CN106653141B - A kind of manufacture of water-soluble conducting nanometer silver carbon slurry and its application process - Google Patents
A kind of manufacture of water-soluble conducting nanometer silver carbon slurry and its application process Download PDFInfo
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- CN106653141B CN106653141B CN201611015827.5A CN201611015827A CN106653141B CN 106653141 B CN106653141 B CN 106653141B CN 201611015827 A CN201611015827 A CN 201611015827A CN 106653141 B CN106653141 B CN 106653141B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
Abstract
A kind of manufacturing method of water-soluble conducting nanometer silver carbon slurry of the present invention, it it is 5~60 nanometers the method includes a kind of particle size range, a concentration of 0.05~8 g/l of water-soluble nano silver solution, it it is 100~900 nanometers with a kind of grain size, a concentration of 10~50 g/l of water-soluble nano grade conductive carbon black solution, by 1：Water-soluble conducting nanometer silver carbon solution is made in 100 ratio, then two kinds of solution are sent into grinder and are ground, and the dispersion of nano-silver powder particle is made to be inlaid into carbon black granules, forms water-soluble conducting nanometer silver carbon slurry.The beneficial effects of the invention are as follows：The water-soluble conducting nanometer silver carbon slurry provides a kind of conductive nano silver carbon film of conductive carbon film formed better than carbon black or graphite for the metallization of pcb board fiberglass layer hole wall surface, simplifies black holes making technology, improves production efficiency.
Description
Technical field
The present invention relates to nano-silver powder applied technical field, more particularly, to a kind of water of pcb board hole black holes manufacturing process
The manufacture and application of soluble conductive nanometer silver carbon slurry.
Background technology
During in pcb board manufacture, two-sided or multi-layer PCB board interlayer conducting wire unicom, is by being led to pcb board interlayer
The technology of line unicom hole metallization is realized.
The technology of pcb board interlayer connecting wire via metal processing procedure, experienced electroless copper process technique, black holes processing procedure skill
The evolution of art and shadow process technique.Exist since black holes process technique and shadow process technique overcome electroless copper technology
Environmental protection, safety, quality, cost, efficiency aspects there are the defects of, as pcb board interlayer connecting wire via metal
Emerging technology.
Black holes process technique is the adsorptivity using carbon, by the electrical interattraction of physics, has been drilled in pcb board
One layer of carbon black is adsorbed on the glass-fiber-plate hole wall of linked hole as conductive carbon film；And shadow process technique has been bored in pcb board
One layer of graphite of absorption is as conductive carbon film on the glass-fiber-plate hole wall of good linked hole；The purpose of the two is all in the hole of linked hole
Copper facing provides a basic lining on wall；Pcb board black holes processing procedure or shadow processing procedure horizontal production line technological process are：
Cleaning → black holes → whole hole → secondary black holes → microetch →
Anti-oxidant → discharging.
The basic function of each work step of technological process is：
1st, it cleans
It cleans in coating bath as weakly alkaline solution and faint complexing agent（It is a kind of interfacial agent）Mixed solution, PCB
After plate enters slot, mixed solution gos deep into hole wall using the hydrophobic group of complexing agent, the dirt on hole wall is washed, mixed solution is compound
The resin of pcb board hole wall and glass fibre are then adjusted to positively charged surface by the hydrophilic group in agent；
2nd, a black holes
Mainly include fine graphite and carbon powder, liquid dispersant in black holes coating bath（Deionized water）And surface-active
The mixed solution of agent composition, the fine graphite and carbon powder in mixed solution are negatively charged；After pcb board after cleaned enters slot,
Under the suction-operated of pcb board hole wall surface positive charge, pcb board hole wall surface forms one layer of graphite or carbon black conductive carbon film；
3rd, whole hole
The whole hole is substantially to repeat " cleaning " process, the reason is that：The electrical not malleable of the glass-fiber-plate of pcb board, first
Secondary black holes processing procedure cannot form satisfactory graphite or carbon black conductive carbon film in the glass-fiber-plate layer hole wall surface of pcb board, therefore palpus
Cleaning treatment carries out secondary black holes processing procedure again；
4th, secondary black holes
The secondary black holes is substantially to repeat " black holes " process, it is therefore an objective to ensure that pcb board hole wall surface forms one layer
Satisfactory graphitic carbon black conductive carbon film；
5th, microetch
After pcb board after secondary black holes enters slot, the micro-corrosion liquid in microetch slot is by spraying and springing up through conductive carbon film
Gap-contact to pcb board copper clad layers hole wall, and corrode copper clad layers hole wall, make conductive carbon film and copper clad layers hole wall at this
It detaches and comes off, while copper clad layers hole wall is roughened due to microetch；
6th, it is anti-oxidant
After pcb board after microetch enters slot, liquid medicine is passivated using copper face, the pcb board copper clad layers hole wall after microetch is carried out
Passivation Treatment；
7th, it discharges
Pcb board after anti-oxidant treatment is transferred to plating copper process.
The defects of although black holes process technique overcomes electroless copper technology with shadow process technique, but the two is also deposited in itself
Different the defects of, particularly in double-sided PCB board and PCB slab hole metallization processing procedures, since black holes process technique is with carbon
Black is conducting medium, by the low limitation of carbon black material electric conductivity, is formed on pcb board glass-fiber-plate layer hole wall electric again after conductive carbon film
During copper facing, it is inadequate to wear plating ability, so thin plate or soft board field can only be locally used in；And shadow processing procedure is led using graphite as medium
Although electrically better than carbon black, because graphite grain size is larger（1000 nanometers of ＞）, easily formed on pcb board copper clad layers hole wall
Residual ink causes subsequent reliability defect；And the common defects that the two has are that processing procedure process is long, that is, need it is secondary cleaning and
Secondary black holes process, low production efficiency.
Invention content
Of the existing technology to solve the problems, such as, the present invention proposes a kind of manufacturing technology of water-soluble conducting nanometer silver carbon slurry
Scheme is as follows：
A kind of manufacturing method of water-soluble conducting nanometer silver carbon slurry, described method includes following steps：
1. selecting a kind of water-soluble nano silver solution, the water-soluble nano silver solution includes：Particle size range is received for 5~60
Rice, a concentration of 0.05~8 g/l of nano-silver powder, further include water and at least five kinds of a concentration of 0.5~10 g/l of interfacial activity
Agent, a concentration of 0.05~1 g/l of organic reducing agent；
2. selecting a kind of water-soluble nano grade conductive carbon black solution, the water-soluble nano grade conductive carbon black solution includes：Grain
Diameter is 100~900 nanometers, a concentration of 10~50 g/l of nano-level conducting carbon black, further includes water and at least five kinds of a concentration of 0.5
~10 g/l of interfacial agent；
3. by step, 1. 2. water-soluble nano grade conductive carbon black solution presses 1 to the water-soluble nano silver solution with step：100
Ratio be mixed to form water-soluble conducting nanometer silver carbon solution；
4. by step, 3. the silver-colored carbon slurry feeding grinder of the water-soluble admittance rice electricity is ground, and makes nano-silver powder particle point
It dissipates and is inlaid into carbon black granules, form water-soluble conducting nanometer silver carbon slurry.
Preferably, the grinder is nanometer sand mill, and 1000 revs/min of rotating speed, milling time is 2 hours.
Preferably, the grain size of the nano-silver powder is 40 nanometers；The grain size of the nano-level conducting carbon black is 700 nanometers；
The interfacial agent includes wetting agent, bleeding agent, dispersant, macromolecule barrier, thixotropic agent, antifoaming agent.
Preferably, water-soluble conducting nanometer silver carbon slurry is non-newtonian fluid, and kinematic viscosity has good for 20 ~ 4000 CPS
Good suspension stability.
A kind of method for carrying out black holes processing procedure to pcb board hole using water-soluble conducting nanometer silver carbon slurry, the method includes
Following steps：
A, it cleans
The mixed solution for weakly alkaline solution and faint complexing agent in coating bath is cleaned, drilling will be completed by design requirement
Pcb board immerses coating bath, and the hydrophobic group of complexing agent gos deep into hole wall in mixed solution, the dirt on hole wall is washed, mixed solution
The surface of the fiberglass layer hole wall of pcb board is then adjusted to positively charged by the hydrophilic group of middle complexing agent；
B, black holes
Mainly include the mixed of water-soluble conducting nanometer silver carbon slurry, liquid dispersant and surfactant composition in black holes coating bath
Solution is closed, the water-soluble conducting nanometer silver carbon slurry in mixed solution is negatively charged；Pcb board after cleaned immerses coating bath, in PCB
Under the suction-operated of the glass-fiber-plate layer hole wall surface positive charge of plate, in the glass-fiber-plate layer hole wall surface of pcb board and copper clad layers hole wall
Surface has deposited one layer of electrical-conductive nanometer silver carbon film；
C, microetch
Surface, which is deposited, the pcb board immersion microetch coating bath of electrical-conductive nanometer silver carbon film, and the micro-corrosion liquid in microetch coating bath passes through
It sprays and springs up the gap-contact through electrical-conductive nanometer silver carbon film to pcb board copper clad layers hole wall, and corrode copper clad layers hole wall, make place
Electrical-conductive nanometer silver carbon film at this detaches with copper clad layers hole wall and come off, and the glass-fiber-plate layer hole wall surface in pcb board is led
Electric nano silver carbon film is then fixed to be retained, while copper clad layers hole wall is roughened due to microetch；
D, it is anti-oxidant
Pcb board after microetch, which enters, immerses anti-oxidant coating bath, is passivated liquid medicine using copper face, covers copper to the pcb board after microetch
Layer hole wall is passivated processing；
E, it washes
Remove excessive antioxidant；
F, it dries
Moisture content is removed, dries plate face.
In the method to metallize using water-soluble conducting nanometer silver carbon slurry to pcb board hole glass-fiber-plate layer hole wall,
To step c, the metallization process in pcb board hole has been completed, and subsequent step d, e, f are the work steps prepared for lower one of copper facing.
Preferably, the pcb board thickness is 0.05~3.5 millimeter, 0.1~1.0 millimeter of aperture.
Preferably, described in step b nanometer homogeneous milling apparatus is equipped in water-soluble conducting nanometer silver carbon slurry black holes coating bath.
Preferably, described in step b water-soluble conducting nanometer silver carbon slurry black holes coating bath in nanometer homogeneous milling apparatus be from
Heart bead mill or high-frequency vibration grinding or ultrasonic disruption machine or aforementioned two kinds or more milling apparatus are used in combination.
Preferably, the nanometer homogeneous milling apparatus continuously-running or intermittent duty.
Water guide soluble conductive nanometer silver carbon of the present invention starches the mechanism to be formed：The grain size of the nano-silver powder is 10~30
Nanometer；The grain size of nano-level conducting carbon black is 100~800 nanometers；Its microstructure of nano-level conducting carbon black be band side chain it
High structure hollow conductive carbon black, the i.e. particle of nano-level conducting carbon black have many gaps as sponge, and specific surface area is
600~1500 meters squared per grams, the water-soluble nano silver solution press 1 with the water-soluble nano grade conductive carbon black solution：100
Ratio mixing after, be ground dispersion by grinder, nano-silver powder particle made just to be inlaid into carbon black granules, formation water
Dissolubility conductive nano silver carbon is starched.
The beneficial effects of the invention are as follows：It is provided for pcb board fiberglass layer hole wall black holes processing procedure a kind of better than carbon black or graphite
The conductive nano silver carbon film of the conductive carbon film of formation, and simplify black holes making technology, improve production efficiency.
Description of the drawings：
Fig. 1 is the electrical-conductive nanometer metal carbon film bushing pipe schematic diagram in a kind of pcb board hole, wherein：
Fig. 1 a are schematic diagrames above pcb board shown in Fig. 1；
Fig. 1 b are schematic diagrames below pcb board shown in Fig. 1.
Fig. 2 is the diagrammatic cross-section in pcb board hole shown in Fig. 1 a, wherein：
Fig. 2 a are the schematic diagrames after the drilling of pcb board shown in Fig. 1；
Fig. 2 b are the schematic diagrames that electrical-conductive nanometer metal carbon film is made shown in Fig. 2 a in pcb board hole.
Fig. 3 is the schematic diagram after pcb board hole metallization shown in Fig. 2 b, wherein：
Fig. 3 a are the schematic diagrames after the electrical-conductive nanometer metal carbon film microetch shown in Fig. 2 b in pcb board；
Fig. 3 b are the schematic diagrames after pcb board hole metallization shown in Fig. 3 a.
Reference sign
Above 1 pcb board, conducting wire above 11 pcb boards；
2 pcb boards are in the following, conducting wire below 21 pcb boards；
Above 3 pcb boards with following conducting wire linked hole, 31 electrical-conductive nanometer metal carbon films；
32 pcb board plated through-holes；
4 pcb board glass laminates.
Specific embodiment
With reference to specific embodiment, the present invention will be described.
Embodiment 1：
A kind of manufacturing method of water-soluble conducting nanometer silver carbon slurry, described method includes following steps：
1. selecting a kind of water-soluble nano silver solution, the water-soluble nano silver solution includes：Particle size range is received for 5~60
Rice, a concentration of 0.05~8 g/l of nano-silver powder, further include water and at least five kinds of a concentration of 0.5~10 g/l of interfacial activity
Agent, a concentration of 0.05~1 g/l of organic reducing agent；
2. selecting a kind of water-soluble nano grade conductive carbon black solution, the water-soluble nano grade conductive carbon black solution includes：Grain
Diameter is 100~900 nanometers, a concentration of 10~50 g/l of nano-level conducting carbon black, further includes water and at least five kinds of a concentration of 0.5
~10 g/l of interfacial agent；
3. by step, 1. 2. water-soluble nano grade conductive carbon black solution presses 1 to the water-soluble nano silver solution with step：100
Ratio be mixed to form water-soluble conducting nanometer silver carbon solution；
4. by step, 3. the silver-colored carbon slurry feeding grinder of the water-soluble admittance rice electricity is ground, and makes nano-silver powder particle point
It dissipates and is inlaid into carbon black granules, form water-soluble conducting nanometer silver carbon slurry.
Embodiment 2：
The present embodiment and the difference of embodiment 1 are：The grinder is nanometer sand mill, 1000 revs/min of rotating speed, during grinding
Between be 2 hours.
Embodiment 3：
The present embodiment and the difference of embodiment 1 are：The grain size of the nano-silver powder is 40 nanometers；The nano-level conducting carbon
Black grain size is 700 nanometers；The interfacial agent include wetting agent, bleeding agent, dispersant, macromolecule barrier, thixotropic agent,
Antifoaming agent.
Embodiment 4：
The present embodiment and the difference of embodiment 1 are：The water-soluble conducting nanometer silver carbon slurry is non-newtonian fluid, is moved glutinous
Spend has good suspension stability for 20~4000 CPS.
Application Example 1
A kind of method for carrying out black holes processing procedure to pcb board hole using water-soluble conducting nanometer silver carbon slurry, the method includes
Following steps：
A, it cleans
The mixed solution for weakly alkaline solution and faint complexing agent in coating bath is cleaned, drilling will be completed by design requirement
Pcb board immerses coating bath, and the hydrophobic group of complexing agent gos deep into hole wall in mixed solution, the dirt on hole wall is washed, mixed solution
The surface of the fiberglass layer hole wall of pcb board is then adjusted to positively charged by the hydrophilic group of middle complexing agent；
B, black holes
Mainly include the mixed of water-soluble conducting nanometer silver carbon slurry, liquid dispersant and surfactant composition in black holes coating bath
Solution is closed, the water-soluble conducting nanometer silver carbon slurry in mixed solution is negatively charged；Pcb board after cleaned immerses coating bath, in PCB
Under the suction-operated of the glass-fiber-plate layer hole wall surface positive charge of plate, in the glass-fiber-plate layer hole wall surface of pcb board and copper clad layers hole wall
Surface has deposited one layer of electrical-conductive nanometer silver carbon film；
C, microetch
Surface, which is deposited, the pcb board immersion microetch coating bath of electrical-conductive nanometer silver carbon film, and the micro-corrosion liquid in microetch coating bath passes through
It sprays and springs up the gap-contact through electrical-conductive nanometer silver carbon film to pcb board copper clad layers hole wall, and corrode copper clad layers hole wall, make place
Electrical-conductive nanometer silver carbon film at this detaches with copper clad layers hole wall and come off, and the glass-fiber-plate layer hole wall surface in pcb board is led
Electric nano silver carbon film is then fixed to be retained, while copper clad layers hole wall is roughened due to microetch；
D, it is anti-oxidant
Pcb board after microetch, which enters, immerses anti-oxidant coating bath, is passivated liquid medicine using copper face, covers copper to the pcb board after microetch
Layer hole wall is passivated processing；
E, it washes
Remove excessive antioxidant；
F, it dries
Moisture content is removed, dries plate face.
In the method to metallize using water-soluble conducting nanometer silver carbon slurry to pcb board hole, until step c, pcb board
The metallization process in hole has been completed, and subsequent step d, e, f are the work steps prepared for lower one of copper facing.
Application Example 2
This application embodiment and the difference of Application Example 1 are：The pcb board thickness is 0.05~3.5 millimeter, aperture
0.1~1.0 millimeter.
Application Example 3
This application embodiment and the difference of Application Example 1 are：Water-soluble conducting nanometer silver carbon slurry black holes plating described in step b
Nanometer homogeneous milling apparatus is equipped in slot.
Application Example 4
This application embodiment and the difference of Application Example 3 are：Water-soluble conducting nanometer silver carbon slurry black holes plating described in step b
Nanometer homogeneous milling apparatus in slot is centrifugation bead mill or high-frequency vibration grinding or ultrasonic disruption machine or aforementioned two kinds or more
Milling apparatus is used in combination.
Application Example 5
This application embodiment and the difference of Application Example 3,4 are：The nanometer homogeneous milling apparatus continuously-running or
Intermittent duty.
Water guide soluble conductive nanometer silver carbon of the present invention starches the mechanism to be formed：The grain size of the nano-silver powder is 10~30
Nanometer；The grain size of nano-level conducting carbon black is 100~800 nanometers；Its microstructure of nano-level conducting carbon black be band side chain it
High structure hollow conductive carbon black, the i.e. particle of nano-level conducting carbon black have many gaps as sponge, and specific surface area is
600~1500 meters squared per grams, the water-soluble nano silver solution press 1 with the water-soluble nano grade conductive carbon black solution：100
Ratio mixing after, be ground dispersion by grinder, nano-silver powder particle made just to be inlaid into carbon black granules, formation water
Dissolubility conductive nano silver carbon is starched.
The beneficial effects of the invention are as follows：It is provided for pcb board fiberglass layer hole wall black holes processing procedure a kind of better than carbon black or graphite
The conductive nano silver carbon film of the conductive carbon film of formation, and simplify black holes making technology, improve production efficiency.
Experiment 1 and Comparative result：
Make two pieces 60 × 100 millimeters, on the FR-4 dual platens of 1.6 millimeters of plate thickness, bore respectively 20 0.3 millimeter hole,
20 0.5 millimeter of hole, 20 1.0 millimeters of hole；
Using prior art graphite or carbon black processing procedure black holes, 5 minutes plated film used times had 7 holes to fail plating and lead to, then plate 5 points
Clock still has the slight hole in 5 holes to break, and it is 3500 ohm that graphite or carbon black conductive carbon film sheet resistance are tested after microetch.
Using silver-colored carbon plasma procedure black holes of the invention, the plated film used time, all plating was logical in 60 holes, is tested after microetch less than 5 minutes
Nanometer silver carbon conductive carbon film sheet resistance is 50 ohm.
Experiment 2 and Comparative result：
It is high-density sponge of the 1cm2 length as 10cm using sectional area, impregnates moistening in graphite or carbon black, and impose
It fully squeezes, fully after drying, surveys its both ends resistance value more than 100K Ω；It is fully dry after moistening is impregnated 1 minute again, survey it
Resistance is 30K Ω.
It is high-density sponge of the 1cm2 length as 10cm using sectional area, fully squeezes and impregnate moistening 1 in nanometer silver carbon slurry
Minute, after fully drying, its both ends resistance value is surveyed as 4K Ω.
The result of contrast experiment 1 is can be found that：Compared with prior art, under equal conditions, nanometer of the present invention is led
Electric silver carbon starches the resistance of conductive nano silver carbon film to be formed and is at least reduced to one of seventy points；The result of contrast experiment 2 can be sent out
It is existing：Compared with prior art, under equal conditions, conductive nano silver carbon of the present invention starches the conductive nano silver carbon film to be formed
Resistance is at least reduced to 1/25th；Under special conditions of contract, conductive nano silver carbon of the present invention is starched the nanometer to be formed and is led
The resistance of electric silver carbon film is at least reduced to 1/7th.
Experiment proves：Conductive nano silver carbon of the present invention starches the conductive nano silver carbon film to be formed and reaches conductive grade level,
A kind of conductive nano of conductive carbon film formed better than carbon black or graphite is provided for pcb board fiberglass layer hole wall surface black holes processing procedure
Silver-colored carbon film simplifies black holes making technology, improves production efficiency.
More than content is only presently preferred embodiments of the present invention, for those of ordinary skill in the art, according to the present invention
Thought, there will be changes, the content of the present specification should not be construed as to the present invention in specific embodiments and applications
Limitation.
Claims (5)
1. a kind of water-soluble conducting nanometer silver carbon slurry is to the method for pcb board hole metallization, it is characterised in that：The method includes such as
Lower step：
A, it cleans
The mixed solution for weakly alkaline solution and faint complexing agent in coating bath is cleaned, the PCB of drilling will be completed by design requirement
Plate immerses coating bath, and the hydrophobic group of complexing agent gos deep into hole wall in mixed solution, and the dirt on hole wall is washed, multiple in mixed solution
The surface of the fiberglass layer hole wall of pcb board is then adjusted to positively charged by the hydrophilic group of mixture；
B, black holes
Mainly include water-soluble conducting nanometer silver carbon slurry, liquid dispersant and table in water-soluble conducting nanometer silver carbon slurry black holes coating bath
The mixed solution of face activating agent composition, the water-soluble conducting nanometer silver carbon slurry in mixed solution are negatively charged；PCB after cleaned
Plate immerse coating bath, under the suction-operated of pcb board hole wall surface positive charge, pcb board glass-fiber-plate layer hole wall surface and cover copper
Layer hole wall surface deposited one layer of electrical-conductive nanometer silver carbon film；
C, microetch
Surface, which is deposited, the pcb board immersion microetch coating bath of electrical-conductive nanometer silver carbon film, and the micro-corrosion liquid in microetch coating bath passes through sprinkling
With spring up gap-contact through electrical-conductive nanometer silver carbon film to pcb board copper clad layers hole wall, and corrode copper clad layers hole wall, make in this
The electrical-conductive nanometer silver carbon film at place is detached with copper clad layers hole wall and is come off.
2. according to water-soluble conducting nanometer silver carbon described in claim 1 slurry to the method for pcb board hole metallization, it is characterised in that：
The pcb board thickness is 0.05~3.5 millimeter, 0.1~1.0 millimeter of aperture.
3. according to water-soluble conducting nanometer silver carbon described in claim 1 slurry to the method for pcb board hole metallization, it is characterised in that：
Described in step b nanometer homogeneous milling apparatus is equipped in water-soluble conducting nanometer silver carbon slurry black holes coating bath.
4. according to the water-soluble conducting nanometer silver carbon slurry described in claim 3 to the method for pcb board hole metallization, it is characterised in that：
Nanometer homogeneous milling apparatus described in step b in water-soluble conducting nanometer silver carbon slurry black holes coating bath is centrifugation bead mill or high frequency vibrating
Dynamic grinding or ultrasonic disruption machine or aforementioned two kinds or more milling apparatus are used in combination.
5. according to the water-soluble conducting nanometer silver carbon slurry described in claim 3 or 4 to the method for pcb board hole metallization, feature exists
In：The nanometer homogeneous milling apparatus continuously-running or intermittent duty.
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| CN107645829B (en) * | 2017-10-16 | 2020-07-10 | 广东天承科技有限公司 | Circuit board conductive liquid and preparation method and application thereof |
| CN107740145B (en) * | 2017-10-16 | 2019-09-24 | 广东天承科技有限公司 | A kind of highly conductive carbon pores liquid of pcb board and its preparation method and application |
| CN107907255B (en) * | 2017-10-17 | 2020-10-23 | 天津大学 | Preparation method of tension sensor based on carbon black-silver nanoparticle composite material |
| CN109825863B (en) * | 2019-03-28 | 2021-02-05 | 烟台恒诺新材料有限公司 | Application of carbon nano tube conductive paste in black hole direct electroplating |
| CN111554430A (en) * | 2020-05-19 | 2020-08-18 | 东莞市硕美电子材料科技有限公司 | Novel composite conductive coating paste composition and preparation method thereof |
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