CN105873368A - Method for manufacturing outer layer graph of thick copper plate - Google Patents
Method for manufacturing outer layer graph of thick copper plate Download PDFInfo
- Publication number
- CN105873368A CN105873368A CN201610280870.8A CN201610280870A CN105873368A CN 105873368 A CN105873368 A CN 105873368A CN 201610280870 A CN201610280870 A CN 201610280870A CN 105873368 A CN105873368 A CN 105873368A
- Authority
- CN
- China
- Prior art keywords
- thick copper
- dry film
- copper coin
- manufacture method
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a method for manufacturing an outer layer graph of a thick copper plate. The method comprises a step a of pasting a dry film to the copper surface of the thick copper plate according to the outer layer copper thickness; a step b of performing primary exposure and primary development; a step c of coating the dry film with a wet film; a step d of performing secondary exposure and secondary development, and manufacturing an outer layer line graph; a step e of opening a window through laser, and using laser to open the window at the position which is subject to hole sealing through the dry film, where a thick copper layer needs to be manufactured; and a step f of performing graph electroplating, to meet the requirements on the thickness of the copper layer in a hole and on the surface of the copper plate. For a thick copper core plate with the unsmooth surface, first the plate is coated with the dry film, the dry film to used to seal the hole after the line graph is manufactured, and then the dry film is coated with the wet film; the fall is filled, the problem that when only the plate is coated with the dry film, the dry film cannot be firmly combined with the copper surface and drops easily is solved, the quality of the thick copper plate is improved, the production yield is improved, and the production cost is reduced.
Description
Technical field
The invention belongs to printed circuit board manufacture technology field, relate in particular to the outer layer of a kind of thick copper coin
Pattern-producing method.
Background technology
Along with the continuous progress of electronic information technology, user's server power supply plate to electric current high-power, big
Day by day strengthen Deng the demand of printed wiring board (PCB), and this kind of PCB often require that have high-fire resistance,
The characteristics such as high-cooling property, it is therefore desirable to core material is thick copper coin.
Because core plate surface layers of copper thicker (>=3OZ), in the PCB course of processing, there is all adding in thick copper coin
Work difficult point, such as outer-layer circuit graphic making operation, outer graphics processing technology typically refers to use photic resisting
Erosion dry film (abbreviation dry film) is by exposing, be developed on overlying copper core plate face formation negative plating resist or positive
Anticorrosion protection figure, in order to electroplate or etch.Prior art ectomesoderm graphic making flow process is: outer
Layer pre-treatment → laminating dry film → exposure → development.
But above-mentioned flow process there is problems in that due to thick copper coin core material copper thickness >=3OZ, in pressing
During there is difference in height, fill when pressing prepreg fills up the difference in height of this position in pressing stress mistake
Often there is drop in journey, drop position is excessive, can cause center fullness, after outer layer laminating dry film
Easily produce bubble, cause dry film with copper face adhesion loosely because there is bubble after exposure imaging, produce
The problem that dry film comes off, causes manufacturing scrap, have impact on product circuit and produces, has drawn high production cost.
Summary of the invention
To this end, the technical problem to be solved is in prior art the outer graphics system of thick copper coin
During work dry film and copper face adhesion loosely, easy to fall off, affect post-exposure development flow process, draw high
Scrappage, thus propose a kind of improve adhesion, reduce into product cost thick copper coin outer graphics make
Method.
For solving above-mentioned technical problem, the technical scheme is that
The present invention provides the outer graphics manufacture method of a kind of thick copper coin, comprises the steps:
A, paste dry film according to the thick copper face at thick copper coin of outer layer copper；
B, for the first time exposure, for the first time development, make dry film shelter from the hole being opened in thick copper coin；
C, coating wet film；
D, second time exposure, second development, make outer-layer circuit figure；
E, laser are windowed, it would be desirable to make being windowed by the position laser of dry film sealing of hole of thick copper layer；
F, graphic plating, meet in hole, copper coin surface copper layer thickness demand.
As preferably, in described step e, in described step e, open described in the radius size ratio that laser is windowed
It is located at the big 0.15mm of pore radius of thick copper coin.
As preferably, the exposure of described first time, second time exposure all use 6 lattice exposure guide rules or 21 lattice exposure guide rules
Carry out.
As preferably, the specification of described dry film is the one in 25.4 μm, 40 μm or 50 μm.
As preferably, also include clean plate face after described step e, prevent the step in dry film access aperture.
As preferably, also including the operation of pre-treatment before described step a, described front operation is for removing plate face
Oxide, roughening plate face.
As preferably, the aux. pressure pasting dry film in described step a is 0.3-0.5Mpa, hot pressing rumble temperature
For 90-130 DEG C, pad pasting temperature is 40-50 DEG C.
As preferably, described wet film coating process particularly as follows: plate edges of boards reserve 2-15 μm space after
In plate, coating thickness is the photosensitive-ink of 30-50 μm
As preferably, in described step c, the thickness of wet film is according to the thickness of subsequent diagram plating plated hole metapore copper
Degree determines.
As preferably, at being additionally included in 85-105 DEG C after coating wet film, toast the step of 7-10min.
The technique scheme of the present invention has the advantage that compared to existing technology
The outer graphics manufacture method of thick copper coin of the present invention, comprises the steps: a, according to outer layer
The thick copper face at thick copper coin of copper pastes dry film；B, for the first time exposure, for the first time development；C, coating wet film；
D, second time exposure, second development, make outer-layer circuit figure；E, laser are windowed, it would be desirable to system
Make thickness to window with the dry film position laser of layer；F, graphic plating, meet in hole, copper coin surface layers of copper
Thickness requirements.For the thick copper core plate of surface irregularity, use and first paste dry film, after making line pattern
Use dry film sealing of hole, be then coated wet film, fill drop, improve and only paste dry film, dry film and copper face
In conjunction with the most caducous problem, improve the quality of thick copper coin, improve production yield, reduce life
Produce cost.
Detailed description of the invention
In order to make present disclosure be more likely to be clearly understood, being embodied as below according to the present invention
The present invention is further detailed explanation for example.
Embodiment 1
The present embodiment provides the outer graphics manufacture method of a kind of thick copper coin, comprises the steps:
A, make thick copper coin according to prior art, then carry out front operation, the thick copper coin of cleaning, remove thick copper
Plate surface oxide layer, and it is roughened copper face, to increase the adhesion of copper face and the follow-up dry film pasted, according to
Outer layer copper thickness and line width and distance paste dry film at the copper face of thick copper coin, in the present embodiment, described dry
Film is the dry film of 25.4 μm, and aux. pressure when pasting dry film is 0.3Mpa, and hot pressing rumble temperature is 90 DEG C,
Pad pasting temperature is 40 DEG C；
B, use 6 lattice exposure guide rules or 21 lattice exposure guide rules the thick copper coin having pasted dry film to be carried out for the first time to expose,
Then carrying out developing for the first time in developing machine, the exposure of described first time and for the first time development all use existing
Exposed and developed parameter in technology, as developer water concentration is: 1.0 ± 0.2%, temperature is 28-32 DEG C,
Make dry film that the hole offered is completely covered on thick copper coin, it is achieved dry film sealing of hole；
C, after dry film sealing of hole thick copper coin surface coating wet film, after edges of boards reserve the space of 2 μm, depend on
According to the photosensitive-ink of the thickness coating 30-50 μm of subsequent diagram plating plated hole metapore copper, in the present embodiment,
Described wet-film thickness is 30 μm, then toasts 7min at 85 DEG C；
D, employing conventional method carry out second time and expose, show for the second time the thick copper coin surface being coated with wet film
Shadow, produces whole outer-layer circuit figure；
E, laser are windowed, it would be desirable to the dry film position laser making thick copper layer is windowed, and use conventional laser
The dry film of sealing of hole is removed by bore process, in order to add thick copper layer, laser in the hole of follow-up copper thick to needs plating
The big 0.15mm of pore radius of thick copper coin it is opened in, after then laser being windowed described in the radius size ratio windowed
Position be carried out, cause in preventing dry film access aperture follow-up cannot plated hole, the problem that Kong Wutong occurs；
F, conventionally carry out graphic plating, according to in hole, the copper layer thickness requirement on copper coin surface
In the hole windowed, copper coin electroplating surface layers of copper.
Carry out subsequent treatment with common process afterwards, detect qualified rear packed products.
Method described in the present embodiment, for the thick copper core plate of surface irregularity, uses and first pastes dry film, system
Use dry film sealing of hole after making line pattern, be then coated wet film, fill drop, improve and only paste dry film,
Dry film is combined the most caducous problem with copper face, improves the quality of thick copper coin, improves production yield,
Reduce production cost.
Embodiment 2
The present embodiment provides the outer graphics manufacture method of a kind of thick copper coin, comprises the steps:
A, make thick copper coin according to prior art, then carry out front operation, the thick copper coin of cleaning, remove thick copper
Plate surface oxide layer, and it is roughened copper face, to increase the adhesion of copper face and the follow-up dry film pasted, according to
Outer layer copper thickness and line width and distance paste dry film at the copper face of thick copper coin, in the present embodiment, described dry
Film is the dry film of 40 μm, and aux. pressure when pasting dry film is 0.4Mpa, and hot pressing rumble temperature is 110 DEG C, patch
Film temperature is 45 DEG C；
B, use 6 lattice exposure guide rules or 21 lattice exposure guide rules the thick copper coin having pasted dry film to be carried out for the first time to expose,
Then carrying out developing for the first time in developing machine, the exposure of described first time and for the first time development all use existing
Exposed and developed parameter in technology, as developer water concentration is: 1.0 ± 0.2%, temperature is 28-32 DEG C,
Make dry film that the hole offered is completely covered on thick copper coin, it is achieved dry film sealing of hole；
C, after dry film sealing of hole thick copper coin surface coating wet film, after edges of boards reserve the space of 2 μm, depend on
According to the photosensitive-ink of the thickness coating 30-50 μm of subsequent diagram plating plated hole metapore copper, in the present embodiment,
Described wet-film thickness is 40 μm, then toasts 9min at 95 DEG C；
D, employing conventional method carry out second time and expose, show for the second time the thick copper coin surface being coated with wet film
Shadow, produces whole outer-layer circuit figure；
E, laser are windowed, it would be desirable to the dry film position laser making thick copper layer is windowed, in order to follow-up thickening
Layers of copper, the position after then windowing laser is carried out, cause in preventing dry film access aperture follow-up cannot
Plated hole, the problem that Kong Wutong occurs；
F, conventionally carry out graphic plating, according to in hole, the copper layer thickness requirement on copper coin surface
In the hole windowed, copper coin electroplating surface layers of copper.
Carry out subsequent treatment with common process afterwards, detect qualified rear packed products.
Embodiment 3
The present embodiment provides the outer graphics manufacture method of a kind of thick copper coin, comprises the steps:
A, make thick copper coin according to prior art, then carry out front operation, the thick copper coin of cleaning, remove thick copper
Plate surface oxide layer, and it is roughened copper face, to increase the adhesion of copper face and the follow-up dry film pasted, according to
Outer layer copper thickness and line width and distance paste dry film at the copper face of thick copper coin, in the present embodiment, described dry
Film is the dry film of 50 μm, and aux. pressure when pasting dry film is 0.5Mpa, and hot pressing rumble temperature is 130 DEG C, patch
Film temperature is 50 DEG C；
B, use 6 lattice exposure guide rules or 21 lattice exposure guide rules the thick copper coin having pasted dry film to be carried out for the first time to expose,
Then carrying out developing for the first time in developing machine, the exposure of described first time and for the first time development all use existing
Exposed and developed parameter in technology, as developer water concentration is: 1.0 ± 0.2%, temperature is 28-32 DEG C,
Make dry film that the hole offered is completely covered on thick copper coin, it is achieved dry film sealing of hole；
C, after dry film sealing of hole thick copper coin surface coating wet film, after edges of boards reserve the space of 2 μm, depend on
According to the photosensitive-ink of the thickness coating 30-50 μm of subsequent diagram plating plated hole metapore copper, in the present embodiment,
Described wet-film thickness is 50 μm, then toasts 10min at 105 DEG C；
D, employing conventional method carry out second time and expose, show for the second time the thick copper coin surface being coated with wet film
Shadow, produces whole outer-layer circuit figure；
E, laser are windowed, it would be desirable to the dry film position laser making thick copper layer is windowed, in order to follow-up thickening
Layers of copper, the position after then windowing laser is carried out, cause in preventing dry film access aperture follow-up cannot
Plated hole, the problem that Kong Wutong occurs；
F, conventionally carry out graphic plating, according to in hole, the copper layer thickness requirement on copper coin surface
In the hole windowed, copper coin electroplating surface layers of copper.
Carry out subsequent treatment with common process afterwards, detect qualified rear packed products.
Obviously, above-described embodiment is only for clearly demonstrating example, and not to embodiment
Restriction.For those of ordinary skill in the field, can also do on the basis of the above description
Go out change or the variation of other multi-form.Here without also all of embodiment being given thoroughly
Lift.And the obvious change thus extended out or variation are still in the protection domain of the invention
Among.
Claims (10)
1. the outer graphics manufacture method of a thick copper coin, it is characterised in that comprise the steps:
A, paste dry film according to the thick copper face at thick copper coin of outer layer copper；
B, for the first time exposure, for the first time development, make dry film shelter from the hole being opened in thick copper coin；
C, coating wet film；
D, second time exposure, second development, make outer-layer circuit figure；
E, laser are windowed, it would be desirable to make being windowed by the position laser of dry film sealing of hole of thick copper layer；
F, graphic plating, meet in hole, copper coin surface copper layer thickness demand.
The outer graphics manufacture method of thick copper coin the most according to claim 1, it is characterised in that institute
State in step e, described in the radius size ratio that laser is windowed, be opened in the big 0.15mm of pore radius of thick copper coin.
The outer graphics manufacture method of thick copper coin the most according to claim 1 and 2, it is characterised in that
The exposure of described first time, second time exposure all use 6 lattice exposure guide rules or 21 lattice exposure guide rules to carry out.
The outer graphics manufacture method of thick copper coin the most according to claim 3, it is characterised in that institute
The specification stating dry film is the one in 25.4 μm, 40 μm or 50 μm.
The outer graphics manufacture method of thick copper coin the most according to claim 4, it is characterised in that institute
Also include clean plate face after stating step e, prevent the step in dry film access aperture.
The outer graphics manufacture method of thick copper coin the most according to claim 5, it is characterised in that institute
Also including the operation of pre-treatment before stating step a, described front operation is for removing plate face oxide, roughening plate face.
The outer graphics manufacture method of thick copper coin the most according to claim 6, it is characterised in that institute
Stating and pasting the aux. pressure of dry film in step a is 0.3-0.5Mpa, and hot pressing rumble temperature is 90-130 DEG C, pad pasting
Temperature is 40-50 DEG C.
The outer graphics manufacture method of thick copper coin the most according to claim 7, it is characterised in that institute
State wet film coating process particularly as follows: plate edges of boards reserve 2-15 μm space after in plate coating thickness be
The photosensitive-ink of 30-50 μm.
The outer graphics manufacture method of thick copper coin the most according to claim 8, it is characterised in that institute
Stating in step c, the thickness of wet film determines according to the thickness of subsequent diagram plating plated hole metapore copper.
The outer graphics manufacture method of thick copper coin the most according to claim 9, it is characterised in that be coated with
The step of 7-10min is toasted at being additionally included in 85-105 DEG C after cloth wet film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610280870.8A CN105873368A (en) | 2016-04-29 | 2016-04-29 | Method for manufacturing outer layer graph of thick copper plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610280870.8A CN105873368A (en) | 2016-04-29 | 2016-04-29 | Method for manufacturing outer layer graph of thick copper plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105873368A true CN105873368A (en) | 2016-08-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610280870.8A Pending CN105873368A (en) | 2016-04-29 | 2016-04-29 | Method for manufacturing outer layer graph of thick copper plate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304643A (en) * | 2016-08-26 | 2017-01-04 | 深圳崇达多层线路板有限公司 | The outer-layer circuit manufacture method of big drop hard plate |
| CN110740583A (en) * | 2019-10-08 | 2020-01-31 | 深南电路股份有限公司 | Pattern transfer method for printed circuit board |
| CN115016229A (en) * | 2022-06-13 | 2022-09-06 | 明士(北京)新材料开发有限公司 | Preparation method of photoresist low-temperature cured thick film |
-
2016
- 2016-04-29 CN CN201610280870.8A patent/CN105873368A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304643A (en) * | 2016-08-26 | 2017-01-04 | 深圳崇达多层线路板有限公司 | The outer-layer circuit manufacture method of big drop hard plate |
| CN110740583A (en) * | 2019-10-08 | 2020-01-31 | 深南电路股份有限公司 | Pattern transfer method for printed circuit board |
| CN115016229A (en) * | 2022-06-13 | 2022-09-06 | 明士(北京)新材料开发有限公司 | Preparation method of photoresist low-temperature cured thick film |
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Application publication date: 20160817 |