CN102438405A - Method for cleaning through hole smears of rigid-flexible printed circuit board - Google Patents
Method for cleaning through hole smears of rigid-flexible printed circuit board Download PDFInfo
- Publication number
- CN102438405A CN102438405A CN2011103862783A CN201110386278A CN102438405A CN 102438405 A CN102438405 A CN 102438405A CN 2011103862783 A CN2011103862783 A CN 2011103862783A CN 201110386278 A CN201110386278 A CN 201110386278A CN 102438405 A CN102438405 A CN 102438405A
- Authority
- CN
- China
- Prior art keywords
- rigid
- epoxy resin
- circuit board
- printed circuit
- soaked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention relates to a method for cleaning through hole smears of a rigid-flexible printed circuit board, belonging to the field of printed circuit board manufacturing. The cleaning method comprises the following steps: 1) using a novel decontamination liquid to remove polyimide and acrylic resin smears and swell epoxy resin smears; 2) using a potassium permanganate decontamination liquid to oxidize and crack the swollen epoxy resin; and 3) using a sulfuric acid-sodium oxalate system to remove the residual potassium permanganate liquid, thereby realizing the removal of through hole smears of the rigid-flexible board based on a low-valence chemical method, wherein every liter of decontamination liquid for removing polyimide and acrylic resin smears and swelling epoxy resin contains 20-50g of sodium hydroxide or potassium hydroxide, 10-40g of epoxy resin sweller, 1-5g of solubilizer, 10-60ml of polyimide sweller and the balance of water. The method provided by the invention realizes the low-cost smear cleaning, and has the characteristics of simple method and high decontamination efficiency. By using the method to clean the through holes of the rigid-flexible printed circuit board, a level hole wall having good hole interlocking capability can be obtained.
Description
Technical field
The invention belongs to printed circuit board and make the field, specially refer to the rigid-flexible combined circuit plate through hole of a kind of cleaning (or removal) and bore dirty method.
Background technology
The development trend of electronic product requires printed circuit board to develop along " light, thin, short, little " and multifunction direction.Rigid-flexible combined printed wiring board is little, in light weight with its size, can avoid Miswire, increases the assembling flexibility, realizes that advantage such as 3 D stereo assembling will become an important directions of printed circuit board development.In rigid-flex combined board, layer with layer between, being electrically connected mainly between rigid plate and the flex plate realize through the plated-through hole of rigid region.Because rigid-flexible combined printed wiring board medium substrate contains rigid board material such as epoxy resin, glass cloth usually, and acrylate glue, flexible panel material such as polyimides, so after the boring, the empty interior logical powder (be called and bore dirt) that leaves above-mentioned material and form that produces.Boring dirt must clean up before via metalization, otherwise can influence metallization performance, can cause scratching when serious between combined printed wiring board layer and the layer and can not realize electric interconnection.
For the comparatively single printed circuit board of base material component, can adopt the method for chemical cleaning solution to remove the brill dirt.Such as, bore dirt and can pass through liquor potassic permanganate swelling, cracking removal for the rigid printed circuit boards of base materials such as epoxy resin or glass cloth; For the flexible printed-circuit board of polyimide base material, bore dirt and can remove through alkaline PI adjustment liquid.But for the multilayer printed circuit board of rigid-flexible combination, simple liquor potassic permanganate and PI adjustment liquid all can't be removed fully and bore dirt.
Existing a kind of dirty method of rigid-flexible combined printed wiring board through hole brill of removing is that the method that adopts that plasma to clean realizes.Its technical scheme main points are: under the high-frequency and high-voltage electric field action, with CF
4And O
2Be ionized into CF
3, F, O, CF, e plasma, highly active plasma can react with the macromolecular materials such as epoxy glass fabric, acrylic acid and polyimides of hole wall and form CO
2, H
2Gas shape materials such as O, thus reach purpose except that desmearing.But plasma cleans and has high input with equipment, and every equipment investment is more than 1,000,000, and the influence of subject plasma generation cavity volume, and cleaning efficiency is lower.In addition, because plasma gas is different to the removal speed of different materials, cause through hole hole wall lack of homogeneity behind the desmearing.
Summary of the invention
The present invention provides a kind of rigid-flexible combined printed wiring board through hole to bore dirty cleaning method.This method realizes simultaneously that through the novel decontamination liquid of configuration polyimides, acrylic resin bore dirty the cleaning and the epoxy resin swelling, carries out the epoxy resin oxicracking then and accomplishes desmearing, has that the decontamination cost is low, efficient is high, characteristics simple to operate.
The concrete technical method of the present invention is following:
A kind of rigid-flexible combined printed wiring board through hole bores dirty cleaning method, and is as shown in Figure 1, may further comprise the steps:
Step 1: prepare two kinds of decontamination liquids.
First kind of decontamination liquid wherein, every liter contains NaOH or potassium hydroxide 20～50g, epoxy resin sweller 10～40g, solubilizer 1～5g, polyimides sweller 10～60ml, and all the other are water; Second kind of decontamination liquid, every liter contains NaOH or potassium hydroxide 10～50g, potassium permanganate 30～60g, clorox 0.1～2g, and all the other are water.
Step 2: polyimides, acrylic resin bore dirty removal and epoxy resin bores dirty swelling.
Rigid-flexible combined printed wiring board after the boring is soaked in first kind of decontamination liquid that step 1 prepares; Under 30～80 ℃ temperature conditions, soaked 3～10 minutes, adopt the mode of vibrating printed circuit board or inflating to improve the grout ability of decontaminating solution in the immersion process.
Step 3: the epoxy resin of potassium permanganate oxidation cracking swelling.
Printed circuit board after step 2 immersion is taken out and uses deionized water rinsing; Be soaked in then in second kind of decontamination liquid that step 1 prepares; Under 50～80 ℃ temperature conditions, soaked 5～20 minutes, adopt the mode of vibrating printed circuit board or inflating to improve the grout ability of decontaminating solution in the immersion process.
Step 4: remove the potassium permanganate debris.
Taking-up after step 3 soaked is also used deionized water rinsing; Be soaked in then in the mixed solution of sulfuric acid-sodium oxalate; Under 30～50 ℃ temperature conditions, soaked 2～15 minutes, adopt the mode of vibrating printed circuit board or inflating to improve the grout ability of decontaminating solution in the immersion process.The mixed solution of said sulfuric acid-sodium oxalate, every liter contains the concentrated sulfuric acid 50～200ml sodium oxalate 10～50g, and all the other are water.
Technique scheme, what need further specify is:
1, in first kind of decontamination liquid: said epoxy resin sweller is a kind of organic substance identical with the epoxide resin reactive group that contain, to come swelling epoxy resin through the similar compatibility principle; Said polyimides sweller is a kind of organic substance identical with the polyimides active group that contain, to come the swelling polyimides through the similar compatibility principle; Said solubilizer is a kind of hydrophilic pure type organic, can improve epoxy resin sweller or the solubility of polyimides sweller in the aqueous solution; Potassium hydroxide or NaOH can decompose the polyimides of acrylic resin and swelling.
When 2, step 2 adopts first kind of decontamination liquid to soak printed circuit board, can realize simultaneously that polyimides, acrylic resin bore dirty removal and epoxy resin bores dirty swelling.
When 3, step 3 adopted second kind of decontamination liquid to soak printed circuit board, main purpose was to adopt the potassium permanganate oxidation cracking to bore dirty through the epoxy resin of step 2 swelling; Also adopt simultaneously potassium hydroxide or NaOH further to decompose and remove polyimides, the dirt of acrylic resin brill that step 2 maybe be residual.
4, step 3 adopts the potassium permanganate oxidation cracking after the epoxy resin of step 2 swelling bores dirt; Meeting residual fraction potassium permanganate debris in printed circuit board and the boring; Wherein contain potassium permanganate, potassium manganate and manganese dioxide, so adopt the mixed solution of sulfuric acid-sodium oxalate to remove the potassium permanganate debris.
The present invention is through the novel decontamination liquid of configuration; Realize that simultaneously polyimides, acrylic resin bore dirty the removal and the epoxy resin swelling; Carry out the epoxy resin oxicracking then, realized boring dirty the cleaning cheaply, have the characteristics that method is simple, detersive efficiency is high simultaneously.Bore dirty cleaning method through rigid-flexible combined printed wiring board through hole provided by the invention rigid-flexible combined printed wiring board through hole cleaned, can access smooth, with the good hole wall of hole copper snap-in force.
Description of drawings
Fig. 1 is a schematic flow sheet of the present invention.
Fig. 2 is for passing through the inventive method desmearing, four layers of rigid-flexible combined printed wiring board through hole cut-plane slices figure that obtain behind the hole metallization.
Embodiment
Embodiment 1
Use mechanical numerical control machine in four layers of rigid-flexible combined printed wiring board, to bore the 0.25mm through hole, the rigid-flex combined board structure is the middle double-faced flexible plate that is, both sides are respectively the single face rigid plate.The rigidity sheet material beneficial 18/0.2FR-4 single-side coated copper plate material of making a living, flex plate are platform rainbow 18/25/18 calendering PI halogen double face copper.Use the inventive method desmearing, hole metallization then, its technical process is following:
Step 1: prepare two kinds of decontamination liquids;
First kind of decontamination liquid wherein, every liter contain NaOH or potassium hydroxide 35g, as the ethylene glycol ethyl ether 30g of epoxy resin sweller, as the butanediol 2g of solubilizer, as the diamine 40ml of polyimides sweller, all the other are water; Second kind of decontamination liquid, every liter contains NaOH or potassium hydroxide 35g, potassium permanganate 55g, clorox 0.5g, and all the other are water;
Step 2: polyimides, acrylic resin bore dirty removal and epoxy resin bores dirty swelling;
Rigid-flexible combined printed wiring board after the boring is soaked in first kind of decontamination liquid that step 1 prepares, under 50 ℃ temperature conditions, soaked 6 minutes, adopt the mode of vibrating printed circuit board or inflating to improve the grout ability of decontaminating solution in the immersion process;
Step 3: the epoxy resin of potassium permanganate oxidation cracking swelling;
Printed circuit board after step 2 immersion is taken out and uses deionized water rinsing; Be soaked in then in second kind of decontamination liquid that step 1 prepares; Under 75 ℃ temperature conditions, soaked 10 minutes, adopt the mode of vibrating printed circuit board or inflating to improve the grout ability of decontaminating solution in the immersion process;
Step 4: remove the potassium permanganate debris;
Taking-up after step 3 soaked is also used deionized water rinsing; Be soaked in then in the mixed solution of sulfuric acid-sodium oxalate; Under 40 ℃ temperature conditions, soaked 10 minutes, adopt the mode of vibrating printed circuit board or inflating to improve the grout ability of decontaminating solution in the immersion process; The mixed solution of said sulfuric acid-sodium oxalate, every liter contains concentrated sulfuric acid 100ml sodium oxalate 30g, and all the other are water.
Rigid-flexible combined printed wiring board is carried out alkaline degreasing, black hole, plating, obtain the through hole behind the hole metallization.After electroplating completion, make through hole cut-plane slices figure, slice map shows that the through hole hole wall is even.According to the IPC method through hole being carried out reliability detects: placed in 280 ℃ of high temperature thermal shock 10 seconds, and impacted 3 times, the making through hole is cut into slices, and slice map shows that hole copper is intact, and desmearing is respond well.
Embodiment 2
Use mechanical numerical control machine to bore the 0.30mm through hole at six layers of rigid-flexible combined printed wiring board, the rigid-flex combined board structure is the double-faced flexible plate in the middle of being, both sides are respectively two-sided rigid plate.The rigidity sheet material beneficial 35/0.5/35FR-4 double-sided copper-clad plate of making a living, flex plate are platform rainbow 18/25/18 calendering PI halogen double face copper.Use the inventive method desmearing, hole metallization, its technical process is following:
Step 1: prepare two kinds of decontamination liquids;
First kind of decontamination liquid wherein, every liter contain NaOH or potassium hydroxide 35g, as the ethylene glycol ethyl ether 20g of epoxy resin sweller, as the butanediol 2g of solubilizer, as the buzane 40ml of polyimides sweller, all the other are water; Second kind of decontamination liquid, every liter contains NaOH or potassium hydroxide 35g, potassium permanganate 55g, clorox 0.5g, and all the other are water;
Step 2: polyimides, acrylic resin bore dirty removal and epoxy resin bores dirty swelling;
Rigid-flexible combined printed wiring board after the boring is soaked in first kind of decontamination liquid that step 1 prepares, under 50 ℃ temperature conditions, soaked 6 minutes, adopt the mode of vibrating printed circuit board or inflating to improve the grout ability of decontaminating solution in the immersion process;
Step 3: the epoxy resin of potassium permanganate oxidation cracking swelling;
Printed circuit board after step 2 immersion is taken out and uses deionized water rinsing; Be soaked in then in second kind of decontamination liquid that step 1 prepares; Under 75 ℃ temperature conditions, soaked 10 minutes, adopt the mode of vibrating printed circuit board or inflating to improve the grout ability of decontaminating solution in the immersion process;
Step 4: remove the potassium permanganate debris;
Taking-up after step 3 soaked is also used deionized water rinsing; Be soaked in then in the mixed solution of sulfuric acid-sodium oxalate; Under 40 ℃ temperature conditions, soaked 10 minutes, adopt the mode of vibrating printed circuit board or inflating to improve the grout ability of decontaminating solution in the immersion process; The mixed solution of said sulfuric acid-sodium oxalate, every liter contains concentrated sulfuric acid 100ml sodium oxalate 30g, and all the other are water.
Rigid-flexible combined printed wiring board is carried out alkaline degreasing, black hole, plating, obtain the through hole behind the hole metallization.After electroplating completion, make through hole cut-plane slices figure, slice map shows that the through hole hole wall is even.According to the IPC method through hole being carried out reliability detects: placed in 280 ℃ of high temperature thermal shock 10 seconds, and impacted 3 times, the making through hole is cut into slices, and slice map shows that hole copper is intact, and desmearing is respond well.
Those skilled in the art should know; Above-mentioned two embodiment are not to be to further qualification of the present invention, and other are any to bore the dirty cleaning method that carries out according to technical scheme of the present invention all within the scope i volume of application protection of the present invention to rigid-flexible combined printed wiring board.It will be appreciated by those skilled in the art that all number ranges in the technical scheme of the present invention (content, temperature, time etc.) only can influence the efficient of boring dirty cleaning, can't influence and bore dirty essence of cleaning.
Claims (7)
1. a rigid-flexible combined printed wiring board through hole bores dirty cleaning method, may further comprise the steps:
Step 1: prepare two kinds of decontamination liquids;
First kind of decontamination liquid wherein, every liter contains NaOH or potassium hydroxide 20～50g, epoxy resin sweller 10～40g, solubilizer 1～5g, polyimides sweller 10～60ml, and all the other are water; Second kind of decontamination liquid, every liter contains NaOH or potassium hydroxide 10～50g, potassium permanganate 30～60g, clorox 0.1～2g, and all the other are water;
Step 2: polyimides, acrylic resin bore dirty removal and epoxy resin bores dirty swelling;
Rigid-flexible combined printed wiring board after the boring is soaked in first kind of decontamination liquid that step 1 prepares; Under 30～80 ℃ temperature conditions, soaked 3～10 minutes, adopt the mode of vibrating printed circuit board or inflating to improve the grout ability of decontaminating solution in the immersion process;
Step 3: the epoxy resin of potassium permanganate oxidation cracking swelling;
Printed circuit board after step 2 immersion is taken out and uses deionized water rinsing; Be soaked in then in second kind of decontamination liquid that step 1 prepares; Under 50～80 ℃ temperature conditions, soaked 5～20 minutes, adopt the mode of vibrating printed circuit board or inflating to improve the grout ability of decontaminating solution in the immersion process;
Step 4: remove the potassium permanganate debris;
Taking-up after step 3 soaked is also used deionized water rinsing; Be soaked in then in the mixed solution of sulfuric acid-sodium oxalate; Under 30～50 ℃ temperature conditions, soaked 2～15 minutes, adopt the mode of vibrating printed circuit board or inflating to improve the grout ability of decontaminating solution in the immersion process; The mixed solution of said sulfuric acid-sodium oxalate, every liter contains the concentrated sulfuric acid 50～200ml sodium oxalate 10～50g, and all the other are water.
2. rigid-flexible combined printed wiring board through hole according to claim 1 bores dirty cleaning method; It is characterized in that; Epoxy resin sweller described in said first kind of decontamination liquid is a kind of organic substance identical with the epoxide resin reactive group that contain, to come swelling epoxy resin through the similar compatibility principle.
3. rigid-flexible combined printed wiring board through hole according to claim 2 bores dirty cleaning method, it is characterized in that, said to contain the organic substance identical with the epoxide resin reactive group be ethylene glycol ethyl ether.
4. rigid-flexible combined printed wiring board through hole according to claim 1 bores dirty cleaning method; It is characterized in that; Polyimides sweller described in said first kind of decontamination liquid is a kind of organic substance identical with the polyimides active group that contain, to come the swelling polyimides through the similar compatibility principle.
5. rigid-flexible combined printed wiring board through hole according to claim 4 bores dirty cleaning method, it is characterized in that, said to contain the organic substance identical with the polyimides active group be diamine or buzane.
6. rigid-flexible combined printed wiring board through hole according to claim 1 bores dirty cleaning method; It is characterized in that; Solubilizer is a kind of hydrophilic pure type organic described in said first kind of decontamination liquid, can improve epoxy resin sweller or the solubility of polyimides sweller in the aqueous solution.
7. rigid-flexible combined printed wiring board through hole according to claim 6 bores dirty cleaning method, it is characterized in that said hydrophilic pure type organic is a butanediol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110386278 CN102438405B (en) | 2011-11-29 | 2011-11-29 | Method for cleaning through hole smears of rigid-flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110386278 CN102438405B (en) | 2011-11-29 | 2011-11-29 | Method for cleaning through hole smears of rigid-flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102438405A true CN102438405A (en) | 2012-05-02 |
| CN102438405B CN102438405B (en) | 2013-08-14 |
Family
ID=45986200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110386278 Expired - Fee Related CN102438405B (en) | 2011-11-29 | 2011-11-29 | Method for cleaning through hole smears of rigid-flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102438405B (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103298269A (en) * | 2013-05-13 | 2013-09-11 | 广东生益科技股份有限公司 | Method for manufacturing PCB (printed circuit board) |
| CN104093279A (en) * | 2014-07-16 | 2014-10-08 | 电子科技大学 | Printed-circuit board manufacturing method based on laser groove machining technology |
| CN104470237A (en) * | 2014-11-25 | 2015-03-25 | 镇江华印电路板有限公司 | Drill dirt removing method for rigid-flexible combined board |
| CN107734870A (en) * | 2017-09-26 | 2018-02-23 | 深圳明阳电路科技股份有限公司 | A kind of rigid-flex combined board is except the method for boring dirt |
| CN109219262A (en) * | 2018-09-13 | 2019-01-15 | 镇江华印电路板有限公司 | A kind of efficient Rigid Flex is except boring dirty method |
| CN109323948A (en) * | 2018-08-15 | 2019-02-12 | 深圳崇达多层线路板有限公司 | A kind of testing mould and test method that can be improved except glue uniformity and efficiency |
| CN111499915A (en) * | 2019-12-30 | 2020-08-07 | 瑞声科技(新加坡)有限公司 | Surface treatment method of L CP film |
| CN113174591A (en) * | 2021-03-20 | 2021-07-27 | 福建闽威科技股份有限公司 | Pretreatment process and treatment equipment for electroless copper plating of double-sided printed circuit board |
| CN113814224A (en) * | 2021-08-23 | 2021-12-21 | 中国电子科技集团公司第十五研究所 | Printed board hole wall drilling dirt treatment method |
| WO2022093956A1 (en) * | 2020-10-30 | 2022-05-05 | Postprocess Technologies, Inc. | Compositions for removing resin and ceramic from a surface of an object and methods of using such compositions |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5261967A (en) * | 1991-07-17 | 1993-11-16 | Church & Dwight Co, Inc. | Powdered electric circuit assembly cleaner |
| JPH06350229A (en) * | 1993-06-08 | 1994-12-22 | Sumitomo Bakelite Co Ltd | Cleaning method of printed circuit board |
| CN1248881A (en) * | 1998-09-21 | 2000-03-29 | 电化学公司 | Permanganate dirt-removing method for printed-circuit board |
| CN101113388A (en) * | 2006-07-28 | 2008-01-30 | 比亚迪股份有限公司 | Black-hole carbon powder cleaning agent composition and cleaning method thereof |
| CN101736328A (en) * | 2009-12-14 | 2010-06-16 | 安捷利（番禺）电子实业有限公司 | Pretreatment solution and process of electroless copper plating of flexible printed circuit board |
| CN102120828A (en) * | 2011-03-18 | 2011-07-13 | 常州大学 | Swelling solution for removing through-hole residues of epoxy resin circuit board |
-
2011
- 2011-11-29 CN CN 201110386278 patent/CN102438405B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5261967A (en) * | 1991-07-17 | 1993-11-16 | Church & Dwight Co, Inc. | Powdered electric circuit assembly cleaner |
| JPH06350229A (en) * | 1993-06-08 | 1994-12-22 | Sumitomo Bakelite Co Ltd | Cleaning method of printed circuit board |
| CN1248881A (en) * | 1998-09-21 | 2000-03-29 | 电化学公司 | Permanganate dirt-removing method for printed-circuit board |
| CN101113388A (en) * | 2006-07-28 | 2008-01-30 | 比亚迪股份有限公司 | Black-hole carbon powder cleaning agent composition and cleaning method thereof |
| CN101736328A (en) * | 2009-12-14 | 2010-06-16 | 安捷利（番禺）电子实业有限公司 | Pretreatment solution and process of electroless copper plating of flexible printed circuit board |
| CN102120828A (en) * | 2011-03-18 | 2011-07-13 | 常州大学 | Swelling solution for removing through-hole residues of epoxy resin circuit board |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103298269A (en) * | 2013-05-13 | 2013-09-11 | 广东生益科技股份有限公司 | Method for manufacturing PCB (printed circuit board) |
| CN103298269B (en) * | 2013-05-13 | 2016-03-09 | 广东生益科技股份有限公司 | A kind of manufacture method of pcb board |
| CN104093279A (en) * | 2014-07-16 | 2014-10-08 | 电子科技大学 | Printed-circuit board manufacturing method based on laser groove machining technology |
| CN104470237A (en) * | 2014-11-25 | 2015-03-25 | 镇江华印电路板有限公司 | Drill dirt removing method for rigid-flexible combined board |
| CN107734870A (en) * | 2017-09-26 | 2018-02-23 | 深圳明阳电路科技股份有限公司 | A kind of rigid-flex combined board is except the method for boring dirt |
| CN109323948A (en) * | 2018-08-15 | 2019-02-12 | 深圳崇达多层线路板有限公司 | A kind of testing mould and test method that can be improved except glue uniformity and efficiency |
| CN109219262A (en) * | 2018-09-13 | 2019-01-15 | 镇江华印电路板有限公司 | A kind of efficient Rigid Flex is except boring dirty method |
| CN111499915A (en) * | 2019-12-30 | 2020-08-07 | 瑞声科技(新加坡)有限公司 | Surface treatment method of L CP film |
| WO2022093956A1 (en) * | 2020-10-30 | 2022-05-05 | Postprocess Technologies, Inc. | Compositions for removing resin and ceramic from a surface of an object and methods of using such compositions |
| CN113174591A (en) * | 2021-03-20 | 2021-07-27 | 福建闽威科技股份有限公司 | Pretreatment process and treatment equipment for electroless copper plating of double-sided printed circuit board |
| CN113174591B (en) * | 2021-03-20 | 2023-02-07 | 福建闽威科技股份有限公司 | Pretreatment process and treatment equipment for electroless copper plating of double-sided printed circuit board |
| CN113814224A (en) * | 2021-08-23 | 2021-12-21 | 中国电子科技集团公司第十五研究所 | Printed board hole wall drilling dirt treatment method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102438405B (en) | 2013-08-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102438405B (en) | Method for cleaning through hole smears of rigid-flexible printed circuit board | |
| CN202752272U (en) | Device capable of cleaning glue refuse in drill hole of printed circuit board (PCB) | |
| CN101466207B (en) | Circuit board and preparation method thereof | |
| US7140103B2 (en) | Process for the production of high-density printed wiring board | |
| CN104838731B (en) | The manufacture method of printed circuit board (PCB) and the printed circuit board (PCB) produced using the manufacture method | |
| KR102315267B1 (en) | Method of forming a metal layer and method of manufacturing a substrate having such metal layer | |
| CN101547569A (en) | Technology for processing semi-hole of PCB board | |
| JP2012151176A (en) | Printed wiring board using aluminum as conductive pattern and manufacturing method thereof | |
| JP2005322868A (en) | Method for electrolytic gold plating of printed circuit board | |
| CN104661450B (en) | A kind of method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN | |
| CN105682382B (en) | It is a kind of containing whether there is or not the Rigid Flex of the high glass transition temperature of copper base layer and its remove adhesive process | |
| CN101442885B (en) | Method for preparing circuit board guide hole | |
| CN103167747B (en) | A kind of preparation method of printed circuit board (PCB) | |
| CN114190011B (en) | High-heat-dissipation PCB and manufacturing process thereof | |
| CN102821558B (en) | A kind of method for metallising of printed circuit board blind hole | |
| JP5794740B2 (en) | Printed wiring board manufacturing method and printed wiring board obtained by using the printed wiring board manufacturing method | |
| CN208657182U (en) | A kind of black holes line apparatus | |
| JP2002043753A (en) | Manufacturing method of multilayer printed circuit board | |
| CN105282989A (en) | Manufacturing method of windowed rigid-flex PCB | |
| CN110446349B (en) | Method for processing through hole of core plate layer by copper plating and hole filling | |
| CN105682379A (en) | Process for rapidly fabricating multi-layer circuit board | |
| CN111531412A (en) | Polishing process of N-Si substrate | |
| US6454954B1 (en) | Desmear etchant and use thereof | |
| JP5001368B2 (en) | Wiring board and manufacturing method thereof | |
| KR100632579B1 (en) | How to Form Via Holes in Printed Circuit Boards |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130814 Termination date: 20141129 |
|
| EXPY | Termination of patent right or utility model |