CN106028654A - Drilling method of flexible circuit board - Google Patents
Drilling method of flexible circuit board Download PDFInfo
- Publication number
- CN106028654A CN106028654A CN201610451611.7A CN201610451611A CN106028654A CN 106028654 A CN106028654 A CN 106028654A CN 201610451611 A CN201610451611 A CN 201610451611A CN 106028654 A CN106028654 A CN 106028654A
- Authority
- CN
- China
- Prior art keywords
- hole
- substrate
- circuit board
- copper
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
The invention discloses a drilling method of a flexible circuit board. The drilling method comprises the steps as follows: a substrate is provided; the copper thickness on the surface of the substrate is controlled to be smaller than or equal to 8 microns; laser drilling is carried out on the position, which needs to be conducted, on the substrate by ultraviolet light; the ratio of the aperture of a drilled through hole to the thickness of the substrate is smaller than or equal to 1.2; residues left during drilling are eliminated; a carbon film is formed in the area, in which non-copper foil is located, on the wall of the drilled through hole; and copper plating is carried out on the through hole. The copper thickness on the substrate is controlled to be smaller than 8 microns, so that subsequent drilling is easier to achieve and the size of the through hole is easier to control. The size of the through hole can be accurately controlled by copper reduction and laser drilling technologies; and the minimum aperture of the through hole in the substrate is controlled to be 35-25 microns when the thickness of the substrate is not greater than 29.4 microns.
Description
Technical field
The present invention relates to flexible PCB, particularly to the boring method of a kind of flexible circuit board.
Background technology
FPC (Flexible Printed Circuit) is also known as flexible circuit board, flexible printed circuit board, flexible electrical
Road plate, is called for short soft board.It is mainly used in mobile phone, notebook computer, PDA, digital camera, LCM etc. to produce
On product, FPC has height reliability with polyimides or mylar for the one that substrate is made, excellent
Flexible printed circuit, has the advantages that distribution density is high, lightweight, thickness is thin.
In the market, when holing FPC, the process capability in the minimum vias aperture that can reach is
50μm.But at present for two-sided FPC, it is less than 29.4 μm to the requirement of thickness, and aspect ratio is (vertical
Horizontal ratio=thickness of slab/minimum-value aperture) need to be less than or equal to 1.2, accordingly, it would be desirable to described minimum vias pore size control is existed
35 μm～25 μm, and existing technique can not reach above-mentioned purpose.
Summary of the invention
The present invention provides the boring method of a kind of flexible circuit board, to solve above-mentioned skill present in prior art
Art problem.
For solving above-mentioned technical problem, the present invention provides the boring method of a kind of flexible circuit board, including:
Substrate is provided；
Control the copper thickness of described substrate surface, make copper thickness be not more than 8 μm；
Use ultraviolet that the position that must turn on substrate is carried out laser drilling, wherein, the through hole hole being drilled
Footpath is less than or equal to 1.2 with the thickness ratio of substrate；
The residue stayed when removing boring；
In the through-hole wall being drilled, non-Copper Foil region forms one layer of carbon film；
Through hole is carried out copper facing.
As preferably, the step of the copper thickness controlling described substrate surface is: for copper thickness less than or equal to 8 μm
Substrate, not to described substrate perform any operation；For the copper thickness substrate more than 8um, by substrate surface
Copper thickness reduce to 6～8 μm or 5～7 μm.
As preferably, plasma electric slurry processes is used to remove the residue in through hole.
As preferably, in through hole, the copper thickness of plating is at least 8 μm, up to 15 μm or 20 μm.
As preferably, also include circuit pre-treatment step.
As preferably, described carbon film uses graphite.
As preferably, while offering through hole, bore the operation hole determining part foot the most simultaneously.
Compared with prior art, the present invention is by controlling the thickness of copper on substrate, by the THICKNESS CONTROL of copper in 8 μm
Below so that follow-up boring is easier to realization, and the easier control of size of through hole.The present invention uses and subtracts
Copper adds laser drilling technique, can accurately control the size of through hole, it is possible to be not more than 29.4 μm at substrate thickness
Time, by the minimum vias pore size control on substrate in 35 μm～25 μm.
Accompanying drawing explanation
Fig. 1 is the workflow diagram of the linear circuit plate of the present invention.
Detailed description of the invention
Understandable for enabling the above-mentioned purpose of the present invention, feature and advantage to become apparent from, the most right
The detailed description of the invention of the present invention is described in detail.It should be noted that, accompanying drawing of the present invention all uses simplification
Form and all use non-ratio accurately, only in order to convenient, aid in illustrating the mesh of the embodiment of the present invention lucidly
's.
As it is shown in figure 1, the present invention provides the boring method of a kind of linear circuit plate, and specifically include following step
Rapid:
First, it is provided that substrate, this substrate can be single-layer double-side plate can be the most just multilamellar dual platen, certainly,
Described substrate surface is layers of copper, and in other words, in the present invention, the substrate of indication is copper-clad base plate.
Then, according to producing needs, substrate is holed.It should be noted that due to the thickness of copper on substrate
Degree difference, the mode therefore holed is the most different, is specifically divided into two kinds: surface copper thickness is more than to the base of 8 μm
Plate, first carries out and subtracts copper step, then hole；And for the substrate of surface copper thickness 8 μm, then omit and subtract copper
Step, directly holes.
Wherein, subtract described in the mode that copper step specifically uses emery cloth to grind the thickness of copper is reduced to 6～8 μm or
5～7 μm.
In described drill process, concrete use the radium-shine mode of ultraviolet light by need on substrate the region of conducting with
Hole is through, and bores the operation hole determining part foot, and the hole of definition conducting region is through hole；Certainly, described through hole
It is satisfied by aspect ratio requirements, the thickness ratio of the through hole being i.e. drilled/aperture, operation hole and substrate with the size in operation hole
Value is less than or equal to 1.2.
Then, using plasma electric slurry processes to remove the residue in through hole, it is ensured that after follow-up plating, section is 200
Times or 500 power microscope lower observation hole walls without residue remain；
Then, in the through-hole wall being drilled, non-Copper Foil region forms one layer of carbon film, specifically uses graphite,
Owing to graphite has the effect of conducting electric current, therefore by the region electric conduction utilizing graphite to make originally to be not turned on
Stream, it is simple to follow-up through hole copper facing can play a role；
Then, through hole is carried out copper facing, it is achieved conducting between each layer in the two-sided and hole of substrate, generally,
Minimum 8 μm of the thickness of copper in described through hole, are 15 μm or 20 μm to the maximum, the most both can realize conducting
Effect, does not the most affect the function in other region of substrate.
Further, present invention additionally comprises circuit pre-treatment step, before described step is arranged on carbon film formation,
Guarantee being normally carried out of follow-up circuit printing.
To sum up, the present invention provides the boring method of a kind of flexible circuit board, including: substrate is provided；Control institute
State the copper thickness of substrate surface, make copper thickness be not more than 8 μm；Use the ultraviolet position to turning on substrate
Place carries out laser drilling, and wherein, the through-hole aperture being drilled is less than or equal to 1.2 with the thickness ratio of substrate；Remove
The residue stayed during boring；In the through-hole wall being drilled, non-Copper Foil region forms one layer of carbon film；To through hole
Carry out copper facing.The present invention, by controlling the thickness of copper on substrate, by the THICKNESS CONTROL of copper below 8 μm, makes
Obtain follow-up boring to be easier to realize, and the size of through hole is easier to control.Present invention employing subtracts copper and adds radium-shine
Bore process, can accurately control the size of through hole, it is possible to when substrate thickness is not more than 29.4 μm, by base
Minimum vias pore size control on plate is in 35 μm～25 μm.
Obviously, those skilled in the art can carry out various change and modification without deviating from the present invention to invention
Spirit and scope.So, if the present invention these amendment and modification belong to the claims in the present invention and
Within the scope of equivalent technologies, then the present invention is also intended to change and including modification include these.
Claims (8)
1. the boring method of a flexible circuit board, it is characterised in that including:
Substrate is provided；
Control the copper thickness of described substrate surface, make copper thickness be not more than 8 μm；
Use ultraviolet that the position that must turn on substrate is carried out laser drilling, wherein, the through hole hole being drilled
Footpath is less than or equal to 1.2 with the thickness ratio of substrate；
The residue stayed when removing boring；
In the through-hole wall being drilled, non-Copper Foil region forms one layer of carbon film；
Through hole is carried out copper facing.
2. the boring method of flexible circuit board as claimed in claim 1, it is characterised in that control described base
The step of the copper thickness on plate surface is: for copper thickness less than or equal to the substrate of 8 μm, do not perform described substrate
Any operation；For copper thickness more than the substrate of 8um, the copper thickness of substrate surface is reduced to 6～8 μm or
5～7 μm.
3. the boring method of flexible circuit board as claimed in claim 1, it is characterised in that use plasma
Plasma-based method removes the residue in through hole.
4. the boring method of flexible circuit board as claimed in claim 1, it is characterised in that plating in through hole
Copper thickness be at least 8 μm, up to 15 μm or 20 μm.
5. the boring method of flexible circuit board as claimed in claim 1, it is characterised in that also include circuit
Pre-treatment step.
6. the boring method of flexible circuit board as claimed in claim 1, it is characterised in that described carbon film is adopted
Use graphite.
7. the boring method of flexible circuit board as claimed in claim 1, it is characterised in that offering through hole
While, bore the operation hole determining part foot the most simultaneously.
8. the boring method of flexible circuit board as claimed in claim 1, it is characterised in that described through hole
Aperture is 25～35 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610451611.7A CN106028654A (en) | 2016-06-21 | 2016-06-21 | Drilling method of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610451611.7A CN106028654A (en) | 2016-06-21 | 2016-06-21 | Drilling method of flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106028654A true CN106028654A (en) | 2016-10-12 |
Family
ID=57086323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610451611.7A Pending CN106028654A (en) | 2016-06-21 | 2016-06-21 | Drilling method of flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106028654A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108289391A (en) * | 2018-01-17 | 2018-07-17 | 维沃移动通信有限公司 | A kind of production method of circuit board, circuit board and mobile terminal |
| CN109719404A (en) * | 2019-01-15 | 2019-05-07 | 广东科翔电子科技有限公司 | A kind of method of IC support plate laser drill |
| CN112739007A (en) * | 2020-11-18 | 2021-04-30 | 厦门爱谱生电子科技有限公司 | Method for manufacturing wide roll-to-roll COF (chip on film) board |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102946695A (en) * | 2012-10-31 | 2013-02-27 | 华为技术有限公司 | Through hole structure, printed circuit board, and manufacture method of through hole structure |
| CN103491727A (en) * | 2013-09-29 | 2014-01-01 | 哈尔滨工业大学 | Method using printed circuit board graphite oxide reduction method to carry out hole conductivity |
| CN103917049A (en) * | 2013-11-22 | 2014-07-09 | 大连太平洋电子有限公司 | Laser drilling plate machining method adopting secondary outer-layer core material for reducing copper |
| CN104105362A (en) * | 2014-07-08 | 2014-10-15 | 深圳华麟电路技术有限公司 | Black hole horizontal production line technological process and black hole groove structure |
| CN104349609A (en) * | 2013-08-08 | 2015-02-11 | 北大方正集团有限公司 | Printed circuit board and manufacturing method thereof |
| CN105307423A (en) * | 2015-10-28 | 2016-02-03 | 安捷利电子科技（苏州）有限公司 | Preparation method for HDI rigid-flex PCB interlayer blind hole all-copper filling |
-
2016
- 2016-06-21 CN CN201610451611.7A patent/CN106028654A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102946695A (en) * | 2012-10-31 | 2013-02-27 | 华为技术有限公司 | Through hole structure, printed circuit board, and manufacture method of through hole structure |
| CN104349609A (en) * | 2013-08-08 | 2015-02-11 | 北大方正集团有限公司 | Printed circuit board and manufacturing method thereof |
| CN103491727A (en) * | 2013-09-29 | 2014-01-01 | 哈尔滨工业大学 | Method using printed circuit board graphite oxide reduction method to carry out hole conductivity |
| CN103917049A (en) * | 2013-11-22 | 2014-07-09 | 大连太平洋电子有限公司 | Laser drilling plate machining method adopting secondary outer-layer core material for reducing copper |
| CN104105362A (en) * | 2014-07-08 | 2014-10-15 | 深圳华麟电路技术有限公司 | Black hole horizontal production line technological process and black hole groove structure |
| CN105307423A (en) * | 2015-10-28 | 2016-02-03 | 安捷利电子科技（苏州）有限公司 | Preparation method for HDI rigid-flex PCB interlayer blind hole all-copper filling |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108289391A (en) * | 2018-01-17 | 2018-07-17 | 维沃移动通信有限公司 | A kind of production method of circuit board, circuit board and mobile terminal |
| CN109719404A (en) * | 2019-01-15 | 2019-05-07 | 广东科翔电子科技有限公司 | A kind of method of IC support plate laser drill |
| CN112739007A (en) * | 2020-11-18 | 2021-04-30 | 厦门爱谱生电子科技有限公司 | Method for manufacturing wide roll-to-roll COF (chip on film) board |
| CN112739007B (en) * | 2020-11-18 | 2022-05-10 | 厦门爱谱生电子科技有限公司 | Method for manufacturing wide roll-to-roll COF (chip on film) board |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161012 |