JPH02251195A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH02251195A JPH02251195A JP7254189A JP7254189A JPH02251195A JP H02251195 A JPH02251195 A JP H02251195A JP 7254189 A JP7254189 A JP 7254189A JP 7254189 A JP7254189 A JP 7254189A JP H02251195 A JPH02251195 A JP H02251195A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- substrate
- resin
- printed wiring
- photosensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 229920005989 resin Polymers 0.000 claims abstract description 62
- 239000011347 resin Substances 0.000 claims abstract description 62
- 238000005530 etching Methods 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 238000005868 electrolysis reaction Methods 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 11
- 238000000151 deposition Methods 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 abstract description 13
- 238000004070 electrodeposition Methods 0.000 abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052802 copper Inorganic materials 0.000 abstract description 7
- 239000010949 copper Substances 0.000 abstract description 7
- 239000007788 liquid Substances 0.000 abstract description 2
- 238000007796 conventional method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000002659 electrodeposit Substances 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、印刷配線板の製造方法に関し、特にスルーホ
ールを有するスルーボール印刷配線板の製造方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a printed wiring board, and particularly to a method for manufacturing a through-ball printed wiring board having through holes.
従来印刷配線板の製造方法としては、露光・現像工程を
へてエツチングレジスト層を形成するフォト印刷法とス
クリーン板を用いてエツチングレジスト層を印刷形成す
るスクリーン印刷法との２種類に大別される。近年、印
刷配線板の高密度化の進展に伴ないビン間３本等ファイ
ンパターンの適用が進むにつれて、フォト印刷法の比率
が年々増加してきている。フォト印刷法の場合感光性樹
脂フィルムいわゆるドライフィルムが多用されてきたが
、ドライフィルムレジストでは、（，１）ファインライ
ン形成の点でピン間３〜４本が限界であること（２）下
地銀箔、銅めっき上の傷、へこみに対するカバーリング
が悪く歩留が改善できないといった欠点があり、この欠
点を補う新しい工法として、電着樹脂を用いる印刷配線
板の製造方法が採用され始めている。Conventional methods for producing printed wiring boards can be roughly divided into two types: photoprinting, which forms an etching resist layer through exposure and development steps, and screen printing, which prints and forms an etching resist layer using a screen plate. Ru. In recent years, as the density of printed wiring boards has become higher and finer patterns such as three lines between bins have been applied, the proportion of photo printing methods has been increasing year by year. In the photo printing method, a photosensitive resin film, so-called dry film, has been frequently used, but with dry film resist, (1) 3 to 4 pins is the limit in terms of forming fine lines, and (2) base silver foil. However, there are drawbacks such as poor covering of scratches and dents on the copper plating, making it impossible to improve the yield.As a new method to compensate for this drawback, printed wiring board manufacturing methods using electrodeposited resins are beginning to be adopted.
従来、電着樹脂を用いる印刷配線板の製造方法としては
次のようなものがあった。Conventionally, there have been the following methods for manufacturing printed wiring boards using electrodeposited resins.
（イ）孔の内壁および表裏面に銅めっきによる導電層２
を形成した基板１を光分解型（以下ポジ型と称す）また
は光重合型（以下ネガ型と称す）の電着感光性樹脂溶液
に浸漬し、直流電解により孔の内壁および表裏面の導電
Ｎ２上全面に感光性樹脂層を形成し、露光・現像を行な
って第２図（ａ）に示したようにエツチングレジスト層
７を形成する。次にエツチングし、次いでエツチングレ
ジスト層７の剥離を行なって所望の回路パターンを形成
する印刷配線板の製造方法がある。(a) Conductive layer 2 made of copper plating on the inner wall of the hole and on the front and back surfaces
The substrate 1 on which N2 has been formed is immersed in a photodegradable (hereinafter referred to as positive type) or photopolymerizable (hereinafter referred to as negative type) electrodeposition photosensitive resin solution, and conductive N2 is formed on the inner walls of the holes and on the front and back surfaces by direct current electrolysis. A photosensitive resin layer is formed on the entire upper surface and exposed and developed to form an etching resist layer 7 as shown in FIG. 2(a). There is a method of manufacturing a printed wiring board in which etching is then performed and then the etching resist layer 7 is peeled off to form a desired circuit pattern.
（ロ）又、（イ）と同様孔の内壁および表裏面に銅めっ
きによる導電層を形成した基板に感光性樹脂フィルムを
被着し露光・現像してめっきレジスト層８を形成した後
、基板を電着樹脂液に浸漬し第２図（ｂ）の如く直流電
解により孔の内壁および表裏面のめつきレジストで被覆
されていない導電層２上に樹脂層５ａを形成し、次いて
、めっきレジスト剥離、エツチンク、樹脂層剥離を行な
って回路パターンを形成する印刷配線板の製造方法とが
ある。(b) Also, as in (a), a photosensitive resin film is applied to a substrate on which a conductive layer is formed by copper plating on the inner wall of the hole and on the front and back surfaces, and after exposing and developing to form a plating resist layer 8, is immersed in an electrodeposition resin solution, and as shown in FIG. 2(b), a resin layer 5a is formed by direct current electrolysis on the inner wall of the hole and the conductive layer 2 on the front and back surfaces not covered with the plating resist, and then plated. There is a method of manufacturing a printed wiring board in which a circuit pattern is formed by removing a resist, etching, and removing a resin layer.
上述した従来の印刷配線板の製造方法には、次のような
欠点があった。The conventional printed wiring board manufacturing method described above has the following drawbacks.
（イ）の製造方法ではネガ型の感光性樹脂を用いた場合
、孔の内壁面に被着した感光性樹脂には露光時の光が十
分に当たらず、孔の内壁面の感光性樹脂を光重合させる
ことができないため、スルーホール印刷配線板には適用
できない欠点があった。この欠点を補うため散乱光を出
ず露光機を用いたり、感光性樹脂の感度を高くするとい
ったことがなされているが、この場合ても製造できる印
刷配線板のスルーポール径に限界があり、０３〜０，４
φといつな小径には適用できないという問題があった。In the production method (a), when a negative photosensitive resin is used, the photosensitive resin adhered to the inner wall of the hole is not sufficiently exposed to light, and the photosensitive resin on the inner wall of the hole is exposed. Since it cannot be photopolymerized, it has the disadvantage that it cannot be applied to through-hole printed wiring boards. In order to compensate for this drawback, attempts have been made to use an exposure machine that does not emit scattered light or to increase the sensitivity of photosensitive resin, but even in this case, there is a limit to the through-pole diameter of the printed wiring board that can be manufactured. 03～0,4
There was a problem that it could not be applied to diameters as small as φ.
しかしながら近年表面実装技術が多用されるにつれ、０
．３〜０．４φの小径スルーホールの適用比率も年々高
くなってきており、このような小径スルーホールの形成
能力は印刷配線板の製造には不可欠である。However, as surface mount technology has been widely used in recent years,
．． The application ratio of small diameter through holes of 3 to 0.4 φ is increasing year by year, and the ability to form such small diameter through holes is essential for manufacturing printed wiring boards.
一方、ポジ型の感光性樹脂を用いる方法では、上述した
ネガ型の欠点を解消でき、小径スルーポールが形成でき
るが、電着てきる感光性樹脂の膜厚が５〜８μｍ程度と
薄くピンホールが出来やすい点と感光感度が著しく悪く
５〜８μｍでも５００〜１ 、 ＯＯＯｍ 、ｊ ／ｃ
ｎｔとかなり高い露光量が必要であり、歩留の点でも生
産性の面からも問題があった。On the other hand, the method using a positive type photosensitive resin can overcome the drawbacks of the negative type described above and can form small-diameter through-poles, but the film thickness of the electrodeposited photosensitive resin is as thin as 5 to 8 μm, making it difficult to form pinholes. It easily forms and the photosensitivity is extremely poor, even at 5-8 μm, it is 500-1, OOOm, j/c.
This requires a considerably high exposure amount of nt, which poses problems in terms of yield and productivity.
（ロ）の製造方法は、感光性樹脂フィルムを用いてめっ
きレジストを形成するため導電層とめっきレジストとの
密着が悪く、ブリッジが発生し易いという欠点があった
。まためっきレジストを剥離する際電着形成した樹脂層
とめっきレジストが密着し易いため剥離に特殊装置を必
要とし、かつ完全剥離も困難であるという重大な欠点を
持っていた。The manufacturing method (b) has the disadvantage that since the plating resist is formed using a photosensitive resin film, the adhesion between the conductive layer and the plating resist is poor and bridging is likely to occur. Furthermore, when the plating resist is peeled off, the electrodeposited resin layer and the plating resist tend to come into close contact with each other, so a special device is required for the peeling, and complete peeling is also difficult, which is a serious drawback.
本発明の目的は、従来の欠点を除去し、小径スルーホー
ルが形成でき表面実装化に対応でき、かつ、ピンホール
の発生が皆無で、高歩留が得られ、また、生産性も高く
、高信頼性でかつ低コストの印刷配線板の製造方法を提
供することにある。The purpose of the present invention is to eliminate the drawbacks of the conventional technology, to form small-diameter through holes, to be compatible with surface mounting, to eliminate the occurrence of pinholes, to obtain high yields, and to achieve high productivity. An object of the present invention is to provide a highly reliable and low-cost method of manufacturing a printed wiring board.
本発明の印刷配線板の製造方法は、孔の内壁面および表
裏面に導電層が形成されている基板の表裏面に樹脂マス
クを被着形成する工程と、基板を電着樹脂液に浸漬し、
直流電解により孔の内壁面の導電層上に樹脂層を形成す
る工程と、樹脂マスクを除去し電着感光性樹脂溶液に浸
漬し直流電解により感光性樹脂層を形成する工程と、感
光性樹脂層にマスクを介して露光・現像してエツチング
レジスト層を形成した後、エツチングレジスト層をマス
クとして導電層の露出部分を選択的にエツチング除去す
る工程と、樹脂層および感光性樹脂層を除去する工程と
を含むことを特徴として構成される。The method for manufacturing a printed wiring board of the present invention includes a step of depositing a resin mask on the front and back surfaces of a substrate on which conductive layers are formed on the inner walls of the holes and on the front and back surfaces, and immersing the substrate in an electrodeposited resin solution. ,
A step of forming a resin layer on the conductive layer on the inner wall surface of the hole by direct current electrolysis, a step of removing the resin mask and immersing it in an electrodeposition photosensitive resin solution and forming a photosensitive resin layer by direct current electrolysis, and a step of forming a photosensitive resin layer by direct current electrolysis. After forming an etching resist layer by exposing and developing the layer through a mask, a step of selectively etching away the exposed portion of the conductive layer using the etching resist layer as a mask, and removing the resin layer and the photosensitive resin layer. It is characterized by including a process.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ）〜（ｈ）は本発明の一実施例を説明するな
めに工程順に示した印刷配線板の断面図である。FIGS. 1(a) to 1(h) are cross-sectional views of a printed wiring board shown in order of process for explaining one embodiment of the present invention.
まず、第１図（ａ）の如く、孔あけおよび銅めっきを行
ない孔３の内壁面および基板１の表裏面に銅めっきによ
る導電層２を形成する。次に、第１図（ｂ）の如く基板
１の表裏面に樹脂マスク４を塗布・乾燥する。次いて第
１図（ｃ）の如く電着樹脂溶液に基板１を浸漬し、直流
電解を印加して孔３の内壁の導電層４上に樹脂層５を電
着する。次に、第１−図（ｄ）の如く基板１の表裏面の
樹脂マスク４を除去した後、第］−図（ｅ）の如くネガ
型電着感光性樹脂液に浸漬し、直流電解を印加して基板
１の表裏面に感光性樹層６を形成する。次いで、マスク
を介して露光し、現像して、第１図（ｆ）の如く樹脂層
５および感光性樹脂層６から成るエツチングレジストを
形成した後、第１図（ｇ＞の、如くエツチングし、第１
図（ｈ）の如く樹脂層５および感光性樹脂層６を剥離除
去して所望の回路パターンを有する印刷配線板を得な。First, as shown in FIG. 1(a), drilling and copper plating are performed to form a conductive layer 2 by copper plating on the inner wall surface of the hole 3 and on the front and back surfaces of the substrate 1. Next, as shown in FIG. 1(b), a resin mask 4 is applied to the front and back surfaces of the substrate 1 and dried. Next, as shown in FIG. 1(c), the substrate 1 is immersed in an electrodeposition resin solution, and DC electrolysis is applied to electrodeposit the resin layer 5 on the conductive layer 4 on the inner wall of the hole 3. Next, after removing the resin masks 4 on the front and back surfaces of the substrate 1 as shown in Fig. 1 (d), it is immersed in a negative electrodeposited photosensitive resin liquid as shown in Fig. 1 - (e), and subjected to direct current electrolysis. A photosensitive resin layer 6 is formed on the front and back surfaces of the substrate 1 by applying a photosensitive resin. Next, after exposure through a mask and development to form an etching resist consisting of a resin layer 5 and a photosensitive resin layer 6 as shown in FIG. 1(f), etching is performed as shown in FIG. 1(g>). , 1st
As shown in Figure (h), the resin layer 5 and the photosensitive resin layer 6 are peeled off to obtain a printed wiring board having a desired circuit pattern.
なお、上記実施例の第１図（ｅ）に示す感光性樹脂層６
はネガ型電着感光性樹脂液に浸漬し、直流電解を印加し
て形成したが、ネガ型にかえて、ポジ型電着性感光性樹
脂を用いても同様に本発明を実施することができる。Note that the photosensitive resin layer 6 shown in FIG. 1(e) in the above embodiment
was formed by immersing it in a negative-type electrodeposition photosensitive resin solution and applying direct current electrolysis, but the present invention can be carried out in the same way by using a positive-type electrodeposition photosensitive resin instead of a negative type. can.
以上の説明から明らかなように、本発明によれば以下の
効果がある。As is clear from the above description, the present invention has the following effects.
（１）小径スルーホールが形成でき、表面実装化に対応
した印刷配線板が製造できる。(1) Small-diameter through holes can be formed, and printed wiring boards compatible with surface mounting can be manufactured.
（２）ピンホールの発生が階無で高歩留が得られ、また
生産性も高く、高信頼度性でかつ低コストの印刷配線板
が製造できる。(2) High yields can be obtained with no pinholes, and printed wiring boards can be produced with high productivity, high reliability, and low cost.
第１図（ａ）〜（ん）は、本発明の一実施例を説明する
ために工程順に示した印刷配線板の断面図、第２図（ａ
）、（ｂ）は何れも従来の印刷配線板の製造方法を説明
するための従来方法により形成された印刷配線板の断面
図である。
１・・・基板、２・・・導電層、３・・・孔、４・・・
樹脂マスク、５，５ａ・・・樹脂層、６・・・感光性樹
脂、７・・・エツチングレジスト層、８・・めっきレジ
スト層。FIGS. 1(a) to 1(n) are cross-sectional views of a printed wiring board shown in the order of steps for explaining one embodiment of the present invention, and FIG.
) and (b) are both cross-sectional views of a printed wiring board formed by a conventional method for explaining a conventional method of manufacturing a printed wiring board. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Conductive layer, 3... Hole, 4...
Resin mask, 5, 5a... Resin layer, 6... Photosensitive resin, 7... Etching resist layer, 8... Plating resist layer.
Claims (1)
板の表裏面に樹脂マスクを被着形成する工程と、前記基
板を第１の電着樹脂溶液に浸漬し直流電解により前記孔
の内壁面の導電層上に樹脂層を形成する工程と、前記樹
脂マスクを除去した後、前記基板を電着感光性樹脂溶液
に浸漬し、直流電解により感光性樹脂層を形成する工程
と、前記樹脂層および感光性樹脂層にマスクを介して露
光・現像してエッチングレジスト層を形成した後、エッ
チングレジスト層をマスクとして導電層の露出部分を選
択的にエッチング除去する工程と、前記樹脂層および感
光性樹脂層を除去する工程とを含むことを特徴とする印
刷配線板の製造方法。A step of depositing a resin mask on the front and back surfaces of the substrate having a conductive layer formed on the inner wall surface of the hole and the front and back surfaces, and immersing the substrate in a first electrodeposited resin solution and applying DC electrolysis to the inside of the hole. forming a resin layer on the conductive layer on the wall; after removing the resin mask, immersing the substrate in an electrodeposited photosensitive resin solution and forming a photosensitive resin layer by direct current electrolysis; A step of forming an etching resist layer by exposing and developing the conductive layer and the photosensitive resin layer through a mask, and then selectively etching and removing exposed portions of the conductive layer using the etching resist layer as a mask; 1. A method for producing a printed wiring board, the method comprising the step of removing a synthetic resin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7254189A JPH0760927B2 (en) | 1989-03-24 | 1989-03-24 | Method for manufacturing printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7254189A JPH0760927B2 (en) | 1989-03-24 | 1989-03-24 | Method for manufacturing printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02251195A true JPH02251195A (en) | 1990-10-08 |
| JPH0760927B2 JPH0760927B2 (en) | 1995-06-28 |
Family
ID=13492320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7254189A Expired - Fee Related JPH0760927B2 (en) | 1989-03-24 | 1989-03-24 | Method for manufacturing printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0760927B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5576148A (en) * | 1994-02-01 | 1996-11-19 | Kansai Paint Co., Ltd. | Process for production of printed circuit board |
| US6802120B2 (en) * | 2001-07-10 | 2004-10-12 | Nippon Avionics Co., Ltd. | Method of manufacturing a printed wiring board having a non-through mounting hole |
| CN104023480A (en) * | 2014-06-13 | 2014-09-03 | 金悦通电子（翁源）有限公司 | Processing method for shortening PCB plating process |
-
1989
- 1989-03-24 JP JP7254189A patent/JPH0760927B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5576148A (en) * | 1994-02-01 | 1996-11-19 | Kansai Paint Co., Ltd. | Process for production of printed circuit board |
| US6802120B2 (en) * | 2001-07-10 | 2004-10-12 | Nippon Avionics Co., Ltd. | Method of manufacturing a printed wiring board having a non-through mounting hole |
| CN104023480A (en) * | 2014-06-13 | 2014-09-03 | 金悦通电子（翁源）有限公司 | Processing method for shortening PCB plating process |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0760927B2 (en) | 1995-06-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |