CN110740583B - Pattern transfer method for printed circuit board - Google Patents
Pattern transfer method for printed circuit board Download PDFInfo
- Publication number
- CN110740583B CN110740583B CN201910952211.8A CN201910952211A CN110740583B CN 110740583 B CN110740583 B CN 110740583B CN 201910952211 A CN201910952211 A CN 201910952211A CN 110740583 B CN110740583 B CN 110740583B
- Authority
- CN
- China
- Prior art keywords
- copper
- foil layer
- copper foil
- ink
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0551—Exposure mask directly printed on the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a pattern transfer method of a printed circuit board, which comprises the following steps: coating photosensitive ink on the surface of a copper foil layer of a copper-clad plate to form an ink layer; attaching a first film on the surface of the ink layer, and exposing the copper-clad plate; and putting the exposed copper-clad plate into a developer, dissolving the unexposed photosensitive ink on the surface of the copper foil layer, and forming a circuit pattern on the copper-clad plate. It can be understood that the technical scheme of the invention can ensure that the printed circuit board has a complete circuit pattern.
Description
Technical Field
The invention relates to the technical field of printed circuit board processing, in particular to a pattern transfer method of a printed circuit board.
Background
The conventional pattern making uses a dry film as a carrier to transfer an image, and the specific process is as follows: pressing and covering a dry film on a copper foil layer of the copper-clad plate, attaching a film sheet to the surface of the dry film, transferring a circuit pattern on the film sheet to a position on the copper foil layer where a circuit needs to be manufactured under the irradiation of an ultraviolet lamp, then placing the exposed copper-clad plate in a developer for washing, and dissolving the unexposed dry film in the developer, thereby forming the required circuit pattern on the copper-clad plate. Therefore, when the copper-clad plate after the development treatment is etched by the etching solution, the copper foil layer exposed out of the dry film is etched by the etching solution, so that the required circuit pattern is obtained. However, the object of the pattern production is a flat copper clad laminate, when the surface of the copper clad laminate is provided with a concave part or a convex part, the surface of the copper clad laminate has a height difference, the flowability of the dry film is poor, the dry film cannot be attached to the surface of the copper clad laminate (as shown in fig. 1), and therefore the etching solution can flow into the copper clad laminate from the gap between the dry film and the copper clad laminate and etch the copper clad laminate, and a complete circuit pattern cannot be obtained.
Disclosure of Invention
The invention mainly aims to provide a pattern transfer method of a printed circuit board, which is used for ensuring that the printed circuit board has complete circuit patterns.
In order to achieve the above object, the present invention provides a method for transferring patterns of a printed circuit board, comprising the steps of:
coating photosensitive ink on the surface of a copper foil layer of a copper-clad plate to form an ink layer;
attaching a first film on the surface of the ink layer, and exposing the copper-clad plate;
and putting the exposed copper-clad plate into a developer, dissolving the unexposed photosensitive ink on the surface of the copper foil layer, and forming a circuit pattern on the copper-clad plate.
Optionally, the photosensitive ink is a gold plating resistant ink.
Optionally, a raised part is arranged on the surface of the copper foil layer; and/or the surface of the copper foil layer is provided with a sunken part.
Optionally, the protruding height of the convex part on the surface of the copper foil layer is not more than 50 μm; and/or the sunken part is sunken to a depth of no more than 50 mu m relative to the surface of the copper foil layer.
Optionally, the copper-clad plate is a flex-rigid plate, the flex-rigid plate comprises a rigid region and at least one flexible region connected with the rigid region, and the height difference between the rigid region and the flexible region is not more than 50 μm.
Optionally, the step of coating photosensitive ink on the surface of the copper foil layer of the copper-clad plate includes:
drilling a hole on the surface of the substrate, and electroplating the drilled substrate to form a copper foil layer on the surface of the substrate to obtain a copper-clad plate with the copper foil layer;
arranging an oil blocking point on the screen plate, installing the screen plate on the copper-clad plate, enabling the oil blocking point to be located between the screen plate and the drilled hole, and extruding the ink on the screen plate in a screen printing mode so as to coat the ink on the surface of the copper foil layer.
Optionally, the step of dissolving the unexposed photosensitive ink on the surface of the copper foil layer further comprises:
and pressing a dry film on the drilled hole, attaching a second film sheet to the surface of the dry film, and carrying out development treatment after exposure to dissolve the unexposed dry film on the surface of the copper foil layer.
Optionally, the step of dissolving the unexposed dry film on the surface of the copper foil layer further comprises:
and putting the copper-clad plate into etching solution, so that the copper foil layer exposed out of the dry film and the copper foil layer exposed out of the photosensitive printing ink are etched by the etching solution.
Optionally, the etching solution comprises hydrochloric acid and an oxidizing agent.
Optionally, the step of forming the circuit pattern on the copper-clad plate further includes:
and placing the copper-clad plate in an alkaline solution, and removing the dry film and the photosensitive ink on the surface of the copper foil layer to form a circuit pattern.
In the technical scheme of the invention, the pattern transfer method of the printed circuit board comprises the steps of coating photosensitive ink on the surface of a copper foil layer of a copper-clad plate to form an ink layer; attaching a first film on the surface of the ink layer, and exposing the copper-clad plate; and putting the exposed copper-clad plate into a developer, dissolving the unexposed photosensitive ink on the surface of the copper foil layer, and forming a circuit pattern on the copper-clad plate. The photosensitive ink is adopted to replace a dry film, so that even if the surface of the copper foil layer is provided with the concave part and the convex part, the photosensitive ink can flow to the surface of the copper foil layer due to good fluidity of the photosensitive ink and is solidified and adhered to the surface of the copper foil layer after exposure, so that the contact between the copper foil layer below the photosensitive ink and etching liquid is avoided, the copper foil layer adhered with the photosensitive ink cannot be etched, and the integrity of a circuit pattern is ensured. It can be understood that the technical scheme of the invention can ensure that the printed circuit board has a complete circuit pattern.
Drawings
FIG. 1 is a diagram illustrating the effect of transferring a circuit pattern by using a dry film in the background art of the present invention;
FIG. 2 is a diagram illustrating an effect of transferring a circuit pattern with photosensitive ink according to an embodiment of the present invention;
FIG. 3 is a flow chart of a method for transferring patterns of a printed circuit board according to an embodiment of the present invention;
the reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | Copper- |
130 | |
| 110 | Raised |
140 | |
| 120 | Drilling holes |
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
The invention provides a pattern transfer method of a printed circuit board.
As shown in fig. 3, in an embodiment of the present invention, a method for transferring a pattern of a printed circuit board includes:
coating photosensitive ink on the surface of a copper foil layer of a copper-clad plate to form an ink layer;
attaching a first film on the surface of the ink layer, and exposing the copper-clad plate;
and putting the exposed copper-clad plate into a developer, dissolving the unexposed photosensitive ink on the surface of the copper foil layer, and forming a circuit pattern on the copper-clad plate.
In the technical scheme of the invention, the pattern transfer method of the printed circuit board comprises the steps of coating photosensitive ink on the surface of a copper foil layer of a copper-clad plate to form an ink layer; attaching a first film on the surface of the ink layer, and exposing the copper-clad plate; and putting the exposed copper-clad plate into a developer, dissolving the unexposed photosensitive ink on the surface of the copper foil layer, and forming a circuit pattern on the copper-clad plate. According to the invention, the photosensitive ink is adopted to replace a dry film, so that even if the surface of the copper foil layer is provided with the concave part and the convex part, the photosensitive ink can flow to the surface of the copper foil layer (as shown in figure 2) due to good fluidity of the photosensitive ink, and is cured and adhered to the surface of the copper foil layer after exposure, so that the contact between the copper foil layer below the photosensitive ink and an etching solution is avoided, the copper foil layer adhered with the photosensitive ink cannot be etched, and the integrity of a circuit pattern is ensured. It can be understood that the technical scheme of the invention can ensure that the printed circuit board has a complete circuit pattern.
It should be noted that the copper-clad plate of the present invention is a substrate having a copper foil layer on a surface thereof, and of course, the substrate may be plated with copper by using an electroplating process. In addition, the photosensitive ink has fluidity, and during exposure treatment, the photosensitive ink corresponding to the photosensitive part of the first film is cured, crosslinked and adhered to the surface of the copper foil layer, and the cured and crosslinked photosensitive ink cannot be dissolved by a developer; the unexposed photosensitive ink is dissolved in the developer, so that the circuit pattern on the first film is transferred to the surface of the copper foil layer. When the etching solution is used for etching the copper foil layer, the copper foil layer adhered with the photosensitive ink is reserved because the surface of the copper foil layer cannot be contacted with the etching solution, and the copper foil layer without the photosensitive ink adhered to the surface of the copper foil layer is etched under the action of the etching solution, so that after the etching is finished, the photosensitive ink on the surface of the copper foil layer is removed, and the printed circuit board with a complete circuit pattern can be obtained. In addition, the circuit pattern can be detected by using the light reflection principle after the etching is finished, so that the accuracy of the circuit pattern is ensured.
In an embodiment of the invention, the photosensitive ink is gold plating resistant ink. The photosensitive ink comprises gold-resisting ink and gold-resisting ink, and the gold-resisting ink cannot be subjected to exposure development. In the embodiment of the invention, the photosensitive ink is anti-gold-plating ink, the exposure scale of the anti-gold-plating ink is 9-10 grades, the anti-gold-plating ink has good fluidity and is in a liquid state after dilution and stirring, the fillable height difference of the anti-gold-plating ink reaches 50 micrometers, the problem of incomplete height difference position patterns caused by weak dry film filling capacity is solved, the anti-gold-plating ink at the photosensitive part of the anti-gold-plating ink after exposure is solidified, and the non-photosensitive anti-gold-plating ink is dissolved in a developer, so that a high-precision circuit pattern is formed on the surface of the copper foil layer.
In an embodiment of the invention, a surface of the copper foil layer is provided with a protruding portion. Because photosensitive ink has good mobility, when adding photosensitive ink to the top of bellying like this, the photosensitive ink that is located the bellying top can flow to the copper foil layer surface, and after the photosensitive ink that flows to the copper foil layer surface exposure solidification, photosensitive ink adhesion in the copper foil layer to this has avoided etching solution and copper foil layer contact, thereby makes the copper foil layer that is stained with photosensitive ink can not be etched, has guaranteed the integrality of circuit figure.
In an embodiment of the invention, a surface of the copper foil layer is provided with a recess. Similarly, because photosensitive ink has good mobility, when adding photosensitive ink to the surface of copper foil layer like this, photosensitive ink can flow to the bottom of depressed part, and after the photosensitive ink exposure solidification that flows to the depressed part, photosensitive ink adhesion in the bottom of depressed part to this depressed part can demonstrate corresponding circuit figure, thereby has guaranteed circuit figure's integrality.
In one embodiment of the invention, the protruding height of the convex part on the surface of the copper foil layer is not more than 50 μm; and/or the sunken part is sunken to a depth of no more than 50 mu m relative to the surface of the copper foil layer. The gold-plating resistant ink has good fluidity, is in a liquid state after being diluted and stirred, and can be filled with a height difference of 50 mu m. Thus, when the gold-plating resistant ink is adopted, the gold-plating resistant ink can be effectively filled in the step copper-clad plate with the height difference not more than 50 microns. Preferably, the protruding height of the convex part on the surface of the copper foil layer is not more than 40 μm; and/or the sunken part is sunken to a depth of not more than 40 mu m relative to the surface of the copper foil layer. According to the embodiment of the invention, the height difference is adjusted to be not more than 40 μm, so that the anti-gold-plating ink can be effectively filled, and the photosensitive ink cured after exposure can be adhered to the surface of the copper foil layer.
In one embodiment of the invention, the copper-clad plate is a flex-rigid plate, the flex-rigid plate comprises a rigid area and at least one flexible area connected with the rigid area, and the height difference between the rigid area and the flexible area is not more than 50 μm. The gold-plating resistant ink has good fluidity, is in a liquid state after being diluted and stirred, and can be filled with a height difference of 50 mu m. Thus, when the gold plating resist ink is used, the gold plating resist ink can be effectively filled in the flex-rigid board having a height difference of not more than 50 μm. Preferably, the difference in height between the rigid region and the flexible region is not more than 40 μm, so as to ensure effective filling with gold-plating-resistant ink.
In an embodiment of the present invention, the step of coating photosensitive ink on the surface of the copper foil layer of the copper-clad plate further includes: drilling a hole on the surface of the substrate, and electroplating the drilled substrate to form a copper foil layer on the surface of the substrate to obtain a copper-clad plate with the copper foil layer; arranging an oil blocking point on the screen plate, installing the screen plate on the copper-clad plate, enabling the oil blocking point to be located between the screen plate and the drilled hole, and extruding the ink on the screen plate in a screen printing mode so as to coat the ink on the surface of the copper foil layer. According to the invention, through electroplating treatment after drilling, metal copper is deposited on the peripheral wall of the drilling hole and the surface of the base material, so that the metal copper deposited on the surface of the base material forms a copper foil layer for manufacturing a circuit pattern; and the copper metal deposited on the peripheral wall of the drilled hole is used for conducting a resistance component and a circuit. Photosensitive ink is coated on the surface of the copper foil layer in a screen printing mode, oil blocking points are arranged on the screen plate, and the oil blocking points play a role of a baffle plate to prevent the photosensitive ink from flowing into a drill hole. According to the embodiment of the invention, the oil blocking points are arranged so as to prevent the photosensitive ink from flowing into the drilled holes, the ink is poured into one end of the screen plate during printing, a scraper plate is used for applying a certain pressure to the ink part on the screen plate, meanwhile, the ink moves towards the other end of the screen plate at a constant speed, and the ink is extruded onto the copper foil layer from meshes by the scraper plate during moving, so that the photosensitive ink is ensured to be coated on the surface of the copper foil layer.
In an embodiment of the present invention, the step of dissolving the unexposed photosensitive ink on the surface of the copper foil layer further includes: and pressing a dry film on the drilled hole, attaching a second film sheet to the surface of the dry film, and carrying out development treatment after exposure to dissolve the unexposed dry film on the surface of the copper foil layer. Wherein, the exposure ruler level of dry film is 6 ~ 8 levels. Because the mobility of dry film is little, when adopting dry film to cover drilling like this, the dry film can not flow in the drilling to prevent the drilling jam, thereby guaranteed electronic components's installation.
In an embodiment of the present invention, the step of dissolving the unexposed dry film on the surface of the copper foil layer further includes: and putting the copper-clad plate into etching solution, so that the copper foil layer exposed out of the dry film and the copper foil layer exposed out of the photosensitive printing ink are etched by the etching solution. The etching solution comprises hydrochloric acid and an oxidizing agent, wherein the oxidizing agent comprises chlorate and copper chloride, and the copper foil layer is etched by continuously oxidizing the copper foil layer under the action of acidity through copper ions. In the oxidation-reduction reaction process, the generated cuprous ions are oxidized into copper ions by chlorine generated by the reaction of chlorate and hydrochloric acid, so that the copper ions continuously etch the copper foil layer. Of course, the copper foil layer having the photosensitive ink or the dry film adhered thereto is maintained because the copper foil layer cannot be contacted with the etching solution. Thus, after the etching is finished, the photosensitive ink and the dry film on the surface of the copper foil layer are removed, and the printed circuit board with the circuit pattern can be obtained.
In an embodiment of the present invention, the step of forming the circuit pattern on the copper-clad plate further includes: and placing the copper-clad plate in an alkaline solution, and removing the dry film and the photosensitive ink on the surface of the copper foil layer to form a circuit pattern. The copper-clad plate is placed in the sodium hydroxide solution, so that the photosensitive ink and the dry film which are not cleaned by the developer can be dissolved in the sodium hydroxide solution, and the printed circuit board with a complete circuit pattern can be obtained.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the present specification and directly/indirectly applied to other related technical fields within the spirit of the present invention are included in the scope of the present invention.
Claims (8)
1. A pattern transfer method of a printed circuit board is characterized by comprising the following steps:
drilling a hole on the surface of the substrate, and electroplating the drilled substrate to form a copper foil layer on the surface of the substrate to obtain a copper-clad plate with the copper foil layer;
arranging an oil blocking point on a screen plate, installing the screen plate on the copper-clad plate, enabling the oil blocking point to be located between the screen plate and the drilled hole, extruding ink on the screen plate in a screen printing mode, and enabling photosensitive ink to coat the surface of a copper foil layer to form an ink layer;
attaching a first film on the surface of the ink layer, and exposing the copper-clad plate;
placing the exposed copper-clad plate into a developer, and dissolving the unexposed photosensitive ink on the surface of the copper foil layer;
and pressing a dry film on the drilled hole, attaching a second film sheet to the surface of the dry film, carrying out development treatment after exposure, dissolving the unexposed dry film on the surface of the copper foil layer, and forming a circuit pattern on the copper-clad plate.
2. The method for pattern transfer of a printed circuit board according to claim 1, wherein said photosensitive ink is an anti-gold ink.
3. The method for transferring patterns on a printed circuit board according to claim 2, wherein the surface of the copper foil layer is provided with a convex portion; and/or the surface of the copper foil layer is provided with a sunken part.
4. The pattern transfer method for a printed circuit board according to claim 3, wherein the height of projection of said convex portion on the surface of said copper foil layer is not more than 50 μm; and/or the sunken part is sunken to a depth of no more than 50 mu m relative to the surface of the copper foil layer.
5. The method for transferring patterns of a printed circuit board according to claim 1, wherein the copper-clad plate is a flex-rigid plate, the flex-rigid plate comprises a rigid area and at least one flexible area connected with the rigid area, and the height difference between the rigid area and the flexible area is not more than 50 μm.
6. The method for transferring patterns of a printed circuit board according to claim 1, wherein the step of dissolving the unexposed dry film on the surface of the copper foil layer further comprises:
and putting the copper-clad plate into etching solution, so that the copper foil layer exposed out of the dry film and the copper foil layer exposed out of the photosensitive printing ink are etched by the etching solution.
7. The method for pattern transfer of a printed circuit board according to claim 6, wherein the etching solution comprises hydrochloric acid and an oxidizing agent.
8. The method for transferring patterns of a printed circuit board according to claim 6, wherein the step of forming a circuit pattern on the copper clad laminate further comprises:
and placing the copper-clad plate in an alkaline solution, and removing the dry film and the photosensitive ink on the surface of the copper foil layer to form a circuit pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910952211.8A CN110740583B (en) | 2019-10-08 | 2019-10-08 | Pattern transfer method for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910952211.8A CN110740583B (en) | 2019-10-08 | 2019-10-08 | Pattern transfer method for printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110740583A CN110740583A (en) | 2020-01-31 |
| CN110740583B true CN110740583B (en) | 2021-06-25 |
Family
ID=69268549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910952211.8A Active CN110740583B (en) | 2019-10-08 | 2019-10-08 | Pattern transfer method for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110740583B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04186792A (en) * | 1990-11-20 | 1992-07-03 | Nec Toyama Ltd | Printed wiring board and manufacture thereof |
| CN1658738A (en) * | 2005-01-10 | 2005-08-24 | 安捷利（番禺）电子实业有限公司 | Wet filming method of flexible printed circuit |
| CN101605432A (en) * | 2009-07-10 | 2009-12-16 | 番禺南沙殷田化工有限公司 | The automatic wet process lamination method of printed circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105873368A (en) * | 2016-04-29 | 2016-08-17 | 深圳崇达多层线路板有限公司 | Method for manufacturing outer layer graph of thick copper plate |
-
2019
- 2019-10-08 CN CN201910952211.8A patent/CN110740583B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04186792A (en) * | 1990-11-20 | 1992-07-03 | Nec Toyama Ltd | Printed wiring board and manufacture thereof |
| CN1658738A (en) * | 2005-01-10 | 2005-08-24 | 安捷利（番禺）电子实业有限公司 | Wet filming method of flexible printed circuit |
| CN101605432A (en) * | 2009-07-10 | 2009-12-16 | 番禺南沙殷田化工有限公司 | The automatic wet process lamination method of printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110740583A (en) | 2020-01-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100661713B1 (en) | Printed wiring board manufacturing method | |
| WO2005086552A1 (en) | Circuit board manufacturing method and circuit board | |
| CN109413881B (en) | Manufacturing method of carbon oil circuit board and solder-mask windowing | |
| JP2006073984A (en) | Resistor built-in printed circuit board and its manufacturing method | |
| US7404908B2 (en) | Printed wiring board manufacturing method | |
| CN111770638A (en) | Manufacturing process of printed circuit board with steps and printed circuit board | |
| KR20120007909A (en) | Printed wiring board manufacturing method | |
| CN110740583B (en) | Pattern transfer method for printed circuit board | |
| CN110785017B (en) | Method for preparing printed circuit board | |
| KR20090071494A (en) | Method of manufacturing for printed wiring board | |
| JP4705972B2 (en) | Printed wiring board and manufacturing method thereof | |
| KR101247303B1 (en) | Method of manufacturing printed circuit board | |
| KR100735659B1 (en) | Micro circuit pattern formation technique by offset printing, and the related female type master plate production method | |
| JP3740869B2 (en) | Fine pattern manufacturing method and printed wiring board using the same | |
| US5573815A (en) | Process for making improved metal stencil screens for screen printing | |
| JP2723744B2 (en) | Manufacturing method of printed wiring board | |
| KR100645642B1 (en) | High density BGA package board and method for manufacturing thereof | |
| JP2860694B2 (en) | Screen printing plate manufacturing method | |
| WO2019088355A1 (en) | Method for manufacturing three-dimensional shaped metal mask by using electroforming | |
| JPH02251195A (en) | Manufacture of printed wiring board | |
| JP2001094234A (en) | Method of fabricating printed wiring board and printed wiring board fabricated by the method | |
| CN115643681A (en) | Circuit board and manufacturing method thereof | |
| JPH06318774A (en) | Manufacturing method of printed-wiring board | |
| JPH04326588A (en) | Manufacture of printed wiring board | |
| JPH05218617A (en) | Manufacture of printed wiring board and printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |