CN112996238B - Circuit board assembly structure - Google Patents
Circuit board assembly structure Download PDFInfo
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- CN112996238B CN112996238B CN202110167098.XA CN202110167098A CN112996238B CN 112996238 B CN112996238 B CN 112996238B CN 202110167098 A CN202110167098 A CN 202110167098A CN 112996238 B CN112996238 B CN 112996238B
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- metal
- circuit board
- substrate
- layer
- assembly structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a circuit board assembly structure which comprises a printed circuit board and a ceramic thin film circuit board, wherein the ceramic thin film circuit board comprises a substrate, the substrate is provided with two metal through holes penetrating through the substrate, the two metal through holes on the front side of the substrate are connected through a network layer, the back side of the substrate is covered with a metal layer, and the metal layer and the two metal through holes are mutually isolated. The front surface of the printed circuit board is provided with a metal connecting layer and a metal signal layer, the connecting layer is isolated from the signal layer, the metal layer on the back surface of the substrate is welded with the connecting layer, and the two metal through holes on the back surface of the substrate are welded with the signal layer. The invention can improve the assembly reliability and the performance consistency.
Description
Technical Field
The invention relates to the technical field of circuit board assembly, in particular to a circuit board assembly structure.
Background
The ceramic film circuit has high dielectric constant, high processing precision and small temperature drift, and has excellent performance and wide application scene in the field of radio frequency microwave. However, the ceramic thin film circuit is usually assembled by adopting a micro-assembly process, the micro-assembly process is very complex, the bonding and gold wire bonding of the ceramic thin film circuit need manual control, and the assembly reliability and the product performance consistency are difficult to guarantee during mass production.
Disclosure of Invention
The invention mainly solves the technical problem of providing a circuit board assembly structure which can improve the assembly reliability and the performance consistency.
In order to solve the technical problems, the invention adopts a technical scheme that: the utility model provides a ceramic film circuit board, includes the base plate, the base plate is equipped with two and runs through the metal via hole of base plate, two positive metal via holes of base plate pass through the network layer and connect, the base plate back covers there is the metal level, mutual isolation between metal level and two metal via holes.
Preferably, the two metal vias are formed on two opposite sides of the substrate respectively.
Preferably, metal rings are formed on the peripheries of the front surface and the back surface of the substrate through the two metal through holes, the two metal through holes are connected with the metal rings, and the metal rings are connected with the network layer.
Preferably, a gap for realizing electrical isolation is formed between the metal layer on the back surface of the substrate and the metal ring on the periphery of the two metal vias.
Preferably, the void is annular in shape.
Preferably, the substrate is a dielectric substrate.
Preferably, the network layer is a microstrip straight-strip line.
Preferably, the network layer is a microstrip filter.
In order to solve the technical problems, the invention adopts a technical scheme that: the utility model provides a circuit board package assembly, including printed circuit board and aforementioned any kind of ceramic film circuit board, the printed circuit board openly is formed with the metallic connection layer and the metallic signal layer, the connection layer is kept apart from signal layer each other, the metal level at the base plate back welds with the connection layer, two metal via holes at the base plate back weld with the signal layer.
Preferably, the connecting layers are two segments and respectively formed on two sides of the front surface of the printed circuit board, the signal layers are two segments and arranged between the two segments of the connecting layers at intervals, and the substrate is arranged in the interval between the two segments of the signal layers.
Different from the prior art, the invention has the beneficial effects that: the metal layer is formed on the back surface of the substrate and covers the back surface of the substrate, so that the substrate can be welded, the assembly complexity is simplified, the assembly reliability is improved, and the assembly reliability and the performance consistency can be improved.
Drawings
Fig. 1 is a schematic top view of a ceramic thin film circuit board according to an embodiment of the present invention.
Fig. 2 is a schematic bottom view of the ceramic thin film circuit board shown in fig. 1.
Fig. 3 is a schematic top view of a circuit board assembly structure according to an embodiment of the invention.
Fig. 4 is a diagram of a simulation result of the circuit board assembly structure shown in fig. 3.
Fig. 5 is a schematic top view of a circuit board assembly structure according to another embodiment of the invention.
Fig. 6 is a diagram of a simulation result of the circuit board assembly structure shown in fig. 5.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
Referring to fig. 1 and 2, in the embodiment of the present invention, the ceramic thin film circuit board 10 includes a substrate 11, the substrate 11 is provided with two metal vias 12 penetrating through the substrate 11, the two metal vias 12 on the front surface of the substrate 11 are connected through a network layer 13, the back surface of the substrate 11 is covered with a metal layer 14, and the metal layer 14 and the two metal vias 12 are isolated from each other. The substrate 11 may be a dielectric substrate.
In this embodiment, the two metal vias 12 are respectively formed on two opposite side surfaces of the substrate 11, that is, the metal vias 12 are opened on the side surfaces of the substrate 11 and are non-closed arc-shaped holes. This facilitates welding of the metal circular hole 12. Of course, in other embodiments, the metal via 12 may also be opened in the middle of the substrate 11, and is a closed circular hole.
In order to improve the connection reliability, in the present embodiment, the two metal vias 12 are formed with the metal ring 121 on the outer periphery of the front surface and the back surface of the substrate 11, the two metal vias 12 are connected to the metal ring 121, and the metal ring 121 is connected to the network layer 13.
In order to effectively isolate the network layer 13 from the metal layer 14 and also to improve the soldering reliability of the metal layer 14, in the present embodiment, a gap 141 for achieving electrical isolation is formed between the metal layer 14 on the back surface of the substrate 11 and the metal ring 121 on the outer periphery of the two metal vias 12. The shape of the void 141 may also be annular.
The network layer 13 may be of different types according to different application scenarios, for example, the network layer 13 may be a microstrip straight line or a microstrip filter.
The ceramic thin-film circuit board 10 of the embodiment is characterized in that the metal layer 14 is arranged on the back surface of the substrate 11, and the metal layer 14 covers the back surface of the substrate 11 and is isolated from the network layer on the front surface of the substrate 11, so that the ceramic thin-film circuit board 10 can be welded on a printed circuit board, the welding reliability and convenience are far higher than those of a micro-assembly process, the assembly complexity is simplified, the assembly reliability is improved, and the reliability and consistency of ceramic thin-film circuit assembly can be improved.
Fig. 3 is a schematic top view of a circuit board assembly structure according to an embodiment of the invention. The circuit board assembly structure comprises a printed circuit board 20 and the ceramic thin film circuit board 10 of the previous embodiment, wherein a metal connecting layer 21 and a metal signal layer 22 are formed on the front surface of the printed circuit board 20, the connecting layer 21 and the signal layer 22 are isolated from each other, the metal layer 14 on the back surface of the substrate 11 is welded with the connecting layer 21, and the two metal through holes 12 on the back surface of the substrate 11 are welded with the signal layer 22. In the present embodiment, the network layer 13 is a microstrip straight line.
Circuit simulation is performed on the circuit board assembly structure of the present embodiment, and the simulation result is shown in fig. 4, and it can be seen from the graph that the insertion loss (curve a) is less than 0.5dB from 0.1GHz to 25GHz, the return loss (curve B) is less than 25dB, and the circuit performance is very excellent.
Fig. 5 is a schematic top view of a circuit board assembly structure according to another embodiment of the invention. The circuit board assembly structure comprises a printed circuit board 20 and the ceramic thin film circuit board 10 of the previous embodiment, wherein a metal connecting layer 21 and a metal signal layer 22 are formed on the front surface of the printed circuit board 20, the connecting layer 21 and the signal layer 22 are isolated from each other, the metal layer 14 on the back surface of the substrate 11 is welded with the connecting layer 21, and the two metal through holes 12 on the back surface of the substrate 11 are welded with the signal layer 22. In this embodiment, the network layer 13 is a microstrip filter with a passband frequency of 12.8GHz-16.4GHz.
Circuit simulation is performed on the circuit board assembly structure of the present embodiment, and a simulation result is shown in fig. 6, and it can be seen from the figure that, from 12.8GHz to 16.4GHz, the insertion loss is less than 1.5dB, the pass-band return loss is less than 15dB, and the suppression greater than 60dBc is performed at 10GHz and 20 GHz. Through the mode, the ceramic film circuit board and the circuit board assembly structure of the embodiment of the invention realize the welding assembly of the ceramic film circuit board, thereby simplifying the assembly complexity, improving the assembly reliability and the performance consistency and having excellent circuit performance.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. The term "comprising", without further limitation, means that the element so defined is not excluded from the group consisting of additional identical elements in the process, method, article, or apparatus that comprises the element.
Claims (9)
1. A circuit board assembly structure is characterized by comprising a printed circuit board and a ceramic film circuit board;
the ceramic thin film circuit board comprises a substrate, wherein the substrate is provided with two metal through holes penetrating through the substrate, the two metal through holes on the front surface of the substrate are connected through a network layer, the back surface of the substrate is covered with a metal layer, and the metal layer and the two metal through holes are isolated from each other;
the printed circuit board is characterized in that a metal connecting layer and a metal signal layer are formed on the front surface of the printed circuit board, the connecting layer is isolated from the signal layer, the metal layer on the back surface of the substrate is welded with the connecting layer, and the two metal through holes on the back surface of the substrate are welded with the signal layer.
2. The circuit board assembly structure of claim 1, wherein the two metal vias are formed on two opposite sides of the substrate.
3. The circuit board assembly structure of claim 2, wherein the two metal vias are formed with metal rings on the peripheries of the front and back surfaces of the substrate, the two metal vias are connected with the metal rings, and the metal rings are connected with the network layer.
4. The circuit board assembly structure of claim 3, wherein a gap for electrical isolation is formed between the metal layer on the back surface of the substrate and the metal ring at the periphery of the two metal vias.
5. The circuit board assembly structure according to claim 4, wherein the void is annular in shape.
6. The circuit board assembly structure of claim 1, wherein the substrate is a dielectric substrate.
7. The circuit board assembly structure of claim 1, wherein the network layer is a microstrip straight strip line.
8. The circuit board assembly structure of claim 1, wherein the network layer is a microstrip filter.
9. The circuit board assembly structure of claim 1, wherein the connection layer is formed in two segments on two sides of the front surface of the printed circuit board, the signal layer is formed in two segments and is disposed between the two connection layers at a spacing, and the substrate is disposed in the spacing between the two signal layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110167098.XA CN112996238B (en) | 2021-02-05 | 2021-02-05 | Circuit board assembly structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110167098.XA CN112996238B (en) | 2021-02-05 | 2021-02-05 | Circuit board assembly structure |
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| Publication Number | Publication Date |
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| CN112996238A CN112996238A (en) | 2021-06-18 |
| CN112996238B true CN112996238B (en) | 2022-12-06 |
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| CN202110167098.XA Active CN112996238B (en) | 2021-02-05 | 2021-02-05 | Circuit board assembly structure |
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Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5565262A (en) * | 1995-01-27 | 1996-10-15 | David Sarnoff Research Center, Inc. | Electrical feedthroughs for ceramic circuit board support substrates |
| JP3677398B2 (en) * | 1998-10-19 | 2005-07-27 | 京セラ株式会社 | Ceramic circuit board and electronic device |
| JP2001176992A (en) * | 1999-12-16 | 2001-06-29 | Jgc Corp | Thin-film ic |
| WO2013190392A2 (en) * | 2012-06-22 | 2013-12-27 | University Of Manitoba | Dielectric strap waveguides, antennas, and microwave devices |
| CN203057693U (en) * | 2013-01-25 | 2013-07-10 | 苏州斯尔特微电子有限公司 | Capacitive type ceramic circuit board |
| TWI542265B (en) * | 2013-10-11 | 2016-07-11 | 宏達國際電子股份有限公司 | Complex circuit board |
| US20160286644A1 (en) * | 2013-10-24 | 2016-09-29 | Cambridge Nanotherm Limited | Metal substrate with insulated vias |
| TWI713419B (en) * | 2018-02-09 | 2020-12-11 | 大陸商深南電路股份有限公司 | Printed circuit board and method of manufacturing the same and electronic apparatus |
| JP6446155B1 (en) * | 2018-07-17 | 2018-12-26 | 株式会社日立パワーソリューションズ | Double-sided circuit non-oxide ceramic substrate and manufacturing method thereof |
| CN211047392U (en) * | 2019-06-12 | 2020-07-17 | 深南电路股份有限公司 | Circuit board |
| CN110676548B (en) * | 2019-11-05 | 2021-06-25 | 成都八九九科技有限公司 | Microstrip circulator, isolator and T/R assembly |
| CN111063970A (en) * | 2019-12-27 | 2020-04-24 | 华南理工大学 | Microwave device and antenna |
| CN111465182B (en) * | 2020-03-26 | 2023-03-24 | 重庆思睿创瓷电科技有限公司 | Filter assembling method |
| CN212381457U (en) * | 2020-06-24 | 2021-01-19 | 上海矽安光电科技有限公司 | Metallized carrier plate |
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2021
- 2021-02-05 CN CN202110167098.XA patent/CN112996238B/en active Active
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| CN112996238A (en) | 2021-06-18 |
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