TWI542265B - Complex circuit board - Google Patents
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- TWI542265B TWI542265B TW102136823A TW102136823A TWI542265B TW I542265 B TWI542265 B TW I542265B TW 102136823 A TW102136823 A TW 102136823A TW 102136823 A TW102136823 A TW 102136823A TW I542265 B TWI542265 B TW I542265B
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Description
本發明是有關於一種電路板，且特別是有關於一種複合式電路板。 This invention relates to a circuit board and, more particularly, to a composite circuit board.
一般而言，通訊裝置之電路板上會配置微處理器及天線等電子元件。電子元件之間是藉由電路板的線路而彼此連接，從而進行資料的傳遞。然而，隨著各電子元件之間所需傳遞的資料量的不同，連接於電子元件之間的線路數量亦有所變化。也就是說，電路板上的佈線密度分配並非均一，舉例而言，微處理器主要是用於處理大多數的資料傳遞與控制動作，因此微處理器的線路區域的佈線密度相對高於其他電子元件的佈線密度，以便執行大筆資料量的運算與處理。 In general, electronic components such as a microprocessor and an antenna are disposed on a circuit board of a communication device. The electronic components are connected to each other by the circuit board, thereby transferring data. However, as the amount of data to be transferred between electronic components varies, the number of lines connected between the electronic components also varies. That is to say, the distribution of wiring density on the circuit board is not uniform. For example, the microprocessor is mainly used to handle most data transfer and control actions, so the wiring density of the circuit area of the microprocessor is relatively higher than other electronic The wiring density of components to perform large amounts of data calculation and processing.
隨著微處理器功能的增加以及電路板電子元件的多樣化，使得微處理器或是其他電子元件之間的線路數量不斷提高，方足以執行更大筆資料量的運算與處理，如此一來，造成電路板上的佈線密度必須不斷被提高。由於電路板上的面積有限，當線 路密度超過其限度時，勢必需要增加電路板的線路層數來滿足其線路佈局。 With the increase in the functionality of microprocessors and the variety of electronic components on the board, the number of lines between microprocessors or other electronic components is increasing, which is sufficient to perform larger amounts of data processing and processing. The wiring density on the board must be continuously increased. Due to the limited area on the board, when the line When the road density exceeds its limit, it is necessary to increase the number of circuit layers of the circuit board to meet its line layout.
本發明提供一種複合式電路板，其整合了軟式電路板與硬式電路板，在同一電路板的不同區域提供不同層數的線路結構，以因應各種不同電子元件之線路佈局的需要，並有助於降低電路板的整體厚度、簡化繁複的製程以及降低製造成本。 The invention provides a composite circuit board, which integrates a flexible circuit board and a hard circuit board, and provides different layer circuit structures in different areas of the same circuit board, in order to meet the needs of the circuit layout of various electronic components, and helps Reduce the overall thickness of the board, simplify complex processes and reduce manufacturing costs.
本發明的複合式電路板包括硬式電路板以及軟式電路板。硬式電路板具有第一多層線路結構。第一多層線路結構在硬式電路板的第一承載面上提供多個第一元件接點，且這些第一元件接點位於第一承載面的接合區外。軟式電路板配置於接合區內。軟式電路板具有第二多層線路結構。第二多層線路結構在軟式電路板的第二承載面上提供多個第二元件接點，並且電連接至第一多層線路結構。 The composite circuit board of the present invention includes a hard circuit board and a flexible circuit board. The rigid circuit board has a first multilayer wiring structure. The first multilayer wiring structure provides a plurality of first component contacts on the first load-bearing surface of the rigid circuit board, and the first component contacts are located outside the junction area of the first load-bearing surface. The flexible circuit board is disposed in the joint area. The flexible circuit board has a second multilayer wiring structure. The second multilayer wiring structure provides a plurality of second component contacts on the second carrier surface of the flexible circuit board and is electrically coupled to the first multilayer wiring structure.
在本發明的一實施例中，上述的接合區包括位於第一承載面上的凹陷，且軟式電路板配置於凹陷內。 In an embodiment of the invention, the bonding region includes a recess on the first bearing surface, and the flexible circuit board is disposed in the recess.
在本發明的一實施例中，上述的硬式電路板的第一承載面與軟式電路板的第二承載面相互共平面。 In an embodiment of the invention, the first bearing surface of the rigid circuit board and the second bearing surface of the flexible circuit board are coplanar with each other.
在本發明的一實施例中，上述的第一多層線路結構在硬式電路板的第一承載面上提供多個電路板接點。這些電路板接點位於接合區內，且軟式電路板接合至這些電路板接點。 In an embodiment of the invention, the first multilayer circuit structure provides a plurality of circuit board contacts on a first load bearing surface of the rigid circuit board. These board contacts are located in the bond area and the flexible circuit board is bonded to these board contacts.
在本發明的一實施例中，上述的複合式電路板更包括多個導電材。這些導電材連接於軟式電路板與這些電路板接點之間。 In an embodiment of the invention, the composite circuit board further includes a plurality of conductive materials. These conductive materials are connected between the flexible circuit board and the board contacts.
在本發明的一實施例中，上述的導電材包括焊料(solder)、導電膠(conductive paste)或異方性導電膜(Anisotropic Conductive Film,ACF)。 In an embodiment of the invention, the conductive material comprises a solder, a conductive paste or an anisotropic conductive film (ACF).
在本發明的一實施例中，上述的複合式電路板具有多個相互獨立的功能區。軟式電路板的數量為多個。這些軟式電路板分別具有不同層數的第二多層線路結構，且這些軟式電路板分別設置於不同的功能區內，使這些功能區具有不同層數的線路佈局。 In an embodiment of the invention, the composite circuit board has a plurality of functional zones that are independent of one another. The number of flexible boards is multiple. The flexible circuit boards respectively have different multilayered multilayer circuit structures, and the flexible circuit boards are respectively disposed in different functional areas, so that the functional areas have different layer layouts.
在本發明的一實施例中，上述的硬式電路板為印刷電路板。 In an embodiment of the invention, the hard circuit board is a printed circuit board.
在本發明的一實施例中，上述的軟式電路板為為高密度互連(High Density Inter-connection,HDI)軟式印刷電路板(Flexible Printed Circuit Board,FPCB)。 In an embodiment of the invention, the flexible circuit board is a High Density Inter-connection (HDI) Flexible Printed Circuit Board (FPCB).
基於上述，本發明的複合式電路板藉由將軟式電路板配置於硬式電路板上，以在不同區域內提供不同層數的線路佈局空間。其中，軟式電路板與硬式電路板可分別具有元件接點，而不同的電子元件可視其線路佈局的需求接合於不同的區域上。因此，應用本發明的複合式電路板可使線路佈局更具彈性，並僅需要在更高線路層數需求的區域內將高線路層數且線路結構整體厚度較薄的軟式電路板設置於硬式電板上，進而有助於降低電路板的整體厚度、簡化繁複的製程以及降低製造成本。 Based on the above, the composite circuit board of the present invention provides different layer layout space layouts in different areas by arranging the flexible circuit boards on the hard circuit board. Among them, the flexible circuit board and the rigid circuit board can respectively have component contacts, and different electronic components can be joined to different regions according to the requirements of their circuit layout. Therefore, the composite circuit board to which the present invention is applied can make the circuit layout more flexible, and only need to set the flexible circuit board with a high number of circuit layers and a thin overall thickness of the circuit structure in a hard area in a region requiring a higher number of circuit layers. On the board, it helps to reduce the overall thickness of the board, simplify complex processes and reduce manufacturing costs.
此外，硬式電路板對應於軟式電路板的位置上可形成凹陷，其中軟式電路板可設置於凹陷內，以使軟式電路板的第二承載面與硬式電路板的第一承載面相互共平面。如此一來，不僅可更進一步降低複合式電路板的整體厚度，亦有助於對後續接合的元件提供平整的接合面，以簡化製程，並確保製程可靠度。 In addition, the hard circuit board may form a recess corresponding to the position of the flexible circuit board, wherein the flexible circuit board may be disposed in the recess such that the second bearing surface of the flexible circuit board and the first bearing surface of the hard circuit board are coplanar with each other. In this way, not only can the overall thickness of the composite circuit board be further reduced, but also help to provide a flat joint surface for the subsequently joined components, thereby simplifying the process and ensuring process reliability.
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。 The above described features and advantages of the invention will be apparent from the following description.
10‧‧‧第一功能區 10‧‧‧First functional area
20‧‧‧第二功能區 20‧‧‧Second functional area
30‧‧‧第三功能區 30‧‧‧ third functional area
40‧‧‧第四功能區 40‧‧‧Fourth functional area
50‧‧‧第五功能區 50‧‧‧ fifth functional area
100A~100D‧‧‧電子裝置 100A~100D‧‧‧Electronic device
110‧‧‧硬式電路板 110‧‧‧hard circuit board
111‧‧‧第一多層線路結構 111‧‧‧First multilayer circuit structure
111a~111c‧‧‧第一絕緣層 111a~111c‧‧‧first insulation
111d~111g‧‧‧第一線路層 111d~111g‧‧‧first circuit layer
112‧‧‧第一承載面 112‧‧‧First bearing surface
112a‧‧‧接合區 112a‧‧‧ junction area
112b‧‧‧凹陷 112b‧‧‧ dent
113‧‧‧第一元件接點 113‧‧‧First component contact
114‧‧‧電路板接點 114‧‧‧Board contacts
120、130、140‧‧‧軟式電路板 120, 130, 140‧‧‧soft circuit board
121‧‧‧第二多層線路結構 121‧‧‧Second multilayer circuit structure
121a~121c‧‧‧第二絕緣層 121a~121c‧‧‧Second insulation
121d~121g‧‧‧第二線路層 121d~121g‧‧‧second circuit layer
122、132、142‧‧‧第二承載面 122, 132, 142‧‧‧ second bearing surface
123‧‧‧第二元件接點 123‧‧‧Second component contacts
圖1是本發明一實例的複合式電路板的剖面示意圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view showing a composite circuit board according to an example of the present invention.
圖2至圖4是本發明其他多個可能實施例的複合式電路板的剖面示意圖。 2 to 4 are schematic cross-sectional views of a composite circuit board according to other possible embodiments of the present invention.
圖5是圖4的複合式電路板的俯視圖。 Figure 5 is a top plan view of the composite circuit board of Figure 4.
本發明提出一種複合式電路板，其整合了軟式電路板與硬式電路板。就其線路結構而言，複合式電路板是以硬式電路板作為其主體，並且將至少一個以上的軟式電路板設置於硬式電路板的不同區域上。如此一來，複合式電路板不僅可於不同區域內提供不同層數的線路佈局空間，來因應各種不同電子元件之線路佈局的需要，亦能降低複合式電路板的整體厚度、簡化繁複製程 以及降低成本。以下，將藉由多個實施例來加以說明。 The present invention provides a composite circuit board that integrates a flexible circuit board and a hard circuit board. In terms of its wiring structure, the composite circuit board has a hard circuit board as its main body, and at least one or more flexible circuit boards are disposed on different areas of the hard circuit board. In this way, the composite circuit board can not only provide different layer layout space in different regions, but also can reduce the overall thickness of the composite circuit board and simplify the complicated copying process according to the needs of the circuit layout of various electronic components. And reduce costs. Hereinafter, it will be explained by a plurality of embodiments.
圖1是本發明一實施例的複合式電路板的剖面示意圖。請參考圖1，在本實施例中，複合式電路板100A包括硬式電路板110與軟式電路板120，前述兩者可透過表面黏著技術(SMT)或膠合等方式彼此接合且電性連接，其中導電膠或異方性導電膜即為兩者在膠合過程所通常採用的接著材料。 1 is a cross-sectional view showing a composite circuit board according to an embodiment of the present invention. Referring to FIG. 1 , in the embodiment, the composite circuit board 100A includes a rigid circuit board 110 and a flexible circuit board 120 , and the two can be bonded and electrically connected to each other through surface adhesion technology (SMT) or gluing. The conductive paste or the anisotropic conductive film is the bonding material commonly used in the gluing process.
一般而言，硬式電路板110例如是紙基材銅箔積層板(FR-1、FR-2、XXXPc、XPc)、紙．環氧樹脂銅箔積層板(FR-3)、玻璃布．環氧樹脂銅箔積層板(FR-4、G10)、耐熱玻璃布．環氧樹脂銅箔積層板(FR-5、G11)、玻璃布．聚醯亞胺系樹脂銅箔積層板(GPY)、紙．玻璃布．環氧樹脂銅箔積層板(CEM-1)、玻璃不織布．玻璃布．環氧樹脂銅箔積層板(CEM-2)、玻璃不織布．玻璃布．聚酯樹脂銅箔積層板(FR-6)或陶瓷等基材所構成印刷電路板。而軟式電路板120可為高密度互連軟式印刷電路板，其特點在於：即使在高層數的層狀結構下，仍可藉由且微埋孔、微盲孔或微導通孔等等，在有限的面積下，使得線路互連於層於層之間，而形成高密度互連的佈線態樣。以下，將藉由多個實施例加以說明。 In general, the rigid circuit board 110 is, for example, a paper substrate copper foil laminate (FR-1, FR-2, XXXPc, XPc), paper. Epoxy copper foil laminate (FR-3), glass cloth. Epoxy copper foil laminate (FR-4, G10), heat resistant glass cloth. Epoxy copper foil laminate (FR-5, G11), glass cloth. Polyimide resin copper foil laminate (GPY), paper. Glass cloth. Epoxy copper foil laminate (CEM-1), glass non-woven fabric. Glass cloth. Epoxy copper foil laminate (CEM-2), glass non-woven fabric. Glass cloth. A printed circuit board comprising a polyester resin copper foil laminate (FR-6) or a substrate such as ceramic. The flexible circuit board 120 can be a high-density interconnected flexible printed circuit board, and is characterized by: even in a layered structure of a high-level number, it can be used by micro-buried holes, micro-blind holes or micro-vias, etc. Under a limited area, the lines are interconnected between layers to form a wiring pattern of high density interconnects. Hereinafter, it will be explained by a plurality of embodiments.
請繼續參閱圖1，在本實施例中，硬式電路板110具有第一多層線路結構111，在此是以四層的線路結構作為舉例說明。也就是說，第一多層線路結構111例如是由三層第一絕緣層111a至111c以及四層第一線路層111d至111g所構成，其中第一線路層111d、111e分別位於第一絕緣層111a上與第一絕緣層111c上，而 第一線路層111f、111g則分別位於第一絕緣層111a與111b之間以及第一絕緣層111b與111c之間。 Referring to FIG. 1, in the present embodiment, the rigid circuit board 110 has a first multilayer wiring structure 111, which is exemplified by a four-layer wiring structure. That is, the first multilayer wiring structure 111 is composed of, for example, three first insulating layers 111a to 111c and four first wiring layers 111d to 111g, wherein the first wiring layers 111d and 111e are respectively located on the first insulating layer. 111a on the first insulating layer 111c, and The first wiring layers 111f, 111g are respectively located between the first insulating layers 111a and 111b and between the first insulating layers 111b and 111c.
應注意的是，在其他可能的實施例中，第一多層線路結構111的層數仍可視其需求而適度增減，也可以是兩層、六層、八層或十層等等。 It should be noted that in other possible embodiments, the number of layers of the first multilayer circuit structure 111 may still be moderately increased or decreased depending on the requirements thereof, and may also be two layers, six layers, eight layers or ten layers, and the like.
再者，第一多層線路結構111在硬式電路板110的第一承載面112上提供多個第一元件接點113，且第一元件接點113位於第一承載面112的接合區112a之外。其中，第一元件接點113例如是第一線路層111d的一部分，在後續製程中可將處理器、天線晶片、衛星定位晶片或無線網路晶片等電子元件接合於這些第一元件接點113上，而與硬式電路板110電連接。 Moreover, the first multilayer wiring structure 111 provides a plurality of first component contacts 113 on the first bearing surface 112 of the rigid circuit board 110, and the first component contacts 113 are located in the bonding region 112a of the first bearing surface 112. outer. The first component contact 113 is, for example, a part of the first circuit layer 111d. In the subsequent process, electronic components such as a processor, an antenna chip, a satellite positioning chip or a wireless network chip can be bonded to the first component contacts 113. Up, and electrically connected to the hard circuit board 110.
軟式電路板120具有第二多層線路結構121，在此是以四層的線路結構作為舉例說明。也就是說，第二多層線路結構121例如是由三層第二絕緣層121a至121c以及四層第二線路層121d至121g所構成，其中第二線路層121d、121e分別位於第二絕緣層121a上與第二絕緣層121c上，而第二線路層121f、121g則分別位於第二絕緣層121a與121b之間以及第二絕緣層121b與121c之間。 The flexible circuit board 120 has a second multilayer wiring structure 121, which is exemplified by a four-layer wiring structure. That is, the second multilayer wiring structure 121 is composed of, for example, three second insulating layers 121a to 121c and four second wiring layers 121d to 121g, wherein the second wiring layers 121d and 121e are respectively located in the second insulating layer. 121a is on the second insulating layer 121c, and the second wiring layers 121f, 121g are located between the second insulating layers 121a and 121b and between the second insulating layers 121b and 121c, respectively.
應注意的是，在其他可能的實施例中，第二多層線路結構121的層數仍可視其需求而適度增減，也可以是兩層、六層、八層或十層等等。 It should be noted that in other possible embodiments, the number of layers of the second multilayer circuit structure 121 may be moderately increased or decreased depending on the requirements thereof, and may also be two layers, six layers, eight layers, ten layers, and the like.
詳細而言，軟式電路板120配置於接合區112a內，而第 一多層線路結構111在硬式電路板110的第一承載面112上提供多個位於接合區112a內的電路板接點114，其中軟式電路板120接合至電路板接點114，且例如是透過位於第二絕緣層121c上的部分第二線路層121e與其電連接。為求穩固地接合軟式電路板120與硬式電路板110，並確保兩者之間的電連接關係，軟式電路板120與電路板接點114更具有連接兩者之間的導電材150。一般而言，導電材150可以是焊料、導電膠或異方性導電膜，但本發明不以此為限。 In detail, the flexible circuit board 120 is disposed in the junction area 112a, and the A multilayer wiring structure 111 provides a plurality of circuit board contacts 114 in the land 112a on the first carrier surface 112 of the rigid circuit board 110, wherein the flexible circuit board 120 is bonded to the board contacts 114 and is, for example, A portion of the second wiring layer 121e located on the second insulating layer 121c is electrically connected thereto. In order to firmly bond the flexible circuit board 120 and the hard circuit board 110 and ensure the electrical connection relationship therebetween, the flexible circuit board 120 and the circuit board contacts 114 have a conductive material 150 connecting the two. In general, the conductive material 150 may be a solder, a conductive paste or an anisotropic conductive film, but the invention is not limited thereto.
此外，第二多層線路結構121在軟式電路板120的第二承載面122上提供多個第二元件接點123。前述第二元件接點123例如是位於第二絕緣層121a上的第二線路層121d的一部分，並且電連接至第一多層線路結構111，換言之，前述電子元件亦可在後續製程中接合於這些第二元件接點123上，而與軟式電路電路板120電連接，其中前述電子元件通常是以焊接的方式接合於第一元件接點113或第二元件接點123上。 In addition, the second multilayer wiring structure 121 provides a plurality of second component contacts 123 on the second carrier surface 122 of the flexible circuit board 120. The foregoing second component contact 123 is, for example, a part of the second wiring layer 121d on the second insulating layer 121a, and is electrically connected to the first multilayer wiring structure 111. In other words, the foregoing electronic component may also be bonded in a subsequent process. These second component contacts 123 are electrically coupled to the flexible circuit board 120, wherein the aforementioned electronic components are typically soldered to the first component contact 113 or the second component contact 123.
更進一步而言，本實施例的接合區112a可以是位於第一承載面112上的凹陷112b，且軟式電路板120配置於凹陷112b內，而與位於凹陷112b內的電路板接點114相接合，其中凹陷112b例如是利用雷射移除部分區域之第一絕緣層111a而形成於硬式電路板110上。在本實施例中，凹陷112b的深度與軟式電路板120的厚度大致上相同，因此當軟式電路板120配置於凹陷112b內之後，硬式電路板110的第一承載面112與軟式電路板120的第二 承載面122相互共平面。也就是說，硬式電路板110的第一元件接點113與軟式電路板120的第二元件接點123位於同一表面上。如此，有助於對後續接合的元件提供平整的接合面，以簡化製程，並確保製程可靠度。 Furthermore, the land 112a of the present embodiment may be a recess 112b on the first bearing surface 112, and the flexible circuit board 120 is disposed in the recess 112b to be engaged with the board contact 114 located in the recess 112b. The recess 112b is formed on the rigid circuit board 110, for example, by using the first insulating layer 111a of the laser removing portion. In the present embodiment, the depth of the recess 112b is substantially the same as the thickness of the flexible circuit board 120. Therefore, after the flexible circuit board 120 is disposed in the recess 112b, the first carrying surface 112 of the rigid circuit board 110 and the flexible circuit board 120 second The bearing faces 122 are coplanar with each other. That is, the first component contact 113 of the rigid circuit board 110 and the second component contact 123 of the flexible circuit board 120 are on the same surface. This helps provide a flat joint for subsequent joined components to simplify the process and ensure process reliability.
承上述，藉由整合硬式電路板110與軟式電路板120不僅可在同一電路板的不同區域提供不同層數的線路結構，以因應各種不同電子元件之線路佈局的需要，並有助於降低電路板的整體厚度、簡化繁複的製程以及降低製造成本。舉例而言，現有的電子產品例如智慧手機大多以輕薄化、多工處理為作其訴求，卻難以有效兼顧電子產品的效能及續航力。本發明所提出的複合式電路板即能符合上述的設計趨勢與訴求，且在降低電路板的整體厚度的情況下，釋放出更多的內部配置空間作為設置大容量電池或相關電子元件之用，以於輕薄化、多工處理的產品訴求下，同時提升了電子產品的效能及續航力。 In the above, by integrating the rigid circuit board 110 and the flexible circuit board 120, not only different line layers can be provided in different areas of the same circuit board, but also in response to the line layout of various electronic components, and help to reduce the circuit. The overall thickness of the board, simplifying complicated processes and reducing manufacturing costs. For example, most of the existing electronic products, such as smart phones, are based on thin and light, multiplex processing, but it is difficult to effectively balance the performance and endurance of electronic products. The composite circuit board proposed by the invention can meet the above design trend and appeal, and release more internal configuration space for setting large-capacity battery or related electronic components while reducing the overall thickness of the circuit board. In order to improve the efficiency and endurance of electronic products, the products are demanded by thinner and more multiplexed products.
雖然上述實施例是以複合式電路板100A的態樣作為舉例說明，但非用以限制本發明。圖2至圖4是本發明其他多個可能實施例的複合式電路板的剖面示意圖。請參考圖2，圖2的複合式電路板100B與圖1的複合式電路板100A的不同處在於：複合式電路板100B的軟式電路板120配置於硬式電路板110的第一承載面112上，而與第一承載面112上的電路板接點114相接合，使得第一承載面112與第二承載面122具有一高度落差。此高度落差釋放出更多的內部配置空間作為設置大容量電池或相關電子 元件之用，如此不僅能符合輕薄化的設計趨勢與訴求，亦有助於提升電子產品的效能及續航力。 Although the above embodiment is exemplified by the aspect of the composite circuit board 100A, it is not intended to limit the present invention. 2 to 4 are schematic cross-sectional views of a composite circuit board according to other possible embodiments of the present invention. Referring to FIG. 2, the composite circuit board 100B of FIG. 2 is different from the composite circuit board 100A of FIG. 1 in that the flexible circuit board 120 of the composite circuit board 100B is disposed on the first carrying surface 112 of the rigid circuit board 110. And engaging with the board contact 114 on the first bearing surface 112 such that the first bearing surface 112 and the second bearing surface 122 have a height drop. This height drop frees up more internal configuration space for setting up large capacity batteries or related electronics The use of components not only meets the trend and appeal of thin and light design, but also helps to improve the performance and endurance of electronic products.
如圖3所示，圖3的複合式電路板100C相較於圖1的複合式電路板100A而言，複合式電路板100C分別具有將軟式電路板120配置於硬式電路板110的第一承載面112上，而與第一承載面112上的電路板接點114相接合，使得第一承載面110a與第二承載面120a具有一高度落差，以及將軟式電路板120配置於凹陷112b內，而與位於凹陷112b內的電路板接點114相接合，使得硬式電路板110的第一承載面112與軟式電路板120的第二承載面122相互共平面等態樣。如此配置下，亦可達到上述實施例所能獲致的技術功效。 As shown in FIG. 3, the composite circuit board 100C of FIG. 3 has a first load carrying the flexible circuit board 120 on the hard circuit board 110, respectively, compared to the composite circuit board 100A of FIG. The surface 112 is coupled to the circuit board contact 114 on the first bearing surface 112 such that the first bearing surface 110a and the second bearing surface 120a have a height difference, and the flexible circuit board 120 is disposed in the recess 112b. The first carrier surface 112 of the rigid circuit board 110 and the second carrier surface 122 of the flexible circuit board 120 are coplanar with each other in a manner similar to the board contact 114 located in the recess 112b. With such a configuration, the technical effects obtained by the above embodiments can also be achieved.
應注意的是，圖1的複合式電路板100A僅是以一個設置於凹陷112b內的軟式電路板120作為舉例說明，就實務上來說，因應各種不同電子元件的線路佈局需求，且為求符合輕薄化的產品設計趨勢，複合式電路板100D則配置如圖4所示，其具有多個不同層數的軟式電路板120(例如二層線路板)、軟式電路板130(例如四層線路板)以及軟式電路板140(例如六層線路板)。由於各個軟式電路板的層數不同，各個軟式電路板的厚度亦有所區別，因此軟式電路120、130與140例如是分別配置於具不同深度的凹陷112b內，並透過凹陷112b內的電路板接點114與硬式電路板110電連接。 It should be noted that the composite circuit board 100A of FIG. 1 is only exemplified by a flexible circuit board 120 disposed in the recess 112b. In practice, it is required to meet the line layout requirements of various electronic components. Lightweight product design trend, composite circuit board 100D is configured as shown in Figure 4, which has a plurality of different layers of flexible circuit board 120 (such as two-layer circuit board), flexible circuit board 130 (such as four-layer circuit board) And a flexible circuit board 140 (for example, a six-layer circuit board). Since the thickness of each flexible circuit board is different, the flexible circuits 120, 130, and 140 are respectively disposed in the recesses 112b having different depths, and pass through the circuit board in the recess 112b. The contact 114 is electrically connected to the hard circuit board 110.
詳細而言，設置於凹陷112b內的硬式電路板110的第一 承載面112分別與軟式電路板120的第二承載面122、軟式電路板130的第二承載面132以及軟式電路板140的第二承載面142係呈現相互共平面之態樣。也就是說，硬式電路板的第一元件接點與前述軟式電路板的各個第二元件接點例如是位於同一表面上。如此，有助於對後續接合的元件提供平整的接合面，以簡化製程，並確保製程可靠度。 In detail, the first of the rigid circuit board 110 disposed in the recess 112b The bearing surface 112 and the second bearing surface 122 of the flexible circuit board 120, the second bearing surface 132 of the flexible circuit board 130, and the second bearing surface 142 of the flexible circuit board 140 are mutually coplanar. That is, the first component contact of the rigid circuit board and the respective second component contacts of the aforementioned flexible circuit board are, for example, on the same surface. This helps provide a flat joint for subsequent joined components to simplify the process and ensure process reliability.
應注意的是，雖然上述實施例是以軟式電路板配置於凹陷內且各個軟式電路板的第二承載面與硬式電路板的第一承載面相互共平面來作說明，但在其他未繪示的實施例中，配置於凹陷內的軟式電路板的第二承載面亦可較高於硬式電路板的第一承載面或較低於硬式電路板的第一承載面，本發明對此不加以限制。 It should be noted that although the above embodiment is configured in which the flexible circuit board is disposed in the recess and the second bearing surface of each flexible circuit board and the first bearing surface of the rigid circuit board are coplanar, the other embodiments are not shown. In the embodiment, the second bearing surface of the flexible circuit board disposed in the recess may be higher than the first bearing surface of the hard circuit board or lower than the first bearing surface of the rigid circuit board, which is not limit.
圖5是圖4的複合式電路板的俯視圖，其中圖4之剖面結構是沿I-I剖線所繪示。請參考圖4與圖5，在本實施例中，複合式電路板100D可具有多個相互獨立的第一功能區10、第二功能區20、第三功能區30、第四功能區40與第五功能區50，其中這些功能區為了因應各種電子元件的不同線路佈局，而分別具有不同層數的線路結構。舉例而言，全球定位系統(GPS)晶片例如是配置於第一功能區10上，而第一功能區10內的線路結構的整體層數需為四層。中央處理單元(CPU)例如是配置於第二功能區20上，而第二功能區20內的線路結構的整體層數需至少為十層。電源管理單元例如是配置於第三功能區30上，而第三功能區30內的線路結構的整體層數需為四層。無線網路晶片例如是配置 於第四功能區40上，而第四功能區40內的線路結構的整體層數需為六層。射頻(Radio Frequency,RF)晶片例如是配置於第五功能區50上，而第五功能區50內的線路結構的整體層數需至少為八層。 5 is a top plan view of the composite circuit board of FIG. 4, wherein the cross-sectional structure of FIG. 4 is depicted along the I-I line. Referring to FIG. 4 and FIG. 5, in the embodiment, the composite circuit board 100D may have a plurality of mutually independent first functional areas 10, second functional areas 20, third functional areas 30, and fourth functional areas 40. The fifth functional area 50, wherein the functional areas have different number of line structures in order to accommodate different circuit layouts of various electronic components. For example, a Global Positioning System (GPS) chip is, for example, disposed on the first functional area 10, and the overall number of layers of the line structure in the first functional area 10 needs to be four layers. The central processing unit (CPU) is, for example, disposed on the second functional area 20, and the overall number of layers of the line structure in the second functional area 20 needs to be at least ten layers. The power management unit is, for example, disposed on the third functional area 30, and the overall number of layers of the line structure in the third functional area 30 needs to be four layers. Wireless network chip is for example configured On the fourth functional area 40, the overall number of layers of the line structure in the fourth functional area 40 needs to be six layers. The radio frequency (RF) chip is disposed, for example, on the fifth functional area 50, and the total number of layers of the line structure in the fifth functional area 50 needs to be at least eight layers.
換言之，上述各種晶片所需的線路結構的層數並不相同。舉例而言，在硬式電路板110為具有四層線路結構的多層線路板的情況下，製造者可視上述各種晶片的佈局需求，進一步於硬式電路板110上的不同功能區上配置相應的軟式電路板，而這些軟式電路板可分別具有不同層數的第二多層線路結構。 In other words, the number of layers of the line structure required for the various wafers described above is not the same. For example, in the case where the rigid circuit board 110 is a multi-layer circuit board having a four-layer line structure, the manufacturer can further configure a corresponding flexible circuit on different functional areas on the hard circuit board 110 according to the layout requirements of the above various wafers. The boards, and the flexible boards may each have a different number of layers of the second multilayer line structure.
詳細而言，由於全球定位系統(GPS)晶片與電源管理單元所需的線路結構的層數為四層，因此全球定位系統(GPS)晶片與電源管理單元例如是直接設置於硬式電路板110的第一承載面112上，即能符合其線路佈局的需求，而無需於功能區內增設軟式電路板。另一方面，中央處理單元(CPU)所需的線路結構的層數為至少十層，因此可於第二功能區20內設置第二多層線路結構的層數為至少六層的軟式電路板140，且在軟式電路板140與硬式電路板110結合之後，即可形成整體層數為十層的複合線路結構，以符合中央處理單元(CPU)的線路佈局的需求。 In detail, since the number of layers of the line structure required for the Global Positioning System (GPS) chip and the power management unit is four layers, the Global Positioning System (GPS) chip and the power management unit are directly disposed on the hard circuit board 110, for example. The first bearing surface 112 can meet the requirements of its circuit layout without adding a flexible circuit board in the functional area. On the other hand, the number of layers of the line structure required by the central processing unit (CPU) is at least ten layers, so that the flexible circuit board having the number of layers of the second multilayer circuit structure of at least six layers can be disposed in the second functional area 20. 140, and after the flexible circuit board 140 is combined with the hard circuit board 110, a composite circuit structure having a total number of layers of ten layers can be formed to meet the line layout requirements of the central processing unit (CPU).
此外，無線網路晶片所需的線路結構的層數為六層，因此可於第四功能區40內設置第二多層線路結構的層數為二層的軟式電路板120，且在軟式電路板120與硬式電路板110結合之後，即可形成整體層數六層的複合線路結構，以符合無線網路晶片的 線路佈局的需求。而射頻(Radio Frequency,RF)晶片所需的線路結構的層數為至少八層，因此可於第五功能區50內設置第二多層線路結構的層數為至少四層的軟式電路板130，且在軟式電路板130與硬式電路板110結合之後，即可形成整體層數至少八層的複合線路結構，以符合射頻(Radio Frequency,RF)晶片的線路佈局的需求。 In addition, the number of layers of the line structure required for the wireless network chip is six, so that the second circuit board 40 can be provided with the second layer of the flexible circuit board 120 having the second layer, and in the flexible circuit. After the board 120 is combined with the hard circuit board 110, a composite layer structure of six layers can be formed to conform to the wireless network chip. The need for line layout. The number of layers of the line structure required for the radio frequency (RF) chip is at least eight layers, so that the flexible circuit board 130 having the number of layers of the second multi-layer line structure of at least four layers can be disposed in the fifth functional area 50. After the flexible circuit board 130 is combined with the hard circuit board 110, a composite circuit structure having an overall number of layers of at least eight layers can be formed to meet the requirements of the line layout of a radio frequency (RF) chip.
如此配置下，可使得不同功能區內分別提供不同層數的線路佈局空間，而不同的電子元件可視其線路佈局的需求接合於不同的區域上。應注意的是，雖然本發明以上述實施例的複合式電路板100D的結構配置為範例做介紹，但非用以限制本發明，在其他可能的實施例中，製造者可針對不同電子元件的線路佈局需求，進一步調整設置於硬式電路板上的軟式電路板的線路結構的層數、接合區的位置以及接合區的面積大小等等。因此，應用本發明的複合式電路板可使線路佈局更具彈性。 In this configuration, different functional areas can be provided with different layers of line layout space, and different electronic components can be joined to different areas according to the requirements of their line layout. It should be noted that although the present invention is described by taking the structural configuration of the composite circuit board 100D of the above embodiment as an example, it is not intended to limit the present invention. In other possible embodiments, the manufacturer may target different electronic components. The layout requirements further adjust the number of layers of the circuit structure of the flexible circuit board disposed on the rigid circuit board, the position of the land, and the size of the land. Therefore, the composite circuit board to which the present invention is applied can make the circuit layout more flexible.
綜上所述，本發明的複合式電路板藉由將軟式電路板配置於硬式電路板上，以在不同區域內提供不同層數的線路佈局空間。其中，軟式電路板與硬式電路板可分別具有元件接點，而不同的電子元件可視其線路佈局的需求接合於不同的區域上。因此，應用本發明的複合式電路板可使線路佈局更具彈性，並僅需要在更高線路層數需求的區域內將高線路層數且線路結構整體厚度較薄的軟式電路板設置於硬式電路板上，進而有助於降低電路板的整體厚度、簡化繁複的製程以及降低製造成本。 In summary, the composite circuit board of the present invention provides a different layer layout space in different areas by arranging the flexible circuit board on the hard circuit board. Among them, the flexible circuit board and the rigid circuit board can respectively have component contacts, and different electronic components can be joined to different regions according to the requirements of their circuit layout. Therefore, the composite circuit board to which the present invention is applied can make the circuit layout more flexible, and only need to set the flexible circuit board with a high number of circuit layers and a thin overall thickness of the circuit structure in a hard area in a region requiring a higher number of circuit layers. On the board, it helps to reduce the overall thickness of the board, simplify complex processes and reduce manufacturing costs.
此外，硬式電路板對應於軟式電路板的位置上可形成凹陷，其中軟式電路板可設置於凹陷內，以使軟式電路板的第二承載面與硬式電路板的第一承載面相互共平面。如此一來，不僅可更進一步降低複合式電路板的整體厚度，亦有助於對後續接合的元件提供平整的接合面，以簡化製程，並確保製程可靠度。 In addition, the hard circuit board may form a recess corresponding to the position of the flexible circuit board, wherein the flexible circuit board may be disposed in the recess such that the second bearing surface of the flexible circuit board and the first bearing surface of the hard circuit board are coplanar with each other. In this way, not only can the overall thickness of the composite circuit board be further reduced, but also help to provide a flat joint surface for the subsequently joined components, thereby simplifying the process and ensuring process reliability.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.
100A‧‧‧電子裝置 100A‧‧‧Electronic device
110‧‧‧硬式電路板 110‧‧‧hard circuit board
111‧‧‧第一多層線路結構 111‧‧‧First multilayer circuit structure
111a~111c‧‧‧第一絕緣層 111a~111c‧‧‧first insulation
111d~111g‧‧‧第一線路層 111d~111g‧‧‧first circuit layer
112‧‧‧第一承載面 112‧‧‧First bearing surface
112a‧‧‧接合區 112a‧‧‧ junction area
112b‧‧‧凹陷 112b‧‧‧ dent
113‧‧‧第一元件接點 113‧‧‧First component contact
114‧‧‧電路板接點 114‧‧‧Board contacts
120‧‧‧軟式電路板 120‧‧‧Soft circuit board
121‧‧‧第二多層線路結構 121‧‧‧Second multilayer circuit structure
121a~121c‧‧‧第二絕緣層 121a~121c‧‧‧Second insulation
121d~121g‧‧‧第二線路層 121d~121g‧‧‧second circuit layer
122‧‧‧第二承載面 122‧‧‧Second bearing surface
123‧‧‧第二元件接點 123‧‧‧Second component contacts
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102136823A TWI542265B (en) | 2013-10-11 | 2013-10-11 | Complex circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102136823A TWI542265B (en) | 2013-10-11 | 2013-10-11 | Complex circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201515534A TW201515534A (en) | 2015-04-16 |
| TWI542265B true TWI542265B (en) | 2016-07-11 |
Family
ID=53437827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102136823A TWI542265B (en) | 2013-10-11 | 2013-10-11 | Complex circuit board |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI542265B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112996238B (en) * | 2021-02-05 | 2022-12-06 | 成都中科四点零科技有限公司 | Circuit board assembly structure |
| CN112969279A (en) * | 2021-02-05 | 2021-06-15 | 成都中科四点零科技有限公司 | Printed circuit board integrated with ceramic thin film circuit and manufacturing method thereof |
-
2013
- 2013-10-11 TW TW102136823A patent/TWI542265B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW201515534A (en) | 2015-04-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |