CN112218926A - 粘合带 - Google Patents

粘合带 Download PDF

Info

Publication number
CN112218926A
CN112218926A CN201980036970.8A CN201980036970A CN112218926A CN 112218926 A CN112218926 A CN 112218926A CN 201980036970 A CN201980036970 A CN 201980036970A CN 112218926 A CN112218926 A CN 112218926A
Authority
CN
China
Prior art keywords
adhesive
adhesive tape
weight
adhesive layer
silicone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980036970.8A
Other languages
English (en)
Chinese (zh)
Inventor
绪方雄大
户田智基
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN112218926A publication Critical patent/CN112218926A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/10—Block or graft copolymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Organic Insulating Materials (AREA)
CN201980036970.8A 2018-06-06 2019-05-27 粘合带 Pending CN112218926A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018-108742 2018-06-06
JP2018108742 2018-06-06
PCT/JP2019/020926 WO2019235287A1 (ja) 2018-06-06 2019-05-27 粘着テープ

Publications (1)

Publication Number Publication Date
CN112218926A true CN112218926A (zh) 2021-01-12

Family

ID=68770760

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980036970.8A Pending CN112218926A (zh) 2018-06-06 2019-05-27 粘合带

Country Status (5)

Country Link
JP (2) JP7334117B2 (ko)
KR (1) KR102590639B1 (ko)
CN (1) CN112218926A (ko)
TW (1) TWI820140B (ko)
WO (1) WO2019235287A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020110489A1 (ja) * 2018-11-30 2020-06-04 日東電工株式会社 粘着シート
CN113260689B (zh) * 2019-03-08 2024-06-07 积水化学工业株式会社 粘合剂组合物及粘合带
JP6856799B1 (ja) * 2019-12-06 2021-04-14 積水化学工業株式会社 シリコーン系グラフト共重合体、粘着剤組成物及び粘着テープ

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010132755A (ja) * 2008-12-03 2010-06-17 Nippon Shokubai Co Ltd 電離放射線硬化性再剥離粘着剤組成物
CN104520974A (zh) * 2012-08-10 2015-04-15 积水化学工业株式会社 晶片的处理方法
TW201535502A (zh) * 2014-02-07 2015-09-16 Sekisui Chemical Co Ltd 晶圓之處理方法
CN107001664A (zh) * 2015-01-14 2017-08-01 琳得科株式会社 树脂膜形成用片、树脂膜形成用复合片、及硅晶片的再生方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2582875B2 (ja) * 1988-11-01 1997-02-19 日東電工株式会社 再剥離型粘着剤
JP2601956B2 (ja) 1991-07-31 1997-04-23 リンテック株式会社 再剥離型粘着性ポリマー
JPH11158453A (ja) * 1997-11-27 1999-06-15 Sekisui Chem Co Ltd アクリル系粘着剤組成物及び粘着加工製品
JP4687576B2 (ja) 2006-02-28 2011-05-25 日立化成工業株式会社 回路接続用フィルム状接着剤
JP5950869B2 (ja) 2013-06-20 2016-07-13 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープ
JP6323000B2 (ja) * 2013-12-26 2018-05-16 日立化成株式会社 仮固定用樹脂組成物、仮固定用樹脂フィルム及び仮固定用樹脂フィルムシート
KR101687062B1 (ko) * 2014-03-05 2016-12-15 제일모직주식회사 점착필름 및 이를 포함하는 광학표시장치
JP2015214636A (ja) * 2014-05-09 2015-12-03 ニッタ株式会社 粘着剤組成物
JP6200611B1 (ja) * 2016-03-17 2017-09-20 古河電気工業株式会社 半導体ウェハ加工用粘着テープ、半導体ウェハ加工用粘着テープの製造方法および半導体ウェハの加工方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010132755A (ja) * 2008-12-03 2010-06-17 Nippon Shokubai Co Ltd 電離放射線硬化性再剥離粘着剤組成物
CN104520974A (zh) * 2012-08-10 2015-04-15 积水化学工业株式会社 晶片的处理方法
TW201535502A (zh) * 2014-02-07 2015-09-16 Sekisui Chemical Co Ltd 晶圓之處理方法
CN107001664A (zh) * 2015-01-14 2017-08-01 琳得科株式会社 树脂膜形成用片、树脂膜形成用复合片、及硅晶片的再生方法

Also Published As

Publication number Publication date
JP7334117B2 (ja) 2023-08-28
WO2019235287A1 (ja) 2019-12-12
TW202016249A (zh) 2020-05-01
JPWO2019235287A1 (ja) 2021-05-06
JP2023155293A (ja) 2023-10-20
TWI820140B (zh) 2023-11-01
KR102590639B1 (ko) 2023-10-17
KR20210016506A (ko) 2021-02-16

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