JPS60185403A - Circuit board - Google Patents
Circuit boardInfo
- Publication number
- JPS60185403A JPS60185403A JP4150284A JP4150284A JPS60185403A JP S60185403 A JPS60185403 A JP S60185403A JP 4150284 A JP4150284 A JP 4150284A JP 4150284 A JP4150284 A JP 4150284A JP S60185403 A JPS60185403 A JP S60185403A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- solder
- board
- copper foil
- foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Waveguides (AREA)
Abstract
Description
【発明の詳細な説明】
２べ−１
産業上の利用分野
本発明は、ＳＨＦ衛星放送受信装置に用いられるＳＨＦ
コンバータをはじめとする高周波機器等に用いられる回
路基板に関するもので、マイクロ波ストリップ線路を形
成したフッ素樹脂を用いた配線基板に関したものである
。[Detailed Description of the Invention] 2B-1 Industrial Application Field The present invention is directed to an SHF satellite broadcast receiver used in an SHF satellite broadcast
The present invention relates to circuit boards used in high frequency equipment such as converters, and relates to wiring boards using fluororesin on which microwave strip lines are formed.
従来例の構成どその問題点
マイクロ波ストリップ線路を用いて帯域通過フィルタや
トラップフィルタ、方向性結合器等を構成できるが、こ
れは第１図に示すようなプリント基板１」二の導電膜に
二つ以上のス） ＩＪツブ線路２゜３．４．７を所定の
間隔だけ離して配置するようにパターンを形成すると、
これらパターン間の間隔５．６．８の部分において電磁
波が結合し、前述のような回路要素を形成できる。しか
しながらこれらのストリップ線路は１０ＧＨ２以上のマ
イクロ波領域で使用されるため、導電帯表面のうず電流
が流れた時に表面の酸化による電流の損失が問題に々る
。このため、従来、ストリップ線路を形成したマイクロ
波回路配線基板の表面をガラス薄３べ−
膜やフッ化樹脂の薄膜で覆うかあるいは導電部に金めつ
きを施こして導電部表面の酸化を防止していたが、これ
らの方法はそれぞれ焼きつけ、スパッタ、めっき等特別
の工程を必要とし、複雑な処理を必要とするので、量産
性に問題がある。Problems with conventional configurations Microwave strip lines can be used to configure bandpass filters, trap filters, directional couplers, etc., but this is done by using a conductive film on a printed circuit board 1'' as shown in Figure 1. When a pattern is formed so that two or more IJ tube lines 2゜3.4.7 are arranged at a predetermined interval,
Electromagnetic waves are coupled at the intervals of 5.6.8 between these patterns to form the circuit element described above. However, since these strip lines are used in the microwave region of 10 GH2 or more, current loss due to surface oxidation becomes a problem when eddy current flows on the surface of the conductive band. For this reason, conventionally, the surface of a microwave circuit wiring board on which a strip line is formed is covered with a thin glass film or a thin film of fluoride resin, or the conductive parts are plated with gold to prevent oxidation of the conductive part surface. However, each of these methods requires special steps such as baking, sputtering, and plating, and requires complex processing, which poses problems in mass production.
発明の目的
本発明は」二連のような複雑な処理を必要とせずに導電
部表面の酸化を防止するだめの量産性に富む配線基板の
構造を有する回路基板を提供することを目的としている
。OBJECTS OF THE INVENTION It is an object of the present invention to provide a circuit board having a wiring board structure that is highly mass-producible and prevents oxidation of the surface of a conductive part without requiring complicated processing such as double wiring. .
発明の構成
本発明の回路基板は、フッ素樹脂基板の表面に形成され
た銅箔を含み、この基板のどちらか一表面上の銅箔によ
りマイクロ波ストリップ線路を形成し、同一表面上の複
数のストリップ線路が、フィルタ、トラップ、方向性結
合器等のマイクロ波における要素回路を構成するように
所定の間隙を隔てて配置し、これら銅箔の一部分あるい
は全部に、銅箔表面の酸化によるマイクロ波伝搬の損失
の増大を防止するための半田層を形成した構造をもつこ
とを特徴とする。Structure of the Invention The circuit board of the present invention includes a copper foil formed on the surface of a fluororesin substrate, and a microwave strip line is formed by the copper foil on one surface of the substrate, and a plurality of microwave strip lines on the same surface are connected to each other. The strip lines are arranged at predetermined intervals so as to constitute microwave element circuits such as filters, traps, directional couplers, etc., and microwave It is characterized by having a structure in which a solder layer is formed to prevent an increase in propagation loss.
実施例の説明 以下、図面を用いて本発明の詳細な説明する。Description of examples Hereinafter, the present invention will be explained in detail using the drawings.
第２図は本発明の一実施例の高周波回路基板の断面図で
ある。フッ素樹脂を用いた基板１０両面に導電箔９，１
Ｑを形成した回路基板の片面に導電箔９よりなるストリ
ップ線路を形成している。通常これら導電箔は電気抵抗
を考慮して銅箔が使用される。ストリップ線路が形成さ
れた而の反対側の表面には全面に導電箔１０を形成し、
これを通常接地してマイクロ波ストリップ線路を形成す
る。FIG. 2 is a sectional view of a high frequency circuit board according to an embodiment of the present invention. Conductive foils 9, 1 on both sides of the substrate 10 made of fluororesin
A strip line made of conductive foil 9 is formed on one side of the circuit board on which Q is formed. Usually, copper foil is used as the conductive foil in consideration of electrical resistance. A conductive foil 10 is formed on the entire surface on the opposite side from where the strip line is formed,
This is usually grounded to form a microwave strip line.
これら導電箔表面に半田層１１．１２がめっきされる。Solder layers 11 and 12 are plated on the surfaces of these conductive foils.
フッ素樹脂基板１は、その誘電率と基板の使用周波数に
より、基板厚みが選択され、０．３〜１鼎のものを用い
る。捷だ、前記銅箔９，１０は２５〜５ｏμ〃７の厚み
のものを使用する。これはストリップ線路パターンの形
成の容易さを考慮して選択される。The thickness of the fluororesin substrate 1 is selected depending on its dielectric constant and the frequency at which the substrate is used, and a thickness of 0.3 to 1 mm is used. However, the copper foils 9 and 10 used have a thickness of 25 to 5 .mu.m. This is selected considering the ease of forming the stripline pattern.
このような構成の高周波回路基板においてたとえばＳＨ
Ｆ衛星放送受信機用のダウンコンバータ５べ一〕
を作製する場合、１０ＧＨｚ以上の信号で動作する各要
素回路を形成するために複数のストリップ線路により形
成される間隙寸法は無アルカリガラスファイバ繊維に四
フッ化エチレン樹脂を含浸させた基板１ではおよそ６０
７ノ７７２程度になる。このように狭い間隔をもつ銅箔
よりなるス］・リップ線路上に半田によりメッキを施そ
うとした場合、従来では半田がこの間隙を埋てし甘い、
電気的短絡状態となると考えられていた。In a high frequency circuit board with such a configuration, for example, SH
When manufacturing a down converter 5 base for F satellite broadcast receiver, the gap size formed by multiple strip lines to form each element circuit that operates with signals of 10 GHz or higher is made of alkali-free glass fiber. Approximately 60 for substrate 1 impregnated with tetrafluoroethylene resin
It will be about 7772. When attempting to plate a strip line made of copper foil with such narrow spacing using solder, conventionally the solder fills in the gaps.
It was believed that this would result in an electrical short circuit.
しかしながら発明者はフッ素樹脂たとえば四フッ化エチ
レン材料は半田との親和性にきわめて乏しく、溶融した
半田をはじく性質があり、３０１１ｍ程度の厚みをもつ
銅箔により形成された二つのストリップ線路間の間隙が
３０μｍ以上であれば、この間隙をほぼ保持して銅箔の
表面に半田めっきを行なうことができることを発見した
。さらに、第２図に示すように銅箔９間の間隙に面した
銅箔の端面に半田が付着すると、間隙間の距離が変化し
て間隙で形成される電気的容量の値が変化し、その結果
、この間隙を利用して形成される高周波６ベー。However, the inventor explained that fluororesins such as tetrafluoroethylene materials have extremely poor affinity with solder and have the property of repelling molten solder. It has been discovered that if the gap is 30 μm or more, solder plating can be performed on the surface of the copper foil while substantially maintaining this gap. Furthermore, as shown in FIG. 2, when solder adheres to the end face of the copper foil facing the gap between the copper foils 9, the distance of the gap changes and the value of the electrical capacitance formed in the gap changes. As a result, a high frequency 6 base is formed using this gap.
要素回路の諸宗教が変化すると考えられるが、これにつ
いても発明者は検討を加え、基板１として四フーノ化エ
チレンを用いた場合には、回路定数の変化がほとんどな
いことを見い出した。通常この四フッ化エチレン樹脂を
無アルカリガラスファイバ繊維に含浸させて基板１を形
成する。半田めっきは、２００〜２５０°Ｃで溶融した
半田に配線基板を浸した９あるいは基板上を溶融半田を
流１〜たり、あるいは熱したブラシあるいはローラ等で
半田をこすりつけたシするといった簡単な方法で行なう
ことができる。このような方法で行なった半田めっきは
その表面に凸凹が生じるが、この凸凹に関しても、発明
者は検削を加え、１０ＧＨ２程度のマイクロ波帯での使
用においては問題がないことを確認した。なお本発明は
高周波用以外の基板にも用いることができることはいう
までもない。Although it is thought that the various religions of the element circuits change, the inventors also investigated this and found that when tetrafluorinated ethylene was used as the substrate 1, there was almost no change in the circuit constants. Usually, the substrate 1 is formed by impregnating non-alkali glass fibers with this tetrafluoroethylene resin. Solder plating can be done using a simple method such as dipping the wiring board in solder melted at 200 to 250°C, flowing the molten solder over the board, or rubbing the solder with a heated brush or roller. It can be done with Solder plating performed by such a method causes unevenness on the surface, but the inventor also performed inspection and confirmed that there is no problem with use in the microwave band of about 10 GH2. It goes without saying that the present invention can also be used for substrates other than those for high frequencies.
発明の効果
上述のように本発明の回路基板を用いると、非常に簡便
な方法により基板上の導電箔の酸化を防止するととがで
き、回路の安定性を長期間にわた７ベーソ
って向上させることができる。寸だ、従来、高価な材料
あるいは処理装置を必要とした複雑な工程を一切必要と
せず、量産性を大幅に向上させることができる。Effects of the Invention As described above, when the circuit board of the present invention is used, oxidation of the conductive foil on the board can be prevented by a very simple method, and the stability of the circuit can be improved by 7 basis over a long period of time. can be done. In fact, there is no need for any complicated processes that conventionally required expensive materials or processing equipment, and mass productivity can be greatly improved.
第１図は従来のマイクロ波ストリップ線路により構成さ
れる高周波回路基板を説明するだめの概略平面図、第２
図は本発明の一実施例による７ノ素樹脂を用いた高周波
回路基板に半田めっきを施した構成を説明するだめの断
面図である。
１・・・・・配線基板、９，１０・・・・・導電箔、１
１゜１２・・・・半田層。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図Figure 1 is a schematic plan view for explaining a high frequency circuit board composed of a conventional microwave strip line;
The figure is a cross-sectional view illustrating a configuration in which a high frequency circuit board using a 7-base resin is solder-plated according to an embodiment of the present invention. 1... Wiring board, 9, 10... Conductive foil, 1
1゜12...Solder layer. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
figure
Claims (4)
銅箔よりなる複数のスト！Ｊ ：／プ線路部が所定の間
隙を隔てて配置され、前記ス） ＩＪツブ線路部表面の
少くとも一部分を半田層で覆っていることを特徴とする
回路基板。(1) Multiple strips made of copper foil on one surface of a printed wiring board containing fluorine resin! J:/ A circuit board characterized in that the IJ tube line portions are arranged at a predetermined gap, and at least a portion of the surface of the IJ tube line portion is covered with a solder layer.
上であることを特徴とする特許請求の範囲第１項記載の
回路基板。(2) The circuit board according to claim 1, wherein the gap between the IJ knob lines is 30μ or 7 or more.
四フッ化エチレン樹脂を含浸させて形成したものである
ことを特徴とする特許請求の範囲第１項記載の回路基板
。(3) The circuit board according to claim 1, wherein the board containing fluororesin is formed by impregnating glass fiber with tetrafluoroethylene resin.
により動作させることを特徴とする特許請求の範囲第１
項記載の回路基板。(4) Claim 1, characterized in that the strip line is operated by a high frequency signal of 10 GHz or higher.
Circuit board as described in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59041502A JP2752966B2 (en) | 1984-03-05 | 1984-03-05 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59041502A JP2752966B2 (en) | 1984-03-05 | 1984-03-05 | Circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60185403A true JPS60185403A (en) | 1985-09-20 |
| JP2752966B2 JP2752966B2 (en) | 1998-05-18 |
Family
ID=12610128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59041502A Expired - Lifetime JP2752966B2 (en) | 1984-03-05 | 1984-03-05 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2752966B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01160202A (en) * | 1987-12-17 | 1989-06-23 | Hitachi Chem Co Ltd | Manufacture of wiring board |
| JP2012114696A (en) * | 2010-11-25 | 2012-06-14 | Mitsubishi Electric Corp | High-frequency circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5227557A (en) * | 1975-08-27 | 1977-03-01 | Hitachi Ltd | Method of manufacturing wiring substrate |
| JPS5352264A (en) * | 1976-10-25 | 1978-05-12 | Hitachi Ltd | Soldering method |
| JPS58166609A (en) * | 1982-03-27 | 1983-10-01 | ダイキン工業株式会社 | Composite dielectric |
-
1984
- 1984-03-05 JP JP59041502A patent/JP2752966B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5227557A (en) * | 1975-08-27 | 1977-03-01 | Hitachi Ltd | Method of manufacturing wiring substrate |
| JPS5352264A (en) * | 1976-10-25 | 1978-05-12 | Hitachi Ltd | Soldering method |
| JPS58166609A (en) * | 1982-03-27 | 1983-10-01 | ダイキン工業株式会社 | Composite dielectric |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01160202A (en) * | 1987-12-17 | 1989-06-23 | Hitachi Chem Co Ltd | Manufacture of wiring board |
| JP2012114696A (en) * | 2010-11-25 | 2012-06-14 | Mitsubishi Electric Corp | High-frequency circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2752966B2 (en) | 1998-05-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |