CN115996876A - 盖带及电子部件包装体 - Google Patents
盖带及电子部件包装体 Download PDFInfo
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- CN115996876A CN115996876A CN202180046230.XA CN202180046230A CN115996876A CN 115996876 A CN115996876 A CN 115996876A CN 202180046230 A CN202180046230 A CN 202180046230A CN 115996876 A CN115996876 A CN 115996876A
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Abstract
盖带至少具有基材层和热封层,热封层含有聚苯乙烯系树脂(A)及乙烯‑(甲基)丙烯酸系共聚物(B),相对于(A)成分及(B)成分的合计100质量份而言,(A)成分及(B)成分的含量分别是大于80质量份且为95质量份以下及5质量份以上且小于20质量份。
Description
技术领域
本发明涉及盖带及电子部件包装体。
背景技术
伴随着电子设备的小型化,对于所使用的电子部件而言,小型高性能化也在发展。在电子设备的组装工序中,实施了在印刷基板上自动地安装部件的步骤。在这样的表面安装用的电子部件的搬运中,为了能够连续地供给电子部件,利用了在与电子部件的形状相应地连续热形成有凹处(pocket)的载带中收纳电子部件而得到的电子部件包装体。
电子部件包装体通过下述方式来制造:在载带的凹处收纳电子部件后,在载带的上表面重叠具有热封层的盖带作为盖材,利用经加热的热封棒将盖带的两端沿长度方向连续地热封(例如,参见专利文献1)。
现有技术文献
专利文献
专利文献1:日本特开2010-173673号公报
发明内容
发明所要解决的课题
近年来,电容器、电阻器、IC、LED、连接器、开关元件等各种电子部件的微细化、轻量化、薄型化发展显著,搭载于基板的部件的件数也逐渐增加。因此,从提高电子部件包装体的生产率的观点考虑,盖带的高速密封化的要求逐渐增涨。另外,从节能化的观点考虑,要求热封所需要的能量的降低。
作为应对这些要求的手段,可考虑降低盖带的热封层的软化温度,但在该情况下,伴随着热封层的软化温度的降低,存在带彼此容易贴合、容易发生粘连的倾向。
本发明是鉴于上述情况而作出的,其目的在于提供抑制粘连的发生、并且能以更少的热能进行热封的盖带及使用其的电子部件包装体。
用于解决课题的手段
为了解决上述课题,本发明的一个方面提供盖带,其至少具有基材层和热封层,热封层含有聚苯乙烯系树脂(A)及乙烯-(甲基)丙烯酸系共聚物(B),相对于(A)成分及(B)成分的合计100质量份而言,(A)成分及(B)成分的含量分别是大于80质量份且为95质量份以下及5质量份以上且小于20质量份。
上述的盖带不易发生粘连,并且能够以更少的热能进行热封。由此,防止由粘连导致的生产线的停止,并且热封的高速化、低温化成为可能,能够实现电子部件包装体的制造中的生产率的提高、节能化。
上述(A)成分可以包含苯乙烯系烃与共轭二烯系烃的共聚物、和耐冲击性聚苯乙烯。在该情况下,容易确保稳定的剥离强度。
从更少的热能下的密封性的呈现和对粘连的抑制的观点考虑,上述(B)成分可以包含乙烯-甲基丙烯酸甲酯共聚物。
本发明的另一个方面提供电子部件包装体,其具备:载带,所述载带具有收纳部;电子部件,所述电子部件收纳于载带的收纳部;和上述盖带,所述盖带作为盖材而热封于载带。
发明效果
根据本发明,可以提供抑制粘连的发生、并且能以更少的热能进行热封的盖带及使用其的电子部件包装体。
附图说明
[图1]为示出盖带的实施方式的示意截面图。
[图2]为示出电子部件包装体的一个实施方式的部分切口立体图。
具体实施方式
以下,对本发明的优选实施方式进行详细说明。
[盖带]
本实施方式的盖带至少包含基材层和热封层。
图1为示出盖带的实施方式的示意截面图。图1的(a)所示的盖带50具备基材层1、设置于基材层1的一面侧的热封层2、和设置于基材层1与热封层2之间的中间层3。另外,图1的(b)所示的盖带52在基材层1与热封层2之间设置有2层中间层3a、3b。本实施方式的盖带可以为未设置中间层的双层结构,也可以具有在基材层1的与热封层2相反的一侧还具备例如抗静电层等层的结构。另外,在不损害热封层的热封性的范围内,本实施方式的盖带也可以具有在热封层2的与基材层1相反的一侧还具备抗静电层等层的结构。
(基材层)
基材层可以为对包含聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯等聚酯树脂、聚丙烯等聚烯烃系树脂、尼龙等聚酰胺系树脂、聚苯乙烯系树脂、聚乙烯系树脂及聚碳酸酯树脂中的1种或2种以上的热塑性树脂的树脂组合物进行制膜而得到的膜。对于这些膜而言,从机械强度的观点考虑,优选为双轴拉伸膜,进而从透明性、强韧性的观点考虑,更优选为双轴拉伸聚对苯二甲酸乙二醇酯膜。
作为聚苯乙烯系树脂,可举出聚苯乙烯、高抗冲聚苯乙烯(HIPS:耐冲击性聚苯乙烯)、苯乙烯-丁二烯共聚物或其氢化物、苯乙烯-异戊二烯共聚物或其氢化物、苯乙烯与乙烯的接枝共聚物、苯乙烯-丁烯-丁二烯共聚物、甲基丙烯酸与苯乙烯的共聚物等在分子链中以1/2以上的摩尔比具有苯乙烯单元的聚合物。它们可以单独使用1种或者组合(以混合物的形式)使用2种以上。
作为聚乙烯系树脂,可举出低密度聚乙烯、直链状低密度聚乙烯、超低密度聚乙烯、乙烯-α烯烃、乙烯-乙酸乙烯酯共聚物、乙烯-(甲基)丙烯酸共聚物、乙烯-(甲基)丙烯酸甲酯共聚物、乙烯-(甲基)丙烯酸乙酯共聚物、乙烯-丙烯橡胶等在分子链中以1/2以上的摩尔比具有乙烯单元的树脂。它们可以单独使用1种或者组合(以混合物的形式)使用2种以上。
从获得对膜进行制膜时的挤出稳定性的观点考虑,基材层可以添加通常使用的抗氧化剂、润滑剂等各种添加剂。
基材层可以为单层,也可以具有多层结构。
从机械强度及热封时的导热性的观点考虑,基材层的厚度可以为5~100μm,可以为10~80μm,也可以为12~30μm。
(中间层)
中间层可以出于使基材层与热封层的粘接强度牢固的目的而设置,可以包含热塑性树脂。作为热塑性树脂,可举出:
(i)低密度聚乙烯、直链状低密度聚乙烯、及超低密度聚乙烯等聚乙烯树脂;
(ii)乙烯-1-丁烯、乙烯与不饱和羧酸的共聚物、乙烯-(甲基)丙烯酸酯共聚物、乙烯-乙酸乙烯酯共聚物、及进一步与酸酐形成的3元共聚物、以及它们的混合物;
(iii)苯乙烯-乙烯接枝共聚物、苯乙烯-丙烯接枝共聚物、苯乙烯-乙烯-丁二烯的嵌段共聚物、及它们的混合物;
等等。
从上述的目的及容易形成层的方面考虑,热塑性树脂优选为聚乙烯系树脂,更优选为低密度聚乙烯树脂、直链状低密度聚乙烯树脂。
另外,中间层可以具有2层以上的结构。在该情况下,能够通过制作热封层与中间层的共挤出膜来提高热封层的挤出稳定性,并且利用其他的中间层来提高共挤出膜与基材层的密合性。对于具有2层以上的结构的中间层而言,例如,可以是与热封层相接的一侧为包含上述(i)、(ii)及(iii)所示的树脂中的一种以上的第一中间层,与基材层相接的一侧为包含上述(i)及(ii)所示的树脂中的一种以上的第二中间层。
从获得对膜进行制膜时的挤出稳定性的观点考虑,中间层可以添加通常使用的抗氧化剂、润滑剂等各种添加剂。
从确保基材层与热封层的粘接强度及盖带的剥离强度的观点考虑,中间层的厚度可以为3~70μm,可以为5~60μm,也可以为10~50μm。
本实施方式的盖带可以具有2个以上的基材层及/或中间层。对于这样的盖带而言,例如,基材层及中间层可以具有基材层/中间层/基材层的3层结构,也可以具有中间层/基材层/中间层/基材层的4层结构。
本实施方式的盖带具有2个以上的基材层及/或中间层的情况下,为了使层间的粘接力牢固,可以使用已知的粘接剂。作为粘接剂,可举出异氰酸酯系粘接剂、乙烯亚胺系粘接剂等。从防止盖带的剥离强度的偏差变大的观点考虑,粘接剂的层的厚度优选为5μm以下。
(热封层)
热封层可以含有聚苯乙烯系树脂(A)(以下,也有时称为(A)成分。)及乙烯-(甲基)丙烯酸系共聚物(B)(以下,也有时称为(B)成分。)。具有这样的热封层的盖带容易确保对于聚苯乙烯制载带、聚碳酸酯制载带等各种材质的载带的密封性。
热封层中,作为(A)成分,可以包含苯乙烯系烃与共轭二烯系烃的共聚物、和耐冲击性聚苯乙烯,也可以包含它们的混合物。
作为苯乙烯系烃,可举出苯乙烯、α-甲基苯乙烯、各种烷基取代苯乙烯等。作为共轭二烯系烃,可举出丁二烯、异戊二烯等。
对于热封层而言,从盖带的剥离强度容易变得稳定的观点考虑,作为(A)成分,可以包含苯乙烯-丁二烯共聚物和耐冲击性聚苯乙烯,也可以包含它们的混合物。
从剥离强度的调节、成膜性的观点考虑,(A)成分可以包含50质量%以上95质量以下的苯乙烯系烃与5质量%以上50质量%以下的共轭二烯系烃的嵌段共聚物(A-1)(以下,也称为(A-1)成分。)、10质量%以上且小于50质量%的苯乙烯系烃与大于50质量%且为90质量%以下的共轭二烯系烃的嵌段共聚物(A-2)(以下,也称为(A-2)成分。)、及耐冲击性聚苯乙烯(A-3)(以下,也称为(A-3)成分。)。在该情况下,各自的含有比例相对于(A-1)成分、(A-2)成分及(A-3)成分的合计100质量份而言可以如下:(A-1)成分为20~40质量份,(A-2)成分为35~60质量份,以及,(A-3)成分为5~15质量份。
作为乙烯-(甲基)丙烯酸系共聚物(B),可举出乙烯-丙烯酸共聚物(EAA)、乙烯-甲基丙烯酸共聚物(EMAA)、乙烯-甲基丙烯酸甲酯共聚物(EMMA)、乙烯-丙烯酸乙酯共聚物(EEA)、乙烯-丙烯酸甲酯共聚物(EMA)、乙烯-甲基丙烯酸缩水甘油基酯-丙烯酸甲酯共聚物(EGMA-MA)。它们可以单独使用1种或者组合(以混合物的形式)使用2种以上。
对于(B)成分而言,从更少的热能下的密封性的呈现和对粘连的抑制的观点考虑,乙烯含有比率可以为60~95质量%,也可以为65~90质量%。
从获得对膜进行制膜时的挤出稳定性的观点考虑,热封层可以添加通常使用的抗氧化剂、润滑剂等各种添加剂。
从抑制粘连的发生、并且使得能以更少的热能进行热封的观点考虑,相对于(A)成分及(B)成分的合计100质量份而言,热封层中的(A)成分及(B)成分的含量分别可以设定成大于80质量份且为95质量份以下及5质量份以上且小于20质量份,也可以为82质量份以上95质量份以下及5质量份以上18质量份以下。另外,从抽出性的观点考虑,相对于(A)成分及(B)成分的合计100质量份而言,热封层中的(A)成分及(B)成分的含量分别可以为84质量份以上95质量份以下及5质量份以上16质量份以下,也可以为85质量份以上95质量份以下及5质量份以上15质量份以下。
热封层中的(A)成分及(B)成分的含量的合计以热封层总量为基准计可以为50质量%以上,可以为70质量%以上,可以为90质量%以上,也可以为100质量%。
上述的各层可以利用例如吹胀法、T模法、流延法、或压延法等方法来进行膜化。在该情况下,可以使用亨舍尔混合机、转鼓混合机、MAZELAR等混合机对构成各层的各成分进行掺混,将其直接用挤出机进行膜化,或者将掺混物暂时用单螺杆或双螺杆的挤出机进行混炼挤出而得到粒料后,将粒料进一步用挤出机挤出而进行膜化。
热封层可以利用下述方法形成:通过吹胀成型、T模挤出等挤出成型而制成膜的方法;将上述的(A)成分及(B)成分溶解于溶剂并涂敷至基材层的膜上的方法;及以水系的乳液的形式涂敷的方法;等等。
通过挤出成型来对热封层用的膜进行制膜的情况下,为了提高挤出稳定性,优选与中间层进行共挤出。例如,可以将构成中间层的树脂和构成热封层的树脂分别使用不同的单螺杆或双螺杆的挤出机进行熔融混炼,将两者介由进料头、多歧管模具进行层叠一体化后,从T模挤出,由此得到中间层与热封层层叠而成的双层膜。
另外,通过挤出成型得到的热封层用的膜可以利用干式层压、挤出层压等通常的方法与基材层层叠而制成盖带。
盖带的整体的厚度可以设定为30~100μm,可以为35~80μm,也可以为40~70μm。若为这样的范围,则容易确保带的强度和密封性。
本实施方式的盖带适合于电子部件的包装用途。作为电子部件,例如,可举出IC、LED(发光二极管)、电阻、液晶、电容器、晶体管、压电元件电阻器、滤波器、石英振荡器、石英振子、二极管、连接器、开关、电位器(volume)、继电器、电感器等。电子部件可以为使用了上述部件的中间制品,也可以为最终制品。
在上述用途的情况下,为了防止尘埃附着、使盖带本身的静电电荷消散,优选对基材层及热封层赋予抗静电性能。关于抗静电性能的赋予,作为通常使用的抗静电剂,可以使用表面活性剂型、导电性氧化金属微粒、电子传导性高分子。这些抗静电剂也可以根据所呈现的性能而混入树脂中,但从高效地呈现效果的观点考虑,可以利用凹版涂布机等涂敷于盖带的两个表层。
电子部件包装用的盖带例如可以热封于载带。
载带可以通过压空成型法、真空成型法等方法而设置有用于收纳电子部件的凹处。作为载带的材料,可以应用聚氯乙烯(PVC)、聚苯乙烯(PS)、聚酯(A-PET、PEN、PET-G、PCTA)、聚丙烯(PP)、聚碳酸酯(PC)、聚丙烯腈(PAN)、丙烯腈-丁二烯-苯乙烯共聚物(ABS)等容易进行片材成型的材料。这些树脂可以单独使用或者组合使用多种。载带也可以为由多个层形成的层叠体。
本实施方式的盖带可以与聚苯乙烯制载带、聚碳酸酯制载带等载带组合使用。
<电子部件包装体>
本实施方式的电子部件包装体具备:载带,其具有能收纳电子部件的收纳部;电子部件,其收纳于载带的收纳部;和本实施方式的盖带,其作为盖材而热封于载带。
图2为示出电子部件包装体的一个实施方式的部分切口立体图。图2所示的电子部件包装体200具备设置有收纳部20的压纹载带16、收纳于收纳部20的电子部件40、和热封于压纹载带16的覆盖膜50。在压纹载带16上设置有能用于IC等各种电子部件的封入工序等中的搬运的输送孔30。另外,在收纳部20的底部设置有用于检查电子部件的孔(省略图示)。
关于电子部件及载带,可举出上述的电子部件及载带。
本实施方式的电子部件包装体可以以卷绕成卷轴状的载带体的形式用于电子部件的保管及搬运。
本实施方式的电子部件包装体可以通过具备将本实施方式的盖带热封于在收纳部中收纳有电子部件的载带的工序的方法来制造。
盖带的热封可以使用能够对热封层施加规定的热量并且赋予规定的压力的、被称为密封烙铁的构件。可以以将这样的密封烙铁从盖带的上方按压于载带的方式使盖带热封于载带表面。作为具体的方法,可以应用一边搬运压纹载带一边经多次来按压密封烙铁的反复密封法、持续地使密封烙铁抵接于盖带侧而进行热封的连续密封法。
密封温度可以为100~240℃,也可以为120~220℃。
根据上述的制造方法,通过使用本实施方式的盖带,从而热封的高速化、低温化成为可能,能够实现电子部件包装体的制造中的生产率的提高、节能化。
实施例
以下,利用实施例及比较例来更具体地说明本发明,但本发明并不限定于以下的实施例。
(实施例1)
利用双螺杆挤出机对作为聚苯乙烯系树脂的苯乙烯-丁二烯共聚物(电化株式会社制,制品名称“CLEAREN 170ZR”,苯乙烯/丁二烯质量比=83/17)35质量份、苯乙烯-丁二烯共聚物(JSR株式会社制,制品名称“TR2000”,苯乙烯/丁二烯质量比=40/60)55质量份、高抗冲聚苯乙烯(Toyo Styrene公司制,制品名称“HIPS H870”)5质量份、及作为乙烯-(甲基)丙烯酸系共聚物的乙烯-甲基丙烯酸甲酯共聚物(住友化学株式会社制,制品名称“ACRYFT WH303-F”,甲基丙烯酸甲酯含量:18质量%,乙烯含量:82质量%)5质量份进行混炼,得到构成热封层的树脂组合物。利用基于T-模法的共挤出法,由该树脂组合物、和作为第一中间层的直链状低密度聚乙烯(UBE-MARUZEN POLYETHYLENE CO.,LTD.制,制品名称“UMERIT 2040F”)得到第一中间层(厚度为20μm)/热封层(厚度为10μm)的双层膜(总厚度为30μm)。利用挤出层压法,使该双层膜隔着由低密度聚乙烯树脂形成的第二中间层(厚度13μm)与双轴拉伸聚对苯二甲酸乙二醇酯膜(东洋纺株式会社制,制品名称“酯膜E5100”,厚度为16μm)层叠,得到实施例1的盖带。
(实施例2~8、比较例1~3)
使聚苯乙烯系树脂及乙烯-(甲基)丙烯酸系共聚物为表1所示的组成,除此以外,与实施例1同样地操作,分别得到实施例2~8及比较例1~3的盖带。
表1所示的原料的详情如下所述。
SBC:苯乙烯-丁二烯共聚物(电化株式会社制,制品名称“CLEAREN 170ZR”,苯乙烯/丁二烯质量比=83/17)
SBR:苯乙烯-丁二烯共聚物(JSR株式会社制,制品名称“TR2000”,苯乙烯/丁二烯质量比=40/60)
HIPS:高抗冲聚苯乙烯(Toyo Styrene公司制,制品名称“HIPS H870”)
EMMA:乙烯-甲基丙烯酸甲酯共聚物(住友化学株式会社制,制品名称“ACRYFTWH303-F”,甲基丙烯酸甲酯含量:18质量%,乙烯含量:82质量%)
EGMA-MA:乙烯-甲基丙烯酸缩水甘油基酯-丙烯酸甲酯共聚物(住友化学株式会社制,制品名称“BONDFAST BF-7M”,甲基丙烯酸缩水甘油基酯含量:6质量%,丙烯酸甲酯含量:27质量%,乙烯含量:67质量%)
EMA:乙烯-丙烯酸甲酯共聚物(Japan Polyethylene Corporation制,制品名称“Rexpearl EB240H”,丙烯酸甲酯含量:20质量%,乙烯含量:80质量%)
EEA:乙烯-丙烯酸乙酯共聚物(UBE-MARUZEN POLYETHYLENE CO.,LTD.制,制品名称“UBE Polyethylene ZE735”,丙烯酸乙酯含量:19质量%,乙烯含量:81质量%)
利用以下的方法对各实施例及各比较例的盖带进行评价。将结果示于表1。
[低温密封性的评价]
使用包带机(永田精机株式会社制,制品名称“NK-600”),在密封头宽度为0.5mm×2、密封头长度为24mm、密封压力为0.5kgf、进给长度为12mm、密封时间为0.3秒、密封烙铁温度为140℃的条件下,将21.5mm宽的盖带热封于24mm宽的聚苯乙烯制载带(电化株式会社制,制品名称“EC-R”)。然后,在温度为23℃、相对湿度为50%的气氛下,以每分钟300mm的剥离速度,以170°~180°的剥离角度将盖带剥离,测定此时的剥离强度,按下述的判定基准对低温密封性进行评价。
<判定基准>
A:剥离强度为0.2N以上
C:剥离强度小于0.2N
[耐粘连性的评价]
将制成21.5mm宽的录音带状卷绕体的盖带在温度为23℃、相对湿度为50%的气氛下静置1天之后,以每分钟2000mm的速度抽出,利用数显测力计测定抽出时的负荷。
另外,将盖带用手抽出,确认粘连的有无,按下述的判定基准对耐粘连性进行评价。
A:无粘连
B:有些地方存在粘连
C:整体存在粘连
[表1]
如表1所示,确认到:实施例1~8的盖带抑制粘连的发生,并且能以更少的热能进行热封。
另一方面,热封层不包含乙烯-(甲基)丙烯酸系共聚物的比较例1的盖带在于低温进行了密封时的剥离强度小,热封层中的乙烯-(甲基)丙烯酸系共聚物的含量超过本发明涉及的范围的比较例2及3的盖带在抽出时的负荷大,也发生了粘连。
附图标记说明
1…基材层,2…热封层,3、3a、3b…中间层,16…压纹载带,20…收纳部,30…输送孔,40…电子部件,50、52…盖带,200…电子部件包装体。
Claims (4)
1.盖带,其至少具有基材层和热封层,
所述热封层含有聚苯乙烯系树脂(A)及乙烯-(甲基)丙烯酸系共聚物(B),
相对于所述(A)成分及所述(B)成分的合计100质量份而言,所述(A)成分及所述(B)成分的含量分别是大于80质量份且为95质量份以下及5质量份以上且小于20质量份。
2.如权利要求1所述的盖带,其中,所述(A)成分包含苯乙烯系烃与共轭二烯系烃的共聚物、和耐冲击性聚苯乙烯。
3.如权利要求1或2所述的盖带,其中,所述(B)成分包含乙烯-甲基丙烯酸甲酯共聚物。
4.电子部件包装体,其具备:载带,所述载带具有收纳部;电子部件,所述电子部件收纳于所述载带的所述收纳部;和权利要求1~3中任一项所述的盖带,所述盖带作为盖材而热封于所述载带。
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JP2006008152A (ja) * | 2004-06-23 | 2006-01-12 | Denki Kagaku Kogyo Kk | カバーテープ |
JP2006321564A (ja) * | 2006-06-21 | 2006-11-30 | Denki Kagaku Kogyo Kk | 熱可塑性樹脂シート |
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US20090246518A1 (en) * | 2006-04-25 | 2009-10-01 | Denki Kagaku Kogyo Kabushiki Kaisha | Cover film |
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JP5296564B2 (ja) | 2009-01-28 | 2013-09-25 | 電気化学工業株式会社 | カバーフィルム |
MY152320A (en) * | 2009-03-13 | 2014-09-15 | Denki Kagaku Kogyo Kk | Cover film |
JP2021080024A (ja) * | 2019-11-15 | 2021-05-27 | 住友ベークライト株式会社 | カバーテープおよび電子部品包装体 |
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JP2004244115A (ja) * | 1999-08-31 | 2004-09-02 | Denki Kagaku Kogyo Kk | 電子部品のキャリアテープ用カバーフィルム及びその製造方法 |
JP2006008152A (ja) * | 2004-06-23 | 2006-01-12 | Denki Kagaku Kogyo Kk | カバーテープ |
US20090246518A1 (en) * | 2006-04-25 | 2009-10-01 | Denki Kagaku Kogyo Kabushiki Kaisha | Cover film |
JP2006321564A (ja) * | 2006-06-21 | 2006-11-30 | Denki Kagaku Kogyo Kk | 熱可塑性樹脂シート |
JP2008273602A (ja) * | 2007-05-02 | 2008-11-13 | Denki Kagaku Kogyo Kk | カバーフィルム |
US20110212324A1 (en) * | 2008-11-12 | 2011-09-01 | Denki Kagaku Kogyo Kabushiki Kaisha | Cover tape |
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US20230265317A1 (en) | 2023-08-24 |
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