate, heat dissipation
Graphite radiating column 5 is installed, and 5 top of graphite radiating column is connected with insulating heat-conductive rubber layer 2, graphite radiating column 5 inside card slot 6
Diameter be equal to heat dissipation 6 width of card slot, and the sum of height of radiate card slot 6 and thermal column 4 is equal to the radius of graphite radiating column 5,
This structure to form gap between cylindric graphite radiating column 5 and the heat dissipation card slot 6 of quadrangular shape, facilitates graphite radiating column 5
Heat is directly delivered in air, and increases heat dissipation metal basic unit 3 and air contact area, to improve radiating rate, absolutely
2 top of edge heat conductive rubber layer is provided with copper-foil conducting electricity line layer 1.
Operation principle：When using the folder paper tinsel base circuit board with heat sink material, this folder paper tinsel with heat sink material is first checked
Base circuit board whether there is it is damaged, dirty, cracking situations such as, begin to use if all are intact, completed on copper-foil conducting electricity line layer 1
After circuit connection, circuit can produce heat when running, and there is insulating heat-conductive rubber layer 2 insulating properties can prevent with conductive
Electric current in heat dissipation metal basic unit 3, thermal column 4 and graphite radiating column 5 influences circuit running, and the insulating heat-conductive with thermal conductivity
The heat transfer that rubber layer 2 produces circuit on copper-foil conducting electricity line layer 1 is to heat dissipation metal basic unit 3, thermal column 4 and graphite radiating
In column 5, insulating heat-conductive rubber layer 2 increases the heat transfer area with heat dissipation metal basic unit 3 by thermal column 4, improves heat transfer rate, and
Graphite radiating column 5 with high-cooling property product after the heat of the transmission of insulating heat-conductive rubber layer 2 is received can be dissipated by graphite
Gap between plume 5 and heat dissipation card slot 6 distributes heat in air, and heat dissipation metal basic unit 3 is receiving insulating heat-conductive
After rubber layer 2 and thermal column 4, heat is given out by the concave/convex-shaped structure increase and the contact area of air of themselves bottom
Go, so as to complete a series of activities.
Although the utility model is described in detail with reference to the foregoing embodiments, come for those skilled in the art
Say, it can still modify the technical solution described in foregoing embodiments, or to which part technical characteristic into
Row equivalent substitution, where within the spirit and principles of the present invention, any modification, equivalent replacement, improvement and so on should all
It is included within the scope of protection of this utility model.
Claims (5)
1. a kind of folder paper tinsel base circuit board with heat sink material, including heat dissipation metal basic unit（3）, it is characterised in that：The metal dissipates
Hot radical layer（3）Top is provided with thermal column（4）, and heat dissipation metal basic unit（3）Top is connected with insulating heat-conductive rubber layer（2）, institute
State heat dissipation metal basic unit（3）Inner upper end is provided with heat dissipation card slot（6）, and the card slot that radiates（6）Top is connected with insulating heat-conductive rubber
Glue-line（2）, the heat dissipation card slot（6）Inside is provided with graphite radiating column（5）, and graphite radiating column（5）Top is connected with insulation
Heat conductive rubber layer（2）, the insulating heat-conductive rubber layer（2）Top is provided with copper-foil conducting electricity line layer（1）.
A kind of 2. folder paper tinsel base circuit board with heat sink material according to claim 1, it is characterised in that：The insulating heat-conductive
Rubber layer（2）Pass through pressing and heat dissipation metal basic unit（3）, thermal column（4）With graphite radiating column（5）It is seamless applying.
A kind of 3. folder paper tinsel base circuit board with heat sink material according to claim 1, it is characterised in that：The heat dissipation metal
Basic unit（3）Width is equal to heat dissipation card slot（6）Width, and heat dissipation metal basic unit（3）Bottom is concave/convex-shaped structure.
A kind of 4. folder paper tinsel base circuit board with heat sink material according to claim 1, it is characterised in that：The thermal column
（4）For truncated cone-shaped structure, and heat dissipation metal basic unit（3）Surface is evenly distributed with least 20 thermal columns（4）.
A kind of 5. folder paper tinsel base circuit board with heat sink material according to claim 1, it is characterised in that：The graphite radiating
Column（5）Diameter be equal to heat dissipation card slot（6）Width, and the card slot that radiates（6）And thermal column（4）The sum of height be equal to graphite radiating
Column（5）Radius.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721300343.5U CN207369392U (en) | 2017-10-10 | 2017-10-10 | A kind of folder paper tinsel base circuit board with heat sink material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721300343.5U CN207369392U (en) | 2017-10-10 | 2017-10-10 | A kind of folder paper tinsel base circuit board with heat sink material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207369392U true CN207369392U (en) | 2018-05-15 |
Family
ID=62346870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721300343.5U Expired - Fee Related CN207369392U (en) | 2017-10-10 | 2017-10-10 | A kind of folder paper tinsel base circuit board with heat sink material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207369392U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111452454A (en) * | 2020-05-26 | 2020-07-28 | 上海禾技实业有限公司 | Metal-based copper-clad laminate and preparation method thereof |
| CN113923855A (en) * | 2021-10-29 | 2022-01-11 | 苏州浪潮智能科技有限公司 | Circuit board |
-
2017
- 2017-10-10 CN CN201721300343.5U patent/CN207369392U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111452454A (en) * | 2020-05-26 | 2020-07-28 | 上海禾技实业有限公司 | Metal-based copper-clad laminate and preparation method thereof |
| CN113923855A (en) * | 2021-10-29 | 2022-01-11 | 苏州浪潮智能科技有限公司 | Circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180515 Termination date: 20181010 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |