CN1147930C - 半导体封装结构及其制造方法 - Google Patents

半导体封装结构及其制造方法

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Publication number
CN1147930C
CN1147930C CNB971087032A CN97108703A CN1147930C CN 1147930 C CN1147930 C CN 1147930C CN B971087032 A CNB971087032 A CN B971087032A CN 97108703 A CN97108703 A CN 97108703A CN 1147930 C CN1147930 C CN 1147930C
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CN
China
Prior art keywords
framework
wire
lead
conductor piece
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB971087032A
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English (en)
Chinese (zh)
Other versions
CN1185656A (zh
Inventor
申明进
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
Original Assignee
LG Semicon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Semicon Co Ltd filed Critical LG Semicon Co Ltd
Publication of CN1185656A publication Critical patent/CN1185656A/zh
Application granted granted Critical
Publication of CN1147930C publication Critical patent/CN1147930C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
CNB971087032A 1996-12-19 1997-12-17 半导体封装结构及其制造方法 Expired - Fee Related CN1147930C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR67949/1996 1996-12-19
KR67949/96 1996-12-19
KR1019960067949A KR100209760B1 (ko) 1996-12-19 1996-12-19 반도체 패키지 및 이의 제조방법

Publications (2)

Publication Number Publication Date
CN1185656A CN1185656A (zh) 1998-06-24
CN1147930C true CN1147930C (zh) 2004-04-28

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Application Number Title Priority Date Filing Date
CNB971087032A Expired - Fee Related CN1147930C (zh) 1996-12-19 1997-12-17 半导体封装结构及其制造方法

Country Status (5)

Country Link
US (2) US5994772A (de)
JP (1) JP2932432B2 (de)
KR (1) KR100209760B1 (de)
CN (1) CN1147930C (de)
DE (1) DE19755675B4 (de)

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US6501170B1 (en) 2000-06-09 2002-12-31 Micron Technology, Inc. Substrates and assemblies including pre-applied adhesion promoter
JP3405456B2 (ja) * 2000-09-11 2003-05-12 沖電気工業株式会社 半導体装置，半導体装置の製造方法，スタック型半導体装置及びスタック型半導体装置の製造方法
WO2006049533A2 (fr) * 2004-11-05 2006-05-11 Mikhail Evgenjevich Givargizov Dispositifs rayonnants et procedes de fabrication correspondants
DE102005043557B4 (de) * 2005-09-12 2007-03-01 Infineon Technologies Ag Verfahren zur Herstellung eines Halbleiterbauteils mit Durchkontakten zwischen Oberseite und Rückseite
USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD754083S1 (en) 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
TWI594380B (zh) * 2015-05-21 2017-08-01 穩懋半導體股份有限公司 封裝結構及三維封裝結構
JP1581768S (de) * 2016-08-02 2017-07-24
JP1642346S (de) * 2019-03-20 2019-09-30
JP1664282S (de) * 2019-07-24 2020-07-27
JP1660133S (de) * 2019-09-26 2020-05-25
USD951215S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951213S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951214S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951212S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
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DE19755675A1 (de) 1998-06-25
KR19980049257A (ko) 1998-09-15
KR100209760B1 (ko) 1999-07-15
US6190946B1 (en) 2001-02-20
JPH10189840A (ja) 1998-07-21
US5994772A (en) 1999-11-30

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