CN1147930C - 半导体封装结构及其制造方法 - Google Patents
半导体封装结构及其制造方法Info
- Publication number
- CN1147930C CN1147930C CNB971087032A CN97108703A CN1147930C CN 1147930 C CN1147930 C CN 1147930C CN B971087032 A CNB971087032 A CN B971087032A CN 97108703 A CN97108703 A CN 97108703A CN 1147930 C CN1147930 C CN 1147930C
- Authority
- CN
- China
- Prior art keywords
- framework
- wire
- lead
- conductor piece
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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KR67949/1996 | 1996-12-19 | ||
KR67949/96 | 1996-12-19 | ||
KR1019960067949A KR100209760B1 (ko) | 1996-12-19 | 1996-12-19 | 반도체 패키지 및 이의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1185656A CN1185656A (zh) | 1998-06-24 |
CN1147930C true CN1147930C (zh) | 2004-04-28 |
Family
ID=19489211
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB971087032A Expired - Fee Related CN1147930C (zh) | 1996-12-19 | 1997-12-17 | 半导体封装结构及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US5994772A (de) |
JP (1) | JP2932432B2 (de) |
KR (1) | KR100209760B1 (de) |
CN (1) | CN1147930C (de) |
DE (1) | DE19755675B4 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6350664B1 (en) | 1999-09-02 | 2002-02-26 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and method of manufacturing the same |
US6624522B2 (en) * | 2000-04-04 | 2003-09-23 | International Rectifier Corporation | Chip scale surface mounted device and process of manufacture |
US6501170B1 (en) | 2000-06-09 | 2002-12-31 | Micron Technology, Inc. | Substrates and assemblies including pre-applied adhesion promoter |
JP3405456B2 (ja) * | 2000-09-11 | 2003-05-12 | 沖電気工業株式会社 | 半導体装置,半導体装置の製造方法,スタック型半導体装置及びスタック型半導体装置の製造方法 |
WO2006049533A2 (fr) * | 2004-11-05 | 2006-05-11 | Mikhail Evgenjevich Givargizov | Dispositifs rayonnants et procedes de fabrication correspondants |
DE102005043557B4 (de) * | 2005-09-12 | 2007-03-01 | Infineon Technologies Ag | Verfahren zur Herstellung eines Halbleiterbauteils mit Durchkontakten zwischen Oberseite und Rückseite |
USD769832S1 (en) * | 2013-02-19 | 2016-10-25 | Sony Corporation | Semiconductor device |
USD754083S1 (en) | 2013-10-17 | 2016-04-19 | Vlt, Inc. | Electric terminal |
TWI594380B (zh) * | 2015-05-21 | 2017-08-01 | 穩懋半導體股份有限公司 | 封裝結構及三維封裝結構 |
JP1581768S (de) * | 2016-08-02 | 2017-07-24 | ||
JP1642346S (de) * | 2019-03-20 | 2019-09-30 | ||
JP1664282S (de) * | 2019-07-24 | 2020-07-27 | ||
JP1660133S (de) * | 2019-09-26 | 2020-05-25 | ||
USD951215S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
USD951213S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
USD951214S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
USD951212S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
CA202671S (en) * | 2021-04-09 | 2024-05-15 | 9493662 Canada Inc | Microfluidic slab with 2 well arrangements |
CA202670S (en) * | 2021-04-09 | 2024-05-15 | 9493662 Canada Inc | Microfluidic slab with 4 well arrangements |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2641869B2 (ja) * | 1987-07-24 | 1997-08-20 | 三菱電機株式会社 | 半導体装置の製造方法 |
US5198888A (en) * | 1987-12-28 | 1993-03-30 | Hitachi, Ltd. | Semiconductor stacked device |
FR2635916B1 (fr) * | 1988-08-23 | 1990-10-12 | Bull Sa | Support de circuit integre de haute densite et son procede de fabrication |
JP2816244B2 (ja) * | 1990-07-11 | 1998-10-27 | 株式会社日立製作所 | 積層型マルチチップ半導体装置およびこれに用いる半導体装置 |
TW258829B (de) * | 1994-01-28 | 1995-10-01 | Ibm | |
KR0139694B1 (ko) * | 1994-05-11 | 1998-06-01 | 문정환 | 솔더 볼을 이용한 반도체 패키지 및 그 제조방법 |
JP2780649B2 (ja) * | 1994-09-30 | 1998-07-30 | 日本電気株式会社 | 半導体装置 |
JP2967697B2 (ja) * | 1994-11-22 | 1999-10-25 | ソニー株式会社 | リードフレームの製造方法と半導体装置の製造方法 |
US5843215A (en) * | 1997-04-07 | 1998-12-01 | Warmm Sciences, Llc | Insect repellent coatings |
-
1996
- 1996-12-19 KR KR1019960067949A patent/KR100209760B1/ko not_active IP Right Cessation
-
1997
- 1997-12-08 US US08/986,146 patent/US5994772A/en not_active Expired - Lifetime
- 1997-12-15 DE DE19755675A patent/DE19755675B4/de not_active Expired - Fee Related
- 1997-12-17 CN CNB971087032A patent/CN1147930C/zh not_active Expired - Fee Related
- 1997-12-17 JP JP9347622A patent/JP2932432B2/ja not_active Expired - Fee Related
-
1999
- 1999-10-22 US US09/422,729 patent/US6190946B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1185656A (zh) | 1998-06-24 |
JP2932432B2 (ja) | 1999-08-09 |
DE19755675B4 (de) | 2007-12-27 |
DE19755675A1 (de) | 1998-06-25 |
KR19980049257A (ko) | 1998-09-15 |
KR100209760B1 (ko) | 1999-07-15 |
US6190946B1 (en) | 2001-02-20 |
JPH10189840A (ja) | 1998-07-21 |
US5994772A (en) | 1999-11-30 |
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