CN105983744B - 喷嘴前端部件、喷嘴、焊接装置、基板装置的制造方法 - Google Patents

喷嘴前端部件、喷嘴、焊接装置、基板装置的制造方法 Download PDF

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Publication number
CN105983744B
CN105983744B CN201610151052.8A CN201610151052A CN105983744B CN 105983744 B CN105983744 B CN 105983744B CN 201610151052 A CN201610151052 A CN 201610151052A CN 105983744 B CN105983744 B CN 105983744B
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China
Prior art keywords
nozzle
inclined surface
substrate
molten solder
end portion
Prior art date
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Active
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CN201610151052.8A
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English (en)
Chinese (zh)
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CN105983744A (zh
Inventor
清水伸浩
水谷淳
高滨伊起
川村纯一
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Fujifilm Business Innovation Corp
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Fuji Xerox Co Ltd
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Publication of CN105983744A publication Critical patent/CN105983744A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating Apparatus (AREA)
  • Molten Solder (AREA)
  • Nozzles (AREA)
CN201610151052.8A 2015-03-20 2016-03-16 喷嘴前端部件、喷嘴、焊接装置、基板装置的制造方法 Active CN105983744B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015057670 2015-03-20
JP2015-057670 2015-03-20
JP2015164568A JP5867645B1 (ja) 2015-03-20 2015-08-24 ノズル先端部材、ノズル、はんだ付け装置、基板装置の製造方法
JP2015-164568 2015-08-24

Publications (2)

Publication Number Publication Date
CN105983744A CN105983744A (zh) 2016-10-05
CN105983744B true CN105983744B (zh) 2020-01-21

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CN201610151052.8A Active CN105983744B (zh) 2015-03-20 2016-03-16 喷嘴前端部件、喷嘴、焊接装置、基板装置的制造方法

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JP (1) JP5867645B1 (ja)
CN (1) CN105983744B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110167706B (zh) * 2017-01-12 2021-05-25 三菱电机株式会社 焊料喷流检查装置及焊料喷流检查方法
WO2018216076A1 (ja) * 2017-05-22 2018-11-29 株式会社Ｆｕｊｉ 対基板作業機

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02187261A (ja) * 1989-01-17 1990-07-23 Tokyo Seisan Giken Kk 半田槽
JPH03300Y2 (ja) * 1989-06-15 1991-01-08
JPH0846347A (ja) * 1994-08-04 1996-02-16 Tamura Seisakusho Co Ltd はんだ付け用噴流ノズル
JPH08288634A (ja) * 1995-04-18 1996-11-01 Nihon Dennetsu Kk はんだ付け装置
JP3939109B2 (ja) * 2001-04-12 2007-07-04 日本電熱計器株式会社 はんだ付け装置
DE20206503U1 (de) * 2002-04-24 2002-08-08 Ltc Laserdienstleistungen Gmbh Lötdüse mit einstellbarer Wellenabflussrichtung und Lötanlage
JP3944438B2 (ja) * 2002-09-19 2007-07-11 ミナミ株式会社 リフロー装置
US7238881B1 (en) * 2004-12-09 2007-07-03 Emc Corporation Controlled height and flow rework nozzle
US20070254255A1 (en) * 2006-03-28 2007-11-01 Neville James E System, apparatus and methods for board cooling
JP2008109034A (ja) * 2006-10-27 2008-05-08 Koki Tec Corp はんだ噴流ノズル及びはんだ付け装置
NL1036267C2 (en) * 2008-12-02 2010-06-03 Oce Tech Bv Device for ejecting droplets of a fluid having a high temperature.
JP2010245310A (ja) * 2009-04-07 2010-10-28 Panasonic Corp 半田噴流装置
JP5884058B2 (ja) * 2010-02-26 2016-03-15 パナソニックＩｐマネジメント株式会社 半田付け装置
CN204195006U (zh) * 2014-07-11 2015-03-11 库尔特机电设备（上海）有限公司 一种选择性波峰焊接设备的喷嘴

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Publication number Publication date
CN105983744A (zh) 2016-10-05
JP5867645B1 (ja) 2016-02-24
JP2016178273A (ja) 2016-10-06

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Address after: Tokyo, Japan

Patentee after: Fuji film business innovation Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: Fuji Xerox Co.,Ltd.