CN1155996C - 制造适于表面贴装的半导体器件的方法 - Google Patents

制造适于表面贴装的半导体器件的方法 Download PDF

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CN1155996C
CN1155996C CNB961904887A CN96190488A CN1155996C CN 1155996 C CN1155996 C CN 1155996C CN B961904887 A CNB961904887 A CN B961904887A CN 96190488 A CN96190488 A CN 96190488A CN 1155996 C CN1155996 C CN 1155996C
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semiconductor element
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K��H��ɣ��˹
K·H·桑德斯
G·J·杜因克肯
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Koninklijke Philips NV
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Abstract

一种半导体器件的制造方法，在半导体元件的第一面和第二面都有一个连接点，并备有与连接点进行电接触的导电条，将半导体元件进行封装，并加工导电条，使之进入器件的连接导体中，其特征在于半导体元件可通过导电条互连为半导体元件互连排，这样某个半导体元件的连接点可通过导电条与排中它之前的半导体元件的连接点相连接，所说的某个半导体元件的另一个连接点可与排中它之后的半导体元件的连接点相连接，之后将其封装在保护性材料中，并将半导体元件分离为有两个面的分立半导体器件，每个器件都有一段导电条，此后加工每个导电条，使之进入连接导体中，其中在侧面有导电层，它们与以上所说的导电条段相接触。

Description

制造适于表面贴装的半导体器件的方法
技术领域
本发明涉及一种制造适用于表面贴装的半导体器件的方法。
背景技术
日本专利申请JP-A-59-143348的英语摘要公开了开篇中的一种方法，由该方法制造的半导体二极管元件在连接点有两个铜导电条，此时它们形成二极管的阴极和阳极。二极管和每个导电条的一段封装在树脂中，之后加工导电条，使之进入连接导体中，其中导电条沿器件的侧面弯曲。
介绍的已知方法的缺点为器件的制造方法较昂贵，并且随着器件的日益小型化，半导体器件制造工艺另外会产生机械化的问题。
发明内容
因此，本发明的目的是消除以上缺点，提供一种成本低、使用简便、特别易于小型化的、制造适用于表面贴装的半导体器件的方法。本发明的方法，其中半导体元件的第一面和第二面都有一个连接点，相对的主表面备有与以上所说的连接点电接触的导电条，此后将半导体元件封装在保护性材料中，加工导电条，放之进入器件的连接导体中。
采用这种方法制造的器件适于表面贴装。这类器件，也称作带有“表面贴装器件”(SMDs)接点的半导体器件，和传统元件相比具有优越性，例如，SMDs可制作在印刷电路板的表面，器件的连接导体不必穿过印刷电路板上的孔，而传统的元件却需要。
根据本发明，用于该目的的方法的特征在于半导体元件可通过导电条互连为半导体元件相关排，这样通过导电条，某个半导体元件的连接点可与排中它之前的半导体元件的连接点相连接，所说的某个半导体元件的另一个连接点可与排中它之后的半导体元件的连接点相连接，之后将半导体元件排封装在保护性材料中，并将这些半导体元件相互分离为有两个侧面的分立半导体器件，每个器件都有一段相关的导电条，此后加工每个导电条，使之进入连接导体中，其中在侧面有导电层，它们与以上所说的导电条段相接触。
因此，在依据本发明的方法中，每次相邻的半导体元件的两个连接点互连时，半导体元件互连从而形成互连排。这里的连接点理解为连接半导体元件的点，例如，发射极、基极、集电极、源极、漏极或栅极连接。这样就建立了相关排，其中，例如，半导体元件在第一个主表面上的连接点与排中它之前的半导体元件的连接点相连接，而另一个连接点，也就是在第二个主表面上的连接点，与下一个半导体元件的连接点相连接。因此，可在一次操作中将互连半导体元件排封装在保护材料中。这在封装中可节省大量成本，而互连排也比已知方法中的分立半导体元件更易处理，这样在日益小型化的半导体器件的制造工艺中也不会产生机械化的问题。
半导体元件排可以封装，其中在半导体元件排上有保护层例如膏或涂料。优选地，依据本发明的方法的特征在于半导体元件排封装在保护性材料中，其中半导体元件排放置在模腔内，而以上所说模腔的是用树脂填充的。这种情况下半导体元件相关排使用的封装材料为，例如，环氧树脂。可在一个模腔内放置一个或多个半导体元件排，之后将元件排封装。封装后，例如，利用锯将元件排再分为分立的半导体器件。
此方法的特征在于半导体元件排放置在模腔内的支撑点上，而支撑点支撑导电条的位置就是将分离半导体元件的位置，而除了元件排上导电条的首尾端，导电条其余的部分都不与模腔壁相接触。在模腔内整个半导体元件排都以这种方式支撑着。然后由树脂基本上完全包围元件排。半导体元件将在导电条被支撑的位置处分离，器件的侧面也将在以后的制造工序中在这些位置处形成。除了元件排上导电条的首尾端和支撑点，导电条和模腔壁不再有其它接触点，也就是半导体元件排完全处在模腔内。导电条不从模腔内伸出，以便沿模腔边缘密封时，不必对导电条进行复杂的密封。由于按照这种方式，内含腔的模具部分很容易制造。半导体元件排上导电条的首尾端可放置在模腔外，例如，用于夹紧内含模腔的模具之间的元件排。然而，同样也可将导电条的首尾端完全放置在模腔内。这样就不必对导电条进行密封。
根据本发明，提供了一种适于表面贴装的封装的半导体器件的制造方法，该方法包括以下步骤：
a)提供多个分立的半导体元件，每一个半导体元件具有在其第一主表面的第一连接点和在其第二主表面的第二连接点，所述第二主表面与所述第一主表面相对；
b)借助多个导电金属条将所述多个分立的半导体元件互连成一个互连排，从而使得借助多个导电金属条中的第一导电金属条将所述多个分立半导体元件的所述第一连接点，该连接点不是该互连排的一个端点，连接到所述多个分立半导体元件中在上述半导体元件之前的一个分立半导体元件的所述第一连接点，并借助所述多个导电金属条中的第二导电金属条将所述分立半导体元件中的所述第二连接点连接到所述多个分立半导体元件的一个半导体元件的第二连接点，该分立半导体是在所述互连排中所述分立半导体元件之后；
c)用一种保护性材料封装所述互连排；
d)将封装的互连排分割以形成多个封装的半导体器件，每一个半导体器件包括所述多个半导体元件中的一个，所述的分割过程应使得所述保护性材料的侧面具有被分割的导电金属条的暴露部分；
e)对所述多个封装的半导体器件进行处理，以通过在所述侧面上形成与所述导电金属条的暴露部分相连接的导电层来提供连接导体。
优选地，导电金属条可为突起部分提供孔和接触点，半导体元件排被定位在模腔内使得突起嵌入孔内。这样用简单的方式就可将元件排定位在模腔内。
半导体器件的形状可以自由选择。然而，优选地，该方法的特征在于使用的模腔基本上为矩形，半导体元件排的纵向定位在模腔的纵向。分开后制造出的器件基本上为矩形。这种矩形非常适于表面贴装。
附图说明
下面将参照图对发明进行详细的介绍，其中：
图1显示的是使用本方法制造并贴装在印刷电路板上的半导体器件，且
图2到图7显示的是依据本发明的方法制造半导体器件的不同阶段。
各附图完全示意性的，并没有按比例画图。
在图中对应的部分一般给出了相同的参考数字。
具体实施方式
图1显示了适于表面贴装并用本方法制造的半导体器件1。器件1，也称作“表面贴装器件”(SMD)，和传统元件相比具有优越性，例如，SMD可制作印刷电路板20的表面，器件1的连接导体22不必穿过印刷电路板20上的孔，而传统的元件却需要。器件1放置在印刷电路板20的导电印刷线24上，连接导体2 2通过如焊料25与导电印刷线24相连接。
图2到图7显示的是依据本发明的方法制造半导体器件的不同阶段。图2显示了如何在半导体元件2的第一和第二面上的连接点3和4上外加导电条8，第一和第二面即为相对的主表面5和6，导电条和连接点3，4进行电接触。在这个例子中，半导体元件为晶体二极管，它的pn结在连接点3，4之间并与主表面5，6平行，连接点3，4构成二极管的阴极和阳极连接点。二极管基本上为方形，尺寸为1×1mm，厚度为0.5mm。在这个实施例中，导电条8是由铜制做的，它的长×宽x高尺寸为5×2×0.5mm。采用已有的焊接技术将导电条8与连接点3，4相接。根据本发明，半导体元件2通过导电条8进行互连，从而形成半导体元件2的互连排10，其中某个半导体元件2的连接点3可通过导电条8与排中它前面的半导体元件2’的连接点3’相连，以上所说的某个半导体元件2的另一个连接点4可与排中它后面的半导体元件2”的连接点4”相连。
图3显示的是如何将半导体元件排封装在保护材料中的，根据本发明，半导体元件2排放置在模腔12内，而模腔12的是用树脂填充的。半导体元件2互连排10使用的封装材料16为如环氧树脂之类。环氧树脂为用于封装半导体元件的本已知的材料。
优选地，半导体元件2的排10放置在模腔12内的支撑点15上，而支撑导电条8的位置就是将分开半导体元件2位置，而除了元件排10上导电条8的首尾端，导电条8其余的部分都不与模腔壁18相接触。在模槽12内整个半导体元件2的排10都以这种方式支撑着。然后元件排10基本上完全由树脂包围。导电条8仅在被支撑处没有被包围。除了元件排10上导电条8的首尾端和支撑点15，导电条8和模腔壁12不再有其它接触点，也就是半导体元件2的排10完全处在模腔12内。导电条8不从模腔12内伸出，以便沿模腔12边缘密封时，不必对导电条8进行复杂的密封。由于按照这种方式，很容易制造内含腔12的模具14，14'部分。半导体元件2的排上导电条8的首尾端可放置在模腔12外，如果需要这样的话，例如为夹紧内含腔12的模具14，14'之间的元件排10。同样，可以将导电条的首尾端完全放置在模腔内，这时只有支撑点15支撑元件排10。
优选地，导电条8有孔，而支撑点15有突起(未显示)，根据本方法，可将半导体元件2排10放入模腔12内突起嵌入孔中。这样用简单的方式就可将元件排10定位在模腔12内。
半导体器件1的形状可以自由选择。在这个例子中使用的模腔12实际为矩形，半导体元件2的排10纵向沿模腔的纵向放置(见图3)。之后制造出的器件1基本上为矩形(见图1)。这种矩形非常适合表面贴装。
图2显示的是外加保护性材料16后的半导体元件2排10。在模腔12内支持元件排10的支撑点15处，半导体元件2相互分离从而形成分立的半导体器件1，所说的器件有两个侧面7，每个侧面都有部分导电条8，例如，采用已知的锯切处理将元件排再分为单立的半导体器件1。然后被锯的表面形成侧面7。因为导电条8也被锯断，因此侧面7包含部分导电条8。导电条8经加工进入连接导体22中，其中在侧面7有导电层22’，22”，它们与以上所说的导部分电条8相接触。导电层包含导电性膏22’，它是用已知方式涂在侧面，例如，焊膏。焊膏外加了一个铜帽，在采用如焊接之类的已知技术例时，它可使半导体器件有良好的接触。
依据本发明的方法可在一次操作中将半导体元件2的互连排10封装在保护材料16中。这在封装中可节省大量成本，而排10也比已知方法中的分立半导体元件2更易处理，这样在日益小型化的半导体器件的制造工艺中也不会产生机械化的问题。
本发明并不局限在以上介绍的实施例。在该例子中，二极管的阴极和阳极连接点接到制造出的半导体器件的连接导体上。然而，其它连接点，例如，半导体元件的发射极、基极、集电极、源极、漏极或栅极的连接点，这类半导体例如晶体管、晶闸管和ICs，都可以使用依据本发明的方法接到连接导体上。
在方法中也可以接有两个以上连接点的半导体元件，例如晶体管或ICs。那么在每个主表面上有一个或几个导电条。在主表面有几条导电条的情形下，导电层以一种结构方式被配置在相应的侧面。随之，多于一条的连接导体可以被配置在一个侧面。可以通过照相平板印刷技术和蚀刻，和通过其他公知的技术，例如丝网印刷来完成将导电层以一种结构方式配置在相应侧面的过程。
在本例子中的导电条8是由铜做的，但也可用一些其它导电性材料替代用做导电条8。在本实施例中，连接点3与它之前的半导体元件2’的连接点3’相连接(见图2)。很显然也可以将连接点3连到它之前半导体元件2’的连接点4’上。那么假设前面元件2’的与元件2反相。
在本实施例中，电导电层22由焊膏和铜帽形成。同样，导电层22也可以仅包含导电膏或，例如，由电化学或汽相淀积技术生长的导电层。
制造半导体器件1的一些技术在以上介绍中都提到了。但这并不意味着依照本发明的方法仅能由这些技术完成。所以，例如，除了焊接也可以使用如导电粘合技术。

Claims (5)

1.一种适于表面贴装的封装的半导体器件的制造方法，该方法包括以下步骤：
a)提供多个分立的半导体元件(2，2’，2”)，每一个半导体元件具有在其第一主表面(5)的第一连接点(3，3’，3”)和在其第二主表面(6)的第二连接点(4，4’，4”)，所述第二主表面(6)与所述第一主表面(5)相对；
b)借助多个导电金属条(8)将所述多个分立的半导体元件互连成一个互连排(10)，从而使得借助多个导电金属条(8)中的第一导电金属条将所述多个分立半导体元件(2)的所述第一连接点(3)，该连接点不是该互连排的一个端点，连接到所述多个分立半导体元件(2，2’，2”)中在上述半导体元件(2)之前的一个分立半导体元件(2’)的所述第一连接点(3’)，并借助所述多个导电金属条(8)中的第二导电金属条将所述分立半导体元件(2)中的所述第二连接点(4)连接到所述多个分立半导体元件(2，2’，2”)的一个半导体元件(2”)的第二连接点(4”)，该分立半导体(2”)是在所述互连排(10)中所述分立半导体元件(2)之后；
c)用一种保护性材料(16)封装所述互连排(10)；
d)将封装的互连排(10)分割以形成多个封装的半导体器件，每一个半导体器件包括所述多个半导体元件(2，2’，2”)中的一个，所述的分割过程应使得所述保护性材料(16)的侧面(7)具有被分割的导电金属条(8)的暴露部分；
e)对所述多个封装的半导体器件进行处理，以通过在所述侧面(7)上形成与所述导电金属条的暴露部分相连接的导电层(22’，22”)来提供连接导体。
2.根据权利要求1的制造方法，其特征在于：半导体元件的互连排封装在保护材料中，其中半导体元件的互连排放置在模腔内，并用树脂填充所说模腔。
3.根据权利要求2的制造方法，其特征在于：半导体元件的互连排放置在模腔内的支撑点上，支撑点支撑导电金属条，支撑位置就是将分离半导体元件的位置，而除了元件的互连排上导电金属条的首尾端，导电金属条其余的部分都不与模腔壁相接触。
4.根据权利要求3的制造方法，其特征在于：导电金属条为突起部分提供孔和接触点，半导体元件的互连排被定位在模腔内以便突起嵌入孔内。
5.根据权利要求2，3和4中任一项的制造方法，其特征在于：模腔为矩形，半导体元件的互连排纵向定位在模腔的纵向。
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