CN206932466U - A kind of antistatic formula circuit board - Google Patents
A kind of antistatic formula circuit board Download PDFInfo
- Publication number
- CN206932466U CN206932466U CN201720567344.XU CN201720567344U CN206932466U CN 206932466 U CN206932466 U CN 206932466U CN 201720567344 U CN201720567344 U CN 201720567344U CN 206932466 U CN206932466 U CN 206932466U
- Authority
- CN
- China
- Prior art keywords
- antistatic
- substrate
- layer
- conductive
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Laminated Bodies (AREA)
- Floor Finish (AREA)
Abstract
The utility model discloses a kind of antistatic formula circuit board,Including substrate,The substrate upper end is provided with Upper conductive layer,The Upper conductive layer upper end is provided with upper-layer insulation film,The upper-layer insulation film upper end is provided with upper strata antistatic film,The upper strata antistatic film upper end surrounding is provided with conductive strips,The substrate lower end is provided with underlying conductive layer,The underlying conductive layer lower end is provided with underlying insulating layer,The underlying insulating layer lower end is provided with lower floor's antistatic film,The substrate corner is provided with installation fixing hole,Conductive core pole is installed inside the installation fixing hole,The conductive core pole bottom outside is provided with rubber knob,Substrate upper end surrounding is provided with guide hole,The utility model has preferable insulating properties,Antistatic film is set to isolate electrostatic,It can be grounded by the conductive strips and the conductive core pole,Prevent electrostatic damage remaining part,Improve antistatic property.
Description
Technical field
Circuit board technology field is the utility model is related to, specially a kind of antistatic formula circuit board.
Background technology
The title of circuit board has：Wiring board, pcb board, aluminium base, high frequency plate, thick copper coin, impedance plate, PCB, ultra-thin circuit
Plate, ultrathin circuit board, printing (copper lithographic technique) circuit board etc..Circuit board is mainly by pad, via, mounting hole, wire, first device
Part, connector, filling, electrical boundary etc. form.The antistatic property of current circuit board is undesirable, easily produces electrostatic, holds
The damage of part is easily caused, potential safety hazard be present.
Utility model content
The purpose of this utility model is to provide a kind of antistatic formula circuit board have preferable insulating properties, sets anti-
Electrostatic film can isolate electrostatic, can be grounded by the conductive strips and the conductive core pole, prevent electrostatic damage
Remaining part, improve antistatic property.
To achieve the above object, the utility model provides following technical scheme：A kind of antistatic formula circuit board, including base
Plate, the substrate upper end are provided with Upper conductive layer, and the Upper conductive layer upper end is provided with upper-layer insulation film, and the upper strata is exhausted
Edge layer upper end is provided with upper strata antistatic film, and the upper strata antistatic film upper end surrounding is provided with conductive strips, the substrate lower end
Underlying conductive layer is provided with, the underlying conductive layer lower end is provided with underlying insulating layer, and the underlying insulating layer lower end is provided with
Lower floor's antistatic film, the substrate corner are provided with installation fixing hole, are provided with conductive core pole inside the installation fixing hole, institute
State conductive core pole bottom outside and rubber knob is installed, substrate upper end surrounding is provided with guide hole.
Preferably, the Upper conductive layer is molded over the substrate upper end, the upper-layer insulation film by way of lamination
The Upper conductive layer upper end is molded over by way of lamination.
Preferably, the upper strata antistatic film is molded over the upper-layer insulation film upper end by way of lamination, it is described on
Layer antistatic film is formed by resin and antistatic additive mixing compacting, and the conductive strips are embedded in the upper strata antistatic film.
Preferably, the underlying conductive layer by using mode be molded over the substrate lower end, the underlying insulating layer
The underlying conductive layer lower end is molded over by way of lamination.
Preferably, lower floor's antistatic film by using mode be molded over the underlying insulating layer lower end, under described
Layer antistatic film is formed by resin and antistatic additive mixing compacting.
Preferably, the installation fixing hole is molded over the substrate corner by mach mode, and the guide hole passes through
Mach mode is molded over substrate upper end surrounding.
Preferably, the conductive core pole be threadably secured installed in it is described installation fixing hole inside, and with the conduction
Band joint, the rubber knob are bushed on the outside of the conductive core pole.
Compared with prior art, the beneficial effects of the utility model are as follows：
The utility model has preferable insulating properties, sets antistatic film to isolate electrostatic, passes through the conductive strips
It can be grounded with the conductive core pole, prevent electrostatic damage remaining part, improve antistatic property.
Brief description of the drawings
Fig. 1 is stereogram of the present utility model；
Fig. 2 is schematic cross-section of the present utility model；
In figure：1-substrate, 2-installation fixing hole, 3-conductive strips, 4-guide hole, 5-conductive core pole, 6-upper strata resist quiet
Electrolemma, 7-upper-layer insulation film, 8-Upper conductive layer, 9-lower floor antistatic film, 10-underlying insulating layer, 11-underlying conductive
Layer, 12-rubber knob.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Fig. 1-2 is referred to, the utility model provides a kind of technical scheme：A kind of antistatic formula circuit board, including substrate 1,
The upper end of substrate 1 is provided with Upper conductive layer 8, and the upper end of Upper conductive layer 8 is provided with upper-layer insulation film 7, and the upper end of upper-layer insulation film 7 is set
Upper strata antistatic film 6 is equipped with, the upper end surrounding of upper strata antistatic film 6 is provided with conductive strips 3, and the lower end of substrate 1 is provided with underlying conductive
Layer 11, the lower end of underlying conductive layer 11 is provided with underlying insulating layer 10, and the lower end of underlying insulating layer 10 is provided with lower floor's antistatic film 9,
1 four jiaos of substrate is provided with installation fixing hole 2, installs and conductive core pole 5 is provided with inside fixing hole 2, the bottom outside of conductive core pole 5 peace
Equipped with rubber knob 12, the upper end surrounding of substrate 1 is provided with guide hole 4.
Preferably, Upper conductive layer 8 is molded over the upper end of substrate 1 by way of lamination, and upper-layer insulation film 7 passes through lamination
Mode is molded over the upper end of Upper conductive layer 8, and upper strata antistatic film 6 is molded over the upper end of upper-layer insulation film 7 by way of lamination, on
Layer antistatic film 6 is formed by resin and antistatic additive mixing compacting, and conductive strips 3 are embedded in upper strata antistatic film 6, underlying conductive layer
11 by using mode be molded over the lower end of substrate 1, underlying insulating layer 10 is molded over underlying conductive layer 11 by way of lamination
Lower end, lower floor's antistatic film 9 by using mode be molded over the lower end of underlying insulating layer 10, lower floor's antistatic film 9 by resin and
Antistatic additive mixing compacting forms, and installation fixing hole 2 is molded over 1 four jiaos of substrate by mach mode, and guide hole 4 is added by machine
The mode of work is molded over the upper end surrounding of substrate 1, and conductive core pole 5 is threadably secured inside installation fixing hole 2, and with leading
The electric joint of band 3, rubber knob 12 are bushed in the outside of conductive core pole 5.
Operation principle：A kind of antistatic formula circuit board, in the interior welds metal of guide hole 4, lead Upper conductive layer 8 and lower floor
Electric layer 11 is connected, and realizes the connection of two lateral circuits, by setting upper-layer insulation film 7 and underlying insulating layer 10 to play insulation
Effect, is protected to Upper conductive layer 8 and underlying conductive layer 11, sets upper strata antistatic film 6 and lower floor's antistatic film 9 can
Anlistatig effect is played, conductive strips 3 and conductive core pole 5 coordinate, be grounded, and can guide electricity when electrostatic occurs
Lotus leads to the earth, so as to ensure safety of the remaining part when freeing electrostatic, prevents parts damages, dual antistatic, improves
The antistatic property of device.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from principle of the present utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (7)
1. a kind of antistatic formula circuit board, including substrate (1), it is characterised in that：Substrate (1) upper end is provided with Upper conductive
Layer (8), Upper conductive layer (8) upper end are provided with upper-layer insulation film (7), and upper-layer insulation film (7) upper end is provided with
Layer antistatic film (6), upper strata antistatic film (6) upper end surrounding are provided with conductive strips (3), and substrate (1) lower end is set
There is underlying conductive layer (11), underlying conductive layer (11) lower end is provided with underlying insulating layer (10), the underlying insulating layer
(10) lower end is provided with lower floor's antistatic film (9), and substrate (1) corner is provided with installation fixing hole (2), and the installation is fixed
Conductive core pole (5) is installed inside hole (2), conductive core pole (5) bottom outside is provided with rubber knob (12), the substrate
(1) upper end surrounding is provided with guide hole (4).
A kind of 2. antistatic formula circuit board according to claim 1, it is characterised in that：The Upper conductive layer (8) passes through
The mode of lamination is molded over the substrate (1) upper end, and the upper-layer insulation film (7) is molded over the upper strata by way of lamination
Conductive layer (8) upper end.
A kind of 3. antistatic formula circuit board according to claim 1, it is characterised in that：The upper strata antistatic film (6) is logical
The mode for crossing lamination is molded over the upper-layer insulation film (7) upper end, and the upper strata antistatic film (6) is mixed by resin and antistatic additive
Combined pressure system forms, and the conductive strips (3) are embedded in the upper strata antistatic film (6).
A kind of 4. antistatic formula circuit board according to claim 1, it is characterised in that：The underlying conductive layer (11) passes through
Be molded over the substrate (1) lower end by the way of, the underlying insulating layer (10) be molded over by way of lamination it is described under
Layer conductive layer (11) lower end.
A kind of 5. antistatic formula circuit board according to claim 1, it is characterised in that：Lower floor's antistatic film (9) is logical
Cross by the way of and be molded over the underlying insulating layer (10) lower end, lower floor's antistatic film (9) is by resin and antistatic additive
Mixing compacting forms.
A kind of 6. antistatic formula circuit board according to claim 1, it is characterised in that：The installation fixing hole (2) passes through
Mach mode is molded over the substrate (1) corner, and the guide hole (4) is molded over the substrate by mach mode
(1) upper end surrounding.
A kind of 7. antistatic formula circuit board according to claim 1, it is characterised in that：The conductive core pole (5) passes through spiral shell
Line is fixedly mounted on installation fixing hole (2) inside, and is inlayed with the conductive strips (3) joint, the rubber knob (12)
It is enclosed on the outside of the conductive core pole (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720567344.XU CN206932466U (en) | 2017-05-19 | 2017-05-19 | A kind of antistatic formula circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720567344.XU CN206932466U (en) | 2017-05-19 | 2017-05-19 | A kind of antistatic formula circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206932466U true CN206932466U (en) | 2018-01-26 |
Family
ID=61351651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720567344.XU Expired - Fee Related CN206932466U (en) | 2017-05-19 | 2017-05-19 | A kind of antistatic formula circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206932466U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113539132A (en) * | 2021-07-28 | 2021-10-22 | Oppo广东移动通信有限公司 | Display module and electronic equipment |
-
2017
- 2017-05-19 CN CN201720567344.XU patent/CN206932466U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113539132A (en) * | 2021-07-28 | 2021-10-22 | Oppo广东移动通信有限公司 | Display module and electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209497668U (en) | A kind of slim pcb board with shielding construction | |
| CN104427841A (en) | Shielding device | |
| CN204206611U (en) | The stepped multilayer circuit board of a kind of novel blending agent | |
| CN203367606U (en) | Electrical connector | |
| CN105657962B (en) | A kind of multilayer PCB circuit board | |
| CN206932466U (en) | A kind of antistatic formula circuit board | |
| CN207995488U (en) | circuit board, display panel and display device | |
| CN205902213U (en) | Take anti -static function's circuit board drilling apron | |
| CN203368912U (en) | Flexible differential impedance board | |
| CN206516800U (en) | Earphone jack seat and its terminal, the earphone extended line of application | |
| CN206932465U (en) | A kind of porous heat dissipation type circuit board | |
| CN201563292U (en) | Grounding structure of circuit board | |
| CN203251505U (en) | Circuit board with white oil coverage layer | |
| CN206075846U (en) | A kind of composite bus bar | |
| CN207897217U (en) | A kind of high reliability carbon ink wiring board | |
| CN201781077U (en) | Ground lug structure | |
| CN201165468Y (en) | MEMS microphone encapsulation structure | |
| CN206302629U (en) | Silver paste cross-line printed wiring board | |
| CN203340419U (en) | Flexible circuit board | |
| CN205265995U (en) | Anti type circuit board that falls | |
| CN206301780U (en) | A kind of plastic package lead frame | |
| CN105305115B (en) | A kind of earthing clamp | |
| CN113015314B (en) | Circuit board device | |
| CN203340410U (en) | Flexible circuit board | |
| CN207625969U (en) | A kind of wire structures for printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180126 Termination date: 20200519 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |