CN111244020A - 基板保持装置、基板处理装置和基板保持方法 - Google Patents

基板保持装置、基板处理装置和基板保持方法 Download PDF

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Publication number
CN111244020A
CN111244020A CN201911086918.1A CN201911086918A CN111244020A CN 111244020 A CN111244020 A CN 111244020A CN 201911086918 A CN201911086918 A CN 201911086918A CN 111244020 A CN111244020 A CN 111244020A
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CN
China
Prior art keywords
substrate
stage
leveling block
peripheral edge
holding apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911086918.1A
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English (en)
Chinese (zh)
Inventor
上野幸一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Publication of CN111244020A publication Critical patent/CN111244020A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
CN201911086918.1A 2018-11-29 2019-11-08 基板保持装置、基板处理装置和基板保持方法 Pending CN111244020A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018223741A JP6875357B2 (ja) 2018-11-29 2018-11-29 基板保持装置、基板処理装置および基板保持方法
JP2018-223741 2018-11-29

Publications (1)

Publication Number Publication Date
CN111244020A true CN111244020A (zh) 2020-06-05

Family

ID=70866171

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911086918.1A Pending CN111244020A (zh) 2018-11-29 2019-11-08 基板保持装置、基板处理装置和基板保持方法

Country Status (4)

Country Link
JP (1) JP6875357B2 (ko)
KR (1) KR102336820B1 (ko)
CN (1) CN111244020A (ko)
TW (1) TWI742464B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114121486A (zh) * 2020-08-25 2022-03-01 日机装株式会社 层叠装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000243814A (ja) * 1999-02-22 2000-09-08 Ulvac Japan Ltd ウエハ保持方法及び装置
JP2006054388A (ja) * 2004-08-16 2006-02-23 Disco Abrasive Syst Ltd 被加工物搬送装置，スピンナー洗浄装置，研削装置，被加工物搬送方法
CN101315872A (zh) * 2007-05-28 2008-12-03 海力士半导体有限公司 处理晶片的热处理设备和热处理晶片的方法
CN101589456A (zh) * 2007-01-26 2009-11-25 朗姆研究公司 具有真空卡盘的斜面蚀刻器
CN103008165A (zh) * 2011-09-26 2013-04-03 大日本网屏制造株式会社 涂敷装置
CN103715125A (zh) * 2012-09-28 2014-04-09 株式会社日立高新技术 板状体保持机构、基板贴合装置以及基板贴合方法
CN204289408U (zh) * 2014-12-29 2015-04-22 昆山国显光电有限公司 产品翘曲矫正装置
CN106994431A (zh) * 2015-12-16 2017-08-01 株式会社斯库林集团 基板保持装置、涂布装置、基板保持方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120134368A (ko) * 2011-06-02 2012-12-12 엘아이지에이디피 주식회사 기판 척킹 디척킹 장치
JP5977042B2 (ja) 2012-02-27 2016-08-24 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置、基板保持装置および基板保持方法
JP5952059B2 (ja) * 2012-04-04 2016-07-13 東京エレクトロン株式会社 基板処理装置および基板保持方法
CN104538331B (zh) * 2014-12-12 2018-06-05 通富微电子股份有限公司 一种晶圆翘曲处理的装置及方法
JP2016127086A (ja) * 2014-12-26 2016-07-11 東京エレクトロン株式会社 基板吸着補助部材及び基板搬送装置
JP2018120935A (ja) 2017-01-25 2018-08-02 東レエンジニアリング株式会社 ウエーハ保持装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000243814A (ja) * 1999-02-22 2000-09-08 Ulvac Japan Ltd ウエハ保持方法及び装置
JP2006054388A (ja) * 2004-08-16 2006-02-23 Disco Abrasive Syst Ltd 被加工物搬送装置，スピンナー洗浄装置，研削装置，被加工物搬送方法
CN101589456A (zh) * 2007-01-26 2009-11-25 朗姆研究公司 具有真空卡盘的斜面蚀刻器
CN101315872A (zh) * 2007-05-28 2008-12-03 海力士半导体有限公司 处理晶片的热处理设备和热处理晶片的方法
CN103008165A (zh) * 2011-09-26 2013-04-03 大日本网屏制造株式会社 涂敷装置
CN103715125A (zh) * 2012-09-28 2014-04-09 株式会社日立高新技术 板状体保持机构、基板贴合装置以及基板贴合方法
CN204289408U (zh) * 2014-12-29 2015-04-22 昆山国显光电有限公司 产品翘曲矫正装置
CN106994431A (zh) * 2015-12-16 2017-08-01 株式会社斯库林集团 基板保持装置、涂布装置、基板保持方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114121486A (zh) * 2020-08-25 2022-03-01 日机装株式会社 层叠装置
CN114121486B (zh) * 2020-08-25 2024-06-04 日机装株式会社 层叠装置

Also Published As

Publication number Publication date
JP2020088275A (ja) 2020-06-04
TW202021172A (zh) 2020-06-01
KR102336820B1 (ko) 2021-12-07
JP6875357B2 (ja) 2021-05-26
KR20200064921A (ko) 2020-06-08
TWI742464B (zh) 2021-10-11

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Application publication date: 20200605

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