CN106231815A - A kind of HDI soft or hard plate hole metallization processes - Google Patents
A kind of HDI soft or hard plate hole metallization processes Download PDFInfo
- Publication number
- CN106231815A CN106231815A CN201610703351.8A CN201610703351A CN106231815A CN 106231815 A CN106231815 A CN 106231815A CN 201610703351 A CN201610703351 A CN 201610703351A CN 106231815 A CN106231815 A CN 106231815A
- Authority
- CN
- China
- Prior art keywords
- hole
- hdi
- soft
- boring
- hard plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
Abstract
The invention discloses a kind of HDI soft or hard plate hole metallization processes, hole including in rigid-flex after laminating, also comprise the steps: pre-whole hole, the surface making the hole wall of boring and rigid-flex is electronegative；Whole hole, uses acid deoiling solution in the hole of boring and the greasy dirt on surface of rigid-flex is cleaned；Kong Hua, the hole wall in boring forms Organic Conductive Films.HDI soft or hard plate hole metallization processes of the present invention, does not produce and has injury to have refuse human body, effectively improves because producing harmful formaldehyde liquid medicine in process of production in heavy process for copper, and simplifies wastewater treatment process.
Description
Technical field
The present invention relates to circuit board technology field, particularly relate to a kind of HDI soft or hard plate hole metallization processes.
Background technology
Electro-coppering is to plate thick layer copper at FPC plate face, hole wall, is further ensured that the reliable and stable of product electric property,
But copper only can be plated on the conductor of energising during plating thickeies, for ensureing that hole wall insulating barrier also can plated with copper, it is necessary to right
Carry out at hole wall dielectric layer process ensure its conduction, otherwise hole wall dielectric layer be cannot plated with copper, the Kong Wutong being commonly called as i.e. occurs
Phenomenon.
HDI Rigid Flex hole metallization processes before is:
Heavy process for copper: last layer conductive copper must be deposited as medium at hole wall with palladium after product removing glue, have an advantage in that work
Skill is ripe, has Rigid Flex technology precipitation for many years.Its deficiency is, produces formaldehyde in production process, can be to health
Generation great damage, and formaldehyde waste water difficult treatment.
Summary of the invention
The technical problem to be solved is to provide a kind of environmental protection and harmless HDI soft or hard plate hole chemical industry
Skill.
In order to solve above-mentioned technical problem, the technical solution used in the present invention is: a kind of HDI soft or hard plate hole metallization processes, bag
Include and hole in rigid-flex after laminating, also comprise the steps:
Pre-whole hole, the surface making the hole wall of boring and rigid-flex is electronegative；
Whole hole, uses acid deoiling solution in the hole of boring and the greasy dirt on surface of rigid-flex is cleaned；
Washing；
Kong Hua, the hole wall in boring forms one layer of Organic Conductive Films.
The beneficial effects of the present invention is: HDI soft or hard plate hole metallization processes of the present invention, in the manufacturing process of hole, make hole wall
And the surface of rigid-flex is electronegative, after whole hole and water-washing step, then the hole wall in boring forms one layer and organic leads
Electrolemma, plays the conducting of interlayer electrical property, and this technical process does not produce has injury to have refuse human body, effectively improves heavy copper
Because producing harmful formaldehyde liquid medicine in process of production in technique, and simplify wastewater treatment process.
Accompanying drawing explanation
Fig. 1 is the process chart of the HDI soft or hard plate hole metallization processes of the embodiment of the present invention；
Fig. 2 is the HDI rigid-flex of embodiment of the present invention structural representation after whole hole；
Fig. 3 is the HDI rigid-flex of embodiment of the present invention structural representation after hole wall forms Organic Conductive Films；
Fig. 4 is the HDI rigid-flex structural representation after plating of the embodiment of the present invention.
Label declaration:
1, outer-layer circuit；2, bonding film；3, internal layer coverlay；4, internal layer soft board；5, blind hole；6, through hole；7, rigid-flex
Land；8, Organic Conductive Films.
Detailed description of the invention
By describing the technology contents of the present invention, structural feature in detail, being realized purpose and effect, below in conjunction with embodiment
And coordinate accompanying drawing to be explained in detail.
The design of most critical of the present invention is: this technique, and the surface first making hole wall and rigid-flex is electronegative, is then boring
One layer of Organic Conductive Films, environmental protection of the present invention and harmless is formed in hole, hole.
Refer to Fig. 1 to Fig. 4, HDI soft or hard plate hole metallization processes of the present invention, hole including in rigid-flex after laminating, also
Comprise the steps:
Pre-whole hole, the surface making the hole wall of boring and rigid-flex is electronegative；
Whole hole, uses acid deoiling solution in the hole of boring and the greasy dirt on surface of rigid-flex is cleaned；
Washing；
Kong Hua, the hole wall in boring forms one layer of Organic Conductive Films.
Knowable to foregoing description, the beneficial effects of the present invention is: HDI soft or hard plate hole metallization processes of the present invention, make in holeization
During work, making the electronegative absorption being beneficial to catalyst in surface of hole wall and rigid-flex, then the hole wall in boring forms one
Layer Organic Conductive Films, plays the conducting of interlayer electrical property, and this technical process does not produce has injury to have refuse human body, effectively changes
It is apt in heavy process for copper because producing harmful formaldehyde liquid medicine in process of production, and has simplified wastewater treatment process.
Further, before carrying out pre-whole hole step, also include removing glue, remove boring residue and be roughened hole wall surface.
During removing glue, by HDI Rigid Flex parameter removing glue, after removing glue, product enters plate section to DMSE horizontal line.
Further, after the step of pre-whole hole and before the step of whole hole, also including washing, this washing is tap water
Wash.
Further, after the polymerization step, the residual using overflow water-washing method to remove product surface is also included
Medicinal liquid.
Further, also include drying and ejecting plate, after removing residual liquor, during drying, use cold-hot wind to dry plate face.
Further, also include electro-coppering, form metallization boring.
Embodiment
Refer to Fig. 1 to Fig. 4, embodiments of the invention are: the HDI soft or hard plate hole metallization processes of the present embodiment, the most right
The blind hole of Rigid Flex or through hole carry out hole process, and existing Rigid Flex is attached by rigid-flex land 7,
Wherein soft board part includes outer-layer circuit 1, bonding film 2, internal layer coverlay 3 and internal layer soft board 4, and wherein blind hole 5 and through hole 6 are opened
It is located at the one side of soft board.
This HDI soft or hard plate hole metallization processes includes holing in rigid-flex after laminating, also comprises the steps:
Removing glue, removes boring residue and is roughened hole wall surface；
Pre-whole hole, the surface making the hole wall of boring and rigid-flex is electronegative；
Wash from the beginning；
Whole hole, uses acid deoiling solution in the hole of boring and the greasy dirt on surface of rigid-flex is cleaned, prepares such as
Product shown in Fig. 2；
Wash from the beginning；
Kong Hua, the hole wall in boring forms Organic Conductive Films 8, prepares product as shown in Figure 3；
Washing, uses overflow water-washing method to remove the residual liquor of product surface；
Dry and ejecting plate, after removing residual liquor, during drying, use cold-hot wind to dry plate face；
Afterwards, carry out electro-coppering and process prepared product as shown in Figure 4.
In sum, the HDI soft or hard plate hole metallization processes that the present invention provides, the technique of the present invention, do not produce and human body is had wound
Evil has refuse, effectively improves in heavy process for copper because producing harmful formaldehyde liquid medicine, Er Qiejian in process of production
Change wastewater treatment process.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every utilize this
The equivalents that bright description and accompanying drawing content are made, or directly or indirectly it is used in relevant technical field, the most in like manner include
In the scope of patent protection of the present invention.
Claims (6)
1. a HDI soft or hard plate hole metallization processes, holes including in rigid-flex after laminating, it is characterised in that also include as follows
Step:
Pre-whole hole, the surface making the hole wall of boring and rigid-flex is electronegative；
Whole hole, uses acid deoiling solution in the hole of boring and the greasy dirt on surface of rigid-flex is cleaned；
Washing；
Kong Hua, the hole wall in boring forms one layer of Organic Conductive Films.
HDI soft or hard plate hole metallization processes the most according to claim 1, it is characterised in that before carrying out pre-whole hole step, also
Including removing glue, remove boring residue and be roughened hole wall surface.
HDI soft or hard plate hole metallization processes the most according to claim 1, it is characterised in that after the step of pre-whole hole and whole
Before the step of hole, also include washing.
4. according to the HDI soft or hard plate hole metallization processes described in any one of claim 1-3, it is characterised in that after the step of hole,
Also include the residual liquor using overflow water-washing method to remove product surface.
HDI soft or hard plate hole metallization processes the most according to claim 4, it is characterised in that also include drying and ejecting plate, removing
After residual liquor, cold-hot wind during drying, is used to dry plate face.
HDI soft or hard plate hole metallization processes the most according to claim 5, it is characterised in that also include electro-coppering, forms metallization
Boring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610703351.8A CN106231815A (en) | 2016-08-22 | 2016-08-22 | A kind of HDI soft or hard plate hole metallization processes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610703351.8A CN106231815A (en) | 2016-08-22 | 2016-08-22 | A kind of HDI soft or hard plate hole metallization processes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106231815A true CN106231815A (en) | 2016-12-14 |
Family
ID=57553425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610703351.8A Pending CN106231815A (en) | 2016-08-22 | 2016-08-22 | A kind of HDI soft or hard plate hole metallization processes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106231815A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107635361A (en) * | 2017-09-13 | 2018-01-26 | 东莞联桥电子有限公司 | A kind of electroplating processing method of Teflon pcb board |
| CN109056015A (en) * | 2018-10-19 | 2018-12-21 | 莆田市涵江区依吨多层电路有限公司 | The mechanical blind brill pattern plating jet apparatus of smart home printed circuit board and its method |
| CN112235946A (en) * | 2020-09-22 | 2021-01-15 | 珠海崇达电路技术有限公司 | Manufacturing method of ten-thousand-hole test circuit board |
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| JP2002252258A (en) * | 1999-12-27 | 2002-09-06 | Hoya Corp | Method for manufacturing contact component and multi- layer interconnection substrate, and wafer batch- contact board |
| CN102892252A (en) * | 2011-07-19 | 2013-01-23 | 联滔电子有限公司 | Method for manufacturing three-dimensional circuit |
| CN103167747A (en) * | 2013-03-01 | 2013-06-19 | 溧阳市新力机械铸造有限公司 | Manufacturing method of printed circuit board |
| CN104145537A (en) * | 2012-03-29 | 2014-11-12 | 德国艾托特克公司 | Method for manufacturing thin-line circuit |
| CN104284527A (en) * | 2013-07-01 | 2015-01-14 | 深圳市环基实业有限公司 | Printed circuit board and manufacturing method thereof |
| CN104582324A (en) * | 2015-01-07 | 2015-04-29 | 台山市精诚达电路有限公司 | Hole metallization method for flexible printed circuit board |
-
2016
- 2016-08-22 CN CN201610703351.8A patent/CN106231815A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002252258A (en) * | 1999-12-27 | 2002-09-06 | Hoya Corp | Method for manufacturing contact component and multi- layer interconnection substrate, and wafer batch- contact board |
| CN102892252A (en) * | 2011-07-19 | 2013-01-23 | 联滔电子有限公司 | Method for manufacturing three-dimensional circuit |
| CN104145537A (en) * | 2012-03-29 | 2014-11-12 | 德国艾托特克公司 | Method for manufacturing thin-line circuit |
| CN103167747A (en) * | 2013-03-01 | 2013-06-19 | 溧阳市新力机械铸造有限公司 | Manufacturing method of printed circuit board |
| CN104284527A (en) * | 2013-07-01 | 2015-01-14 | 深圳市环基实业有限公司 | Printed circuit board and manufacturing method thereof |
| CN104582324A (en) * | 2015-01-07 | 2015-04-29 | 台山市精诚达电路有限公司 | Hole metallization method for flexible printed circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107635361A (en) * | 2017-09-13 | 2018-01-26 | 东莞联桥电子有限公司 | A kind of electroplating processing method of Teflon pcb board |
| CN109056015A (en) * | 2018-10-19 | 2018-12-21 | 莆田市涵江区依吨多层电路有限公司 | The mechanical blind brill pattern plating jet apparatus of smart home printed circuit board and its method |
| CN112235946A (en) * | 2020-09-22 | 2021-01-15 | 珠海崇达电路技术有限公司 | Manufacturing method of ten-thousand-hole test circuit board |
| CN112235946B (en) * | 2020-09-22 | 2022-04-19 | 珠海崇达电路技术有限公司 | Manufacturing method of ten-thousand-hole test circuit board |
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20161214 |