JP7344656B2 - 搬送装置 - Google Patents
搬送装置 Download PDFInfo
- Publication number
- JP7344656B2 JP7344656B2 JP2019046318A JP2019046318A JP7344656B2 JP 7344656 B2 JP7344656 B2 JP 7344656B2 JP 2019046318 A JP2019046318 A JP 2019046318A JP 2019046318 A JP2019046318 A JP 2019046318A JP 7344656 B2 JP7344656 B2 JP 7344656B2
- Authority
- JP
- Japan
- Prior art keywords
- pad
- workpiece
- bernoulli
- base
- annular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1126—Using direct fluid current against work during delaminating
- Y10T156/1132—Using vacuum directly against work during delaminating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1928—Differential fluid pressure delaminating means
- Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Dicing (AREA)
Description
前記搬送装置では、該保持面は、該環状パッド装着部に装着された該環状パッドの該被加工物に対向する保持面と面一でも良い。
前記搬送装置では、該基台の周方向に間隔をあけて固定されて、該被加工物の外縁に当接して、該被加工物の水平方向の移動を規制する外周支持部材を備え、該外周支持部材は、基台の周方向に沿って互いに隣り合う該ベルヌーイ搬送パッド間でかつ該ベルヌーイ搬送パッドよりも基台の外周寄りに配置されても良い。
本発明の実施形態1に係る搬送装置を図面に基づいて説明する。図1は、実施形態1に係る搬送装置を備える加工装置の構成例を示す斜視図である。図2は、実施形態1に係る搬送装置の構成を示す斜視図である。図3は、図2に示された搬送装置が被加工物を非接触吸引した状態を示す要部の断面図である。
3 移動ユニット
7 基台
8 ベルヌーイ搬送パッド
10-1,10-2,10-3 環状パッド
11 下面(保持面)
81 下面(保持面)
82 パッド本体
83 流体噴出部
87 環状パッド装着部
200 被加工物(板状物)
300 空気(流体)
Claims (3)
- 板状物の被加工物を非接触状態で吸引し搬送する搬送装置であって、
被加工物に流体を噴射して負圧を発生させるベルヌーイ搬送パッドと、
該ベルヌーイ搬送パッドが固定される基台と、
該基台を移動させる移動ユニットとを備え、
該ベルヌーイ搬送パッドは、
流体噴出部が形成された保持面を備えるパッド本体に、該保持面を径方向に拡張し吸引力を補強する環状パッドが装着される環状パッド装着部を備え、該基台の周方向に間隔をあけて固定されていることを特徴とする搬送装置。 - 該保持面は、該環状パッド装着部に装着された該環状パッドの該被加工物に対向する保持面と面一となることを特徴とする請求項1に記載の搬送装置。
- 該基台の周方向に間隔をあけて固定されて、該被加工物の外縁に当接して、該被加工物の水平方向の移動を規制する外周支持部材を備え、
該外周支持部材は、基台の周方向に沿って互いに隣り合う該ベルヌーイ搬送パッド間でかつ該ベルヌーイ搬送パッドよりも基台の外周寄りに配置されていることを特徴とする請求項1または請求項2に記載の搬送装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019046318A JP7344656B2 (ja) | 2019-03-13 | 2019-03-13 | 搬送装置 |
SG10202001232XA SG10202001232XA (en) | 2019-03-13 | 2020-02-11 | Transfer apparatus |
US16/802,855 US11322386B2 (en) | 2019-03-13 | 2020-02-27 | Transfer apparatus |
KR1020200026471A KR20200110188A (ko) | 2019-03-13 | 2020-03-03 | 반송 장치 |
CN202010138161.2A CN111696904A (zh) | 2019-03-13 | 2020-03-03 | 搬送装置 |
TW109107946A TWI833922B (zh) | 2019-03-13 | 2020-03-11 | 搬送裝置 |
DE102020203262.9A DE102020203262B4 (de) | 2019-03-13 | 2020-03-13 | Übertragungsvorrichtung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019046318A JP7344656B2 (ja) | 2019-03-13 | 2019-03-13 | 搬送装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020150131A JP2020150131A (ja) | 2020-09-17 |
JP7344656B2 true JP7344656B2 (ja) | 2023-09-14 |
Family
ID=72289574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019046318A Active JP7344656B2 (ja) | 2019-03-13 | 2019-03-13 | 搬送装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US11322386B2 (ja) |
JP (1) | JP7344656B2 (ja) |
KR (1) | KR20200110188A (ja) |
CN (1) | CN111696904A (ja) |
DE (1) | DE102020203262B4 (ja) |
SG (1) | SG10202001232XA (ja) |
TW (1) | TWI833922B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200142622A (ko) * | 2019-06-12 | 2020-12-23 | 삼성디스플레이 주식회사 | 기판 이송 장치 및 이를 이용한 기판 이송 방법 |
CN112850148A (zh) * | 2021-01-06 | 2021-05-28 | 深圳格兰达智能装备股份有限公司 | 一种多工位测试分选机的检测机构总成 |
WO2023191712A2 (en) * | 2022-03-29 | 2023-10-05 | Nanyang Technological University | Material handling system and method thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004119784A (ja) | 2002-09-27 | 2004-04-15 | Disco Abrasive Syst Ltd | 板状物の搬送装置 |
JP2007067054A (ja) | 2005-08-30 | 2007-03-15 | Fluoro Mechanic Kk | ベルヌーイチャック |
JP2010527805A (ja) | 2007-05-31 | 2010-08-19 | ヨナス アンド レードマン アウトマーツィオーンズテヒニク ゲーエムベーハー | ベルヌーイ・グリッパからなるグリッパ |
JP2012000706A (ja) | 2010-06-16 | 2012-01-05 | Nippon Pneumatics Fluidics System Co Ltd | 保持具 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG115602A1 (en) | 2003-01-09 | 2005-10-28 | Disco Corp | Conveying device for a plate-like workpiece |
DE102016011618A1 (de) | 2016-09-28 | 2018-03-29 | Broetje-Automation Gmbh | Endeffektoranordnung |
-
2019
- 2019-03-13 JP JP2019046318A patent/JP7344656B2/ja active Active
-
2020
- 2020-02-11 SG SG10202001232XA patent/SG10202001232XA/en unknown
- 2020-02-27 US US16/802,855 patent/US11322386B2/en active Active
- 2020-03-03 CN CN202010138161.2A patent/CN111696904A/zh active Pending
- 2020-03-03 KR KR1020200026471A patent/KR20200110188A/ko not_active Application Discontinuation
- 2020-03-11 TW TW109107946A patent/TWI833922B/zh active
- 2020-03-13 DE DE102020203262.9A patent/DE102020203262B4/de active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004119784A (ja) | 2002-09-27 | 2004-04-15 | Disco Abrasive Syst Ltd | 板状物の搬送装置 |
JP2007067054A (ja) | 2005-08-30 | 2007-03-15 | Fluoro Mechanic Kk | ベルヌーイチャック |
JP2010527805A (ja) | 2007-05-31 | 2010-08-19 | ヨナス アンド レードマン アウトマーツィオーンズテヒニク ゲーエムベーハー | ベルヌーイ・グリッパからなるグリッパ |
JP2012000706A (ja) | 2010-06-16 | 2012-01-05 | Nippon Pneumatics Fluidics System Co Ltd | 保持具 |
Also Published As
Publication number | Publication date |
---|---|
KR20200110188A (ko) | 2020-09-23 |
US20200294840A1 (en) | 2020-09-17 |
TWI833922B (zh) | 2024-03-01 |
DE102020203262A1 (de) | 2020-09-17 |
DE102020203262B4 (de) | 2024-01-11 |
CN111696904A (zh) | 2020-09-22 |
JP2020150131A (ja) | 2020-09-17 |
TW202034445A (zh) | 2020-09-16 |
SG10202001232XA (en) | 2020-10-29 |
US11322386B2 (en) | 2022-05-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7344656B2 (ja) | 搬送装置 | |
JP6679157B2 (ja) | 加工装置の搬送機構 | |
KR102252839B1 (ko) | 판상물 반송 장치 및 가공 장치 | |
JP5399690B2 (ja) | 切断装置 | |
KR102279560B1 (ko) | 반송 장치 | |
JP6202962B2 (ja) | 切削装置 | |
JP2009253244A (ja) | ウエーハの搬出方法 | |
TWI806950B (zh) | 切削裝置 | |
JP2015082570A (ja) | ウエーハ加工システム | |
JP2017220579A (ja) | ウェーハ加工システム | |
TW201830559A (zh) | 加工裝置的搬運機構 | |
JP5412261B2 (ja) | 加工装置 | |
JP7339858B2 (ja) | 加工装置及び板状ワークの搬入出方法 | |
JP2003077982A (ja) | 搬送装置 | |
JP2023019354A (ja) | 洗浄装置 | |
JP2014116432A (ja) | 加工装置 | |
JP2014008597A (ja) | 研削装置 | |
JP2018032825A (ja) | 被加工物のアライメント方法 | |
JP2003145473A (ja) | 吸着パッド | |
JP2016078132A (ja) | 加工装置 | |
JP7278059B2 (ja) | 加工システム | |
JP5841798B2 (ja) | 研削装置 | |
JP7246904B2 (ja) | 搬送装置 | |
JP2022144939A (ja) | 搬送装置 | |
JP2022135314A (ja) | 搬送機構、及び、それを備える加工装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220121 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20230202 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230207 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230405 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230808 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230904 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7344656 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |