CN113766724B - Circuit board, manufacturing method thereof and tracing method - Google Patents
Circuit board, manufacturing method thereof and tracing method Download PDFInfo
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- CN113766724B CN113766724B CN202010485932.5A CN202010485932A CN113766724B CN 113766724 B CN113766724 B CN 113766724B CN 202010485932 A CN202010485932 A CN 202010485932A CN 113766724 B CN113766724 B CN 113766724B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 122
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000003825 pressing Methods 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 5
- 238000010422 painting Methods 0.000 claims description 4
- 230000002596 correlated effect Effects 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 2
- 238000011835 investigation Methods 0.000 abstract description 6
- 230000000875 corresponding effect Effects 0.000 description 12
- 230000002159 abnormal effect Effects 0.000 description 3
- 238000004590 computer program Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09927—Machine readable code, e.g. bar code
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a circuit board, a manufacturing method and a tracing method thereof, wherein the manufacturing method of the circuit board comprises the following steps: providing a sub-circuit board; setting a first identification code on one surface of the sub-circuit board; the first identification code comprises information of an inner layer board of the sub-circuit board and production batch information during production of the sub-circuit board. According to the circuit board manufactured by the method, tracing can be achieved, the first identification code is identified, the sub-circuit board can be traced to the inner layer board quickly and accurately, the rest circuit boards of the inner layer board with quality problems are conveniently locked and used, and the investigation efficiency and accuracy are improved.
Description
Technical Field
The invention relates to the technical field of tracing of PCB product manufacturing processes, in particular to a circuit board, a manufacturing method thereof and a tracing method thereof.
Background
Along with the development of the electronic circuit industry, the design and process of PCB (Printed Circuit Board) products are more and more complex, and the requirements on the quality control of product manufacturing are also continuously improved; the manufacturing enterprises in the electronic circuit industry belong to high-end discrete manufacturing, have the characteristics of multiple varieties, small batches and single production, have the conditions of production and research, mixed line production, continuous change of the technological process, continuous switching of main and auxiliary materials and the like, and need to quickly present factor information of each process in the manufacturing process of the product through a traceability system after the product has abnormal quality and quickly and accurately position the product through changing factors. Manufacturers generally adopt a mode of firstly batching products and establishing serial numbers according to batch numbers of the products to monitor and trace the inner layer board, the outer layer board and the circuit board, but when quality problems occur to the products, the method cannot quickly and accurately lock the abnormal range of the abnormal products and cannot trace the serial numbers of the outer layer board and the inner layer core board according to the serial numbers of the circuit board.
Disclosure of Invention
The invention mainly solves the technical problem of providing a circuit board and a tracing method of the circuit board, and solves the problem that the circuit board in the prior art cannot be traced quickly and accurately.
In order to solve the technical problems, the first technical scheme adopted by the invention is as follows: the method for manufacturing the circuit board comprises the following steps: providing a sub-circuit board; setting a first identification code on one surface of the sub-circuit board; the first identification code comprises information of an inner layer board of the sub-circuit board and production batch information during production of the sub-circuit board.
Wherein, providing the sub-circuit board specifically includes: providing at least one inner layer plate and an outer layer plate covering the outer surface of the inner layer plate; generating a second identification code according to the information of each inner layer plate, and arranging the second identification code on at least one surface of the inner layer plate; laminating the inner layer plate and the outer layer plate and pressing to form a mother circuit board; a third identification code is arranged on one surface of the outer layer plate far away from the inner layer plate, and the third identification code comprises production batches in the production of the mother circuit board; the mother circuit board is divided to form a plurality of daughter circuit boards.
The method for generating the second identification code according to the information of each inner layer plate comprises the following steps of: storing the second identification code; setting a third identification code on a surface of the outer layer plate far away from the inner layer plate, wherein the third identification code comprises the following components of the production batch in the production of the circuit board: storing the third identification code, and associating the third identification code with the second identification code; after the first identification code is set on at least one surface of the sub-circuit board, the method further comprises: the first identification code is stored, and the first identification code is associated with the third identification code.
The step of generating the second identification code according to the information of each inner layer plate specifically comprises the following steps: obtaining batch information of the inner layer plates according to the worksheets, and numbering the inner layer plates; and generating a second identification code of the inner layer plate according to the batch information and the number of the inner layer plate.
The step of providing a third identification code on a surface of the outer layer board far away from the inner layer board specifically comprises the following steps: obtaining batch information of the bus circuit board, and numbering the bus circuit board; generating a third identification code of the mother circuit board according to the batch information and the serial number; and setting the third identification code on at least one surface of the mother circuit board.
The step of setting the first identification code on at least one surface of the sub-circuit board specifically includes: obtaining batch information of the sub-circuit boards, and numbering the sub-circuit boards; generating a first identification code of the sub-circuit board according to the batch information and the serial number; the first identification code is arranged on at least one surface of the sub-circuit board.
The step of storing the second identification code specifically includes: inputting a second identification code, and analyzing the information of each inner layer plate according to the second identification code; and (5) correlating and storing the information of each inner layer plate.
The step of storing the third identification code and associating the third identification code with the second identification code specifically includes: storing the third identification code and analyzing the information of the mother circuit board according to the third identification code; acquiring a second identification code of at least one inner layer plate, and analyzing the information of the inner layer plate according to the second identification code; and correlating the information of the inner layer board with the information of the mother circuit board.
The step of storing the first identification code and associating the first identification code with the third identification code specifically includes: acquiring a first identification code, and analyzing information of the sub-circuit board according to the first identification code; acquiring a third identification code of a bus circuit board forming the sub circuit board, and analyzing information of the bus circuit board according to the third identification code; and correlating the information of the sub-circuit board with the information of the bus circuit board.
The second identification code is fixed on the inner layer board in a light painting mode.
In order to solve the technical problems, a second technical scheme adopted by the invention is as follows: providing a circuit board, wherein the circuit board comprises at least one inner layer board and outer layer boards positioned on two sides of the inner layer board; the surface of the outer layer plate on at least one side is provided with a first identification code, and the first identification code comprises production information of the circuit board; the production information of the circuit board at least comprises production batches during the production of the circuit board.
The first identification code is a two-dimensional code or a bar code.
In order to solve the technical problems, a third technical scheme adopted by the invention is as follows: the circuit board comprises at least one inner layer plate and outer layer plates positioned on two sides of the inner layer plate; the surface of the outer layer plate on at least one side is provided with a first identification code, and the first identification code comprises production information of the circuit board; the production information of the circuit board at least comprises production batches during the production of the circuit board; the tracing method comprises the following steps: identifying a first identification code, and identifying a production batch of the circuit board during production according to the first identification code; and determining the rest circuit boards produced in the same batch with the circuit boards according to the production batch during the production of the circuit boards, and realizing the tracing from the circuit boards to the inner layer boards.
The beneficial effects of the invention are as follows: different from the prior art, the circuit board, the manufacturing method and the traceability method thereof provided by the utility model comprise the following steps: providing a sub-circuit board; setting a first identification code on one surface of the sub-circuit board; the first identification code comprises information of an inner layer board of the sub-circuit board and production batch information during production of the sub-circuit board. According to the circuit board manufactured by the method, tracing can be achieved, the first identification code is identified, the sub-circuit board can be traced to the inner layer board quickly and accurately, the circuit board of the inner layer board with quality problems can be locked and used conveniently, and the investigation efficiency and accuracy are improved.
Drawings
FIG. 1 is a schematic flow chart of a first embodiment of a circuit board manufacturing method of the present invention;
fig. 2 is a schematic flow chart of a second embodiment of the circuit board manufacturing method of the present invention;
FIG. 3 is a schematic diagram of an embodiment of a circuit board according to the present invention;
fig. 4 is a flowchart of an embodiment of a circuit board tracing method according to the present invention.
Detailed Description
The following describes the embodiments of the present application in detail with reference to the drawings.
In the following description, for purposes of explanation and not limitation, specific details are set forth such as the particular system architecture, interfaces, techniques, etc., in order to provide a thorough understanding of the present application.
The term "and/or" is herein merely an association relationship describing an associated object, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship. Further, "a plurality" herein means two or more than two.
In order to enable those skilled in the art to better understand the technical scheme of the invention, the circuit board, the manufacturing method and the tracing method thereof provided by the invention are further described in detail below with reference to the accompanying drawings and the specific embodiments.
Referring to fig. 1, fig. 1 is a flow chart of a first embodiment of a circuit board manufacturing method according to the present invention. In this embodiment, a method for manufacturing a circuit board is implemented by a computer program of an IMES (Intelligent Manufacturing Enterprise Solutions, intelligent manufacturing) system, and includes the following steps:
s11: a sub-wiring board is provided.
Specifically, a sub-wiring board is provided, which is a finished wiring board. The sub-circuit board comprises a plurality of inner layers and outer layers positioned on two sides of the inner layers.
S12: setting a first identification code on one surface of the sub-circuit board; the first identification code comprises information of an inner layer board of the sub-circuit board and production batch information during production of the sub-circuit board.
Specifically, a first identification code is printed on one surface of the sub-circuit board, and the information of the inner-layer board in the sub-circuit board and the production batch information during production of the sub-circuit board can be traced back from the inner-layer board information of the sub-circuit board to the information of the rest sub-circuit boards using the batch of inner-layer boards through the first identification code.
The manufacturing method of the circuit board provided by the embodiment provides a sub-circuit board; setting a first identification code on one surface of the sub-circuit board; the first identification code comprises information of an inner layer board of the sub-circuit board and production batch information during production of the sub-circuit board. The circuit board manufactured by the method can realize tracing, and can realize rapid and accurate mutual tracing from the sub-circuit board to the inner layer board by identifying the first identification code, so that other circuit boards of the inner layer board with quality problems can be conveniently locked and used, and the investigation efficiency and accuracy are improved.
Referring to fig. 2, fig. 2 is a flow chart of a circuit board manufacturing method according to a second embodiment of the invention. In this embodiment, a method for manufacturing a circuit board is implemented by a computer program of an IMES (IntelligentManufacturing Enterprise Solutions, intelligent manufacturing) system, and includes the following steps:
s21: at least one inner ply and an outer ply overlying the outer surface of the inner ply are provided.
Specifically, matching inner laminate and outer laminate covering both sides of the inner laminate are prepared according to the job ticket demand provided by the customer.
S22: and generating a second identification code according to the information of each inner layer plate, and arranging the second identification code on at least one surface of the inner layer plate.
Specifically, batch information of each inner layer plate and each outer layer plate is obtained according to the worksheet, the inner layer plates and the outer layer plates are numbered, and respective second identification codes are generated according to the batch information and the numbers of the inner layer plates and the outer layer plates. In this embodiment, the second identification code may be disposed at a predetermined position of the inner layer board and the outer layer board by means of optical painting. The inner layer plates and the outer layer plates in the same batch have the same batch information and different numbers, and the second identification codes generated by the different inner layer plates and the different outer layer plates in the same batch are also different, and each inner layer plate and each outer layer plate have a unique second identification code. The second identification code may be a two-dimensional code or a bar code. The second identification code may include any one or any combination of a production order grade of the inner layer board or the outer layer board, a production year, month and day, a production work order serial number, a production work order number of parts, and a production check code area. In another alternative embodiment, the second identification code may be disposed on one surface of the inner layer board or the outer layer board, or may be disposed on both surfaces of the inner layer board or the outer layer board, so as to facilitate the subsequent scanning and storage of the second identification code of the inner layer board.
S23: and laminating the inner layer plate and the outer layer plate and pressing to form the mother circuit board.
Specifically, the prepared inner-layer plates are stacked one by one in sequence according to a lamination structure specified by the flow card, the second identification code of each inner-layer plate is read by an X-Ray code reader, and the read second identification code is sent to an IMES system. And the IMES system identifies the acquired second identification code of each inner layer plate and analyzes the second identification code to obtain the batch information and the serial number of each inner layer plate. The lot information and number of each of the stacked inner-layer plates is correlated with the lot information and number of the adjacent inner-layer plates. And placing the outer layer plates on the upper surface of the stacked inner layer plates and the lower surface of the stacked inner layer plates, and pressing the outer layer plates, the plurality of inner layer plates and the outer layer plates which are stacked in sequence from bottom to top by using a press to form the mother circuit board.
S24: and a third identification code is arranged on one surface of the outer layer plate, which is far away from the inner layer plate, wherein the third identification code comprises production batches during the production of the mother circuit board.
Specifically, batch information of the bus circuit board is obtained, and the bus circuit board is numbered; and generating a third identification code of the mother circuit board according to the batch information and the serial number. In this embodiment, the third identification code may be set at a preset position of the bus-bar board by the code printing device. The bus-bar boards in the same batch have the same batch information and different numbers, and the third identification codes generated by the bus-bar boards in the same batch are different, and each bus-bar board has a unique third identification code. The third identification code may be a two-dimensional code or a bar code. The third identification code can comprise any one or any combination of a plurality of production sequence grades, production year, month and day, production work order serial numbers, production work order quantity serial numbers and production check code areas of the mother circuit board. The third identification code comprises a production batch of the mother circuit board during production. In another alternative embodiment, the third identification code may be disposed on one surface of the mother circuit board, that is, on a surface of the outer layer board away from the inner layer board in the mother circuit board, or may be disposed on both surfaces of the mother circuit board.
The IMES system obtains and stores a third identification code of the bus-bar board made by laminating the inner layer board and the outer layer board, analyzes batch information and serial numbers of the bus-bar board according to the third identification code, reads a second identification code of the inner layer board in the bus-bar board by using an X-Ray code reader, analyzes information of the inner layer board according to the second identification code, and the information of the bus-bar board can be batch information and serial numbers. The IMES system correlates information on the bus board with information on the inner layer board that is pressed to form the bus board.
S25: the mother circuit board is divided to form a plurality of sub circuit boards, wherein the plurality of sub circuit boards do not comprise the second identification code and the third identification code.
Specifically, the bus circuit board is cut into a plurality of sub circuit boards according to the pattern of the circuit board required by the customer, and the third identification code on the bus circuit board and the second identification code on the inner layer board are not contained on the sub circuit boards.
S26: setting a first identification code on at least one surface of the sub-circuit board; wherein the first identification code is associated with the second identification code and the third identification code.
Specifically, batch information of the sub-circuit boards is obtained, and the sub-circuit boards in the same batch are numbered; generating a first identification code of the sub-circuit board according to the batch information and the serial number of the sub-circuit board, and sending the first identification code to a circuit board code printing device by the IMES system to control the code printing device to print the first identification code on a preset position of the sub-circuit board. The sub-circuit boards in the same batch have the same batch information and different numbers, and the first identification codes generated by the different sub-circuit boards in the same batch are also different, and each circuit board has a unique first identification code. The first identification code may be a two-dimensional code or a bar code. The first identification code can comprise any one or any combination of a plurality of production sequence grades, production year, month and day, production work order serial numbers, production work order quantity serial numbers and production check code areas of the sub-circuit board.
The IMES system retrieves the third identification code of the mother circuit board, reads the first identification code of the sub circuit board through the X-Ray code reader and sends the first identification code to the IMES system, the IMES system respectively identifies the third identification code of the mother circuit board and the first identification code of the sub circuit board, analyzes the information respectively corresponding to the third identification code of the mother circuit board and the first identification code of the sub circuit board, and associates the information of the mother circuit board with the information of the sub circuit board.
In another alternative embodiment, the first identification code is preset identification information, the IMES system invokes the third identification code of the mother circuit board, the IMES system identifies the third identification code of the mother circuit board to obtain batch information and serial number of the mother circuit board, the IMES system correlates the analyzed batch information and serial number of the mother circuit board with preset identification information of the sub circuit board, and sends the first identification code corresponding to the preset identification information of the sub circuit board to the code printing device, and the IMES system controls the code printing device to print the first identification code on the sub circuit board.
In another embodiment, a plurality of inner plates and two outer plates are prepared according to a work order, an IMES system generates a second identification code according to batch information and numbers of each inner plate and each outer plate, each inner plate and each outer plate respectively have a unique second identification code, the IMES system sends the second identification code to a coding device, and the coding device fixes the second identification code on preset positions of the corresponding inner plate and outer plate in a light painting mode, and the second identification code is reserved in an inner etching process. The second identification code may be a two-dimensional code or a bar code. And stacking the inner layer plate and the outer layer plate one by one in sequence according to a lamination structure specified by the flow card, reading second identification codes of each inner layer plate and each outer layer plate by using an X-Ray code reader, and sending the read second identification codes to an IMES system. And the IMES system identifies the acquired second identification codes of the inner layer plate and the outer layer plate, and analyzes the acquired batch information and numbers of the inner layer plate and the outer layer plate. The IMES system correlates the lot information and number of the outer ply with the lot information and number of the inner ply. And the IMES system controls the press to press the stacked outer laminates and the stacked inner laminates to manufacture the mother circuit boards, generates a third identification code according to the batch information and the serial numbers of each mother circuit board, and sends the third identification code to the code printing equipment, and the code printing equipment prints the third identification code on the preset position of the corresponding mother circuit board. The third identification code may be a two-dimensional code or a bar code. And after milling the edges of the bus circuit board manufactured by pressing, reading the second identification code of the inner layer board in the bus circuit board by using an X-Ray code reader, uploading the second identification code to an IMES system, and correlating the acquired second identification code of the inner layer board with the stored third identification code of the bus circuit board formed by pressing by the IMES system. Dividing a mother circuit board into a plurality of sub circuit boards, generating a first identification code by an IMES system according to the batch information and the serial number of the sub circuit boards, associating the batch information and the serial number corresponding to the first identification code with the stored batch information and serial number corresponding to the third identification code of the mother circuit board, establishing an association relationship between the sub circuit boards and the mother circuit boards, receiving an instruction of printing the first identification code sent by the IMES system by a printing device, printing the first identification code on the sub circuit boards by the printing device, and printing related characters corresponding to the first identification code on preset positions of the corresponding sub circuit boards by the printing device.
The manufacturing method of the circuit board provided by the embodiment comprises the steps of providing at least one inner layer plate and an outer layer plate covered on the outer surface of the inner layer plate; generating a second identification code according to the information of each inner layer plate, and arranging the second identification code on at least one surface of the inner layer plate; laminating the inner layer plate and the outer layer plate and pressing to form a mother circuit board; a third identification code is arranged on one surface of the outer layer plate far away from the inner layer plate, and the third identification code comprises production batches in the production of the circuit board; dividing the mother circuit board to form a plurality of sub circuit boards, wherein the plurality of sub circuit boards do not comprise the second identification code and the third identification code; setting a first identification code on at least one surface of the sub-circuit board; wherein the first identification code is associated with the second identification code and the third identification code. According to the circuit board manufactured by the method, tracing can be achieved, the first identification code, the second identification code and the third identification code can achieve rapid and accurate mutual tracing among the sub-circuit board, the bus circuit board and the inner layer board, the circuit board with quality problems, which is used for the outer layer board or the inner layer board, is conveniently locked, and the investigation efficiency and accuracy are improved.
Referring to fig. 3, fig. 3 is a schematic structural diagram of an embodiment of a circuit board according to the present invention. The circuit board 10 disclosed in the present embodiment is manufactured by the manufacturing method of the above embodiment, and the circuit board 10 includes an inner layer board 12 and outer layer boards 11 located on both sides of the inner layer board 12. Wherein, a first identification code 13 is arranged on one surface of at least one side outer layer plate 11, and the first identification code 13 contains the production information of the circuit board 10; the production information of the circuit board 10 includes a production lot at the time of production of the circuit board 10. The first identification code 13 may be at least one of a two-dimensional code and a bar code.
The circuit board that this embodiment provided can realize that the circuit board traces back to the circuit board to the inlayer board fast accuracy, and the convenient locking uses the circuit board of mother circuit board or inlayer board that has the quality problem, improves investigation efficiency and rate of accuracy.
Referring to fig. 4, fig. 4 is a flowchart illustrating a circuit board tracing method according to an embodiment of the invention. The circuit board tracing method provided by the embodiment is implemented based on the circuit board provided by the embodiment.
S31: and identifying the first identification code, and identifying the production batch of the circuit board during production according to the first identification code.
Specifically, the first identification code on the circuit board is scanned by using the X-Ray code scanner, and is uploaded to the IMES system, and the IMES system performs identification analysis on the acquired first identification code to obtain a production batch corresponding to the first identification code of the circuit board during production, wherein the production batch can be batch information and a serial number.
S32: and determining the rest circuit boards produced in the same batch with the circuit boards according to the production batch during the production of the circuit boards, and realizing the tracing from the circuit boards to the inner layer boards.
Specifically, according to the analyzed production lot at the time of production of the circuit board, searching for the production lots at the time of production of all the mother circuit boards and the inner boards corresponding to the identified first identification code in the information corresponding to the first identification code, the third identification code of the mother circuit board and the second identification code of the inner board, which are prestored in the IMES system, wherein the production lots are lot information and numbers.
In a specific embodiment, when a circuit board has a quality problem, a first identification code of the circuit board is scanned by an X-Ray code scanner and is uploaded to an IMES system, the IMES system analyzes the first identification code to obtain a production batch and a serial number of the circuit board, and the IMES system searches a correlation table among a pre-established sub-circuit board, a bus circuit board and an inner layer board for batch signals and serial numbers of the bus circuit board and the inner layer board associated with the production batch and the serial number of the circuit board corresponding to the first identification code, and also searches a sub-circuit board using the bus circuit board or the inner layer board, thereby realizing the tracing from the circuit board to the inner layer board.
According to the tracing method of the circuit board, the first identification code is identified, and the information of the inner layer board and the production batch of the circuit board during production are identified according to the first identification code; the production batch during production of the circuit board is used for determining other circuit boards produced in the same batch with the circuit board, so that the circuit boards related to the circuit board and the circuit board can be traced back quickly and accurately, the circuit boards of the mother circuit board or the inner layer board with quality problems can be locked and used conveniently, and the investigation efficiency and accuracy are improved.
The foregoing description is only of embodiments of the present invention, and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the invention.
Claims (8)
1. The manufacturing method of the circuit board is characterized by comprising the following steps:
providing at least one inner layer plate and an outer layer plate covering the outer surface of the inner layer plate;
generating a second identification code according to the information of each inner layer plate, and arranging the second identification code on at least one surface of the inner layer plate;
inputting the second identification code, and analyzing the information of each inner layer plate according to the second identification code;
correlating and storing the information of each inner layer plate;
laminating the inner layer plate and the outer layer plate and pressing the inner layer plate and the outer layer plate to form a mother circuit board;
a third identification code is arranged on one surface of the outer layer plate far away from the inner layer plate, and the third identification code comprises a production batch of the bus circuit board during production;
storing the third identification code and analyzing the information of the bus circuit board according to the third identification code;
acquiring the second identification code of at least one inner layer plate, and analyzing the information of the inner layer plate according to the second identification code;
correlating the information of the inner layer board with the information of the bus duct board;
dividing the mother circuit board to form a plurality of sub circuit boards;
setting a first identification code on one surface of the sub-circuit board; the first identification code comprises information of an inner layer plate of the sub-circuit board and production batch information during production of the sub-circuit board;
acquiring the first identification code, and analyzing the information of the sub-circuit board according to the first identification code;
acquiring the third identification code of a bus circuit board forming the sub-circuit board, and analyzing information of the bus circuit board according to the third identification code;
and correlating the information of the sub-circuit board with the information of the bus circuit board.
2. The method for manufacturing a circuit board according to claim 1, wherein the step of generating the second identification code according to the information of each of the inner boards specifically comprises:
obtaining batch information of the inner layer plates according to the worksheets, and numbering the inner layer plates;
and generating the second identification code according to the batch information of the inner layer plate and the number.
3. The method according to claim 1, wherein the step of providing a third identification code on a surface of the outer plate remote from the inner plate comprises:
acquiring batch information of the bus-bar boards, and numbering the bus-bar boards;
generating a third identification code of the bus-bar board according to the batch information and the number;
and setting the third identification code on at least one surface of the mother circuit board.
4. The method of claim 1, wherein the step of disposing a first identification code on at least one surface of the sub-circuit board specifically comprises:
acquiring batch information of the sub-circuit board, and numbering the sub-circuit board;
generating a first identification code of the sub-circuit board according to the batch information and the number;
and setting the first identification code on at least one surface of the sub-circuit board.
5. The method of claim 1, wherein the second identification code is affixed to the inner panel by means of optical painting.
6. The circuit board is characterized by being prepared based on the manufacturing method of the circuit board according to any one of claims 1-5, and comprises at least one inner layer board and outer layer boards positioned on two sides of the inner layer board; information of adjacent inner layers is correlated with each other;
the surface of the outer layer plate on at least one side is provided with a first identification code, and the first identification code comprises production information of the circuit board; the production information of the circuit board at least comprises production batches during the production of the circuit board; the circuit board is obtained by dividing a mother circuit board, production information of the circuit board is related to information of the mother circuit board, and information of the mother circuit board is related to information of the inner layer board.
7. The circuit board of claim 6, wherein the first identification code is a two-dimensional code or a bar code.
8. The circuit board tracing method is characterized in that the circuit board is prepared based on the circuit board manufacturing method according to any one of claims 1-5, and comprises at least one inner layer board and outer layer boards positioned on two sides of the inner layer board; information of adjacent inner layers is correlated with each other;
the surface of the outer layer plate on at least one side is provided with a first identification code, and the first identification code comprises production information of the circuit board;
the production information of the circuit board at least comprises production batches during the production of the circuit board; the circuit board is obtained by dividing a mother circuit board, production information of the circuit board is related to information of the mother circuit board, and information of the mother circuit board is related to information of the inner layer board;
the tracing method comprises the following steps:
identifying the first identification code, and identifying the production batch of the circuit board during production according to the first identification code;
and determining the rest circuit boards produced in the same batch with the circuit boards according to the production batch during the production of the circuit boards, and realizing the tracing from the circuit boards to the inner layer board.
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