CN1160448A - 具有芯片卡模块和与之相连线圈的电路装置 - Google Patents

具有芯片卡模块和与之相连线圈的电路装置 Download PDF

Info

Publication number
CN1160448A
CN1160448A CN95195672A CN95195672A CN1160448A CN 1160448 A CN1160448 A CN 1160448A CN 95195672 A CN95195672 A CN 95195672A CN 95195672 A CN95195672 A CN 95195672A CN 1160448 A CN1160448 A CN 1160448A
Authority
CN
China
Prior art keywords
contact
circuit arrangement
chip
coil
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN95195672A
Other languages
English (en)
Other versions
CN1118039C (zh
Inventor
D·霍德奥
J·蒙迪戈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6527469&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN1160448(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Siemens AG filed Critical Siemens AG
Publication of CN1160448A publication Critical patent/CN1160448A/zh
Application granted granted Critical
Publication of CN1118039C publication Critical patent/CN1118039C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

电路装置具有一个平面的、含有至少两个接触片的载体，在该载体上安置一块半导体芯片，并与载体上相互隔离的接触片电连接，其中，至少两个接触片用于连接半导体芯片和一个线圈的两个末端，并且其中这两个接触片具有不同的长度，使任何一个线圈末端都不必与线圈绕组交叉。

Description

具有芯片卡模块和 与之相连线圈的电路装置
专利DE3029667 C2给出一种电路装置，该装置在柔韧的、不导电的薄垫一侧备有导电层。在薄垫上例如冲压出若干空隙，使通过这些空隙可以接触到面向薄垫一侧的导电层。此导电层通过例如刻蚀出凹槽分成为电学上相互隔离的接触区域，其中导电层的每个接触区与薄垫的一个空隙相对应。在某一个空隙中，优选在中央的一个空隙中***一半导体芯片，该芯片借助接合线与接触区连接。将半导体芯片和接合线浇注上浇注树脂加以保护。此种电路装置，即一种所谓的载体构件被装入一个塑料卡或者也称为芯片卡中，其中接触区与芯片卡表面大致位于同一平面，使读取站经接触区借助机械接触的半导体芯片提供电能和与半导体芯片交换信息。
专利EP0254640 B1给出具有接触区的电路装置的另一种方案。在此方案中金属薄片被冲出若干空隙，由这些空隙确定接触区域，这些区域只用一个外框相互连接在一起，并称为引线架(leadframe)。在近于中间的接触区内安装一块半导体芯片，该芯片借助接合线与其它接触区导电连接。此装置用合成树脂如此浇注，即只保留接触区域向外伸出的部分作为接触片，再经去除支承框使其相互隔离，并可用作半导体芯片的触点接通。
在两个已知电路装置中，借助机械接触经接触片提供驱动半导体芯片所需的电能以及与半导体芯片进行往返的数据交换。
由专利DE4115065 C2已知，例如一种无接触式数据和能量传输装置。在这种装置中半导体芯片与两个线圈连接，经这两个线圈无接触式，例如通过变压器变换传输数据和电能。
这种内部包含具有线圈的电路装置的芯片卡被大批量地进行生产。因此有必要采用一种快速、廉价和可自动化的方法制造这种芯片卡，为此，当然有必要使用一种适当结构的电路装置。
对至目前为止的无接触式芯片卡方案的分析表明，在芯片卡上线圈的末端以任意方式与线圈交叉地引至半导体芯片的连接点，然而这样做对自动化是不利的，因为此时一个线圈末端必与线圈的某一位置交叉。这样一种增厚结构的线圈是不利的，因为卡片覆盖层必须补偿此不适当的高度，从而在某些情况下将导致聚氯乙烯薄膜的显著变形。因为通常在覆盖层具有清晰的用户印刷照片，也就是说展示出一标识部分，所以位于未确定线圈交叉点区域内的局部变形有可能导致不希望的印刷像片的变形。
因此，本发明的任务是提出一种无触点式芯片卡的电路装置，使该芯片卡可简单、廉价和易于自动化制造。
此项任务通过权利要求1所述的电路装置得以解决。在从属权利要求中给出了良好的改进结构。
使用本发明电路结构就没有必要必须使一线路末端与平面线圈的绕组交叉，也就是说一种线圈的绕组，该种线圈的绕组彼此不重叠而是毗邻平放，致使可以不占据未确定的位置。因此在线圈末端的范围内也能实现明确的、几何上可确定的场力线结构。
必要的跨接可借助电路装置的两个接触片中较长的一个来实现。其中平面载体可以是一个引线架或者是一由金属覆盖的薄垫，例如覆铜玻璃环氧化物薄片。
接触片的末端可按有利的方式加以展宽，使线圈末端与接触片之间能够较易实现连接。
线圈通常具有的横截面积近似等于芯片卡的尺寸。半导体芯片可有利地安置在线圈的某角区，也就是安置在芯片卡的某角区，此处对IC的弯曲负荷最小。此处将两个接触片设置成相互垂直是特别有利的。
下面借助附图用几个实施例进一步阐述本发明。这些附图是：
图1：平面载体的底部视图示出接触区和接触片的结构。上部视图用虚线标出；
图2：图1所示具有浇注半导体芯片和线圈绕组的平面载体横截面图；
图3：采用引线架技术和合成树脂浇注的电路装置侧视图；
图4：图3所示电路装置的俯视图；
图5：具有有关接触片相互垂直的、采用引线架技术和合成树脂浇注的电路装置侧视图；
图6：图5所示电路装置的俯视图。
图1示出本发明电路装置平面载体的第一实施结构。平面载体包括一柔韧的、不导电的薄垫1，例如玻璃环氧化物薄片，此薄垫在一侧设置接触区2和设置与这些接触区连接的接触片8，接触片8具有展宽的末端9。此处，接触区2和具有展宽末端9的接触片8，例如由压制在薄垫上的金属薄片例如铜箔采用刻蚀工艺制成。图1中可看到点线示出的区域6，这些区域应表示薄垫另一侧的视图。在此涉及的是薄垫中的空隙，通过这些空隙可以接触到接触区2及接触片8、9面向薄垫的一侧。在图1中用虚线示出薄垫1的另一种结构。用实线示出的薄垫1的结构具有的优点为，薄垫中的空隙不是四周封闭的以便一线圈的末端更容易由该侧来固定。
图2示出了图1所示平面载体的一横截面，其中在空隙6的一个空隙中置入半导体芯片3。此半导体芯片3及其与接触区的电连接是用浇注树脂覆盖的，在此未示出电连接。此外，还可以看到线圈绕组5，其中两个外圈固定在接触片8、展宽末端9的空隙内，例如焊接上。通过应用本发明一个较短的和一个较长的接触片8可以使线圈无交叉地缠绕，使其末端相互之间以及与半导体芯片具有确定的位置。这种设置使易于自动化的、快速的和廉价的制造成为可能。
图3至图6示出本发明电路装置引线架技术的其它实施结构。在此，将一个未示出的半导体芯片及若干接触区浇注在外壳10内。在图3和图4中两个接触片11和12平行排列，其中接触片11比另一接触片12长。其中，图3示出这样一种电路装置的侧视图，图4示出此装置的俯视图。此外，在图中还可看到平面线圈的绕组13。正如可以清楚地看到的那样，以本发明不同长度的接触片为基础可以实现与线圈没有交叉。
图5和图6分别示出，本发明电路装置引线架技术的另一实施结构的侧视图和俯视图。在外壳10内浇注有半导体芯片以及与其有关的接触区，由此外壳10伸出两个相互垂直安装的接触区14、16。它们具有展宽的末端15和17，在这两个末端上例如用焊接可固定线圈13的末端。采用电路装置的这种结构有可能特别简单地把电路安置在线圈的某个角区。

Claims (11)

1、电路装置具有一个平面的、含有至少两个接触片的载体，在该载体上安置一块半导体芯片，并与载体上相互隔离的接触片电连接，其中，至少两个接触片用于连接半导体芯片和一个线圈的两个末端，并且其中这两个接触片具有不同的长度，使任何一个线圈末端都不必与线圈绕组交叉。
2、根据权利要求1所述的电路装置，
其特征在于，
平面载体是一种引线架。
3、根据权利要求1所述的电路装置，
其特征在于，
平面载体是一种覆盖导电层的、柔韧的、不导电的薄垫，其中接触片由导电层刻蚀出的结构所组成，同时半导体芯片及线圈末端通过薄垫中的空隙与面向薄垫一侧的导电层组成接触面的区域连接。
4、根据权利要求1至3之一所述的电路装置，
其特征在于，
接触片的末端构成一大面积接触区。
5、根据权利要求4所述的电路装置，就权利要求4往回推涉及到权利要求3而论，
其特征在于，
用于接通线圈末端的接触区在薄垫上是这样安置的，它们至少在一个线圈末端的引入方向不具有薄垫边缘。
6、根据权利要求1至5之一所述的电路装置，
其特征在于，
半导体芯片及与接触片的连接线采用起保护作用的塑料材料包封。
7、根据权利要求1至7之一所述的电路装置，
其特征在于，
线圈基本上为一矩形。
8、根据权利要求7所述的电路装置，
其特征在于，
半导体芯片安置在线圈的某一角区。
9、根据权利要求1至8之一所述的电路装置，
其特征在于，
至少两个接触片相互平行安置。
10、根据权利要求1至8之一所述的电路装置，
其特征在于，
至少两个接触片相互垂直安置。
11、根据权利要求1至8之一所述电路装置，
其特征在于，
至少两个接触片安置在半导体芯片的相对侧。
CN95195672A 1994-09-05 1995-09-05 具有芯片卡模块和与之相连线圈的电路装置 Expired - Lifetime CN1118039C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP4431604.6 1994-09-05
DE4431604A DE4431604A1 (de) 1994-09-05 1994-09-05 Schaltungsanordnung mit einem Chipkartenmodul und einer damit verbundenen Spule

Publications (2)

Publication Number Publication Date
CN1160448A true CN1160448A (zh) 1997-09-24
CN1118039C CN1118039C (zh) 2003-08-13

Family

ID=6527469

Family Applications (1)

Application Number Title Priority Date Filing Date
CN95195672A Expired - Lifetime CN1118039C (zh) 1994-09-05 1995-09-05 具有芯片卡模块和与之相连线圈的电路装置

Country Status (11)

Country Link
US (1) US5982628A (zh)
EP (1) EP0780004B1 (zh)
JP (1) JP2962580B2 (zh)
KR (1) KR100344887B1 (zh)
CN (1) CN1118039C (zh)
AT (1) ATE173848T1 (zh)
DE (2) DE4431604A1 (zh)
ES (1) ES2125648T3 (zh)
RU (1) RU2161330C2 (zh)
UA (1) UA54373C2 (zh)
WO (1) WO1996007982A1 (zh)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19654902C2 (de) * 1996-03-15 2000-02-03 David Finn Chipkarte
FR2747866B1 (fr) 1996-04-22 1998-06-19 Em Microelectronic Marin Sa Ensemble electronique comprenant une unite electronique reliee a une bobine
DE19640260A1 (de) * 1996-09-30 1998-04-02 Siemens Ag Kontaktlose Chipkarte
FR2769109B1 (fr) * 1997-09-26 1999-11-19 Gemplus Sca Dispositif electronique a puce jetable et procede de fabrication
JP3837215B2 (ja) * 1997-10-09 2006-10-25 三菱電機株式会社 個別半導体装置およびその製造方法
TW428149B (en) * 1998-05-28 2001-04-01 Shinko Electric Ind Co IC card and plane coil for IC card
FR2782822A1 (fr) * 1998-09-02 2000-03-03 Hitachi Maxell Module a semi-conducteur et procede de production
US6883714B2 (en) * 1998-12-14 2005-04-26 Stratos Lightwave, Inc. Methods of optical filament scribing of circuit patterns with planar and non-planar portions
WO2000038108A1 (en) * 1998-12-22 2000-06-29 Koninklijke Philips Electronics N.V. Device arranged for contactless communication and provided with a data carrier with fully enclosed holding means for holding a chip and a passive component
KR100441287B1 (ko) * 1999-03-24 2004-07-21 롬 가부시키가이샤 충전전지의 보호회로 모듈 및 그 제조방법
JP3513452B2 (ja) * 1999-07-02 2004-03-31 新光電気工業株式会社 非接触型ｉｃカードと非接触型ｉｃカードの製造方法と非接触型ｉｃカード用平面コイル
JP2001188891A (ja) * 2000-01-05 2001-07-10 Shinko Electric Ind Co Ltd 非接触型ｉｃカード
US8015592B2 (en) * 2002-03-28 2011-09-06 Innovation Connection Corporation System, method and apparatus for enabling transactions using a biometrically enabled programmable magnetic stripe
US8103881B2 (en) * 2000-11-06 2012-01-24 Innovation Connection Corporation System, method and apparatus for electronic ticketing
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US8082575B2 (en) 2002-03-28 2011-12-20 Rampart-Id Systems, Inc. System, method and apparatus for enabling transactions using a user enabled programmable magnetic stripe
WO2003084124A1 (en) * 2002-03-28 2003-10-09 Innovation Connection Corporation Apparatus and method for transactions security using biometric identity validation and contactless smartcard.
US7500307B2 (en) 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
US7623034B2 (en) 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
US7555826B2 (en) * 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
EP1816592A1 (en) * 2006-02-06 2007-08-08 Assa Abloy Identification Technology Group AB Method for producing a RFID tag with at least an antenna comprising two extremities and a integrated circuit chip
JP4947637B2 (ja) * 2007-01-09 2012-06-06 ソニーモバイルコミュニケーションズ株式会社 無接点電力伝送コイル、携帯端末及び端末充電装置
JP5540524B2 (ja) * 2009-02-20 2014-07-02 凸版印刷株式会社 非接触ｉｃシート、非接触ｉｃカード及び非接触ｉｃシートを備えた冊子体
DE102016114199B4 (de) 2016-08-01 2021-07-22 Infineon Technologies Ag Chipkartenmodul, chipkarte, chipkartenanordnung, verfahren zum ausbilden eines chipkartenmoduls und verfahren zum ausbilden einer chipkarte

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692604A (en) * 1984-10-25 1987-09-08 American Telephone And Telegraph Company, At&T Bell Laboratories Flexible inductor
US4996411A (en) * 1986-07-24 1991-02-26 Schlumberger Industries Method of manufacturing a card having electronic memory and a card obtained by performing said method
EP0379592A4 (en) * 1988-06-29 1991-06-19 Matsushita Electric Industrial Co. Ltd. Ic memory card
FR2641102B1 (zh) * 1988-12-27 1991-02-22 Ebauchesfabrik Eta Ag
DE4112857C2 (de) * 1990-04-27 1998-07-02 Aeg Ges Moderne Inf Sys Mbh Flüssigkristall-Anzeigevorrichtung
DE4105869C2 (de) * 1991-02-25 2000-05-18 Edgar Schneider IC-Karte und Verfahren zu ihrer Herstellung
EP0578701B1 (en) * 1991-04-03 1999-10-20 Integrated Silicon Design Pty. Ltd Article sorting system
JPH04321190A (ja) * 1991-04-22 1992-11-11 Mitsubishi Electric Corp 非接触型携帯記憶装置のアンテナ回路
US5272596A (en) * 1991-06-24 1993-12-21 At&T Bell Laboratories Personal data card fabricated from a polymer thick-film circuit
JP2672924B2 (ja) * 1992-07-30 1997-11-05 三菱電機株式会社 非接触ｉｃカードとその製造方法及びテスト方法
US5412192A (en) * 1993-07-20 1995-05-02 American Express Company Radio frequency activated charge card
US5581445A (en) * 1994-02-14 1996-12-03 Us3, Inc. Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module
FR2721732B1 (fr) * 1994-06-22 1996-08-30 Solaic Sa Carte à mémoire sans contact dont le circuit électronique comporte un module.

Also Published As

Publication number Publication date
ATE173848T1 (de) 1998-12-15
CN1118039C (zh) 2003-08-13
ES2125648T3 (es) 1999-03-01
DE59504352D1 (de) 1999-01-07
WO1996007982A1 (de) 1996-03-14
DE4431604A1 (de) 1996-03-07
RU2161330C2 (ru) 2000-12-27
KR100344887B1 (ko) 2002-09-18
KR970705802A (ko) 1997-10-09
US5982628A (en) 1999-11-09
EP0780004A1 (de) 1997-06-25
EP0780004B1 (de) 1998-11-25
JP2962580B2 (ja) 1999-10-12
JPH09512221A (ja) 1997-12-09
UA54373C2 (uk) 2003-03-17

Similar Documents

Publication Publication Date Title
CN1160448A (zh) 具有芯片卡模块和与之相连线圈的电路装置
KR100358786B1 (ko) 캐리어엘리먼트
KR100363296B1 (ko) 칩 모듈 및 칩 모듈 제조방법
US4047242A (en) Compact electronic control and power unit structure
US5598032A (en) Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module
CN1106626C (zh) 无接触式芯片卡
RU2412483C2 (ru) Электронный модуль с двойным интерфейсом связи, в частности, для пластиковой карты с микрочипом
CN1155913C (zh) 生产芯片卡的方法及芯片卡
EP0015111B1 (en) Lead frame and housing for integrated circuit
US6326683B1 (en) Carrier element for a semiconductor chip
CN1233334A (zh) 芯片卡－模块,包括芯片卡－模块的组合－芯片卡及其制造方法
KR100346803B1 (ko) Ｉｃ 카드, ｉｃ 카드용 안테나 및 그 안테나 프레임
US6797543B2 (en) Process for manufacturing IC card
FR2787609B1 (fr) Procede de fabrication de carte a puce sans contact
US20110074005A1 (en) Semiconductor device, method for fabricating a semiconductor device and lead frame, comprising a bent contact section
CN1329735A (zh) 无触点电子模块、带有该模块的芯片卡及制造该模块的方法
CN1118894C (zh) 高速传输连接器及其端子及端子的制造方法
US6043111A (en) Small size semiconductor package
CN1207688C (zh) 芯片模块的制造方法
CN1227647A (zh) 传输电信号的数据载体
KR20000076745A (ko) Ｉｃ 카드용 안테나 프레임 및 그 제조방법과 이를 이용한ｉｃ 카드의 제조 방법
EP1002296B1 (en) Data carrier comprising an implanted module based on a metal lead frame with a double-sided chip cover
JP2002500794A (ja) 金属リードフレームを主体とする差し込みモジュールを有するデータ媒体
CN1208487A (zh) 用于制造一种含有线圈的芯片卡的芯片卡体
US20020172018A1 (en) Smart-card module with an anisotropically conductive substrate film

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: INFINEON TECHNOLOGIES AG

Free format text: FORMER OWNER: SIEMENS AG

Effective date: 20120220

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20120220

Address after: Federal Republic of Germany City, Laura Ibiza Berger

Patentee after: Infineon Technologies AG

Address before: Munich, Germany

Patentee before: Siemens AG

CX01 Expiry of patent term

Expiration termination date: 20150905

Granted publication date: 20030813

EXPY Termination of patent right or utility model