CN206490896U - A kind of novel circuit board - Google Patents
A kind of novel circuit board Download PDFInfo
- Publication number
- CN206490896U CN206490896U CN201720242368.8U CN201720242368U CN206490896U CN 206490896 U CN206490896 U CN 206490896U CN 201720242368 U CN201720242368 U CN 201720242368U CN 206490896 U CN206490896 U CN 206490896U
- Authority
- CN
- China
- Prior art keywords
- plate body
- layer
- copper
- heat dissipating
- based surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of novel circuit board, including plate body, described plate body is by epoxy coating, copper-based surface layer and ceramic substrate layer are composited, described epoxy coating is located at the top of the copper-based surface layer, described ceramic substrate layer is located at the lower section of described copper-based surface layer, several through holes are provided with described plate body, heat dissipating layer is provided with described plate body, the center section of described heat dissipating layer is respectively placed in epoxy coating, in copper-based surface layer and ceramic substrate layer, the both sides of described heat dissipating layer are through described copper-based surface layer and extend on the both sides of the plate body and the surface of several through holes, described heat dissipating layer is made up of grapheme material, the utility model is used as the primary structure radiated in plate body using grapheme material, the radiating effect and toughness of plate body is set to get a promotion.
Description
Technical field
The utility model is related to a kind of wiring board, especially a kind of novel circuit board.
Background technology
At present, the radiating effect of most wiring boards is poor, and the heat energy that wiring board is produced during operation can not be discharged into outer
Boundary, thermal energy buildup is excessive, temperature beyond plate body material bearing temperature so that wiring board is damaged, so, wiring board dissipates
Heat problem is one of improved emphasis of circuit board structure.
Utility model content
The utility model is main as what is radiated in plate body there is provided a kind of use grapheme material for above-mentioned technical deficiency
Structure, the novel circuit board for making the radiating effect and toughness of plate body get a promotion.
To reach above-mentioned purpose, the utility model is achieved through the following technical solutions：
A kind of novel circuit board, including plate body, described plate body is by epoxy coating, copper-based surface layer and ceramic substrate layer
It is composited, described epoxy coating is located at the top of the copper-based surface layer, described ceramic substrate layer is located at described
It is provided with the lower section of copper-based surface layer, described plate body in several through holes, described plate body and is provided with heat dissipating layer, described heat dissipating layer
Center section be respectively placed in epoxy coating, copper-based surface layer and ceramic substrate layer, the both sides of described heat dissipating layer are run through
Described copper-based surface layer and extend on the both sides of the plate body and the surface of several through holes.
Further, several described through holes are circular port.
Further, described heat dissipating layer is made up of grapheme material.
The beneficial effects of the utility model are：Using grapheme material as the primary structure radiated in plate body, stone is utilized
The excellent thermal conductivity of black alkene material is conducted to the heat energy of plate body, makes heat energy in plate body be easier to be dispersed into outside plate body, simultaneously
Grapheme material has excellent toughness, and plate body both sides can make the toughness of plate body get a promotion covered with grapheme material.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
In figure, plate body 1, epoxy coating 2, copper-based surface layer 3, ceramic substrate layer 4, several through holes 5, heat dissipating layer 6.
Embodiment
As shown in figure 1, a kind of novel circuit board, including plate body 1, described plate body 1 is by epoxy coating 2, copper-based face
Layer 3 and ceramic substrate layer 4 are composited, and described epoxy coating 2 is located at the top of the copper-based surface layer 3, described pottery
Ceramic chip layer 4, which is located in the lower section of described copper-based surface layer 3, described plate body 1, to be provided with several through holes 5, described plate body 1
Provided with heat dissipating layer 6, the center section of described heat dissipating layer 6 is respectively placed in epoxy coating 2, copper-based surface layer 3 and ceramic substrate
In layer 4, the both sides of described heat dissipating layer 6 through described copper-based surface layer 3 and extend to the plate body 1 both sides and several lead to
On the surface in hole 5, several described through holes 5 are circular port, and described heat dissipating layer 6 is made up of grapheme material.
The utility model is excellent using grapheme material using main heat sink structure of the grapheme material as the plate body 1
Good thermal conductivity is conducted to the heat energy of plate body, because the heat dissipating layer 6 described in part is arranged at outside plate body 1, it connects with the external world
Tactile area is more, so heat scatters and disappears comparatively fast, makes heat energy in plate body 1 be easier to be dispersed into outside plate body, while grapheme material
With excellent toughness, the both sides of plate body 1 can make the toughness of plate body get a promotion covered with grapheme material.
Claims (3)
1. a kind of novel circuit board, including plate body (1), it is characterised in that described plate body (1) is by epoxy coating (2), copper
Foundation base (3) and ceramic substrate layer (4) are composited, and described epoxy coating (2) is located at the upper of the copper-based surface layer (3)
Side, described ceramic substrate layer (4) is located at logical provided with several in the lower section of described copper-based surface layer (3), described plate body (1)
Heat dissipating layer (6) is provided with hole (5), described plate body (1), the center section of described heat dissipating layer (6) is respectively placed in epoxy resin
In coating (2), copper-based surface layer (3) and ceramic substrate layer (4), described copper-based surface layer is run through in the both sides of described heat dissipating layer (6)
(3) and extend on the both sides of the plate body (1) and the surface of several through holes (5).
2. a kind of novel circuit board according to claim 1, it is characterised in that several described through holes (5) are circle
Hole.
3. a kind of novel circuit board according to claim 1, it is characterised in that described heat dissipating layer (6) is by graphene material
Material is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720242368.8U CN206490896U (en) | 2017-03-12 | 2017-03-12 | A kind of novel circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720242368.8U CN206490896U (en) | 2017-03-12 | 2017-03-12 | A kind of novel circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206490896U true CN206490896U (en) | 2017-09-12 |
Family
ID=59762876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720242368.8U Expired - Fee Related CN206490896U (en) | 2017-03-12 | 2017-03-12 | A kind of novel circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206490896U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109788637A (en) * | 2018-10-23 | 2019-05-21 | 江西增孚新材料科技有限公司 | Ceramic circuit-board |
-
2017
- 2017-03-12 CN CN201720242368.8U patent/CN206490896U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109788637A (en) * | 2018-10-23 | 2019-05-21 | 江西增孚新材料科技有限公司 | Ceramic circuit-board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170912 Termination date: 20190312 |