CN111383936B - 基板处理装置和基板处理方法 - Google Patents

基板处理装置和基板处理方法 Download PDF

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Publication number
CN111383936B
CN111383936B CN201911381483.3A CN201911381483A CN111383936B CN 111383936 B CN111383936 B CN 111383936B CN 201911381483 A CN201911381483 A CN 201911381483A CN 111383936 B CN111383936 B CN 111383936B
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substrate
chipset
processing
chip set
distance
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CN111383936A (zh
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坂上贵志
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
CN201911381483.3A 2018-12-27 2019-12-27 基板处理装置和基板处理方法 Active CN111383936B (zh)

Applications Claiming Priority (2)

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JP2018245914A JP7281901B2 (ja) 2018-12-27 2018-12-27 基板処理装置、および基板処理方法
JP2018-245914 2018-12-27

Publications (2)

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CN111383936A CN111383936A (zh) 2020-07-07
CN111383936B true CN111383936B (zh) 2024-06-07

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JP (1) JP7281901B2 (ja)
CN (1) CN111383936B (ja)
TW (1) TW202108299A (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI766702B (zh) * 2021-05-26 2022-06-01 均豪精密工業股份有限公司 片狀工件研磨方法及研磨裝置
CN115431163B (zh) * 2021-06-01 2024-03-08 均豪精密工业股份有限公司 片状工件研磨方法及研磨装置
CN114267606B (zh) * 2022-03-01 2022-06-21 武汉精立电子技术有限公司 一种晶圆高度检测方法及装置

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003148941A (ja) * 2001-11-12 2003-05-21 Dainippon Printing Co Ltd 割れ検知装置及びそれを用いた焼成ライン
JP2005021998A (ja) * 2003-06-30 2005-01-27 Komatsu Machinery Corp 研削加工装置及び研削加工方法
JP2012078179A (ja) * 2010-09-30 2012-04-19 Tokyo Electron Ltd 温度測定方法、記憶媒体、プログラム
CN103691715A (zh) * 2013-12-30 2014-04-02 合肥京东方光电科技有限公司 一种基板清洗设备
CN104704385A (zh) * 2012-10-04 2015-06-10 株式会社电装 物体检测装置
JP2015205367A (ja) * 2014-04-21 2015-11-19 株式会社ディスコ 研削装置
JP2015205362A (ja) * 2014-04-18 2015-11-19 株式会社ディスコ レーザ変位計及び研削装置
CN105690260A (zh) * 2016-04-05 2016-06-22 泉州装备制造研究所 基于位移传感技术的建筑石材连续抛磨过程在线检测***
JP2017050408A (ja) * 2015-09-02 2017-03-09 株式会社ディスコ 積層ウェーハの製造方法
JP2017069517A (ja) * 2015-10-02 2017-04-06 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP2017199845A (ja) * 2016-04-28 2017-11-02 株式会社ディスコ デバイスの製造方法及び研削装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100708A (ja) * 2001-09-27 2003-04-04 Mitsubishi Electric Corp 終点判別方法、半導体処理装置および半導体装置の製造方法
JP5943544B2 (ja) * 2010-12-20 2016-07-05 株式会社ディスコ 積層デバイスの製造方法及び積層デバイス
JP5254308B2 (ja) * 2010-12-27 2013-08-07 東京エレクトロン株式会社 液処理装置、液処理方法及びその液処理方法を実行させるためのプログラムを記録した記録媒体
JP2014172131A (ja) * 2013-03-11 2014-09-22 Disco Abrasive Syst Ltd 研削装置
DE112014005866B4 (de) * 2013-12-24 2018-08-02 Lytro, Inc. Verbesserung der plenoptischen Kameraauflösung

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003148941A (ja) * 2001-11-12 2003-05-21 Dainippon Printing Co Ltd 割れ検知装置及びそれを用いた焼成ライン
JP2005021998A (ja) * 2003-06-30 2005-01-27 Komatsu Machinery Corp 研削加工装置及び研削加工方法
JP2012078179A (ja) * 2010-09-30 2012-04-19 Tokyo Electron Ltd 温度測定方法、記憶媒体、プログラム
CN104704385A (zh) * 2012-10-04 2015-06-10 株式会社电装 物体检测装置
CN103691715A (zh) * 2013-12-30 2014-04-02 合肥京东方光电科技有限公司 一种基板清洗设备
JP2015205362A (ja) * 2014-04-18 2015-11-19 株式会社ディスコ レーザ変位計及び研削装置
JP2015205367A (ja) * 2014-04-21 2015-11-19 株式会社ディスコ 研削装置
JP2017050408A (ja) * 2015-09-02 2017-03-09 株式会社ディスコ 積層ウェーハの製造方法
JP2017069517A (ja) * 2015-10-02 2017-04-06 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
CN105690260A (zh) * 2016-04-05 2016-06-22 泉州装备制造研究所 基于位移传感技术的建筑石材连续抛磨过程在线检测***
JP2017199845A (ja) * 2016-04-28 2017-11-02 株式会社ディスコ デバイスの製造方法及び研削装置

Also Published As

Publication number Publication date
CN111383936A (zh) 2020-07-07
JP7281901B2 (ja) 2023-05-26
TW202108299A (zh) 2021-03-01
JP2020107756A (ja) 2020-07-09

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