CN103339724B - 功率半导体模块 - Google Patents

功率半导体模块 Download PDF

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Publication number
CN103339724B
CN103339724B CN201180065986.5A CN201180065986A CN103339724B CN 103339724 B CN103339724 B CN 103339724B CN 201180065986 A CN201180065986 A CN 201180065986A CN 103339724 B CN103339724 B CN 103339724B
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Prior art keywords
resin
power semiconductor
battery lead
lead plate
encapsulated
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CN103339724A (zh
Inventor
浅田晋助
长尾健二郎
中岛泰
渡边雄悦
浅尾淑人
大贺琢也
加藤政纪
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Abstract

功率半导体模块(100)包括：电极板(2)，该电极板(2)一体形成有主体部(2a)与外部连接端子部(2b)，并且主体部(2a)配置在同一平面上；半导体元件(1)，该半导体元件(1)配置在主体部(2a)的一个面(装载面)(2c)上；以及树脂封装(3)，该树脂封装(3)将主体部(2a)的另一个面(散热面)(2d)露出，并利用树脂对电极板(2)的主体部(2a)及半导体元件(1)进行密封，该散热面(2d)与树脂封装(3)的底面(3a)形成同一平面。由此，能够提高散热性及可靠性，并能实现小型化。

Description

功率半导体模块
技术领域
本发明涉及一种功率半导体模块，尤其涉及一种安装在汽车用的旋转电气设备上来使用的、例如构成用于汽车用电动力转向***用旋转电气设备的逆变器电路、继电器电路的功率半导体模块。
背景技术
一般来说，车辆用的逆变器电路、继电器电路所使用的功率半导体模块中有大电流流过，且发出的热量较大，因此在确保电绝缘性的同时，还需要散热方案。
因此，在已有的专利文献1的半导体装置中，多块导电性的散热基板上直接配置有半导体元件，这些半导体元件与和半导体元件进行电连接的多个外部连接电极一起通过传递模塑成形、从而一体形成在树脂封装内部(例如参照专利文献1)。这里，使与配置有多块散热基板的半导体元件的一面相反的一面侧的树脂封装较薄，从而使得由半导体元件发出的热量通过散热基板后，再通过较薄的树脂封装，将热释放到安装在功率半导体模块外部的散热器等。此外，功率半导体模块与散热器通过具有散热性的绝缘粘接剂等而相接合。
现有技术文献
专利文献
专利文献1：日本专利特开2003-7966号公报
发明内容
发明所要解决的技术问题
然而，在专利文献1的半导体装置中，多个外部连接端子与散热基板均为单独准备后，通过焊接等使其相接合，因此将使得半导体装置增加多余的面积、即进行接合所需的面积，另外，由半导体元件发出的热通过散热基板后，再通过热传导性较低的树脂封装，因此在散热性方面较为不利，从而需要增大散热基板的面积以确保散热性能，这点将使得半导体装置难以小型化，由此，产生问题。
本发明为了解决上述问题而得以完成，提供一种散热性良好、能够实现小型化、且可靠性较高的功率半导体模块。
解决技术问题所采用的技术方案
为了解决上述问题，在本发明的权利要求1所涉及的功率半导体模块对半导体元件进行了树脂密封，包括：多个电极板，该多个电极板一体形成有外部连接端子部与主体部，并且所述主体部配置在同一平面上；半导体元件，该半导体元件配置在所述电极板的主体部的一个面上；以及树脂封装，该树脂封装至少将所述电极板的主体部的另一个面的一部分露出，并对所述电极板的主体部及所述半导体元件进行树脂密封。
另外，在权利要求2所涉及的功率半导体模块中，所述外部连接端子部的宽度比所述电极板的主体部的宽度要窄。
另外，权利要求3所涉及的功率半导体模块中，所述电极板的主体部的露出面与该面一侧上的所述树脂封装的底面形成同一平面，所述外部连接端子部的根部周围、除了与所述电极板的主体部的露出面处于同一平面的部分以外、被树脂覆盖。
另外，在权利要求4所涉及的功率半导体模块中，所述电极板的主体部上设有贯通孔，所述贯通孔的孔内也填充有所述树脂封装的树脂。
另外，在权利要求5所述的功率半导体模块中，所述电极板的主体部的露出面与该面一侧上的所述树脂封装的底面的、除该底面的边缘部以外的部分形成同一平面，所述树脂封装的底面的外边缘部上连续或间断地形成有树脂突出部，所述外部连接端子部的根部贯穿所述树脂突出部。
另外，在权利要求6所涉及的功率半导体模块中，所述电极板的主体部上设有贯通孔，所述贯通孔的孔内也填充有所述树脂封装的树脂，并且所述贯通孔的至少一部分设置于埋设所述树脂突出部的树脂的部分。
另外，在权利要求7所涉及的功率半导体模块中，所述电极板的主体部的一部分上形成有在所述半导体元件的装载面侧弯曲的爪部。
另外，在权利要求8所涉及的功率半导体模块中，所述电极板的主体部的露出面一侧的边缘部的至少一部分上设有被切割成段状的缺口部，所述缺口部中填充有所述树脂封装的树脂。
另外，权利要求9所涉及的功率半导体模块被安装于汽车用的旋转电气设备中。
发明效果
根据本发明的功率半导体模块，一体形成有外部连接端子部与主体面的多个电极板上配置有半导体元件，通过使露出的电极板的半导体元件的非装载面直接与外部散热单元接触，从而能提高散热性及可靠性，并实现小型化。
另外，本发明的功率半导体模块能小型化，因此能对需要被装载在有限空间内的汽车的旋转电气设备的小型化作出贡献。另外，因密接性有所提高，因此即使伴随使用过程中的行驶、旋转而产生的振动、从而产生使外部连接端子部与树脂封装发生剥离的力，也能抑制故障的发生。
附图说明
图1是表示本发明的实施方式1所涉及的功率半导体模块的结构的立体图。
图2是从底面观察图1的功率半导体模块的结构的立体图。
图3是图2的功率半导体模块的AA部剖视图。
图4是表示本发明的实施方式1所涉及的功率半导体模块的变形例1的结构的剖视图。
图5是表示本发明的实施方式2所涉及的功率半导体模块的结构的立体图。
图6是图5的功率半导体模块的AA部剖视图。
图7是表示本发明的实施方式2所涉及的功率半导体模块的变形例1的结构的立体图。
图8是表示本发明的实施方式2所涉及的功率半导体模块的变形例2的结构的立体图。
图9是图7及图8的功率半导体模块的剖视图。
图10是表示本发明的实施方式2所涉及的功率半导体模块的变形例3的结构的剖视图。
图11是表示本发明的实施方式3所涉及的功率半导体模块的结构的立体图。
图12是表示本发明的实施方式4所涉及的功率半导体模块的结构的剖视图。
具体实施方式
下面，参照图1～图12对本发明的实施方式所涉及的功率半导体模块进行说明。此外，本发明中的功率半导体模块未对内部的电路结构进行限定，在以下实施方式中，以具有使用了MOSFET(MetalOxideSemiconductorFieldEffectTransistor：金属氧化物半导体场效应晶体管)的继电器电路的功率半导体模块为例进行说明。
实施方式1
图1是表示本发明的实施方式1所涉及的功率半导体模块的结构的立体图，图2是从底面观察该功率半导体模块的结构的立体图。另外，图3是图2的功率半导体模块的AA部剖视图。此外，图4是表示实施方式1所涉及的功率半导体模块的变形例1的结构的剖视图。
如图1、图2以及图3所示，功率半导体模块100包括：电极板2，该电极板2一体成形有主体部2a以及外部连接端子部2b，并且主体部2a配置在同一平面上；半导体元件1，该半导体元件1配置在主体部2a的一个面(装载面)2c上；以及树脂封装3，该树脂封装3使主体部2a的另一个面(散热面)2d露出，并利用树脂对电极板2的主体部2a及半导体元件1进行密封，外部连接端子部2b的宽度比电极板2的主体部2a的宽度要窄，散热面2d、该散热面2d一侧的树脂封装3的底面3a形成同一平面，外部连接端子部2b的根部2e周围、除了与散热面2d处于同一平面的部分以外被树脂覆盖。
接下来，对实施方式1所涉及的功率半导体模块的结构的细节及效果进行说明。MOSFET芯片即半导体元件1在一个面上具有源极电极1a以及栅极电极1b，而在反面具有漏极电极。半导体元件1的漏极电极与电极板2的装载面2c通过焊料或导电性粘接剂等导电性连接构件(未图示)来进行机械性、电气性连接。电极板2例如由铜合金等热传导性及导电性良好的金属构成，可以适当地对其整个表面或一部分实施镀锡处理或镀镍处理等。
2个半导体元件1的各自的源极电极1a之间通过引线5a进行电连接。引线5a通过焊料等连接构件(未图示)与源极电极1a相连。另外，引线5a的中间部通过焊料等连接构件来与未装载有半导体元件1的电极板2相连。同样的，栅极电极1b之间也连接有引线5b，其中间部也与不同于引线5a的其它电极板2进行电连接。此外，也可以不使用引线5，而利用铝线等来进行连接。在使用铝线的情况下，可以使用公知的引线接合法，根据容许电流恰当地选择铝线的直径、根数以及线径。
如图1及图2所示，树脂封装3通过环氧树脂等对半导体元件1、电极板2以及引线5进行密封。通过利用公知的传递成型法，将半导体元件1、电极板2以及引线5作为***构件一体成形，从而形成树脂封装3。
虽然半导体元件1及引线5完全被树脂封装3覆盖，但电极板2的外部连接端子部2b除了根部2e以外均被引出到树脂封装3的外部。外部连接端子部2b在这里为了与外部设备相连，而呈弯曲状。作为连接方法，可列举出各种熔接法或焊接、通过螺栓来进行接合等方法。
如图2及图3所示，装载有半导体元件1的电极板2的装载面2c的相反面2d从树脂封装3露出，并形成散热面2d。
此外，外部连接端子部2b笔直地从树脂封装3中引出。即，外部连接端子部2b在与散热面2d的同一平面上从树脂封装3引出，因此外部连接端子部2b的根部2e处于仅与散热面2d的同一面从树脂封装3露出的状态，装载有半导体元件1的装载面2c及2个侧面、共计3个面被树脂封装3的树脂覆盖。外部连接端子部2b的侧面是通过冲压加工或蚀刻加工来制造电极板2时形成的面，因此实际上，并非是像图1、图2以及图3所示的理想平面，有时会由于脱落剥离等使得无法明显区分电极板2的装载面2c、底面的散热面2d的面。然而，即使在该情况下，如果侧面部的大半部分被树脂封装3的树脂覆盖，则也不会有问题。
另外，引出到树脂封装3外部的外部连接端子部2b的宽度w1比埋设在树脂封装3中的主体部2a(装载面2c、散热面2d)的宽度w2要窄。因此，即使在外部连接端子部2b与外部设备的端子相接合时被拉伸，较窄的部位也会被勾住，因而能防止剥落。
图4是表示实施方式1所涉及的功率半导体模块的变形例1的结构的剖视图。在图4的功率半导体模块110中，被树脂封装3覆盖的电极板2的主体部2a在板厚方向上形成有贯通孔10。另外，在贯通孔10的内部也埋入了树脂封装3的树脂。对于贯通孔10的配置部位及个数未作特别指定，但优选为设置在外部连接端子部2b的根部2e附近。
通过在贯通孔10中埋入树脂，从而能增强电极板2对树脂封装3的吸附。由此，即使万一在外部连接端子部2b的根部2e出现剥离，所吸附的部分也将起到固定的作用，从而能防止电极板2进一步剥离，由此能防止内部元器件受损。
由此，在实施方式1的功率半导体模块中，外部连接端子部与散热部(主体部)由同一电极板构成，因此与单独准备然后相接合的情况相比，能够减小用于接合的面积，另外，由于散热板从树脂封装露出，因此由半导体元件发出的热量能够不经过热传导性较低的树脂部而直接释放到外部，从而具有能够获得小型且散热性较优的显著效果。
此外，外部连接端子部的根部周围的三个面被树脂封装的树脂覆盖，因此与仅利用树脂覆盖一个面的情况相比，能够在电极板与树脂封装之间得到较高的密接性。在将功率半导体模块安装到外部设备的步骤中，在通过熔接或螺钉旋拧等方法来将外部连接端子部与外部设备的端子相接合时，由于夹着外部连接端子部及外部设备端子，使得电极板与树脂封装容易在外部连接端子部的根部因为该夹持负荷而剥离。如果根部处与树脂封装之间具有较强的密接性，则能防止剥离。其结果是，能够防止水从剥离部位渗入导致内部的半导体元件的电极等受到腐蚀，并且还能防止进一步剥离使得半导体元件、引线、连接构件等内部元器件受损，因此能够得到一种可靠性较高的功率半导体模块。
另外，外部连接端子部通过从主体部开始宽度变窄来向树脂封装的外部引出，从而使得较窄的部位在上述夹持负荷下被勾住，因此能进一步提高防止剥离的效果。
实施方式2
图5是表示实施方式2所涉及的功率半导体模块的结构的立体图，图6是该功率半导体模块的AA部剖视图。另外，图7是表示实施方式2所涉及的功率半导体模块的变形例1的结构的立体图。另外，图8是表示实施方式2所涉及的功率半导体模块的变形例2的结构的立体图。另外，图9是图7及图8的功率半导体模块的剖视图。此外，图10是表示实施方式2所涉及的功率半导体模块的变形例3的结构的剖视图。
如图5及图6所示，在实施方式2所涉及的功率半导体模块中，与图1及图2所示的实施方式1的功率半导体模块的不同点在于，在电极板2的露出面2d一侧的树脂封装3的底面3a的外缘部设有树脂突出部6，并且外部连接端子部2b的根部2e贯穿树脂突出部6，其它结构要素与实施方式1相同，省略说明。
接下来，对实施方式2所涉及的功率半导体模块的结构的细节及效果进行说明。如图5及图6的功率半导体模块200所示，树脂突出部6沿着树脂封装3的外缘部形成，并覆盖外部连接端子部2b的根部2e。树脂突出部6的宽度d未作特别指定，但优选为如图5所示那样，树脂突出部6的一部分覆盖电极板2的散热面2d的端部。由此，外部连接端子部2b的根部2e以及电极板2的散热面2d的端部的一部分被树脂封装3的树脂覆盖，从而能防止电极板2从树脂封装3剥离。
图7中示出了实施方式2所涉及的功率半导体模块的变形例1的结构的立体图。另外，图8中示出了实施方式2所涉及的功率半导体模块的变形例2的结构的立体图。在图7的功率半导体模块300中，沿着树脂封装3的外缘部，断续地设有多个树脂突出部6，以包围散热面2d。此外，在图8的功率半导体模块400中，沿着树脂封装3的外缘部，环形地设有树脂突出部6，以包围散热面2d。
在上述实施方式2的功率半导体模块200、300、400中，树脂突出部6相对于由电极板2构成的散热面2d突出。因此，如图5及图7的实施方式2所涉及的功率半导体模块及其变形例1的剖视图(图9)所示，在安装于功率半导体模块300、400的散热器7上，需要使通过散热中间构件9与散热面2d相连接的面提高。若采用图7及图8的变形例1以及变形例2的结构，则设置成包围散热面2d的树脂突出部6与散热器7的凸部8相嵌，因此在安装散热器7时，不会发生前后左右的偏移，并且在使用过程中，也无需特意顾虑因发生振动等而产生偏移。由此，能够通过散热中间构件9可靠地使散热面2d与散热器7相抵接，从而能确保散热性。
图10示出了实施方式2所涉及的功率半导体模块的变形例3的结构的剖视图。在将散热器安装到图10的功率半导体模块500时，被树脂封装3覆盖的电极板2的主体部2a在板厚方向上形成有贯通孔10。另外，在贯通孔10的内部也埋入了树脂封装3的树脂。对于贯通孔10的配置部位及个数未作特别指定，但优选为设置在外部连接端子部2b的根部2e附近。此外，优选为，将所有贯通孔10或部分贯通孔10设置在被树脂突出部6覆盖的部位。
通过在贯通孔10中埋入树脂，从而能增强电极板2对树脂封装3的吸附。由此，即使万一外部连接端子部2b的根部2e出现剥离，所吸附的部分也将起到固定的作用，从而能防止电极板2进一步剥离，由此能防止内部元器件受损。
另外，通过将贯通孔10设置在树脂突出部6的位置，使得贯通孔10起到传递模塑时的树脂封装3的树脂流入通路的作用。由此，使得树脂封装3对于树脂突出部6的填充性较为良好。如图5所示，树脂突出部6呈细长形，另外，其大部分通过电极板2的主体部2a而与其它部分分隔开。因此，在进行传递模塑时，树脂封装3的树脂难以从电极板2的半导体元件1一侧填充至树脂突出部6为止。其结果是，树脂突出部6的形状可能会不完整。另外，即使形状不完整也在树脂固化反应之后进行填充，因而将产生树脂封装3与电极板2的主体部2a的密接性变差的问题。通过设置贯通孔10、以增加树脂的流入通路，能够使得树脂对于树脂突出部6的填充性变得良好，从而能解决上述问题。
此外，在图10的功率半导体模块500中、在散热面2d的缝隙间设有由与树脂封装3相同的树脂构成的间隔件11。间隔件11的高度设定为散热中间构件9的厚度。由此，在将功率半导体模块500安装到散热器7时，能对散热中间构件9的厚度进行管理，并能防止散热中间构件9过薄、使得散热面2d与散热器7相接触、从而产生电短路的不良的发生。此外，如图7所示，如果间断地设置树脂突出部6，则即使涂布了过多的散热中间构件9，也能从树脂突出部6的间隙处将多余的部分排出。由此使得涂布量的管理也变得容易，较为有利。
由此，在实施方式2的功率半导体模块中，通过在外部连接端子部的根部周围利用树脂封装的树脂将其覆盖，从而在实施方式1的功率半导体模块所得到的小型化及提高散热性的效果之上，还能提高外部连接端子部的根部与树脂封装的密接性，因此不容易产生电极板的剥离，并能进一步减少伴随着剥离而产生的半导体元件的电极的腐蚀、半导体元件等内部元器件受损，产生显著效果。
实施方式3
图11是表示实施方式3所涉及的功率半导体模块的结构的立体图。
如图11所示，在实施方式3所涉及的功率半导体模块中，与图1及图2所示的实施方式1的功率半导体模块的不同点在于，在电极板2的边缘部的一部分上设有爪部2f，该爪部2f在半导体元件1的装载面2d一侧弯曲而得以形成，其它结构要素与实施方式1相同，省略说明。
接下来，对实施方式3的功率半导体模块的结构及效果进行说明。如图11所示，这里在配置有半导体元件1的2块最外部的电极板2的边缘部的一部分上形成有爪部2f，该爪部2f在半导体元件1的装载面2d一侧弯曲。对于爪部2f的弯曲形状、个数、配置等未作特别指定，关于配置，优选为，设置在外部连接端子部2b的根部2e附近。通过设置爪部2f，能使电极板2与树脂封装3吸附，从而提高密接性，因此能进一步提高抑制剥离产生、拉伸的效果，从而能得到可靠性较高的功率半导体模块。
由此，在实施方式3所涉及的功率半导体模块中，通过在电极板的边缘部的一部分设置在半导体元件的装载面一侧弯曲的爪部，从而在实施方式1的功率半导体模块所得到的小型化及提高散热性的效果之上，还能使电极板与树脂封装吸附得更牢，提高密接性，因此，电极板不容易剥离，从而能够抑制剥离的产生、拉伸，能进一步提高可靠性，产生显著效果。
实施方式4
图12是表示实施方式4所涉及的功率半导体模块的结构的剖视图。本实施方式与图1及图2所示的实施方式1的功率半导体模块的不同点在于，至少在多个电极板的露出面一侧的边缘部的一部分处设置有被切割成段状的缺口部，其它结构要素与实施方式1相同，因此省略说明。
接下来，对实施方式4的功率半导体模块的结构及效果进行说明。如图12所示，在电极板2的散热面2d一侧的边缘部的一部分或整个边缘部处设有被切割成段状的缺口部2g，切口部2g中填充有树脂封装3的树脂。由此，电极板2的散热面2d一侧的边缘部的前端部被埋设于树脂封装3内，使得电极板2与树脂封装3的密接性得以提高。
另外，电极板2的缺口部2g的反面一侧的装载有半导体元件1的表面上，除了在利用冲压加工形成缺口部2g时产生的稍许***以外，几乎呈现为平坦状。因此，使得安装半导体元件1等内部元器件的制造工序变得容易。例如，在将焊料糊料用作为半导体元件1的连接构件、并利用丝网印刷法来提供的步骤中，由于电极板2的半导体元件1的装载面呈平坦状，因此能够使丝网掩模与装载面密接，使得对焊料糊料的印刷厚度进行管理变得容易。
由此，在实施方式4所涉及的功率半导体模块中，通过在电极板的散热面一侧的边缘部的一部分或整个边缘部处设置被切割成段状的缺口部，从而在实施方式1的功率半导体模块所得到的小型化及提高散热性的效果之上，还能通过设置段状的缺口部来使电极板的边缘部的前端部埋设于树脂封装内，从而进一步提高电极板与树脂封装的密接性，进一步提高抑制剥离的效果，产生显著效果。
此外，上述实施方式中的说明仅为本发明的实施方式的示例，也可以在本发明思想的基础上作适当改变，或将上述实施方式相组合。
另外，在上述实施方式中，将使用了MOSFET元件的继电器电路用作为半导体元件，但也可以是具有其它电路功能的功率半导体模块。例如，可以是用于三相旋转机的三相桥式逆变器电路，也可以是构成逆变器电路的一部分的功率半导体模块。
另外，在上述实施方式中，半导体元件并不限于功率MOSFET元件，也可以是IGBT(InsulatedGateBipolarTransistor：绝缘栅双极晶体管)元件等功率半导体元件。
另外，在上述实施方式中，对作为模塑在功率半导体模块的树脂封装中的电子元件、对半导体元件进行模塑的情况进行了说明，但并不局限于半导体元件，也可以将芯片型的电容器、电阻一起模塑在树脂封装中。
另外，上述实施方式中说明的功率半导体模块适用于将其安装到汽车用的旋转电气设备中来使用。上述实施方式的功率半导体模块实现了小型化，因此有助于装载在像汽车这样有限空间内的旋转电气设备的小型化。另外，这是因为，由于密接性有所提高，因此即使由于使用过程中的行驶或旋转而产生的振动、从而产生使外部连接端子部与树脂封装发生剥离的力，也能减少因这种力而发生的不良。
另外，在图中，同一标号表示相同或相当部分。
标号说明
100,110,200,300,400,500,600,700功率半导体模块
1半导体元件
2电极板
2a主体部
2b外部连接端子部
2c装载面
2d散热面(露出面)
2e根部
2f爪部
2g缺口部
3树脂封装
5,5a,5b引线
6树脂突出部
10贯通孔
11间隔件

Claims (8)

1.一种功率半导体模块，对半导体元件进行了树脂密封，包括：
多个电极板，该多个电极板一体形成有外部连接端子部与主体部，并且所述主体部配置在同一平面上；
多个半导体元件，该多个半导体元件配置在所述电极板的主体部的一个面上；以及
树脂封装，该树脂封装至少将所述电极板的主体部的另一个面的一部分露出，并对所述电极板的主体部及所述多个半导体元件进行树脂密封，
所述电极板的主体部的露出面与该面一侧上的所述树脂封装的底面上除该底面的外缘部以外的部分形成在同一平面上，
在所述树脂封装的底面的外缘部上至少形成有将所述外部连接端子部的根部四周覆盖的树脂突出部，
所述外部连接端子部沿着同一平面向所述树脂封装的外侧延伸。
2.如权利要求1所述的功率半导体模块，其特征在于，
所述外部连接端子部的宽度比所述电极板的主体部的宽度要窄。
3.如权利要求1所述的功率半导体模块，其特征在于，
所述电极板的主体部上设有贯通孔，所述贯通孔的孔内也填充有所述树脂封装的树脂。
4.如权利要求1所述的功率半导体模块，其特征在于，
所述树脂突出部连续或间断地形成。
5.如权利要求3所述的功率半导体模块，其特征在于，
所述贯通孔的至少一部分设置于埋设所述树脂突出部的树脂的部分。
6.如权利要求1所述的功率半导体模块，其特征在于，
所述电极板的主体部的一部分上形成有在所述多个半导体元件的装载面侧弯曲的爪部。
7.如权利要求1所述的功率半导体模块，其特征在于，
所述电极板的主体部的露出面一侧的边缘部的至少一部分上设有被切割成段状的缺口部，所述缺口部中填充有所述树脂封装的树脂。
8.如权利要求1至7中任一项所述的功率半导体模块，其特征在于，
所述功率半导体模块被安装于汽车用的旋转电气设备中。
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