CN106373904A - Production marking method of IC (Integrated Circuit) support plate - Google Patents
Production marking method of IC (Integrated Circuit) support plate Download PDFInfo
- Publication number
- CN106373904A CN106373904A CN201610872775.7A CN201610872775A CN106373904A CN 106373904 A CN106373904 A CN 106373904A CN 201610872775 A CN201610872775 A CN 201610872775A CN 106373904 A CN106373904 A CN 106373904A
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- support plate
- mark position
- quick response
- response code
- outermost layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to a production marking method of an IC (Integrated Circuit) support plate. The IC support plate comprises multiple layers of substrates which are laminated and is corresponding to a two-dimensional code. The marking method comprises the following steps of reserving a first mark position on an inner-layer substrate; marking the corresponding two-dimensional code in the first mark position by processing a through hole; at least laminating an outer-layer substrate at each of two sides of the inner-layer substrate; performing circuit fabrication on each outer-layer substrate, reserving a second mark position on one of the outer-layer substrates arranged at the outermost layer, and performing windowing on a position corresponding to the first mark position; and reading the two-dimensional code of the first mark position in a backlight condition, and marking the corresponding two-dimensional code in the second mark position by processing a through hole. By the IC support plate, mark transfer of an inner layer and an outer layer is realized, and mark accuracy and consistency of an inner-layer plate and an outer-layer plate are ensured; the two-dimensional code is set to be information such as numbers, defect positions and the like of the IC support plate, production tracking and monitoring are facilitated, automatic production is satisfied, and the production efficiency is improved.
Description
Technical field
The present invention relates to ic support plate production marker technical field, particularly to a kind of ic support plate production marker method.
Background technology
With the development of ic support plate industry, circuit is more and more intensive, and multi-layer sheet gradually increases, multi-layer sheet after lamination,
It is difficult to distinguish the numbering of inner plating, be typically marked record by manual record individual plates at present and shift, but be frequently present of
The situation of error of omission, incorrect posting or transfer mistake, makes the numbering of inside and outside laminate inconsistent, and current mark mode cannot meet certainly
Dynamic metaplasia is produced, low production efficiency, is unfavorable for following the tracks of.
Content of the invention
It is an object of the invention to provide a kind of ic support plate production marker method, ensure that the standard of the labelling of inside and outside laminate
Really property and and concordance, meet automated production, beneficial to tracking.
For realizing the purpose of the present invention, adopt the technical scheme that:
A kind of ic support plate production marker method, ic support plate includes being laminated the multilager base plate of pressing, corresponding one two of ic support plate
Dimension code, this labeling method comprises the following steps:
(1), the first mark position is reserved on internal substrate；
(2), in the first mark position, mark corresponding Quick Response Code by processing through hole；
(3), at least press one layer of outermost layer substrate respectively in the both sides of internal substrate；
(4), circuit making is carried out to outermost layer substrate, in the second mark reserved on outermost one of outermost layer substrate
Note position simultaneously carries out windowing process in the position of corresponding first mark position；
(5) under backlight conditions, read the Quick Response Code of the first mark position, and pass through to process through hole in the second mark position
Mark corresponding Quick Response Code.
Process multiple through holes, the throughhole portions in the first mark position and entity portion in the first mark position of internal substrate
Divide and cooperatively form the corresponding Quick Response Code of ic support plate, after multi-layer sheet pressing, processed by windowing and read internal layer under backlight conditions
The labelling of substrate, finally by the Quick Response Code processing reading on outermost outermost layer substrate, the labelling realizing ectonexine turns
Move it is ensured that the accuracy of the labelling of inside and outside laminate and concordance；One Quick Response Code corresponds to an ic support plate, and this Quick Response Code can root
According to need to be set to should the other information such as the numbering of ic support plate, defective locations, beneficial to production tracing and monitoring, and Quick Response Code
Automated production, improve production efficiency can be met by external equipment automatic identification.
Below technical scheme is further illustrated:
It is further in step (5), to read the Quick Response Code of the first mark position by scanner, then will read
Information send to controller, controller drives process equipment to process corresponding Quick Response Code in the second mark position.By sweeping
Retouch the Quick Response Code in instrument automatic identification first mark position, realize the transfer of internal substrate labelling, improve ectonexine further
The accuracy of the labelling of plate and concordance.
It is further that scanner is two-dimensional code scanning rifle.
It is further, in step (1), the first mark position to be reserved on the copper face of internal substrate.First marker bit
Put and be arranged on copper face, make to be easier in step (4) to read the Quick Response Code of the first mark position under backlight conditions.
It is further, in step (4), the position of corresponding first mark position of outermost layer substrate to be etched, makes outer
The base material of corresponding first mark position of laminar substrate is exposed.Make to be easier in step (4) to read the first marker bit under backlight conditions
The Quick Response Code put.
It is further, in step (4), the second mark position to be reserved on the copper face of outermost layer substrate.
It is further, after completing step (5), to continue n other outermost layer substrate of superposition pressing on outermost laminar substrate, often
Secondary superposition press first repeated execution of steps (4) and (5) after at least one of which outermost layer substrate, is further continued for folding of outermost layer substrate next time
Pressurization is closed, and makes to process corresponding Quick Response Code in the n-th+2 mark position, and wherein n is natural number.
It is further, in step (2) and step (5), through hole to be machined by single shaft rig or laser drilling.
Compared with prior art, the method have the advantages that
The present invention to mark the corresponding Quick Response Code of ic support plate by boring on internal substrate, after multi-layer sheet pressing, leads to
Cross the labelling that windowing processes and reads internal substrate under backlight conditions, process finally by outermost outermost layer substrate
The Quick Response Code reading, the labelling transfer realizing ectonexine is it is ensured that the accuracy of the labelling of inside and outside laminate and concordance；One two dimension
The corresponding ic support plate of code, this Quick Response Code can be arranged as required to be to should the numbering of ic support plate, defective locations etc. other
Information, beneficial to production tracing and monitoring, and Quick Response Code can be identified by external equipment, meets automated production, improve and produce effect
Rate.
Brief description
Fig. 1 is the schematic flow sheet of embodiment of the present invention ic support plate production marker method；
Fig. 2 is the first working state schematic representation in embodiment of the present invention ic support plate production marker；
Fig. 3 is the second working state schematic representation in embodiment of the present invention ic support plate production marker；
Fig. 4 is the 3rd working state schematic representation in embodiment of the present invention ic support plate production marker；
Fig. 5 is the 4th working state schematic representation in embodiment of the present invention ic support plate production marker.
Description of reference numerals:
10. Quick Response Code, 20. internal substrates, 210. first mark positions, 30. outermost layer substrates, 310. second mark positions,
40. base materials, 50. copper faces.
Specific embodiment
Below in conjunction with the accompanying drawings embodiments of the invention are described in detail:
As shown in figure 1, a kind of ic support plate production marker method, ic support plate includes being laminated the multilager base plate of pressing, its feature
It is, ic support plate corresponds to a Quick Response Code 10, this labeling method comprises the following steps:
(1) as shown in Fig. 2 the first mark position 210 is reserved on internal substrate 20；
(2) as shown in figure 3, marking corresponding Quick Response Code 10 by processing through hole in the first mark position 210；
(3), at least press one layer of outermost layer substrate 30 respectively in the both sides of internal substrate 20；
(4) make, positioned at outermost one of outermost layer substrate as shown in figure 4, outermost layer substrate 30 is entered with row line
Reserve the second mark position 310 on 30 and carry out windowing process in the position of corresponding first mark position 210；
(5) as shown in figure 5, reading the Quick Response Code 10 of the first mark position 210 under backlight conditions, and in the second labelling
Position 310 marks corresponding Quick Response Code 10 by processing through hole.
Process multiple through holes, the throughhole portions in the first mark position 210 in the first mark position 210 of internal substrate 20
Cooperatively form the corresponding Quick Response Code of ic support plate with entity part, after multi-layer sheet pressing, processed and under backlight conditions by windowing
Read the labelling of internal substrate 20, finally by the Quick Response Code 10 that reading is processed on outermost outermost layer substrate 30, realize
The labelling transfer of ectonexine is it is ensured that the accuracy of the labelling of inside and outside laminate and concordance；One Quick Response Code 10 corresponds to an ic and carries
Plate, this Quick Response Code 10 can be arranged as required to be to should the other information such as the numbering of ic support plate, defective locations, beneficial to production
Follow the tracks of and monitor, and Quick Response Code 10 can be identified by external equipment, meets automated production, improve production efficiency.
In the present embodiment, in step (2) and step (5), holed by single shaft rig or laser drilling machine, also
According to actual needs through hole can be processed by other equipment.
The Quick Response Code 10 of the first mark position 210, then the information that will read in step (5), is read by scanner
Send to controller, controller drives rig to process corresponding Quick Response Code 10 in the second mark position 310.By scanning
Quick Response Code 10 in instrument automatic identification the first mark position 210, realizes the transfer of internal substrate 20 labelling, improves interior further
The accuracy of the labelling of lamina rara externa and concordance.
In the present embodiment, scanner is Quick Response Code 10 scanner, and scanner can also adopt according to actual needs
Other forms.
After completing step (5), continue in n outermost layer substrate 30 of superposition pressing on outermost outermost layer substrate 30, often
Secondary superposition has pressed first repeated execution of steps (4) and (5) after at least one of which outermost layer substrate 30, is further continued for outermost layer substrate 30 next time
Superposition pressing, make the n-th+2 mark position process corresponding Quick Response Code 10, wherein n be natural number.
In the present embodiment, press one layer of outermost layer substrate 30 respectively in the both sides of internal substrate 20, the two of outermost layer substrate 30
After the completion of dimension code 10 labelling, continue to be superimposed one layer of outermost layer substrate 30 of pressing in the outside of two outermost layer substrates 30 respectively.Fold every time
The number of plies that outermost layer substrate 30 is closed in pressurization can adopt more than one layer according to actual needs.
In step (4), the position of corresponding first mark position 210 of outermost layer substrate 30 is etched, makes outermost layer substrate
The base material 40 of 30 corresponding first mark positions 210 is exposed, makes to be easier in step (4) to read the first marker bit under backlight conditions
Put 210 Quick Response Code 10.
In the present embodiment, mark position is arranged on the copper face 50 on counterpart substrate, makes more to hold under backlight conditions
Easily read the Quick Response Code 10 of mark position.Mark position also dependent on be actually needed base material 40 grade being arranged on counterpart substrate other
Position.
Each technical characteristic of embodiment described above can arbitrarily be combined, for making description succinct, not to above-mentioned reality
The all possible combination of each technical characteristic applied in example is all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all it is considered to be the scope of this specification record.
Embodiment described above only have expressed the several embodiments of the present invention, and its description is more concrete and detailed, but simultaneously
Can not therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
Say, without departing from the inventive concept of the premise, some deformation can also be made and improve, these broadly fall into the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be defined by claims.
Claims (8)
1. a kind of ic support plate production marker method, ic support plate includes being laminated the multilager base plate of pressing it is characterised in that ic support plate pair
Answer a Quick Response Code, this labeling method comprises the following steps:
(1), the first mark position is reserved on internal substrate；
(2), in the first mark position, mark corresponding Quick Response Code by processing through hole；
(3), at least press one layer of outermost layer substrate respectively in the both sides of internal substrate；
(4), circuit making is carried out to outermost layer substrate, the second marker bit is being reserved on outermost one of outermost layer substrate
Put and carry out windowing process in the position of corresponding first mark position；
(5) under backlight conditions, read the Quick Response Code of the first mark position, and pass through to process through hole labelling in the second mark position
Go out corresponding Quick Response Code.
2. ic support plate production marker method according to claim 1 is it is characterised in that in step (5), by scanner
Device reads the Quick Response Code of the first mark position, then the information of reading is sent to controller, and controller drives process equipment the
Two mark positions process corresponding Quick Response Code.
3. ic support plate production marker method according to claim 2 is it is characterised in that described scanner is swept for Quick Response Code
Retouch rifle.
4. ic support plate production marker method according to claim 1 is it is characterised in that in step (1), in internal substrate
Copper face on reserved first mark position.
5. ic support plate production marker method according to claim 4 is it is characterised in that in step (4), to outermost layer substrate
The position of corresponding first mark position is etched, and makes the base material of corresponding first mark position of outermost layer substrate exposed.
6. ic support plate production marker method according to claim 1 is it is characterised in that in step (4), in outermost layer substrate
Copper face on reserved second mark position.
7. the ic support plate production marker method according to any one of claim 1 to 6 is it is characterised in that complete step (5)
Afterwards, continue n outermost layer substrate of superposition pressing on outermost laminar substrate, superposition every time first weighs after having pressed at least one of which outermost layer substrate
Multiple execution step (4) and (5), are further continued for the superposition pressing of outermost layer substrate next time, make to process correspondence in the n-th+2 mark position
Quick Response Code, wherein n be natural number.
8. the ic support plate production marker method according to any one of claim 1 to 6 is it is characterised in that in step (2) and walk
Suddenly in (5), by single shaft rig or laser drilling machining through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610872775.7A CN106373904B (en) | 2016-09-29 | 2016-09-29 | IC support plate production mark method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610872775.7A CN106373904B (en) | 2016-09-29 | 2016-09-29 | IC support plate production mark method |
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| CN106373904A true CN106373904A (en) | 2017-02-01 |
| CN106373904B CN106373904B (en) | 2019-07-12 |
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|---|---|---|---|
| CN201610872775.7A Active CN106373904B (en) | 2016-09-29 | 2016-09-29 | IC support plate production mark method |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106851990A (en) * | 2017-03-27 | 2017-06-13 | 雪龙数控设备(深圳)有限公司 | For the drilling control method and drilling control system of wiring board |
| CN107041063A (en) * | 2017-06-09 | 2017-08-11 | 东莞市威力固电路板设备有限公司 | The processing method and multi-layer PCB of a kind of multi-layer PCB |
| CN107708288A (en) * | 2017-09-08 | 2018-02-16 | 江西景旺精密电路有限公司 | A kind of pcb board and its processing method |
| CN107846774A (en) * | 2017-11-22 | 2018-03-27 | 厦门弘信电子科技股份有限公司 | FPC processing procedure traces Quick Response Code laser carving preparation method |
| CN107949172A (en) * | 2017-11-22 | 2018-04-20 | 厦门弘信电子科技股份有限公司 | Flexible circuit board processing procedure retrospect Quick Response Code drilling production method |
| CN107944517A (en) * | 2017-12-13 | 2018-04-20 | 广东正业科技股份有限公司 | A kind of product whole process quality retroactive method |
| CN107992917A (en) * | 2017-12-13 | 2018-05-04 | 广东正业科技股份有限公司 | A kind of quality retroactive method of efficient multi-layer PCB |
| CN107992918A (en) * | 2017-12-13 | 2018-05-04 | 广东正业科技股份有限公司 | A kind of efficient product whole process quality retroactive method |
| CN108012426A (en) * | 2017-12-13 | 2018-05-08 | 广东正业科技股份有限公司 | A kind of quality retroactive method of multi-layer PCB |
| CN108012437A (en) * | 2017-11-22 | 2018-05-08 | 厦门弘信电子科技股份有限公司 | Flexible circuit board processing procedure retrospect Quick Response Code etching production method |
| CN109033917A (en) * | 2018-06-04 | 2018-12-18 | 广州美维电子有限公司 | A kind of information tracing method of pcb board and pcb board |
| CN110399937A (en) * | 2018-04-17 | 2019-11-01 | 鹏鼎控股(深圳)股份有限公司 | Information detecting method for printed circuit board |
| CN111010806A (en) * | 2019-12-24 | 2020-04-14 | 南通深南电路有限公司 | Drilling control method for multilayer plate |
| CN113747702A (en) * | 2021-07-20 | 2021-12-03 | 青岛歌尔智能传感器有限公司 | Packaging structure with identification information |
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Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106851990A (en) * | 2017-03-27 | 2017-06-13 | 雪龙数控设备(深圳)有限公司 | For the drilling control method and drilling control system of wiring board |
| CN107041063A (en) * | 2017-06-09 | 2017-08-11 | 东莞市威力固电路板设备有限公司 | The processing method and multi-layer PCB of a kind of multi-layer PCB |
| CN107041063B (en) * | 2017-06-09 | 2019-05-03 | 东莞市威力固电路板设备有限公司 | A kind of processing method and multi-layer PCB of multi-layer PCB |
| CN107708288A (en) * | 2017-09-08 | 2018-02-16 | 江西景旺精密电路有限公司 | A kind of pcb board and its processing method |
| CN107846774A (en) * | 2017-11-22 | 2018-03-27 | 厦门弘信电子科技股份有限公司 | FPC processing procedure traces Quick Response Code laser carving preparation method |
| CN107949172A (en) * | 2017-11-22 | 2018-04-20 | 厦门弘信电子科技股份有限公司 | Flexible circuit board processing procedure retrospect Quick Response Code drilling production method |
| CN108012437A (en) * | 2017-11-22 | 2018-05-08 | 厦门弘信电子科技股份有限公司 | Flexible circuit board processing procedure retrospect Quick Response Code etching production method |
| CN108012426A (en) * | 2017-12-13 | 2018-05-08 | 广东正业科技股份有限公司 | A kind of quality retroactive method of multi-layer PCB |
| CN107992918A (en) * | 2017-12-13 | 2018-05-04 | 广东正业科技股份有限公司 | A kind of efficient product whole process quality retroactive method |
| CN107992917A (en) * | 2017-12-13 | 2018-05-04 | 广东正业科技股份有限公司 | A kind of quality retroactive method of efficient multi-layer PCB |
| CN107944517A (en) * | 2017-12-13 | 2018-04-20 | 广东正业科技股份有限公司 | A kind of product whole process quality retroactive method |
| CN107992917B (en) * | 2017-12-13 | 2020-01-31 | 广东正业科技股份有限公司 | Quality tracing method for multilayer PCBs |
| CN107944517B (en) * | 2017-12-13 | 2020-06-05 | 广东正业科技股份有限公司 | Product whole-process quality tracing method |
| CN108012426B (en) * | 2017-12-13 | 2020-07-28 | 广东正业科技股份有限公司 | Quality tracing method for multilayer PCB |
| CN110399937A (en) * | 2018-04-17 | 2019-11-01 | 鹏鼎控股(深圳)股份有限公司 | Information detecting method for printed circuit board |
| CN109033917A (en) * | 2018-06-04 | 2018-12-18 | 广州美维电子有限公司 | A kind of information tracing method of pcb board and pcb board |
| CN111010806A (en) * | 2019-12-24 | 2020-04-14 | 南通深南电路有限公司 | Drilling control method for multilayer plate |
| CN113747702A (en) * | 2021-07-20 | 2021-12-03 | 青岛歌尔智能传感器有限公司 | Packaging structure with identification information |
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