JP6510146B1 - 電子モジュール - Google Patents
電子モジュール Download PDFInfo
- Publication number
- JP6510146B1 JP6510146B1 JP2018522160A JP2018522160A JP6510146B1 JP 6510146 B1 JP6510146 B1 JP 6510146B1 JP 2018522160 A JP2018522160 A JP 2018522160A JP 2018522160 A JP2018522160 A JP 2018522160A JP 6510146 B1 JP6510146 B1 JP 6510146B1
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- JP
- Japan
- Prior art keywords
- back surface
- exposed
- connector
- surface exposed
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004020 conductor Substances 0.000 claims abstract description 146
- 238000007789 sealing Methods 0.000 claims abstract description 72
- 230000002093 peripheral effect Effects 0.000 claims description 26
- 238000003780 insertion Methods 0.000 claims description 11
- 230000037431 insertion Effects 0.000 claims description 11
- 238000003825 pressing Methods 0.000 description 66
- 229920005989 resin Polymers 0.000 description 18
- 239000011347 resin Substances 0.000 description 18
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 11
- 238000005452 bending Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 230000009286 beneficial effect Effects 0.000 description 6
- 230000007547 defect Effects 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 230000020169 heat generation Effects 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
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Abstract
Description
本発明による電子モジュールは、
封止部と、
裏面が露出する裏面露出部を有する裏面露出導体と、
裏面が露出しない裏面非露出導体と、
前記封止部内に設けられ、前記裏面露出導体のおもて面に設けられた電子素子と、
前記電子素子を前記裏面露出導体に電気的に接続するための第一接続子と、
前記電子素子を前記裏面非露出導体に電気的に接続するための第二接続子と、
を備え、
前記第一接続子の厚みが前記第二接続子の厚みよりも厚くなってもよい。
本発明の概念1による電子モジュールにおいて、
前記裏面露出導体及び前記裏面非露出導体の厚みよりも第一接続子の厚みは薄くなってもよい。
本発明の概念1又は2による電子モジュールにおいて、
前記第一接続子の厚みは前記第二接続子の厚みの1.2倍以上1.5倍以下となってもよい。
本発明の概念1乃至3のいずれか1つによる電子モジュールにおいて、
前記第一接続子は第一接続基端部及び第一接続先端部を有し、
前記第一接続基端部及び前記第一接続先端部の各々には第一穴部が設けられてもよい。
本発明の概念1乃至4のいずれか1つによる電子モジュールにおいて、
前記第二接続子は第二接続基端部及び第二接続先端部を有し、
前記第二接続基端部の幅は前記第二接続先端部の幅よりも大きくてもよい。
本発明の概念5による電子モジュールにおいて、
前記第二接続基端部に第二穴部が設けられ、第二接続先端部に穴部が設けられていなくてもよい。
本発明の概念1乃至6のいずれか1つによる電子モジュールにおいて、
前記裏面露出導体は、前記封止部の側面から外方に突出する端子部と、前記裏面露出部と前記端子部との間に設けられ、裏面が露出しない連結部を有し、
前記連結部の厚みは、前記裏面露出部の厚み及び前記端子部の厚みよりも薄くなっていてもよい。
本発明の概念1乃至7のいずれか1つによる電子モジュールは、
前記封止部の周縁部に設けられ、締結部材を挿入するための締結部材挿入部をさらに備え、
前記裏面露出導体が、周縁裏面露出導体と、前記周縁裏面露出導体よりも前記締結部材挿入部から離れた位置に設けられた内方裏面露出導体とを有し、
周縁裏面露出導体の裏面露出部の面積が、内方裏面露出導体の裏面露出部の面積よりも小さくなってもよい。
本発明の概念8による電子モジュールにおいて、
一対の締結部材挿入部が設けられ、
前記内方裏面露出導体の前記裏面露出部の面積と比較した、一方側における周縁裏面露出導体の裏面露出部の減少量は、他方側における周縁裏面露出導体の裏面露出部の減少量よりも大きくてもよい。
《構成》
図2に示すように、本実施の形態の電子モジュールは、封止部90(図3参照)と、封止部90の側面から外方に突出する裏面露出側端子部11,21,31と、裏面が露出する裏面露出部12,22,32(図8参照)とを有する裏面露出導体10,20,30と、封止部90の側面から外方に突出する裏面非露出側端子部41,51を有し、裏面が露出しない裏面非露出導体40,50と、封止部90内に設けられ、裏面露出導体10,20,30のおもて面にはんだ等の導電性接着剤190(図1参照)を介して設けられた複数の電子素子15,25と、第一接続子60及び第二接続子70を有する接続子60,70と、を有してもよい。本実施の形態において、電子モジュールの封止部90の裏面側からおもて面側に向かう方向を含む方向を「第一方向」と呼び、第一方向を法線とする平面内の方向(図2の第二方向及び第三方向を含む面内方向)を「面内方向」と呼ぶ。
次に、上述した構成からなる本実施の形態による作用・効果のうち、まだ説明していないものについて説明する。なお、「作用・効果」で説明するあらゆる態様を、上記構成で採用することができる。
次に、本発明の第2の実施の形態について説明する。
次に、本発明の第3の実施の形態について説明する。
次に、本発明の第4の実施の形態について説明する。
11 第一端子部(裏面露出側端子部)
12 第一裏面露出部(裏面露出部)
15 第一電子素子(電子素子)
16 連結部
20 第二裏面露出導体
21 第二端子部(裏面露出側端子部)
22 第二裏面露出部(裏面露出部)
25 第二電子素子(電子素子)
26 連結部
30 第三裏面露出導体
31 第三端子部(裏面露出側端子部)
32 第三裏面露出部(裏面露出部)
36 連結部
40 第一裏面非露出導体(裏面非露出導体)
50 第二裏面非露出導体(裏面非露出導体)
60 第一接続子
61 第一接続基端部
62 第一接続先端部
66 第一穴部
70 第二接続子
71 第二接続基端部
72 第二接続先端部
76 第二穴部
90 封止部
Claims (8)
- 封止部と、
裏面が露出する裏面露出部を有する複数の裏面露出導体と、
裏面が露出しない裏面非露出導体と、
前記封止部内に設けられ、ある裏面露出導体のおもて面に設けられた電子素子と、
前記電子素子を他の裏面露出導体に電気的に接続するための第一接続子と、
前記電子素子を前記裏面非露出導体に電気的に接続するための第二接続子と、
を備え、
前記第一接続子の厚みは前記第二接続子の厚みよりも厚くなっており、
前記第二接続子は第二接続基端部及び第二接続先端部を有し、
前記第二接続基端部の幅は前記第二接続先端部の幅よりも大きくなり、
前記第二接続基端部に第二穴部が設けられ、第二接続先端部に穴部が設けられていないことを特徴とする電子モジュール。 - 封止部と、
裏面が露出する裏面露出部を有する複数の裏面露出導体と、
裏面が露出しない裏面非露出導体と、
前記封止部内に設けられ、ある裏面露出導体のおもて面に設けられた電子素子と、
前記電子素子を他の裏面露出導体に電気的に接続するための第一接続子と、
前記電子素子を前記裏面非露出導体に電気的に接続するための第二接続子と、
を備え、
前記第一接続子の幅は厚みよりも大きくなり、
前記第二接続子の幅は厚みよりも大きくなり、
前記第一接続子の一端は前記裏面露出部のおもて面に設けられ、
前記第一接続子の厚みは前記第二接続子の厚みよりも厚くなっており、
前記裏面露出導体は、前記封止部の側面から外方に突出する端子部と、前記裏面露出部と前記端子部との間に設けられ、裏面が露出しない連結部を有し、
前記連結部の厚みは、前記裏面露出部の厚み及び前記端子部の厚みよりも薄くなっていることを特徴とする電子モジュール。 - 封止部と、
裏面が露出する裏面露出部を有する複数の裏面露出導体と、
裏面が露出しない裏面非露出導体と、
前記封止部内に設けられ、ある裏面露出導体のおもて面に設けられた電子素子と、
前記電子素子を他の裏面露出導体に電気的に接続するための第一接続子と、
前記電子素子を前記裏面非露出導体に電気的に接続するための第二接続子と、
前記封止部の周縁部に設けられ、締結部材を挿入するための締結部材挿入部と、
を備え、
前記第一接続子の厚みは前記第二接続子の厚みよりも厚くなり、
前記裏面露出導体は、周縁裏面露出導体と、前記周縁裏面露出導体よりも前記締結部材挿入部から離れた位置に設けられた内方裏面露出導体とを有し、
周縁裏面露出導体の裏面露出部の面積は、内方裏面露出導体の裏面露出部の面積よりも小さくなっていることを特徴とする電子モジュール。 - 一対の締結部材挿入部が設けられ、
前記内方裏面露出導体の前記裏面露出部の面積と比較した、一方側における周縁裏面露出導体の裏面露出部の減少量は、他方側における周縁裏面露出導体の裏面露出部の減少量よりも大きいことを特徴とする請求項3に記載の電子モジュール。 - 前記裏面露出導体及び前記裏面非露出導体の厚みよりも第一接続子の厚みは薄くなっていることを特徴とする請求項1乃至4のいずれか1項に記載の電子モジュール。
- 前記第一接続子の厚みは前記第二接続子の厚みの1.2倍以上1.5倍以下となっていることを特徴とする請求項1乃至5のいずれか1項に記載の電子モジュール。
- 前記第一接続子は第一接続基端部及び第一接続先端部を有し、
前記第一接続基端部及び前記第一接続先端部の各々には第一穴部が設けられていることを特徴とする請求項1乃至6のいずれか1項に記載の電子モジュール。 - 前記第二接続子は第二接続基端部及び第二接続先端部を有し、
前記第二接続基端部の幅は前記第二接続先端部の幅よりも大きいことを特徴とする請求項2乃至7のいずれか1項に記載の電子モジュール。
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US20210202429A1 (en) | 2021-07-01 |
NL2021880B1 (en) | 2019-09-12 |
US11309274B2 (en) | 2022-04-19 |
JPWO2019092840A1 (ja) | 2019-11-14 |
NL2021880A (en) | 2019-05-15 |
CN111295751A (zh) | 2020-06-16 |
WO2019092840A1 (ja) | 2019-05-16 |
CN111295751B (zh) | 2023-09-15 |
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