CN1431518A - 用于测试小型装置和部件的接触器 - Google Patents
用于测试小型装置和部件的接触器 Download PDFInfo
- Publication number
- CN1431518A CN1431518A CN02147996A CN02147996A CN1431518A CN 1431518 A CN1431518 A CN 1431518A CN 02147996 A CN02147996 A CN 02147996A CN 02147996 A CN02147996 A CN 02147996A CN 1431518 A CN1431518 A CN 1431518A
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- substrate
- contactor
- contact terminal
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- wiring
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- 239000000758 substrate Substances 0.000 claims abstract description 201
- 239000011810 insulating material Substances 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 37
- 238000012360 testing method Methods 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 25
- 238000005192 partition Methods 0.000 claims description 19
- 230000005489 elastic deformation Effects 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000012545 processing Methods 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000009713 electroplating Methods 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 6
- 102000011842 Serrate-Jagged Proteins Human genes 0.000 claims description 5
- 108010036039 Serrate-Jagged Proteins Proteins 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 230000000712 assembly Effects 0.000 claims description 2
- 238000000429 assembly Methods 0.000 claims description 2
- 238000003475 lamination Methods 0.000 claims 13
- 235000012431 wafers Nutrition 0.000 description 33
- 239000004065 semiconductor Substances 0.000 description 29
- 238000010586 diagram Methods 0.000 description 19
- 239000010408 film Substances 0.000 description 9
- 239000000523 sample Substances 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- 238000001514 detection method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 239000008393 encapsulating agent Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 229920001195 polyisoprene Polymers 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 241000519996 Teucrium chamaedrys Species 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000013100 final test Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 238000007669 thermal treatment Methods 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000013228 contact guidance Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007850 degeneration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 210000002683 foot Anatomy 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (37)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP002744/2002 | 2002-01-09 | ||
JP2002002744A JP4391717B2 (ja) | 2002-01-09 | 2002-01-09 | コンタクタ及びその製造方法並びにコンタクト方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1431518A true CN1431518A (zh) | 2003-07-23 |
CN1209806C CN1209806C (zh) | 2005-07-06 |
Family
ID=19190783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021479968A Expired - Fee Related CN1209806C (zh) | 2002-01-09 | 2002-11-01 | 用于测试小型装置和部件的接触器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6927343B2 (zh) |
JP (1) | JP4391717B2 (zh) |
KR (1) | KR100847034B1 (zh) |
CN (1) | CN1209806C (zh) |
TW (1) | TWI226932B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101849191B (zh) * | 2007-11-16 | 2014-02-19 | 电子科学工业有限公司 | 改进型电子组件处理机测试板 |
CN109313216A (zh) * | 2016-06-10 | 2019-02-05 | 金亨益 | 橡胶插座及其制造方法 |
KR20210076129A (ko) * | 2018-11-21 | 2021-06-23 | 미쓰이 가가쿠 가부시키가이샤 | 이방 도전성 시트, 이방 도전성 복합 시트, 이방 도전성 시트 세트, 전기 검사 장치 및 전기 검사 방법 |
Families Citing this family (72)
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US7220920B1 (en) * | 2004-01-23 | 2007-05-22 | Hutchinson Technology Incorporated | Flexible electrical circuit with slotted coverlay |
JP4721099B2 (ja) * | 2004-03-16 | 2011-07-13 | 軍生 木本 | 電気信号接続装置及びこれを用いたプローブ組立体並びにプローバ装置 |
FR2870382A1 (fr) * | 2004-05-13 | 2005-11-18 | Commissariat Energie Atomique | Cablage de connexion elastique |
JP4727948B2 (ja) | 2004-05-24 | 2011-07-20 | 東京エレクトロン株式会社 | プローブカードに用いられる積層基板 |
WO2006093704A1 (en) * | 2005-03-01 | 2006-09-08 | Sv Probe Pte Ltd. | Probe card with stacked substrate |
JP4878438B2 (ja) * | 2005-03-08 | 2012-02-15 | 東京特殊電線株式会社 | プローブ針及びその製造方法 |
JP4649248B2 (ja) * | 2005-03-22 | 2011-03-09 | 山一電機株式会社 | プローブユニット |
JP4962929B2 (ja) * | 2005-09-19 | 2012-06-27 | 軍生 木本 | プローバ装置及びこれに用いるプローブ組立体 |
JP5077736B2 (ja) * | 2005-09-19 | 2012-11-21 | 軍生 木本 | 接触子組立体及びこれを用いたlsiチップ検査装置 |
JP3117072U (ja) * | 2005-09-26 | 2006-01-05 | 船井電機株式会社 | フレキシブルフラット形ケーブルとその組立装置 |
US7737708B2 (en) * | 2006-05-11 | 2010-06-15 | Johnstech International Corporation | Contact for use in testing integrated circuits |
CN200941318Y (zh) * | 2006-08-02 | 2007-08-29 | 富士康(昆山)电脑接插件有限公司 | 柔性扁平线缆 |
JP4781943B2 (ja) * | 2006-08-29 | 2011-09-28 | 日本メクトロン株式会社 | フレキシブル配線板 |
US20080083554A1 (en) * | 2006-10-04 | 2008-04-10 | International Business Machines Corporation | Hybrid bonded flex circuit |
DE102007008109B4 (de) * | 2007-02-19 | 2022-10-27 | Osram Gmbh | Trägerplattenanordnung |
DE102007044502A1 (de) * | 2007-09-18 | 2009-03-19 | Robert Bosch Gmbh | Flexible elektrische Anbindung |
JP5087634B2 (ja) | 2007-10-31 | 2012-12-05 | 株式会社アドバンテスト | コンタクトアームの接触部の異常を検出する異常検出装置 |
JP5053106B2 (ja) * | 2008-01-18 | 2012-10-17 | 株式会社石川技研 | コンタクトプローブ |
JP5240827B2 (ja) * | 2008-04-15 | 2013-07-17 | Necカシオモバイルコミュニケーションズ株式会社 | フレキシブル配線基板、及び電子機器 |
JP5333829B2 (ja) * | 2008-10-03 | 2013-11-06 | 軍生 木本 | プローブ組立体 |
JP5396112B2 (ja) * | 2009-03-12 | 2014-01-22 | 東京エレクトロン株式会社 | プローブカード |
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- 2002-01-09 JP JP2002002744A patent/JP4391717B2/ja not_active Expired - Fee Related
- 2002-10-09 US US10/266,866 patent/US6927343B2/en not_active Expired - Lifetime
- 2002-10-14 TW TW091123611A patent/TWI226932B/zh not_active IP Right Cessation
- 2002-10-23 KR KR1020020064807A patent/KR100847034B1/ko not_active IP Right Cessation
- 2002-11-01 CN CNB021479968A patent/CN1209806C/zh not_active Expired - Fee Related
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CN101849191B (zh) * | 2007-11-16 | 2014-02-19 | 电子科学工业有限公司 | 改进型电子组件处理机测试板 |
CN109313216A (zh) * | 2016-06-10 | 2019-02-05 | 金亨益 | 橡胶插座及其制造方法 |
KR20210076129A (ko) * | 2018-11-21 | 2021-06-23 | 미쓰이 가가쿠 가부시키가이샤 | 이방 도전성 시트, 이방 도전성 복합 시트, 이방 도전성 시트 세트, 전기 검사 장치 및 전기 검사 방법 |
CN113168935A (zh) * | 2018-11-21 | 2021-07-23 | 三井化学株式会社 | 各向异性导电片、各向异性导电复合片、各向异性导电片组、电气检查装置及电气检查方法 |
KR102587764B1 (ko) | 2018-11-21 | 2023-10-10 | 미쓰이 가가쿠 가부시키가이샤 | 이방 도전성 시트, 이방 도전성 복합 시트, 이방 도전성 시트 세트, 전기 검사 장치 및 전기 검사 방법 |
US11860193B2 (en) | 2018-11-21 | 2024-01-02 | Mitsui Chemicals, Inc. | Anisotropic conductive sheet, anisotropic conductive composite sheet, anisotropic conductive sheet set, electric inspection device and electric inspection method |
Also Published As
Publication number | Publication date |
---|---|
KR20030060751A (ko) | 2003-07-16 |
KR100847034B1 (ko) | 2008-07-18 |
JP2003207523A (ja) | 2003-07-25 |
CN1209806C (zh) | 2005-07-06 |
US6927343B2 (en) | 2005-08-09 |
TWI226932B (en) | 2005-01-21 |
US20030127246A1 (en) | 2003-07-10 |
JP4391717B2 (ja) | 2009-12-24 |
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