CN113543528B - Substrate processing method and apparatus - Google Patents
Substrate processing method and apparatus Download PDFInfo
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- CN113543528B CN113543528B CN202010306787.XA CN202010306787A CN113543528B CN 113543528 B CN113543528 B CN 113543528B CN 202010306787 A CN202010306787 A CN 202010306787A CN 113543528 B CN113543528 B CN 113543528B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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Abstract
The invention provides a substrate processing method and device, wherein a CCD (charge coupled device) acquisition device is used for acquiring the plate information of pre-stacked substrates and the plate information of base plates, then a plurality of pre-stacked substrates and a plurality of base plates are stacked and laminated through a laminating device to form a laminated plate, the plate information of the pre-stacked substrates and the plate information of the base plates adjacent to the pre-stacked substrates are bound with the substrates, and finally the substrates are dismounted through a plate dismounting device to finish the preparation of the substrates.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a substrate processing method and device.
Background
With the continuous development of electronic technology in high speed, multifunction, large capacity, portability, low consumption and the like, substrates used as electronic component supports and electronic component electrical connection carriers are gradually developed from single-layer boards to double-layer and multi-layer boards, and are not continuously developed to multi-layer, high-density, high-precision, fine-aperture, fine-wire, high-reliability and high-transmission speed.
The manufacturing of base plate mainly adopts the manual work to carry out the lamination pressfitting among the traditional technology, and there are machining efficiency low, the scheduling problem of making mistakes easily in manual work pressfitting, and in case the problem appears can lead to a large amount of products to scrap, and the risk is great.
Disclosure of Invention
The invention aims to solve the technical problems that the risk of manually pressing the substrate is high, and once the problem occurs, a large number of products are scrapped, so that the risk is high.
In order to solve the above technical problems, the present invention provides a substrate processing method, including: acquiring plate information of a pre-stacked substrate and plate information of a base plate; laminating a plurality of pre-stacked substrates and a plurality of base plates to form a laminated plate, and binding plate information of the pre-stacked substrates and plate information of the base plates adjacent to the pre-stacked substrates with the substrates; and fixing the laminated plate, and sequentially removing the base plates laminated with the pre-laminated base plates to finish the preparation of the base plates.
Further, the step of obtaining the plate information of the pre-stacked substrate and the plate information of the backing plate further comprises the following steps: acquiring the plate information and the copper foil layer information of the core plate; fixing a copper foil layer above and below the core plate by using prepregs to prepare a pre-laminated substrate; the board information of the pre-laminated substrate comprises the board information of the core board and the information of the copper foil layer.
Further, fixing a copper foil layer on the upper side and the lower side of the core board by using prepregs respectively to manufacture the pre-laminated substrate, wherein the step of manufacturing the pre-laminated substrate comprises the following steps: and connecting the core plates by using prepregs, and fixing a copper foil layer above and below the plates connected by the core plates by using the prepregs respectively to prepare the pre-laminated substrate.
Further, the step of laminating the plurality of pre-laminated substrates and the plurality of backing plates to form a laminated plate comprises: and paving a soft buffer layer below the base plate, sequentially stacking and arranging a pre-stacked substrate and the base plate above the base plate, arranging the base plate above the finally arranged pre-stacked substrate, paving the soft buffer layer above the base plate, and pressing to form a laminated plate.
Further, the step of binding the plate information of the pre-stacked substrate and the plate information of the backing plate adjacent to the pre-stacked substrate with the substrate includes: and binding the plate information of the pre-stacked substrate, the information of the soft buffer layer and the plate information of the base plate adjacent to the pre-stacked substrate with the substrate.
Further, the backing plate comprises a steel plate, and the soft buffer layer comprises kraft paper.
Further, the step of fixing the laminated plate and removing the backing plate to complete the substrate preparation comprises: and fixing the base plate at the lowest layer of the laminated plate, sequentially sucking the base plates above the pre-laminated base plate, and sucking the base plate to a specified position to finish the preparation of the base plate.
There is also provided a substrate processing apparatus including: the stacking device is used for stacking a plurality of pre-stacked base plates and a plurality of base plates; the pressing device is used for carrying out hot pressing treatment on the plates stacked by the plurality of pre-stacked substrates and the plurality of base plates to manufacture stacked plates; the plate detaching device is used for fixing the stacked plates and sequentially detaching the base plates stacked with the pre-stacked base plates to finish the preparation of the base plates; an information acquisition device; the information acquisition device is used for acquiring the plate information of the pre-stacked substrate and the plate information of the base plate.
Further, the pre-laminated substrate comprises a copper foil layer fixed above and below the core plate by prepregs to prepare the pre-laminated substrate; the board information of the pre-laminated substrate comprises the board information of the core board and the information of the copper foil layer.
Further, the plate stacking device for stacking a plurality of pre-stacked base plates and a plurality of backing plates includes: the plate stacking device lays a soft buffer layer below the base plate, the base plates and the base plates are sequentially stacked above the base plate, the base plate is arranged above the last base plate to be stacked in advance, and the soft buffer layer is laid above the base plate.
According to the technical scheme, the plate stacking efficiency is improved, the problem that the base plate is scrapped can be quickly found out according to the plate information of the pre-stacked base plate and the plate information of the base plate, and the situation that a large number of base plates are scrapped is prevented.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic flow chart diagram of a first embodiment of a substrate processing method according to the present invention;
FIG. 2 is a schematic flow chart of a substrate processing method according to a second embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a first embodiment of a pre-stacked substrate according to the present invention;
FIG. 4 is a schematic structural diagram of a second embodiment of a pre-stacked substrate according to the present invention;
FIG. 5 is a schematic block diagram of a substrate processing apparatus according to the present invention;
FIG. 6 is a schematic view of a pre-stacked substrate stack according to the present invention;
FIG. 7 is a schematic view of a laminated state of the present invention;
fig. 8 is a schematic diagram of a carrier structure according to the present invention.
Detailed Description
The invention is described in further detail below with reference to the figures and examples. It is to be noted that the following examples are only illustrative of the present invention, and do not limit the scope of the present invention. Likewise, the following examples are only some but not all examples of the present invention, and all other examples obtained by those skilled in the art without any inventive step are within the scope of the present invention.
The terms "first", "second" and "third" in the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. In the embodiment of the present invention, all directional indicators (such as up, down, left, right, front, rear \8230;) are used only to explain the relative positional relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly. The terms "comprising" and "having" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or may alternatively include other steps or elements inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Fig. 1 is a schematic flow chart illustrating a substrate processing method according to a first embodiment of the present invention.
And S01, acquiring the plate information of the pre-stacked substrate and the plate information of the backing plate.
The pre-stacked substrate is an intermediate transition product obtained by preparing the substrate, the pre-stacked substrate comprises a core plate and copper foil layers arranged on the upper surface and the lower surface of the core plate, the pre-stacked substrate does not have the product characteristics of the substrate due to the fact that the pre-stacked substrate is not subjected to hot pressing, in the embodiment, plate information of the pre-stacked substrate is obtained firstly, wherein the plate information of the pre-stacked substrate comprises information of product specifications, size, manufacturer, performance parameters and the like of the pre-stacked substrate, and the plate information of the pre-stacked substrate comprises identity information of each pre-stacked substrate, so that a tracing effect is achieved. The plate information of the base plate comprises information of product specification, size, manufacturer, performance parameters and the like of the base plate, and the plate information of the base plate comprises identity information of each base plate and is also used for tracing the base plate. The plate information of the pre-stacked substrate and the plate information of the base plate can be acquired by scanning codes by using a CCD acquisition device.
And S02, laminating a plurality of pre-laminated substrates and a plurality of base plates to be pressed to form a laminated plate.
The method comprises the steps of arranging pre-stacked substrates and base plates in a stacked mode, automatically laying a layer of base plate on a carrier plate processed by the substrates by using an adsorption manipulator of a plate stacking device, then laying a layer of pre-stacked substrates on the base plate, repeating the steps, laying 12 layers of pre-stacked substrates, then laying a layer of base plate, and performing hot pressing to obtain the stacked plate. In the present embodiment, 12 layers of pre-stacked substrates are laid, and in other embodiments, other layers of pre-stacked substrates may be laid. The CCD collecting device collects the plate information of each pre-stacked substrate and the plate information of the base plate adjacent to the pre-stacked substrate. And after the collection is finished, performing hot-pressing treatment on the stacked plates to prepare a laminated plate, wherein the temperature and the pressure in the hot-pressing treatment process are set as conventional hot-pressing treatment parameters.
And S03, binding the plate information of the pre-stacked substrate and the plate information of the base plate adjacent to the pre-stacked substrate with the substrate.
In the last step, the CCD acquisition device acquires the plate information of each pre-stacked substrate and the plate information of the base plate adjacent to the pre-stacked substrate, and the plate information of each pre-stacked substrate and the plate information of the base plate adjacent to the pre-stacked substrate are bound on the substrate through the remote PC. This is done to trace back if any one of the substrates is of a quality problem, and moreover, the problem of the base plate or the problem of the core plate or the copper foil layer in the pre-stacked substrate of the substrate can be traced, so that the problem reason of the substrate can be conveniently found by workers and timely solved.
And S04, fixing the laminated plate, and removing the base plate to finish the preparation of the substrate.
After the laminated board is subjected to the hot-pressing treatment, the pre-laminated base board in the laminated board reaches the parameter index of the base board through the hot-pressing treatment, and the base board is manufactured. In the preparation process of the base plate, the pre-stacked base plate and the laminated plate are always arranged on the carrier plate, in the step, the laminated plate on the carrier plate is fixed, and the adsorption mechanical arm of the plate detaching device is used for absorbing the base plate layer by layer and placing the base plate at an appointed position, so that the preparation of the base plate is completed.
This embodiment is through the panel information that acquires the panel information of folding the base plate in advance and the panel information of backing plate, carry out the pressfitting with a plurality of folding base plates in advance and a plurality of backing plate range upon range of setting and make the folded sheet, and the panel information that will fold the base plate in advance and the panel information of folding the adjacent backing plate of base plate in advance bind with the base plate, demolish the base plate at last, accomplish the preparation of base plate, this technical scheme can be when the pressfitting base plate goes wrong, according to the quick condemned problem of finding out of base plate of the panel information of folding the base plate in advance and backing plate information, the condemned condition of a large amount of base plates has been prevented and has taken place.
Fig. 2 is a schematic flow chart illustrating a substrate processing method according to a second embodiment of the present invention.
And S11, acquiring the plate information and the copper foil layer information of the core plate.
The pre-stacked substrate is formed by thermally pressing a core plate and a copper foil layer through a prepreg, and the plate information of the pre-stacked substrate comprises the plate information of the core plate, the information of the copper foil layer and the information of the prepreg. During the preparation of the substrate, firstly, the plate information, the copper foil layer information and the prepreg information of the core plate of each pre-stacked substrate need to be acquired. The plate information of the core plate comprises the product specification, the size, the product manufacturer, the performance parameters and the identity information of the core plate. The information of the copper foil layer comprises the product specification, the size, the product manufacturer, the performance parameters and the identity information of the core plate. The information of the prepreg comprises product specification, size, manufacturer, performance parameters and identity information of the core board. The manner of obtaining the board information and the copper foil layer information of the core board is the same as that of the previous embodiment, and is not repeated herein.
And S12, fixing a copper foil layer above and below the core plate by using prepregs to prepare a pre-laminated substrate.
In an embodiment, the prepreg is first cut to a predetermined size, and the suction manipulator of the lamination device sequentially superimposes and arranges the prepreg and the core plate layer by layer to obtain a pre-laminated substrate: and the adsorption manipulator absorbs a copper foil layer and places the copper foil layer on the carrier plate, absorbs a prepreg and places the prepreg on the copper foil layer, absorbs a core plate and places the core plate on the top of the prepreg, absorbs a prepreg and places the prepreg on the top of the core plate, and finally places a copper foil layer on the top of the prepreg to form the pre-laminated substrate. Fig. 3 is a schematic structural diagram of a pre-stacked substrate according to a first embodiment of the invention. The core plate comprises a core plate 1 and copper foil layers 3 arranged on the upper surface and the lower surface of the core plate 1, wherein the core plate 1 is connected with the copper foil layers 3 through prepregs 2.
In another embodiment, when the pre-stacked substrate including four core boards is required to be manufactured, the four core boards are connected through the prepregs according to the operation steps of the previous embodiment, and finally, the upper surface and the lower surface of the core board are respectively connected with one copper foil layer through the prepregs, so that the pre-stacked substrate including the four core boards is manufactured. Fig. 4 is a schematic structural diagram of a pre-stacked substrate according to a second embodiment of the invention. The core board comprises four layers of core boards 1, the core boards 1 are connected through prepregs 2, and copper foil layers 3 are connected to the upper surface and the lower surface of a connecting block of each core board 1 through the prepregs 2.
And S13, paving a soft buffer layer below the base plate, sequentially stacking a pre-stacked substrate and the base plate above the base plate, arranging the base plate above the finally-arranged pre-stacked substrate, paving the soft buffer layer above the base plate, and pressing to obtain a laminated plate.
A plurality of soft buffer layers are paved on a support plate by using an adsorption manipulator of a plate stacking device, and then a base plate is paved above the buffer layers, wherein the base plate and the buffer layers are respectively a steel plate and kraft paper in the embodiment. And then, a plate stacking device is used for sucking and placing the pre-stacked substrate prepared in the previous step on a base plate, a layer of base plate is laid, and the like, a layer of base plate is laid after 12 layers of pre-stacked substrates are laid, and a soft buffer layer is laid above the base plate. And then the conveying device conveys the stacked plates to a pressing device for hot pressing treatment to manufacture a laminated plate.
In another embodiment, step S12 and step S13 may be performed simultaneously, a material box may be disposed on one side of the plate stacking device, and a core plate, a prepreg, a copper foil layer, a backing plate, and a soft buffer layer may be disposed in the material box. And an adsorption manipulator of the plate stacking device automatically and sequentially places the soft buffer layer, the base plate, the copper foil layer, the prepreg, the core plate, the prepreg, the copper foil layer, the base plate and the soft buffer layer on the support plate. And then the conveying device conveys the stacked plates to a pressing device for hot pressing treatment to manufacture a laminated plate. The plates containing the pre-stacked substrates can be repeatedly placed in sequence to form a plurality of pre-stacked substrates.
When the laminated board is subjected to hot pressing treatment, the CCD collecting device arranged at the pressing device collects the board information of each pre-laminated base board, the board information of the base plate adjacent to the pre-laminated base board and the information of the soft buffer layer, and the collected information is bound on the manufactured base board, so that the follow-up of information is facilitated.
And S14, binding the plate information of the pre-laminated substrate, the information of the soft buffer layer and the plate information of the base plate adjacent to the pre-laminated substrate with the substrate.
In the last step, the CCD acquisition device acquires the plate information of each pre-stacked substrate, the plate information of the base plate adjacent to the pre-stacked substrate and the information of the soft buffer layer, and the plate information of each pre-stacked substrate, the information of the soft buffer layer and the plate information of the base plate adjacent to the pre-stacked substrate are bound on the substrate through the remote PC. This is done to trace back if any one of the substrates is of a quality problem, and moreover, the problem of the base plate or the problem of the core plate or the copper foil layer in the pre-stacked substrate of the substrate can be traced, so that the problem reason of the substrate can be conveniently found by workers and timely solved.
And S15, fixing the base plate at the lowest layer of the laminated plate, sequentially sucking the base plates above the pre-laminated base plate, and sucking the base plate to a specified position to finish the preparation of the base plate.
And the clamping device on the support plate fixes the base plate at the lowest layer of the laminated plate, and the plate detaching device sequentially absorbs the base plates above the pre-laminated base plate and absorbs the base plate to a specified position to complete the preparation of the base plate.
In this embodiment, the absorption manipulator through the lamination device will fold the base plate in advance, soft buffer layer and backing plate are laid on the support plate, acquire the panel information of each base plate of folding in advance simultaneously and with the panel information and the soft buffer layer's of the backing plate that the base plate is adjacent in advance information, and bind this information on the base plate, such technical scheme can find out when the base plate goes wrong whether the problem has appeared in the backing plate or the core plate in the base plate of folding in advance of this base plate or the copper foil layer has appeared the problem, make things convenient for the staff to find out the problem reason of base plate, in time solve.
Fig. 5 is a schematic block diagram of a substrate processing apparatus according to the present invention.
The substrate processing apparatus 100 includes: the plate stacking device 8, the pressing device 6, the plate detaching device 9 and the information acquisition device 10. The information collecting device 10 is a CCD collecting device in this embodiment, and in other embodiments, the information collecting device 10 may be other high definition image collecting devices. The CCD collecting devices are respectively arranged on the plate stacking device 8 and the pressing device 6, and in order to obtain the plate information of the pre-stacked substrates and the plate information of the base plates, the plate information of each pre-stacked substrate and the plate information of the base plates adjacent to the pre-stacked substrates are finally bound on the substrates through the remote PC. The plate stacking device 8, the pressing device 6 and the plate detaching device 9 are not connected with each other, and the stacked plates manufactured by the pressing device 6 are conveyed to the plate detaching device 9 by other conveying devices to be detached, so that the manufactured base plates are finally obtained.
The stacking device 8 is a robot provided with an adsorption manipulator, the stacking device 8 is generally used for stacking a plurality of pre-stacked substrates and a plurality of backing plates 5, in this embodiment, the stacking device 8 is also used for preparing the pre-stacked substrates, and please refer to fig. 6, which is a schematic diagram of a stacking state of the pre-stacked substrates according to the present invention. The adsorption manipulator of the plate stacking device 8 sequentially overlaps and arranges the prepregs 2 and the core plates 1 layer by layer to obtain a pre-stacked substrate: the adsorption manipulator sucks a copper foil layer 3 to be placed on the carrier plate, sucks a prepreg 2 to be placed on the copper foil layer 3, sucks a core plate 1 to be placed on the top of the prepreg 2, sucks a prepreg 2 to be placed on the top of the core plate 1, and finally places a copper foil layer 3 on the top of the prepreg 2 to form the pre-stacked substrate.
Then, a laminated board is prepared by using the laminated board device 8, and fig. 7 is a schematic view of a laminated board pressing state according to the present invention. Fig. 8 is a schematic diagram of a carrier structure according to the present invention. The adsorption manipulator of the plate stacking device 8 lays a plurality of soft buffer layers 4 on a carrier plate 7, a base plate 5 is laid above the buffer layer 4, the pre-stacked substrate prepared in the previous step is sucked and placed on the base plate 5, a base plate 5 is laid, and the like, a base plate 5 is laid after 12 pre-stacked substrates are laid, and the soft buffer layer 4 is laid above the base plate. Then the conveying device conveys the stacked plates to the pressing device 6 for hot pressing treatment to manufacture a stacked plate. Information can be acquired in the laminating process of the laminated plate, the CCD acquisition device acquires the plate information of the pre-laminated base plate, the information of the soft buffer layer 4 and the plate information of the base plate 5, and the acquired information is bound on the manufactured base plate.
And (3) disassembling the laminated board after the preparation of the laminated board is finished, conveying the laminated board together with the support board 7 to a board disassembling device 9 by a conveying device, fixing the laminated board on the support board 7, and sucking the base board layer by using an adsorption manipulator of the board disassembling device 9 and placing the base board at a specified position to finish the preparation of the base board.
This embodiment acquires the panel information of folding base plate in advance and the panel information of backing plate through CCD collection device, then carry out the pressfitting through folding the device with a plurality of base plates of folding in advance and the range upon range of setting of a plurality of backing plates and make the folded plate, and the panel information of folding the base plate in advance and the panel information of the adjacent backing plate of base plate in advance bind with the base plate, demolish the base plate through tearing open the board device at last, accomplish the preparation of base plate, this technical scheme has solved artifical folded plate inefficiency, the problem that the disability rate is high, and can be when the base plate goes wrong, according to the panel information of folding the base plate in advance and the quick condemned problem of finding out the base plate of backing plate information, the condemned condition of a large amount of base plates has been prevented and has taken place.
The above description is only a part of the embodiments of the present invention, and not intended to limit the scope of the present invention, and all equivalent devices or equivalent processes performed by the present invention through the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (5)
1. A substrate processing method, comprising:
acquiring plate information of a pre-stacked substrate and plate information of a base plate;
laminating the pre-stacked substrates and the base plates to form a laminated plate, and binding plate information of the pre-stacked substrates and plate information of the base plates adjacent to the pre-stacked substrates with the substrates;
fixing the laminated plate, and removing the backing plate to complete the preparation of the substrate;
wherein, still include before the step of the panel information of acquireing the base plate of folding in advance and the panel information of backing plate: acquiring the plate information and the copper foil layer information of the core plate;
fixing a copper foil layer above and below the core plate by using prepregs to prepare a pre-laminated substrate;
the plate information of the pre-laminated substrate comprises plate information of the core plate and information of the copper foil layer;
the step of fixing a copper foil layer above and below the core plate by using prepregs respectively to manufacture the pre-laminated substrate comprises the following steps: connecting the core plates by using prepregs, and fixing a copper foil layer above and below the plates connected by the core plates by using the prepregs respectively to prepare a pre-laminated substrate;
the step of laminating the plurality of pre-laminated substrates and the plurality of backing plates to form a laminated plate comprises the following steps: paving a soft buffer layer below the base plate, sequentially stacking the pre-stacked substrate and the base plate above the base plate, arranging the base plate above the finally-arranged pre-stacked substrate, paving the soft buffer layer above the base plate, and pressing to form a stacked plate;
the step of fixing the laminated plate and removing the backing plate to complete the preparation of the substrate comprises the following steps: and fixing the base plate at the lowest layer of the laminated plate, sequentially sucking the base plates above the pre-laminated substrate, and sucking the substrate to a specified position to complete substrate preparation.
2. The substrate processing method according to claim 1, wherein the step of binding the plate material information of the pre-stacked substrate and the plate material information of the tie plate adjacent to the pre-stacked substrate with the substrate comprises: and binding the plate information of the pre-stacked substrate, the information of the soft buffer layer and the plate information of the base plate adjacent to the pre-stacked substrate with the substrate.
3. The substrate processing method according to claim 1 or 2, wherein the backing plate comprises a steel plate, and the soft buffer layer comprises kraft paper.
4. A substrate processing apparatus, comprising:
the stacking device is used for stacking a plurality of pre-stacked substrates and a plurality of base plates;
the pressing device is used for carrying out hot pressing treatment on the pre-stacked substrate and the plate with the plurality of base plates stacked in a stacked mode to manufacture a stacked plate;
the plate detaching device is used for fixing the stacked plates and detaching the base plate to finish the preparation of the base plate;
an information acquisition device; the information acquisition device is used for acquiring the plate information of the pre-stacked substrate and the plate information of the base plate;
the pre-stacked substrate comprises a core plate, a copper foil layer and a pre-stacked substrate, wherein the copper foil layer is fixed above and below the core plate by using prepregs to manufacture the pre-stacked substrate;
the plate information of the pre-laminated substrate comprises plate information of the core plate and information of the copper foil layer.
5. The substrate processing apparatus according to claim 4, wherein the stacking means for stacking a plurality of pre-stacked substrates and a plurality of tie plates includes: the soft buffer layer is laid to the lamination device below the backing plate, and the top of backing plate stacks gradually the setting fold in advance the base plate with the backing plate, last one the top of folding in advance the base plate sets up the backing plate, and soft buffer layer is laid to the top of backing plate.
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| CN101471328B (en) * | 2007-12-25 | 2010-06-09 | 力成科技股份有限公司 | Substrate panel |
| CN104582328B (en) * | 2014-12-22 | 2017-09-29 | 东莞美维电路有限公司 | The pcb board production technology of anti-row's plate mistake |
| CN106604576B (en) * | 2016-12-30 | 2019-04-12 | 广州兴森快捷电路科技有限公司 | Wiring board laminating method and system |
| CN107992917B (en) * | 2017-12-13 | 2020-01-31 | 广东正业科技股份有限公司 | Quality tracing method for multilayer PCBs |
| CN108012426B (en) * | 2017-12-13 | 2020-07-28 | 广东正业科技股份有限公司 | Quality tracing method for multilayer PCB |
| CN109933033B (en) * | 2019-04-23 | 2022-04-19 | 深圳镭霆激光科技有限公司 | PCB whole-process tracing laminating process segment tracing method |
| CN110366333A (en) * | 2019-07-10 | 2019-10-22 | 皆利士多层线路版(中山)有限公司 | The compression method and buffer layer of PCB circuit board |
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