JPH04170202A - Planer dielectric filter - Google Patents
Planer dielectric filterInfo
- Publication number
- JPH04170202A JPH04170202A JP2295310A JP29531090A JPH04170202A JP H04170202 A JPH04170202 A JP H04170202A JP 2295310 A JP2295310 A JP 2295310A JP 29531090 A JP29531090 A JP 29531090A JP H04170202 A JPH04170202 A JP H04170202A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- side end
- filter
- metallic plate
- input
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims description 19
- 239000004020 conductor Substances 0.000 abstract description 23
- 238000009966 trimming Methods 0.000 abstract description 7
- 238000003825 pressing Methods 0.000 abstract description 3
- 238000005219 brazing Methods 0.000 abstract description 2
- 238000001259 photo etching Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 11
- 238000005530 etching Methods 0.000 description 8
- 238000001465 metallisation Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
Landscapes
- Control Of Motors That Do Not Use Commutators (AREA)
- Non-Reversible Transmitting Devices (AREA)
- Waveguides (AREA)
Abstract
Description
【発明の詳細な説明】
・ (発明の属する技術分野)
本発明はマイクロ波帯の通信機器に用いられる小形て量
産性に富む平面形誘電体フィルタに関する。DETAILED DESCRIPTION OF THE INVENTION - (Technical Field to which the Invention Pertains) The present invention relates to a planar dielectric filter that is small and can be mass-produced for use in microwave band communication equipment.
(従来の技術)
マイクロ波帯フィルタの一つとしてス1〜リップ導体を
利用した小型で軽量な平面形誘電体フィルタかある。図
6は従来の平面形誘電体フィルタの一部切欠斜視図であ
り、図7は外部接続用の端子のあるフィルタの斜視図で
ある。(Prior Art) As one type of microwave band filter, there is a small and lightweight planar dielectric filter using a slip conductor. FIG. 6 is a partially cutaway perspective view of a conventional planar dielectric filter, and FIG. 7 is a perspective view of a filter with external connection terminals.
図6に示すように、従来の平面形誘電体フィルタは、一
つの誘電体基板lの一方主表面に一端短絡他端開放の届
波長ストリップ導体3及び4がメタライズあるいはエツ
チングにより並列配置され、これに入出力端子5及び6
が設けられている。この誘電体基板1の他方主表面には
接地導体7が設けられており、もう一つの誘電体基板2
の一方主表面を残した他の面に接地導体8が設けられた
ものとを図示のように重ね合わせてガラス等で融着固着
させるか、機械的に固定してつくられている。As shown in FIG. 6, in a conventional planar dielectric filter, wavelength strip conductors 3 and 4 with one end shorted and the other end open are arranged in parallel on one main surface of one dielectric substrate l by metallization or etching. Input/output terminals 5 and 6
is provided. A ground conductor 7 is provided on the other main surface of this dielectric substrate 1, and another dielectric substrate 2
The ground conductor 8 is provided on one main surface and the other surface is superimposed as shown in the figure and fused and fixed with glass or the like, or mechanically fixed.
かかる従来の平面形誘電体フィルタは次のような欠点が
ある。Such conventional planar dielectric filters have the following drawbacks.
(1)ストリップ導体3及び4が、銀ペーストや銅ペー
ストを印刷、焼成するメタライズ法で形成された場合、
その導体断面は図5のように厚みが一定とならず、この
ため対向する誘電体基板2とストリップ導体3及び4の
間に隙間ができ、共振周波数か大幅にばらつくことにな
る。このため、フィルタとして所要の特性を出すために
、大幅なトリミングを必要とし、量産を効果的に行うこ
とが困難であった。(1) When the strip conductors 3 and 4 are formed by a metallization method in which silver paste or copper paste is printed and fired,
The thickness of the cross section of the conductor is not constant as shown in FIG. 5, and as a result, a gap is created between the dielectric substrate 2 and the strip conductors 3 and 4, which face each other, and the resonance frequency varies considerably. For this reason, extensive trimming is required in order to obtain the required characteristics as a filter, making it difficult to effectively mass-produce the filter.
(2)ストリップ導体3及び4が、誘電体基板1゜2に
全面めっきで導体をつけ、その後エツチングにより所要
の導体パターンを形成する方法の場合は、メタライズ法
のように導体の厚みの均一性かなくなることはない。し
かし、誘電体基板1. 2に金属めっきする場合は、密
着強度を高めるため、まず下地としてニッケルやクロム
など比較的電気抵抗の大きい金属を無電解めっきをし、
その後銅、金、銀のような電気抵抗の小さい金属を電解
めっきで付けることになる。(2) If the strip conductors 3 and 4 are formed by plating the entire surface of the dielectric substrate 1゜2 and then forming the required conductor pattern by etching, the thickness of the conductor should be uniform as in the metallization method. It will never go away. However, the dielectric substrate 1. When plating metal on 2, in order to increase the adhesion strength, electroless plating is first performed on a metal with relatively high electrical resistance, such as nickel or chromium, as a base.
After that, metals with low electrical resistance such as copper, gold, and silver are applied by electrolytic plating.
このため、高周波電流密度の高い基板面側の導体抵抗が
大きくなり、メタライズ法に比べ損失が増加する。われ
われの試作結果では、メタライズ法に比へ、めっき・エ
ツチング法はI GHzにおいて1〜2割のQの低下が
確認された。このため、損失の少ないフィルタの用途に
使うことが困難であった。Therefore, the conductor resistance on the side of the substrate where the high frequency current density is high increases, and the loss increases compared to the metallization method. In our trial production results, it was confirmed that the plating/etching method lowers the Q by 10 to 20% at I GHz compared to the metallization method. For this reason, it has been difficult to use it as a filter with low loss.
(3)フィルタとして無線機器に用る場合は入出力の引
出線が必要である。従来は図7(A)に示すように誘電
体基板lと2の間に薄い板を入れて引出線9としていた
。ところがこの方法では引出線9の板厚分誘電体基板l
と2の間(ど隙間かできるため、実効誘電率か下がり小
形化への障害となる。この対策として同図(B)に示す
ように、誘電体基板の寸法を変えたものを組合わせて引
出線10を露出させる方法もあるか、誘電体基板を製造
する際の抜型か2種類になり、初期投資が大きいこと、
誘電体基板1に引出線10を電気的機械的に接続するた
めのスペースか必要なため、小形化への障害となるとい
う難点かある。(3) When used as a filter in wireless equipment, input/output leader lines are required. Conventionally, as shown in FIG. 7(A), a thin plate was inserted between dielectric substrates 1 and 2 to serve as a leader line 9. However, in this method, the thickness of the dielectric substrate l of the leader wire 9 is
and 2 (because a gap is created, the effective permittivity decreases and becomes an obstacle to miniaturization.As a countermeasure to this problem, as shown in the same figure (B), a combination of dielectric substrates with different dimensions is used. There are two methods: exposing the leader wire 10, or using a cutting die when manufacturing the dielectric substrate, and the initial investment is large;
Since a space is required to electrically and mechanically connect the lead wire 10 to the dielectric substrate 1, there is a problem in that it becomes an obstacle to miniaturization.
以上まとめると次のようになる。The above can be summarized as follows.
(1)メタライズ法による導体形成−導体厚の不拘−−
トリミング量大=量産性に問題あり(2)めっき・エツ
チングによる導体形成−導体損失の増加=特性の劣化
(3)外部引出線=実効誘電率の低下=接続スペースが
必要=形状大
(発明が解決しよとする課題)
本発明の目的は、以上述へた従来例にあった導体形成法
、外部引出線の課題を解消し、小形でトリミング量が少
なく量産性に優れ、経済的な平面形誘電体フィルタを提
供することにある。(1) Formation of conductor by metallization method - Regardless of conductor thickness -
Large amount of trimming = Problems with mass production (2) Conductor formation by plating and etching - Increase in conductor loss = Deterioration of characteristics (3) External lead wire = Decrease in effective dielectric constant = Connection space required = Large shape (invention (Problems to be Solved) The purpose of the present invention is to solve the problems of the conductor forming method and external leader wires in the conventional examples mentioned above, and to create a compact, economical flat surface with less trimming and excellent mass productivity. An object of the present invention is to provide a shaped dielectric filter.
(課題を解決しようとする手段) 図1は本発明の実施例の構成を示す分解斜視図である。(Means to try to solve the problem) FIG. 1 is an exploded perspective view showing the configuration of an embodiment of the present invention.
誘電体基板11.12の一方主表面及び一対の側端面に
は全面メタライズ導体16.17が形成されている。フ
ィルタを形成するために必要な共振用電極13a〜13
e及び入出力電極15a、 15bはこれらを保持する
部分と共に1枚の金属板20に板金プレス加工やフォト
エツチングによって作られる。A full-surface metallized conductor 16.17 is formed on one main surface and a pair of side end surfaces of the dielectric substrate 11.12. Resonant electrodes 13a to 13 necessary to form a filter
e and the input/output electrodes 15a, 15b, together with the parts that hold them, are made on a single metal plate 20 by sheet metal pressing or photo etching.
基板11と12の他方主表面を対向させ、その間に金属
板20を挟んで重ね、側端面電極16.17と金属板2
0の側端面をろう付けにより電気的接続及び機械的固定
を行う。次にプレスガイド穴14を基準として、不要な
金属・板部分をプレス加工により破線で示した部分を切
断して図2のごとく、フィルタ完成品が得られる。18
a〜18dは電気的には接地端子となり、15a、15
bは入出力用のホット端子となる。接地端子18aと2
8a間の金属板は、安定な挟着固定状態を保つと共に電
磁シールドの役割を果たしている。The other main surfaces of the substrates 11 and 12 are made to face each other, the metal plate 20 is sandwiched between them, and the side end surface electrodes 16, 17 and the metal plate 2 are stacked.
Electrical connection and mechanical fixation are performed by brazing the side end surfaces of 0. Next, using the press guide hole 14 as a reference, the unnecessary metal/plate portion is press-worked to cut the portion indicated by the broken line to obtain a finished filter product as shown in FIG. 18
A to 18d are electrically ground terminals, and 15a and 15
b becomes a hot terminal for input/output. Ground terminals 18a and 2
The metal plates between 8a maintain a stable clamping and fixing state and also play the role of an electromagnetic shield.
表面実装部品としての端子形状を要求される場合は、こ
の後さらに端子成形をし、図3の側面図に示す形にする
こともてきる。If a terminal shape as a surface mount component is required, the terminal may be further formed into the shape shown in the side view of FIG. 3 after this.
導体として、1枚の金属板20を用いているので、厚み
は均一であり、従来の印刷・焼成によるメタライズ法の
表面あらさか3μ口であるのに対し、0゜3μmの表面
あらさの金属板か一般品で入手することかできる。この
ためメタライズ品に比へ10倍の均一性を得ることかで
き、従来のメタライズ電極の厚みの不均一により生じる
電気的特性のバラツキをおさえることかでき、量産にお
いてトリミング量が格段に少なくてすみ、歩留向上をは
かることかできる。Since a single metal plate 20 is used as the conductor, the thickness is uniform, and the surface roughness of the metal plate is 0°3μm, compared to the 3μm surface roughness of the conventional metallization method by printing and baking. Or you can get it as a general item. As a result, it is possible to obtain 10 times more uniformity than in metallized products, suppressing variations in electrical characteristics caused by non-uniform thickness of conventional metallized electrodes, and significantly reducing the amount of trimming required in mass production. , it is possible to improve yield.
さらに、金属板材料として機械的強度の大きい鉄系の材
料を用いることかでき、表面処理として機械的強度は弱
いか導電性にすぐれた銅、銀、金なとのめっきをするこ
とにより、このめっき部分にのみ高周波電流を流すこと
かてき、Qの高い共振回路を得ることができる。さらに
入出力引出電極はそのまま入出力端子となるので、従来
例の図7 (A)(B)で述へた問題点か一切なくなり
、小形で経済的なフィルタを実現することができる。Furthermore, iron-based materials with high mechanical strength can be used as the metal plate material, and this can be achieved by plating with copper, silver, or gold, which has low mechanical strength or high conductivity, as a surface treatment. By passing high frequency current only through the plated portion, a high Q resonant circuit can be obtained. Furthermore, since the input/output extraction electrodes serve as input/output terminals as they are, the problems described in FIGS. 7(A) and 7(B) of the conventional example are completely eliminated, and a small and economical filter can be realized.
ところで、一般に誘電体の材料としては、アルミナ(1
20,)や低損失高誘電率セラミックスか用いられる。By the way, alumina (1
20,) or low loss high dielectric constant ceramics are used.
これらの材料と金属板を接合するときは、線膨張係数の
違いにより機械的歪みによる電気的特性の劣化が問題と
なる。これらセラミックスの線膨張係数はおよそ5〜1
1pHm/°Cであるか、金属板として鉄ニツケル合金
を用いることによって両者の線膨張係数の整合をとるこ
とかできる。When joining these materials to metal plates, there is a problem of deterioration of electrical characteristics due to mechanical strain due to differences in linear expansion coefficients. The coefficient of linear expansion of these ceramics is approximately 5 to 1.
1 pHm/°C, or by using an iron-nickel alloy as the metal plate, the linear expansion coefficients of both can be matched.
鉄ニツケル合金はニッケルの含有率によって0.9〜2
0pI)m/’Cの範囲で線膨張係数をコントロールす
ることかできるので、使用するセラミックスに応じて最
適の材料を選定することかできる。このように、電気的
特性は表面処理のめつきて決定し、機械的、熱的に最適
な材料を選択できることも本発明の大きな特徴である。Iron-nickel alloys have a range of 0.9 to 2 depending on the nickel content.
Since the coefficient of linear expansion can be controlled within the range of 0 pI) m/'C, the optimum material can be selected depending on the ceramic used. In this way, a major feature of the present invention is that the electrical properties are determined by the surface treatment and that mechanically and thermally optimal materials can be selected.
図4は使用周波数か低く複数の共振器電極13か共通接
続される短絡端だけては機械的に支えきれない場合に適
用した金属板2oの例を示す部分平面図とそのX−Y断
面図である。共振器電極13の開放端の一部に保持部分
21を設け、この部分をハーフエツチンク処理して薄く
しである。組立の直前にこの部分を軽くたたくと、この
部分がはずれるようになっている。金属板にフォー・エ
ツチングでこれらの電極を形成した場合、フォー・エツ
チングは金属板の両面からエツチンク処理されるので、
レジスト版を変えるたけであり、ハーフエツチングした
からといってコストの上昇はない。FIG. 4 is a partial plan view and its X-Y sectional view showing an example of a metal plate 2o applied when the working frequency is low and a plurality of resonator electrodes 13 cannot be mechanically supported by only the commonly connected short-circuited ends. It is. A holding portion 21 is provided at a part of the open end of the resonator electrode 13, and this portion is thinned by half-etching. If you tap this part lightly just before assembly, it will come off. When forming these electrodes on a metal plate by four-etching, the four-etching process is performed from both sides of the metal plate, so
It is just a change of the resist version, and there is no increase in cost due to half-etching.
以上本発明をバンドパスフィルタを例に説明したか、本
発明によりローパスフィルタ、バンドエリミネーション
フィルタなどにも応用構成できることは自明である。Although the present invention has been described above using a band pass filter as an example, it is obvious that the present invention can be applied to low pass filters, band elimination filters, and the like.
(発明の効果)
以上詳細に説明したように、本発明を実施することによ
り次の効果がある。(Effects of the Invention) As described above in detail, the following effects can be obtained by implementing the present invention.
(1)トリミング量を少なくでき、量産性が向上し、こ
の結果経済的にフィルタが構成できる。(1) The amount of trimming can be reduced, mass productivity is improved, and as a result, the filter can be constructed economically.
(2)外部接続のための特別な端子を付加する必要かな
いため小形となる。(2) It is compact because there is no need to add special terminals for external connections.
(3)高周波電流密度の高い誘電体板側のめっき電極金
属に導電率の良い金属を選定することかできるので共振
回路のQが向上し、低損失化が図られる。(3) Since a metal with good conductivity can be selected as the plating electrode metal on the side of the dielectric plate where high frequency current density is high, the Q of the resonant circuit is improved and loss can be reduced.
(4)誘電体板と金属板の線膨張係数の整合をとった材
料を選ぶことができるので、耐環境特性。(4) Environmental resistance is achieved because it is possible to select materials that match the linear expansion coefficients of the dielectric plate and the metal plate.
信頼性の優れたフィルタを構成することかできる。It is possible to construct a highly reliable filter.
図1は本発明の構成例を示す分解斜視図、図2は本発明
の実施例を示す斜視図、図3は本発明の入出力端子を整
形したフィルタの側面図、図4は本発明の他の金属板電
極構成を示す図、図5はメタライズ導体の厚さを示す断
面図、図6は従来例を示す一部切欠斜視図、図7 (A
XB)は従来の実施例で入出力端子をつけたフィルタの
斜視図である。
1.2・・・誘電体基板、 3.4・・・スI・リッ
プ導体、 5,6・・・入出力端子、 7.8・・・
接地導体、 9.10・・・引出線、 11.12・
・・誘電体基板、13a〜13e・・・共振用電極、
14・・・ガイド穴、15a、 15b・・・入出力引
出電極、 16.17・・・全面メタライズ導体、 1
8a〜18d・・・接地端子、20・・・金属板、 2
1・・・保持部分。FIG. 1 is an exploded perspective view showing a configuration example of the present invention, FIG. 2 is a perspective view showing an embodiment of the present invention, FIG. 3 is a side view of a filter with shaped input/output terminals of the present invention, and FIG. 5 is a sectional view showing the thickness of the metallized conductor, FIG. 6 is a partially cutaway perspective view showing a conventional example, and FIG.
XB) is a perspective view of a conventional filter with input/output terminals. 1.2... Dielectric substrate, 3.4... Slip I/Lip conductor, 5, 6... Input/output terminal, 7.8...
Grounding conductor, 9.10... Leading wire, 11.12.
...Dielectric substrate, 13a to 13e...Resonance electrode,
14...Guide hole, 15a, 15b...I/O extraction electrode, 16.17...Full surface metallized conductor, 1
8a to 18d...ground terminal, 20...metal plate, 2
1...Holding part.
Claims (1)
の全面に電極か設けられた第1の誘電体基板と、 該第1の誘電体基板と等しい形状をなし一方の主表面及
び対向する一対の側端面の全面に電極が設けられた第2
の誘電体基板と、 該第1及び第2の誘電体基板の前記一対の側端面をそれ
ぞれ対応させて他方の主表面間に挟持され、前記一対の
側端面の電極と端面とがそれぞれ固着された金属板とを
備え、 該金属板は、並列に配置された複数の共振電極と該複数
の共振電極のそれぞれ一端が共通接続され前記側端面の
一方に沿って両端部分が露出して接地端子となる共通接
続部と前記複数の共振電極の初段と最終段の共振電極か
らそれぞれ引き出されてその端部が露出した外部引出端
子部とが一体形成された第1の金属板と、前記側端面の
他方に沿って両端部分が露出した接地端子となるように
形成された第2の金属板とからなる平面形誘電体フィル
タ。[Scope of Claims] A first dielectric substrate that is a rectangular flat plate and has electrodes provided on the entire surface of one main surface and a pair of opposing side end surfaces; A second electrode is provided on the entire main surface of the main surface and a pair of opposing side end surfaces.
a dielectric substrate, and the pair of side end surfaces of the first and second dielectric substrates are sandwiched between the other main surfaces in correspondence with each other, and the electrodes and end surfaces of the pair of side end surfaces are respectively fixed. a plurality of resonant electrodes arranged in parallel; one end of each of the plurality of resonant electrodes is commonly connected, and both end portions are exposed along one of the side end surfaces to form a ground terminal. a first metal plate integrally formed with a common connection portion and an external lead-out terminal portion whose ends are exposed by being drawn out from the first-stage and last-stage resonance electrodes of the plurality of resonance electrodes; and the side end surface. and a second metal plate formed to serve as a ground terminal with both end portions exposed along the other side of the planar dielectric filter.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2295310A JPH0760962B2 (en) | 1990-11-02 | 1990-11-02 | Planar dielectric filter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2295310A JPH0760962B2 (en) | 1990-11-02 | 1990-11-02 | Planar dielectric filter |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04170202A true JPH04170202A (en) | 1992-06-17 |
JPH0760962B2 JPH0760962B2 (en) | 1995-06-28 |
Family
ID=17818954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2295310A Expired - Fee Related JPH0760962B2 (en) | 1990-11-02 | 1990-11-02 | Planar dielectric filter |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0760962B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5489881A (en) * | 1992-10-14 | 1996-02-06 | Matsushita Electric Industrial Co., Ltd. | Stripline resonator filter including cooperative conducting cap and film |
JPH08172302A (en) * | 1994-12-20 | 1996-07-02 | Goyo Denshi Kogyo Kk | Plane filter made of synthetic resin with high dielectric constant |
JP2002198719A (en) * | 2000-12-25 | 2002-07-12 | Furukawa Electric Co Ltd:The | Small antenna |
JP2002261507A (en) * | 2001-03-02 | 2002-09-13 | Matsushita Electric Ind Co Ltd | Dielectric filter and antenna shared apparatus using the same, and communications equipment |
JP2010199790A (en) * | 2009-02-24 | 2010-09-09 | Nec Wireless Networks Ltd | Mounting structure of dielectric resonator, manufacturing method thereof, and filter device |
JP2017184178A (en) * | 2016-03-31 | 2017-10-05 | 学校法人 龍谷大学 | Low-pass filter |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5122059A (en) * | 1974-08-20 | 1976-02-21 | Matsushita Electric Ind Co Ltd | |
JPS5196710A (en) * | 1975-02-21 | 1976-08-25 | Shoketsugokinnyori seisakusuru baransueito | |
JPS5696710U (en) * | 1979-12-25 | 1981-07-31 |
-
1990
- 1990-11-02 JP JP2295310A patent/JPH0760962B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5122059A (en) * | 1974-08-20 | 1976-02-21 | Matsushita Electric Ind Co Ltd | |
JPS5196710A (en) * | 1975-02-21 | 1976-08-25 | Shoketsugokinnyori seisakusuru baransueito | |
JPS5696710U (en) * | 1979-12-25 | 1981-07-31 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5489881A (en) * | 1992-10-14 | 1996-02-06 | Matsushita Electric Industrial Co., Ltd. | Stripline resonator filter including cooperative conducting cap and film |
JPH08172302A (en) * | 1994-12-20 | 1996-07-02 | Goyo Denshi Kogyo Kk | Plane filter made of synthetic resin with high dielectric constant |
JP2002198719A (en) * | 2000-12-25 | 2002-07-12 | Furukawa Electric Co Ltd:The | Small antenna |
JP2002261507A (en) * | 2001-03-02 | 2002-09-13 | Matsushita Electric Ind Co Ltd | Dielectric filter and antenna shared apparatus using the same, and communications equipment |
JP4501291B2 (en) * | 2001-03-02 | 2010-07-14 | パナソニック株式会社 | Dielectric filter and antenna duplexer and communication device using the same |
JP2010199790A (en) * | 2009-02-24 | 2010-09-09 | Nec Wireless Networks Ltd | Mounting structure of dielectric resonator, manufacturing method thereof, and filter device |
JP2017184178A (en) * | 2016-03-31 | 2017-10-05 | 学校法人 龍谷大学 | Low-pass filter |
Also Published As
Publication number | Publication date |
---|---|
JPH0760962B2 (en) | 1995-06-28 |
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