CN1096691C - 要安装到印刷电路板上的线绕元件 - Google Patents

要安装到印刷电路板上的线绕元件 Download PDF

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CN1096691C
CN1096691C CN97102912.1A CN97102912A CN1096691C CN 1096691 C CN1096691 C CN 1096691C CN 97102912 A CN97102912 A CN 97102912A CN 1096691 C CN1096691 C CN 1096691C
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circuit board
printed circuit
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前多治
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Funai Electric Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
    • Y10T29/49142—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal including metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

一种要安装到印刷电路板上的线绕元件。在线绕元件体上绕线，并将线的两端绕到引出端上，用模制耐热树脂材料将引出端和线绕元件体构成为一个整体。线的两端绕到模制引出端上，并将引出端***印刷电路板，然后焊接，使其连接到印刷电路板的电路图形上。

Description

要安装到印刷电路板上的线绕元件
本发明涉及诸如变压器、行滤波器、线圈之类要安装到印刷电路板上的线绕元件的结构改进。
常规的线绕元件是用树脂制成的，其金属引出端牢固地压装在线绕元件体(以下称作“元件体”)的周边中，金属线绕在元件体上，其两个端部绕在金属引出端上，由此构成线绕元件。在印刷电路板上安装线绕元件时，将金属引出端***印刷电路板并焊到电路上；或线绕元件本身具有安装部分可固定到印刷电路板上，而将其金属引出端通过引线连到印刷电路板的电路上。
但是，要安装到印刷电路板上的线绕元件的上述结构有以下问题：
必须设置只用于印刷电路板的专用金属引出端，并将其压装在元件体中，因而大大增加了制造步骤和成本；
当线绕元件的金属引出端通过引线连接到印刷电路板上的电路上时，连接点数量很大，使成本增加。
因此，本发明的目的是，提供一种要安装到印刷电路板上的线绕元件，其结构能减少制造工艺步骤和制造成本。
为达到上述目的，本发明提供的要安装到印刷电路板上的线绕元件包括：其上要绕线的线绕元件体；其上绕有绕线端部的模制引出端，该模制引出端与线绕元件体以耐热树脂材料模制成一个整体。
图1是按本发明优选实施例构成的轴上局部绕有线圈的AC行滤波器的正视图；
图2(A)、2(B)和2(C)是正视图，图2(D)和2(E)是剖视图，详细示出AC行滤波器的模制引出端，并表示出安装模制引出端到一印刷电路板上的步骤；
图3(A)、3(B)和3(C)是模制引出端的改型的正视图。
以下参见图1和2(A)至2(E)说明本发明的一个优选实施例。
图1和图2(A)至2(E)中，1表示线绕元件，即本发明实施例的AC行滤波器。AC行滤波器1包括：铁芯2；***铁芯2的耐热树脂材料(实施例中是聚对苯二甲酸乙酯)构成的线轴3；和绕在线轴3上的两段金属线4。线轴3包括：其上设置有两个绕组的线轴体3a，线轴体3a的两端有两个端缘3b和3c；端缘3b中嵌入的一对模制引出端5和5；端缘3c中嵌入的另一对模制引出端6和6。两段金属线4之一绕在轴3的一个绕组段上，它的两端分别绕在模制引出端5和5上；另一段金属线4绕在线轴3的另一绕组段上，它的两端分别绕在模制引出端6和6上。
图2(A)至2(E)示出印刷电板7上那些引出端中每个模制引出端5和6的详细结构和安装工艺步骤。
图2(A)至2(E)只展示出作为模制引出端5和6一个典型例的模制引出端5；但应注意，模制引出端5和6的结构彼此相同，并以相同方式安装到印刷电路板7上。
首先，模制线轴体3a时同时制成模制引出端5，其结构如图2(A)所示；即，模制引出端5包括：有大直径L1的底座部分5a；有中等直径L2的第1防止移动部分5b；和有小直径L3的缠绕部分5c，即L1＞L2＞L3。模制引出端5还包括其直径L4大于缠绕部分5c的直径L3但小于底座部分5a的直径L1的第2防止移动部分5d，即L1＞L4＞L3。
如图2(B)所示绕制绕线4的一个端部或另一端部。此后，绕在模制引出端5上的一端浸入约400℃的熔融焊料中，其结果如图2(C)所示。除去线4端部上覆盖的聚亚胺脂模等，将焊料加到线4的端部表面上，使模制引出端5变成拟金属引出端。
之后，如图2(D)所示，将模制引出端5的端部***印刷电路板7中的模制引出端插孔7a中。插孔7a的直径M大于模制引出端5的第1和第2防止移动部分5b和5d的直径L2和L4，但小于底座部分5a的直径L1。即L1＞M＞L2或L4。因此，按第1防止移动部分5b***孔7a中、底座5a支撑在印刷电路板7上的方式结束线绕元件AC的行滤波器1的***操作；即，模制引出端5处于随后要进行焊接操作的位置。印刷电路板7的一边有电路图形7b，即图2(D)所示的按模制引出端5的***方向的下表面上有电路图形7b。
最后，在230℃-250℃的温度范围进行浸入操作，通过焊料8使绕在模制引出端5上的线4的端部牢固地连接到电路图形7b上。即，当AC行滤波器1安装到印刷电板7上时，线4电连接到电路图形7b上，如图2(E)所示。
如上所述，线4的端部绕到模制引出端5上之后，将其浸入溶融的焊料中，从而给线端加上焊料。于是，除去线4端部的膜，将绕在模制引出端5上的线4的线匝牢固地相互焊在一起。即，将这样处理过的模制引出端5用作金属引出端。因此，能容易地将模制引出端5固定到印刷电路板7上。
上述的模制引出端5包括大直径的底座部分5a、中等直径的第1防止移动部分5b、小直径的绕线部分5c、和端部的第2防止移动部分5d。因此，能防止线从模制引出端5脱落。另一方面，由于印刷电路板7中形成的孔7a的直径M满足L1＞M＞L2或L4的条件，因此，能使模制引出端5在焊接操作中就位；即，能正确而迅速地进行焊接操作。
已说明了本发明的优选实施例，但本发明不限于该实施例，或者说实施例不限制发明。本发明在不脱离其主题情况下可以有各种变化或改型。即，本发明的技术原理可用于各种线绕元件，如变压器、线圈、以及上述的AC行滤波器1等。耐热树脂材料除聚对苯二甲酸乙酯外，还可用酚。焊接操作中，模制引出端可以有某些变形或熔融。更具体地说是，它可以变形或熔融到能作为引出端的程度。因此，模制引出端材料的耐热性可以不高。
如图2(C)所示，根据对线绕元件的质量要求，可省去线绕到模制引出端5后所进行的焊接操作。
如图3(A)、3(B)和3(C)所示，模制引出端5或6在结构上可以改型。用除去图2(A)至2(E)所示模制引出端5的第2防止移动部分5d可得到图3(A)所示的模制引出端。用除去图2(A)至2(E)所示模制引出端5的第1防止移动部分5b可得到图3(B)所示的模制引出端。用除去图2(A)至2(E)所示模制引出端5的第1和第2防止移动部分5b和5d可得到图3(C)所示的模制引出端。
如上所述，用本发明的线绕元件不必用金属引出端，也不必对其压装，因而减少了制造步骤，降低了成本。

Claims (5)

1.一种要安装到印刷电路板上的线绕元件，包括：
其上要绕线的线绕元件体；
线的端部绕于其上的模制引出端，以模制耐热树脂材料将该模制引出端和所述线绕元件体构成为一个整体，
其特征是，所述模制引出端包括：
直径为L1的底座部分；
直径为L2、且L2＜L1、从所述底座部分伸出的第1防止移动部分；
直径为L3、且L3＜L2、从所述第1防止移动部分伸出的绕线部分；
直径为L4、且L1＞L4＞L3、从所述绕线部分伸出的作为端部的第2防止移动部分，
其中，所述底座部分的直径L1大于印刷电路板中形成的模制引出端***孔的直径M，所述第1和第2防止移动部分的直径L2和L4小于直径M。
2.如权利要求1的线绕元件，其特征是，耐热树脂材料为聚对苯二甲酸乙脂。
3.如权利要求1的线绕元件，其特征是，耐热树脂材料是酚。
4.一种将权利要求1的线绕元件安装到印刷电路板上的方法，包括以下步骤：
将其上绕有线的端部的所述模制引出端插到印刷电路板上；
使绕在所述模制引出端上的线的端部与印刷电路板上的电路图形相互焊接在一起。
5.如权利要求4的方法，还包括在所述***步骤前除去绕在所述模制引出端上的线的端部的覆盖膜的步骤。
CN97102912.1A 1996-01-23 1997-01-23 要安装到印刷电路板上的线绕元件 Expired - Fee Related CN1096691C (zh)

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JP1996000145U JP3027112U (ja) 1996-01-23 1996-01-23 巻線部品のプリント基板への取り付け構造

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CN1823396B (zh) * 2003-07-11 2010-05-12 Nxp股份有限公司 电感***及其制造方法、印刷电路板和调谐器

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