CN112119482B - 基板处理装置 - Google Patents

基板处理装置 Download PDF

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Publication number
CN112119482B
CN112119482B CN201980031901.8A CN201980031901A CN112119482B CN 112119482 B CN112119482 B CN 112119482B CN 201980031901 A CN201980031901 A CN 201980031901A CN 112119482 B CN112119482 B CN 112119482B
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CN
China
Prior art keywords
cover
cooling body
cooling
chamber
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201980031901.8A
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English (en)
Chinese (zh)
Other versions
CN112119482A (zh
Inventor
重富贤一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN112119482A publication Critical patent/CN112119482A/zh
Application granted granted Critical
Publication of CN112119482B publication Critical patent/CN112119482B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201980031901.8A 2018-05-21 2019-05-08 基板处理装置 Active CN112119482B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018097196 2018-05-21
JP2018-097196 2018-05-21
PCT/JP2019/018443 WO2019225319A1 (ja) 2018-05-21 2019-05-08 基板処理装置

Publications (2)

Publication Number Publication Date
CN112119482A CN112119482A (zh) 2020-12-22
CN112119482B true CN112119482B (zh) 2023-09-05

Family

ID=68617296

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980031901.8A Active CN112119482B (zh) 2018-05-21 2019-05-08 基板处理装置

Country Status (4)

Country Link
JP (1) JP6937906B2 (ko)
KR (1) KR20210011395A (ko)
CN (1) CN112119482B (ko)
WO (1) WO2019225319A1 (ko)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002164333A (ja) * 2000-11-27 2002-06-07 Tokyo Electron Ltd 熱処理装置
JP2004079677A (ja) * 2002-08-13 2004-03-11 Dainippon Screen Mfg Co Ltd 熱処理装置
CN1924709A (zh) * 2005-08-31 2007-03-07 东京毅力科创株式会社 加热装置以及涂布·显影装置
JP2008034739A (ja) * 2006-07-31 2008-02-14 Dainippon Screen Mfg Co Ltd ロードロック装置、それを備えた基板処理装置および基板処理システム
JP2009176862A (ja) * 2008-01-23 2009-08-06 Sokudo Co Ltd 基板処理装置
CN101799624A (zh) * 2009-02-06 2010-08-11 东京毅力科创株式会社 基板处理装置
JP2011044553A (ja) * 2009-08-20 2011-03-03 Tokyo Electron Ltd 加熱処理装置及び熱処理装置
JP2012094617A (ja) * 2010-10-26 2012-05-17 Tokyo Electron Ltd 基板処理装置及び基板処理方法
TWM482837U (zh) * 2012-09-20 2014-07-21 Tokyo Electron Ltd 熱處理裝置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3898895B2 (ja) 2001-01-26 2007-03-28 東京エレクトロン株式会社 加熱処理装置及び加熱処理方法
JP2008244224A (ja) * 2007-03-28 2008-10-09 Sumitomo Precision Prod Co Ltd プラズマ処理装置
JP5107318B2 (ja) * 2009-08-24 2012-12-26 東京エレクトロン株式会社 加熱処理装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002164333A (ja) * 2000-11-27 2002-06-07 Tokyo Electron Ltd 熱処理装置
JP2004079677A (ja) * 2002-08-13 2004-03-11 Dainippon Screen Mfg Co Ltd 熱処理装置
CN1924709A (zh) * 2005-08-31 2007-03-07 东京毅力科创株式会社 加热装置以及涂布·显影装置
JP2008034739A (ja) * 2006-07-31 2008-02-14 Dainippon Screen Mfg Co Ltd ロードロック装置、それを備えた基板処理装置および基板処理システム
JP2009176862A (ja) * 2008-01-23 2009-08-06 Sokudo Co Ltd 基板処理装置
CN101799624A (zh) * 2009-02-06 2010-08-11 东京毅力科创株式会社 基板处理装置
JP2011044553A (ja) * 2009-08-20 2011-03-03 Tokyo Electron Ltd 加熱処理装置及び熱処理装置
JP2012094617A (ja) * 2010-10-26 2012-05-17 Tokyo Electron Ltd 基板処理装置及び基板処理方法
TWM482837U (zh) * 2012-09-20 2014-07-21 Tokyo Electron Ltd 熱處理裝置

Also Published As

Publication number Publication date
JP6937906B2 (ja) 2021-09-22
CN112119482A (zh) 2020-12-22
JPWO2019225319A1 (ja) 2021-05-27
WO2019225319A1 (ja) 2019-11-28
KR20210011395A (ko) 2021-02-01

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