CN206932463U - A kind of high-temp resistant type circuit board - Google Patents
A kind of high-temp resistant type circuit board Download PDFInfo
- Publication number
- CN206932463U CN206932463U CN201720561693.0U CN201720561693U CN206932463U CN 206932463 U CN206932463 U CN 206932463U CN 201720561693 U CN201720561693 U CN 201720561693U CN 206932463 U CN206932463 U CN 206932463U
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- substrate
- underlying
- layer
- conductive layer
- circuit board
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- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a kind of high-temp resistant type circuit board,Including ceramic substrate,The ceramic substrate is divided into top substrate layer and underlying substrate,Heat dissipation cavity is provided between the top substrate layer and the underlying substrate,The top substrate layer upper end is provided with Upper conductive layer,The Upper conductive layer upper end is provided with upper-layer insulation film,The underlying substrate lower end is provided with underlying conductive layer,The underlying conductive layer lower end is provided with underlying insulating layer,The ceramic substrate corner is provided with guide hole,The guide hole is internally provided with metal bridge,The ceramic substrate both sides are provided with installation fixing groove,The utility model is integrally using lamination,The mode of sintering is molded,Ensure the contact between each part,Improve thermal conductivity,By setting the heat dissipation cavity to improve thermal diffusivity,Substrate manufacture is carried out using ceramics,Ensure that device has higher thermal conductivity,Improve resistance to elevated temperatures.
Description
Technical field
Circuit board technology field is the utility model is related to, specially a kind of high-temp resistant type circuit board.
Background technology
The title of circuit board has：Wiring board, pcb board, aluminium base, high frequency plate, thick copper coin, impedance plate, PCB, ultra-thin circuit
Plate, ultrathin circuit board, printing (copper lithographic technique) circuit board etc..Circuit board is mainly by pad, via, mounting hole, wire, first device
Part, connector, filling, electrical boundary etc. form.In order to meet different use demands, single sided board, double can be made in circuit board
Panel, multi-layer sheet.Wherein dual platen is to use more one kind.Current double-layer circuit board is due to its material, manufacturing process, knot
The factors such as structure, cause heat dispersion undesirable, so as to cause resistance to elevated temperatures undesirable, easily influence the usability of circuit board
Energy.
Utility model content
The purpose of this utility model is to provide a kind of high-temp resistant type circuit board, it is overall using lamination, sinter by the way of into
Type, it is ensured that the contact between each part, thermal conductivity is improved, by setting the heat dissipation cavity to improve thermal diffusivity, using ceramics
Substrate manufacture is carried out, ensures that device has higher thermal conductivity, improves resistance to elevated temperatures.
To achieve the above object, the utility model provides following technical scheme：A kind of high-temp resistant type circuit board, including ceramics
Substrate, the ceramic substrate are divided into top substrate layer and underlying substrate, are provided between the top substrate layer and the underlying substrate
Heat dissipation cavity, the top substrate layer upper end are provided with Upper conductive layer, and the Upper conductive layer upper end is provided with upper-layer insulation film, institute
State underlying substrate lower end and be provided with underlying conductive layer, the underlying conductive layer lower end is provided with underlying insulating layer, the ceramic base
Plate corner is provided with guide hole, and the guide hole is internally provided with metal bridge, and the ceramic substrate both sides are provided with installation fixing groove.
Preferably, the top substrate layer and the underlying substrate are made up, the radiating using ceramics of plastotype, punching press
Chamber is molded in the top substrate layer and the underlying substrate integrated molding, and the heat dissipation cavity runs through the top substrate layer and institute
State between underlying substrate.
Preferably, the Upper conductive layer is molded over the top substrate layer upper end by way of lamination, and the upper strata is exhausted
Edge layer is molded over the Upper conductive layer upper end by way of lamination.
Preferably, the underlying conductive layer is molded over the underlying substrate lower end by way of lamination, and the lower floor is exhausted
Edge layer is molded over the underlying conductive layer lower end by way of lamination.
Preferably, the guide hole is molded over the ceramic substrate corner, the metal bridge welding by mach mode
Inside the guide hole, the installation fixing groove is molded over the ceramic substrate both sides by mach mode.
Compared with prior art, the beneficial effects of the utility model are as follows：
The utility model is integrally molded by the way of lamination, sintering, it is ensured that the contact between each part, improves heat conduction
Property, thermal diffusivity can be improved by setting the heat dissipation cavity, substrate manufacture is carried out using ceramics, ensures that device has higher lead
It is hot, improve resistance to elevated temperatures.
Brief description of the drawings
Fig. 1 is stereogram of the present utility model；
Fig. 2 is section enlarged diagram of the present utility model.
In figure：1-ceramic substrate, 2-guide hole, 3-metal bridge, 4-installation fixing groove, 5-upper-layer insulation film, 6-on
Layer conductive layer, 7-top substrate layer, 8-heat dissipation cavity, 9-underlying substrate, 10-underlying conductive layer, 11-underlying insulating layer.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Fig. 1-2 is referred to, the utility model provides a kind of technical scheme：A kind of high-temp resistant type circuit board, include ceramics
Substrate 1, ceramic substrate 1 divide for top substrate layer 7 and underlying substrate 9, and heat dissipation cavity is provided between top substrate layer 7 and underlying substrate 9
8, the upper end of top substrate layer 7 is provided with Upper conductive layer 6, and the upper end of Upper conductive layer 6 is provided with upper-layer insulation film 5, under underlying substrate 9
End is provided with underlying conductive layer 10, and the lower end of underlying conductive layer 10 is provided with underlying insulating layer 11, and 1 four jiaos of ceramic substrate, which is provided with, leads
Hole 2, guide hole 2 are internally provided with metal bridge 3, and the both sides of ceramic substrate 1 are provided with installation fixing groove 4.
Preferably, top substrate layer 7 and underlying substrate 9 are made up, heat dissipation cavity 8 is in upper strata base using ceramics of plastotype, punching press
It is molded during 9 integrated molding of plate 7 and underlying substrate, heat dissipation cavity 8 runs through between top substrate layer 7 and underlying substrate 9, Upper conductive layer
6 are molded over the upper end of top substrate layer 7 by way of lamination, and upper-layer insulation film 5 is molded over Upper conductive layer 6 by way of lamination
Upper end, underlying conductive layer 10 are molded over the lower end of underlying substrate 9 by way of lamination, and underlying insulating layer 11 is by way of lamination
The lower end of underlying conductive layer 10 is molded over, guide hole 2 is molded over 1 four jiaos of ceramic substrate by mach mode, and metal bridge 3 is welded on
Inside guide hole 2, installation fixing groove 4 is molded over the both sides of ceramic substrate 1 by mach mode.
Operation principle：A kind of high-temp resistant type circuit board, top substrate layer 7 and underlying substrate 9 pass through plastotype punching press using ceramics
Ceramic substrate 1 is made, using the ceramic thermal conductivity of itself, improves heat dispersion, so as to improve resistance to elevated temperatures, while utilizes pottery
The insulating properties of porcelain, it is ensured that safety, in 9 integrated molding of top substrate layer 7 and underlying substrate, form heat dissipation cavity 8, auxiliary is carried out
Radiating, it is possible to increase heat dispersion, so as to improve resistance to elevated temperatures, Upper conductive layer 6, upper-layer insulation film 5, underlying conductive layer
10th, underlying insulating layer 11 is molded by the way of lamination, eventually through the mode global formation of sintering, it can be ensured that between each layer
Contact, improve thermal conductivity, be easy to radiate, improve resistance to elevated temperatures, metal bridge 3 and guide hole 2 coordinate, and realizes Upper conductive layer
6 and the connection of underlying conductive layer 10, it is easy to the connection of circuit, sets installation fixing groove 4 to be easy to the manufacture of device, device integrally has
There is higher heat conductivility, higher operating temperature can be born, performance is good.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from principle of the present utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of high-temp resistant type circuit board, including ceramic substrate (1), it is characterised in that：The ceramic substrate (1) is divided into upper strata base
Plate (7) and underlying substrate (9), are provided with heat dissipation cavity (8) between the top substrate layer (7) and the underlying substrate (9), it is described on
Laminar substrate (7) upper end is provided with Upper conductive layer (6), and Upper conductive layer (6) upper end is provided with upper-layer insulation film (5), institute
State underlying substrate (9) lower end and be provided with underlying conductive layer (10), underlying conductive layer (10) lower end is provided with underlying insulating layer
(11), ceramic substrate (1) corner is provided with guide hole (2), and the guide hole (2) is internally provided with metal bridge (3), the ceramics
Substrate (1) both sides are provided with installation fixing groove (4).
A kind of 2. high-temp resistant type circuit board according to claim 1, it is characterised in that：The top substrate layer (7) and described
Underlying substrate (9) using ceramics, be made up of plastotype, punching press, the heat dissipation cavity (8) the top substrate layer (7) and it is described under
Be molded during laminar substrate (9) integrated molding, the heat dissipation cavity (8) through the top substrate layer (7) and the underlying substrate (9) it
Between.
A kind of 3. high-temp resistant type circuit board according to claim 1, it is characterised in that：The Upper conductive layer (6) passes through
The mode of lamination is molded over the top substrate layer (7) upper end, and the upper-layer insulation film (5) is molded over described by way of lamination
Upper conductive layer (6) upper end.
A kind of 4. high-temp resistant type circuit board according to claim 1, it is characterised in that：The underlying conductive layer (10) passes through
The mode of lamination is molded over the underlying substrate (9) lower end, and the underlying insulating layer (11) is molded over institute by way of lamination
State underlying conductive layer (10) lower end.
A kind of 5. high-temp resistant type circuit board according to claim 1, it is characterised in that：The guide hole (2) passes through machining
Mode be molded over the ceramic substrate (1) corner, the metal bridge (3) is welded on that the guide hole (2) is internal, and the installation is solid
Determine groove (4) and the ceramic substrate (1) both sides are molded over by mach mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720561693.0U CN206932463U (en) | 2017-05-19 | 2017-05-19 | A kind of high-temp resistant type circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720561693.0U CN206932463U (en) | 2017-05-19 | 2017-05-19 | A kind of high-temp resistant type circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206932463U true CN206932463U (en) | 2018-01-26 |
Family
ID=61351580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720561693.0U Expired - Fee Related CN206932463U (en) | 2017-05-19 | 2017-05-19 | A kind of high-temp resistant type circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206932463U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112399705A (en) * | 2020-11-10 | 2021-02-23 | 四川深北电路科技有限公司 | High-frequency high-heat-conductivity mixed compression plate for 5G communication equipment and manufacturing method thereof |
-
2017
- 2017-05-19 CN CN201720561693.0U patent/CN206932463U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112399705A (en) * | 2020-11-10 | 2021-02-23 | 四川深北电路科技有限公司 | High-frequency high-heat-conductivity mixed compression plate for 5G communication equipment and manufacturing method thereof |
| CN112399705B (en) * | 2020-11-10 | 2022-09-30 | 四川深北电路科技有限公司 | High-frequency high-heat-conductivity mixed compression plate for 5G communication equipment and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180126 Termination date: 20200519 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |