CN206575656U - Concentrate heat radiating type reinforced circuit board - Google Patents
Concentrate heat radiating type reinforced circuit board Download PDFInfo
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- CN206575656U CN206575656U CN201720024271.XU CN201720024271U CN206575656U CN 206575656 U CN206575656 U CN 206575656U CN 201720024271 U CN201720024271 U CN 201720024271U CN 206575656 U CN206575656 U CN 206575656U
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Abstract
The utility model discloses a kind of concentration heat radiating type reinforced circuit board, include the reinforced hard being from bottom to top cascading, aluminium base, insulating barrier, copper plate layer and heat dissipating layer, the circuit that etching is formed is provided with the copper plate layer, the heat dissipating layer is located above copper plate layer, the heat dissipating layer includes thermal conductive metal plate, heat conduction stratum reticulare and cooling tube layer, the thermal conductive metal plate, heat conduction stratum reticulare and cooling tube layer are sequentially overlapped from lower to upper, the thermal conductive metal plate is brought into close contact with above-mentioned copper plate layer, the thermal conductive silicon lipid layer for being easy to heat to conduct is provided between thermal conductive metal plate and copper plate layer.Thereby, by the heat dissipating layer formed by thermal conductive metal plate, cooling tube layer and thermal conductive network layer stackup, radiated after concentrating heat absorption to circuit board.So as to reduce circuit board temperature, improve its job stability.
Description
Technical field
The utility model is related to field of circuit boards technology, refers in particular to a kind of concentration heat radiating type reinforced circuit board.
Background technology
The title of circuit board has：Wiring board, pcb board, aluminium base, high frequency plate, thick copper coin, impedance plate, PCB, ultra-thin circuit
Plate, ultrathin circuit board, printing（Copper lithographic technique）Circuit board etc., circuit board makes circuit miniaturization, directly perceivedization, for permanent circuit
Batch production and optimization electrical appliance layout play an important role, according to statistics as shown by data 55% electronic product failure with it is too high
Thermal environment stress is relevant, and harsher thermal environment stress produces serious influence to the normal work of most of electronic products, leads
Electronic component is caused to accelerate failure, so as to cause the failure of whole product, in recent years, with extensive, ultra-large integrated electricity
Road and the application of surface mounting technology, electronic product develop to miniaturization, high density, high reliability direction, are especially navigated in aviation
Its field, high integration, pinpoint accuracy, high complexity and extremely narrow space the features such as so as to electronic system
The requirement of thermal design also more and more higher, radiating turns into one of key factor for influenceing its Performance And Reliability, thus for
It is very necessary that upper situation, which designs a kind of new circuit board,.
Utility model content
In view of this, in view of the existing deficiencies of the prior art, its main purpose is to provide a kind of concentrate and dissipated the utility model
Heat type reinforced circuit board, it is by by thermal conductive metal plate, cooling tube layer and the heat dissipating layer that is formed of thermal conductive network layer stackup, to circuit
Plate is radiated after concentrating heat absorption.So as to reduce circuit board temperature, improve its job stability.
To achieve the above object, the utility model is using following technical scheme：
One kind concentrates heat radiating type reinforced circuit board, includes the reinforced hard being from bottom to top cascading, aluminium
The circuit that etching is formed is provided with substrate, insulating barrier, copper plate layer and heat dissipating layer, the copper plate layer, the heat dissipating layer is located at copper plate layer
Top, the heat dissipating layer includes thermal conductive metal plate, heat conduction stratum reticulare and cooling tube layer, the thermal conductive metal plate, heat conduction stratum reticulare and cooling
Tube layer is sequentially overlapped from lower to upper, and the thermal conductive metal plate is brought into close contact with above-mentioned copper plate layer, in thermal conductive metal plate and copper plate layer it
Between be provided be easy to heat conduct thermal conductive silicon lipid layer.
It is used as a kind of preferred scheme：The cooling tube layer includes a cavity and the cooling tube in cavity.
It is used as a kind of preferred scheme：The cavity two ends are respectively arranged with thermal vias.
It is used as a kind of preferred scheme：The thermal conductive metal plate upper surface is provided with a plurality of radiating projections, in above-mentioned heat conduction
Stratum reticulare lower surface correspondence radiating projection is provided with plurality of grooves, and radiating projection is embedded in groove.
It is used as a kind of preferred scheme：The heat conduction stratum reticulare includes the metal heat-conducting silk of complex root setting interlaced with each other.
The utility model has clear advantage and beneficial effect compared with prior art, specifically, by above-mentioned technology
Scheme understands, by being formed by thermal conductive metal plate, cooling tube layer and thermal conductive network layer stackup in being set in the copper plate layer of circuit board
Heat dissipating layer, thermal conductive metal plate and heat conduction stratum reticulare are concentrated to circuit board to absorb heat, and is radiated by cooling tube layer.So as to make circuit board work
When the heat that produces can Quick diffusing, reduce circuit board temperature, improve its job stability.
More clearly to illustrate architectural feature of the present utility model and effect, come below in conjunction with the accompanying drawings with specific embodiment pair
It is described in detail.
Brief description of the drawings
Fig. 1 is the circuit board stratiform structural representation of the utility model.
Accompanying drawing identifier declaration：
10th, reinforced hard 20, aluminium base
30th, insulating barrier 40, copper plate layer
50th, heat dissipating layer 51, thermal conductive metal plate
511st, radiate projection 52, heat conduction stratum reticulare
521st, groove 53, cooling tube layer
531st, cavity 532, cooling tube
533rd, thermal vias 54, thermal conductive silicon lipid layer.
Embodiment
The utility model is as shown in figure 1, a kind of concentration heat radiating type reinforced circuit board, includes and from bottom to top stack gradually
Reinforced hard 10, aluminium base 20, insulating barrier 30, copper plate layer 40 and the heat dissipating layer 50 of setting, wherein：
The circuit that etching is formed is provided with the copper plate layer 40；The heat dissipating layer 50 is located at the top of copper plate layer 40, the heat dissipating layer
50 include thermal conductive metal plate 51, heat conduction stratum reticulare 52 and cooling tube layer 53, the thermal conductive metal plate 51, heat conduction stratum reticulare 52 and cooling tube
Layer 53 is sequentially overlapped from lower to upper, and the thermal conductive metal plate 51 is brought into close contact with above-mentioned copper plate layer 40, in thermal conductive metal plate 51 and copper
The thermal conductive silicon lipid layer 54 for being easy to heat to conduct is provided between flaggy 40；The cooling tube layer 53 includes a cavity 531 and positioned at chamber
Cooling tube 532 in body 531, a plurality of thermal vias 533 are respectively arranged with the two ends of cavity 531；The heat conduction stratum reticulare 52 includes
There is the metal heat-conducting silk of complex root setting interlaced with each other.
In addition, a plurality of radiating projections 511 are provided with the upper surface of thermal conductive metal plate 51, in the above-mentioned following table of heat conduction stratum reticulare 52
Face correspondence radiating projection 511 is provided with plurality of grooves 521, and radiating projection 511 is embedded in groove 521.
Design focal point of the present utility model is, by being set in the copper plate layer of circuit board by thermal conductive metal plate, cooling
Tube layer and the heat dissipating layer of thermal conductive network layer stackup formation, thermal conductive metal plate and heat conduction stratum reticulare are concentrated to circuit board and absorbed heat, by cooling tube
Layer radiating.So as to which the heat Quick diffusing for enabling circuit board to be produced when working reduces circuit board temperature, improves its work steady
It is qualitative.
It is described above, only it is preferred embodiment of the present utility model, not technical scope of the present utility model is made
Any limitation, thus it is every according to technical spirit of the present utility model to any trickle amendment made for any of the above embodiments, equivalent become
Change with modification, in the range of still falling within technical solutions of the utility model.
Claims (5)
1. one kind concentrates heat radiating type reinforced circuit board, it is characterised in that：Include the hard being from bottom to top cascading
The circuit that etching is formed, heat dissipating layer position are provided with enhancement layer, aluminium base, insulating barrier, copper plate layer and heat dissipating layer, the copper plate layer
Above copper plate layer, the heat dissipating layer includes thermal conductive metal plate, heat conduction stratum reticulare and cooling tube layer, the thermal conductive metal plate, thermal conductive network
Layer and cooling tube layer be sequentially overlapped from lower to upper, the thermal conductive metal plate is brought into close contact with above-mentioned copper plate layer, in thermal conductive metal plate with
The thermal conductive silicon lipid layer for being easy to heat to conduct is provided between copper plate layer.
2. concentration heat radiating type reinforced circuit board according to claim 1, it is characterised in that：The cooling tube layer includes one
Cavity and the cooling tube in cavity.
3. concentration heat radiating type reinforced circuit board according to claim 2, it is characterised in that：The cavity two ends are set respectively
It is equipped with thermal vias.
4. concentration heat radiating type reinforced circuit board according to claim 1, it is characterised in that：The thermal conductive metal plate upper table
Face is provided with a plurality of radiating projections, and above-mentioned heat conduction stratum reticulare lower surface correspondence radiating projection is provided with plurality of grooves, radiated
Projection is embedded in groove.
5. concentration heat radiating type reinforced circuit board according to claim 1, it is characterised in that：The heat conduction stratum reticulare includes
The metal heat-conducting silk of complex root setting interlaced with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720024271.XU CN206575656U (en) | 2017-01-10 | 2017-01-10 | Concentrate heat radiating type reinforced circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720024271.XU CN206575656U (en) | 2017-01-10 | 2017-01-10 | Concentrate heat radiating type reinforced circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206575656U true CN206575656U (en) | 2017-10-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720024271.XU Active CN206575656U (en) | 2017-01-10 | 2017-01-10 | Concentrate heat radiating type reinforced circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN206575656U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111655007A (en) * | 2020-06-22 | 2020-09-11 | 云谷（固安）科技有限公司 | Display screen heat abstractor |
-
2017
- 2017-01-10 CN CN201720024271.XU patent/CN206575656U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111655007A (en) * | 2020-06-22 | 2020-09-11 | 云谷（固安）科技有限公司 | Display screen heat abstractor |
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