CN102802364A - Method for arranging metal palladium layer in conducting layer of printed circuit board and layered structure thereof - Google Patents
Method for arranging metal palladium layer in conducting layer of printed circuit board and layered structure thereof Download PDFInfo
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- CN102802364A CN102802364A CN2012103329933A CN201210332993A CN102802364A CN 102802364 A CN102802364 A CN 102802364A CN 2012103329933 A CN2012103329933 A CN 2012103329933A CN 201210332993 A CN201210332993 A CN 201210332993A CN 102802364 A CN102802364 A CN 102802364A
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Abstract
The invention relates to a method for arranging a metal palladium layer in a conducting layer of a printed circuit board and a layered structure thereof. The method comprises the following steps of: firstly, coating copper on an insulating substrate, and baking the substrate; then, sequentially carrying out the processes of drilling, copper precipitation, line manufacturing and insulating layer solder resisting so as to obtain a half-finished product of a board body; and finally, sequentially carrying out the processes of nickel precipitation, palladium precipitation and gold precipitation to the line part of the half-finished product of the board body. In the process of plating soft gold on the printed circuit board, a metal palladium layer is arranged between a nickel layer and a gold layer, so that the thickness of the gold layer can be greatly reduced so as to achieve the effect of lowering the material cost.
Description
Technical field
The present invention relates to a kind of manufacture method and layer structure thereof of printed circuit board (PCB), be meant a kind of method and layer structure thereof that the Metal Palladium layer is set especially in the process of printed circuit board (PCB) being plated soft gold between nickel dam and gold layer.
Background technology
Printed circuit board; Claim printed circuit board (PCB) again; Be the generator that electronic devices and components are electrically connected, the major advantage that in practical implementation, adopts printed circuit board (PCB) is the mistake that can significantly reduce wiring and assembling, can improve automatization level and productive labor efficient.Printed circuit board is to be base material with the insulation board; Be cut into certain size; At least have a conductive pattern on it, and the porose position of cloth, such as component hole, fastener hole, plated-through hole etc.; It can be used for replacing installing the chassis of electronic devices and components in the past, and can realize interconnecting between the electronic devices and components.Printed circuit board is important electron parts very now, is the supporter of electronic devices and components.
Present printed circuit board mainly is made up of following part, circuit and figure face portion, and circuit is the instrument as conducting between the original paper, the big copper face of the other design of meeting is as ground connection and bus plane in design.The dielectric layer part, it is to be used for keeping the insulating properties between circuit and each layer, is commonly called as to be base material.The hole bit position, wherein via can make the above circuit conducting each other of two levels, and bigger via has non-conduction hole to be commonly used to as the surface mount location then as part plug-in unit usefulness in addition, and fixed screw is used during assembling.Therefore the anti-solder ink part is not that whole copper faces all will be eaten part on the tin in practical implementation, and the material (being generally epoxy resin) that the isolated copper face of one deck is eaten tin can be printed in non-zone of eating tin, avoids short circuit between the non-circuit of eating tin.Surface treatment because copper face in general environment, is easy to oxidation, causes going up tin (solderability is bad), therefore can on the copper face that will eat tin, protect.The mode of protection has spray tin, changes gold, changes silver, changes tin etc.
In order to improve the conductivity of printed circuit with special purpose; Generally can carry out nickel plating and gold-plated processing through the later stage that the mode of non-electrolysis or electrolytic gold plating is made moulding at printed circuit; Chemistry or electronickelling gold are provided with the last layer gold after exactly one deck nickel being set earlier on the printed circuit board surface conductor again; Nickel dam mainly is the diffusion that prevents between gold and the copper, because meeting phase counterdiffusion between gold and the copper, and nickel dam can stop the diffusion between it; If there is not the obstruct of nickel dam, gold will be diffused in the copper in several hours and go.Chemical nickel plating/soak gold also can stop the dissolving of copper in addition, and this will be of value to pb-free solder.And present electronickelling gold has two types: plate soft gold and the hard gold of plating, beat gold thread when soft gold is mainly used in Chip Packaging; Hard gold mainly is used in the electrical interconnects of non-weld.Under the normal condition, welding can cause electrogilding to become fragile, and this is reduction of service life, thereby will avoid on electrogilding, welding, and chemical nickel plating/soak gold because gold is very thin and consistent, the phenomenon that becomes fragile is rare.
But at present on the market of encapsulation printed substrate; As the position of soft gold solder contact, the thickness of gold layer generally requires minimum more than 0.5um, just can have good gold thread bonding effect; But metallic gold is that comparison is expensive as its material cost of a kind of precious metal; Adopt existing method and processing structure to be difficult to reduce the use amount of gold, thereby make the cost of printed circuit board (PCB) higher always, and this is the major defect for conventional art.
Summary of the invention
The present invention provides a kind of method and layer structure thereof that the Metal Palladium layer is set in the conductive layer of printed circuit board (PCB); Can in the process of printed circuit board (PCB) being plated soft gold, between nickel dam and gold layer, the Metal Palladium layer be set through its method and layer structure; Can reduce the thickness of gold layer greatly through the Metal Palladium layer that adds; Thereby reach the effect that reduces material cost, and this is a main purpose of the present invention.
The technical scheme that the present invention taked is: a kind of method that the Metal Palladium layer is set in the conductive layer of printed circuit board (PCB) comprises the steps:
The first step, insulated substrate is covered copper,, form copper-clad laminated board at the surface applied Copper Foil of this insulated substrate.
Second step, the copper-clad laminated board in the first step bake plate, copper-clad laminated board is placed on continues in the environment of 160 ℃ to 190 ℃ of temperature to bake plate 4 hours.
The 3rd step, in second step through the copper-clad laminated board behind the roasting plate, the processing of holing successively, heavy copper operation, make the operating process that circuit, insulating barrier resistance weld and obtain the semi-finished product plate body.
The 4th step, the circuit pack of semi-finished product plate body in the 3rd step sink nickel, heavy palladium, turmeric operation successively, in order to improve the conductivity of semi-finished product plate body circuit pack, sink nickel, heavy palladium, turmeric successively to operate, specifically production stage is:
Step 1, the semi-finished product plate body dropped in the cleaning slot clean, the effect of this step is to remove semi-finished product plate body copper face slight oxidation thing and dirt, and air that is adsorbed in copper face and dirt are arranged; Reduce surface tension of liquid, reach moistening effect, make the soup of subsequent treatment be able to smoothly and the copper face effect; Use RCOOH to clean; The concentration of RCOOH is 80 to 120ml/L, and cleaning temperature is 40 to 50 ℃, and the processing time was controlled at 3 to 6 minutes.
Step 2, the semi-finished product plate body is taken out from cleaning slot, carry out little rotten processing after cleaning with clear water, little rotten effect of handling is to remove the copper face oxide; Make the little alligatoring of copper face, make the electroless nickel layer in copper layer and the subsequent step that good adherence arranged, in carrying out little rotten process of handling, select for use the mixing material of sodium peroxydisulfate and CP sulfuric acid to carry out little corruption; The consumption of sodium peroxydisulfate is 80 to 120 g/L; The consumption of CP sulfuric acid is 15 to 25ml/L, and temperature is controlled at 20 to 30 ℃, and the processing time was controlled at 1 to 2 minute; The little erosion amount of copper face is controlled at 20 to 40 μ m, when little rotten liquid copper content reaches 15 g/l, need upgrade little sanies.
Step 3, the semi-finished product plate body is taken out from little sanies, carry out pickling processes after cleaning with clear water, carry out preimpregnation after the cleaning; Wherein, The effect of pickling is the copper face oxide of removing after little erosion, and the effect of preimpregnation is to keep the acidity in the activated bath in the following step, make copper face under oxide-free state, get into below activated bath in the step; The concentration of control CP sulfuric acid is 40 ml/L when carrying out pickling processes; Processing time was controlled at 1 to 1.5 minute, and the concentration of control hydrochloric acid is 30 ml/L when carrying out preimpregnation, and the preimpregnation time was controlled at 1 to 2 minute.
The semi-finished product plate body of step 4, process preimpregnation is directly inserted and is carried out activation act in the activated bath; Activation act is the pre-treatment before the semi-finished product plate body does not have electrolytic nickel; Catalytic activation is carried out on the copper surface, and it specifically comprises replaces palladium and copper, makes the complete copper surface that is adsorbed on of palladium active nucleus; Through activation act palladium catalysis nuclear optionally is adsorbed on the copper, lets no electrolytic nickel be plated in fully on the copper surface.
Step 5, to carry out the nickel plating operation through the semi-finished product plate body of activation processing, the nickel plating operation is that the semi-finished product plate body copper face after activation plates one deck nickel, as the layer that blocks that blocks migration between the Jin Yutong, diffusion,
After cleaning, step 6, the semi-finished product plate body that nickel plating is operated to process plate the palladium operation, plating palladium layer on the nickel dam of semi-finished product plate body, and the thickness of palladium layer is between 0.01 to 0.15 μ m.
Step 7, carry out gold-plated operation after the semi-finished product plate body through plating palladium operation cleaned, Gold plated Layer on the palladium layer of semi-finished product plate body, the thickness of gold layer is between 0.03 to 0.05 μ m.
Two sides at this insulated substrate in the first step apply Copper Foil, form copper-clad laminated board, and utilize acid solution to subtract the copper operation.
In the 3rd step, the concrete operations step is the processing of at first holing; After the boring processing, adopt chemical electroless plating copper mode to handle and on Copper Foil, form first coating, make both sides Copper Foil mutual conduction; To accomplish heavy copper operation, electrolytic copper plating is carried out on the surface of this first coating handle, on this first coating, form second coating; For second coating surface at copper-clad laminated board forms circuit, on this second coating, attach the dry film that contains emulsion, then; Make public and video picture through the optical treatment operation, be formed for forming the dry film peristome of circuit, the electrolytic copper plating processing is carried out at the position that needs is formed circuit; Form copper coating, remove this sensitization of this copper coating periphery through stripping process and use dry film, thereby accomplish the operation of making circuit; Obtain circuit, on this circuit, attach the dry film contain emulsion once more, attach dry film once more after; In order on this circuit that forms through the optical treatment operation, to form external circuit, be formed for forming the etching protective film of external circuit through exposure and video picture operation, etching protective film Copper Foil, first coating, second coating in addition that being used to of forming through the optical treatment operation is constituted external circuit carries out etching; After forming external circuit, remove external circuit peripheral Copper Foil, first coating, second coating through stripping process, in order to ensure mutually insulated between the etched circuit; Carry out the printing process that PSR operation or polyimides are insulating material, carry out forming insulating barrier between the circuit beyond the surface treatment region at needs.
In the step 4 in the 4th step, in the process of carrying out activation act, to utilize hydrochloric acid palladium and hydrochloric acid to process activating solution and carry out activation act, the activation concrete steps do; At first in treatment trough, put into about 60% and build the water of bath amount, then the concentration according to 20ml/l adds hydrochloric acid, and the concentration according to 100ml/l adds the hydrochloric acid palladium afterwards; Then add entry to fixed capacity, and fully stir, heating makes fluid temperature to 20 to 30 ℃; Handled 2 to 5 minutes, to accomplish activation process.
In the step 5 in the 4th step, use following composition when carrying out the nickel plating operation, nickelous sulfate is in order to provide nickel ion; Inferior sodium phosphate makes nickel ion be reduced to metallic nickel in order to electronics to be provided, and the misfit agent is in order to form the wrong ion of nickel; Reduce free nickel ion concentration, prevent that nickel hydroxide and phosphorous acid nickel from generating, increase and bathe stability, pH buffering; PH adjustment agent is in order to keep proper pH value, and stabilization agent reduces on colloidal particle or other particulate in order to prevent nickel, stablizes plating bath; Prevent that plating bath from decomposing, additive makes and opens the easy and increase reduction efficiency of plating in order to the negative potential on increase plated body surface.
The nickel plating step does, at first adds deionized water to cell body 2/3 position, then adds 18.75L/100L reducing agent, misfit agent, additive and evenly stirs, and the percentage by weight of reducing agent, misfit agent, additive is 1:1:1; Then add 6.25L/100L nickelous sulfate and evenly stirring; After add the 200ml/100L additive again and evenly stir; Long-pending , heats while stirring to 75 to 85 ℃ with deionized water adjustment tank liquor body; Open circulating filtration, the control time operated thereby accomplish nickel plating at 15 to 25 minutes, in the nickel plating step, controlled the pH value all the time and was controlled at 4.5 ± 0.2, and rising pH value is adjusted with 28% ammonia spirit, reduced the sulfuric acid solution adjustment of pH value with 10 %.
In the step 6 in the 4th step, the plating bath of liquid composition that plates the palladium operation is that the content of metal Pd is controlled at 0.8 to 1.2g/L with operating condition; Temperature is controlled at 50 to 54 ℃; Reductant concentration is controlled at 1.5 to 10g/L, and pH value is controlled at 7.3 to 7.9, and electroplating time was controlled at 3 to 10 minutes; It is 94 to 98% that metal Pd is separated out purity, and speed of separating out is 0.4 to 0.8 μ m/hr.
The concrete steps of plating palladium operation are that building the bath condition with 100L is example, at first in electroplating bath, adds pure water 40L; Then, 50L is plated palladium stoste join in the electroplating bath, add 2.5L palladium bulking liquor again; Confirm that pH value is 7.5 to 7.7, add 10% sulfuric acid in the time of extraneous and 30% potassium hydroxide is adjusted, at last; With pure water liquid measure is adjusted to 100L, the liquid temperature is adjusted to 50 to 54 ℃, slowly add reducing agent 300g while stir; Make it to dissolve fully, accomplished the plating palladium through 3 to 10 minutes and operate.
In the step 7 in the 4th step; The plating bath of liquid composition that carries out gold-plated operation with operating condition does; The content of metallic gold is controlled at 1.5 to 2.5g/L, and temperature is controlled at 80 to 95 ℃, and pH value is controlled at 4.7 to 5.3; Speed of separating out is 0.3 to 0.4 μ m/20 branch, and the time was controlled at 15 to 20 minutes.
The concrete steps of gold-plated operation are that building the bath condition with 100L is example, at first, the 60L pure water is added electroplating bath; Then add the 25L gold plating bath, 294 g potassium auricyanides (Au metal 2g/L) are added in the 5L temperature pure water, dissolve, then add in the electroplating bath; With pure water liquid measure is adjusted to 100L, confirm that pH value is whether in 4.7 to 5.3 scopes, if use 20% potassium hydroxide solution that goes beyond the scope is adjusted; After the pH adjustment, the liquid temperature rises when arriving 90 ℃, can operate.
A kind of Metal Palladium layer structure of printed circuit board (PCB) conductive layer; Comprise insulated substrate, circuit layer and conductive layer, this circuit layer is arranged on this insulated substrate, and this circuit layer forms the integrated circuit of printed circuit board (PCB); This conductive layer is arranged on this circuit layer; One side of this circuit layer is connected with this insulated substrate, and an other side of this circuit layer is connected with this conductive layer, through this conductive layer and this insulated substrate this circuit layer is wrapped up.
This conductive layer comprises metal nickel dam, Metal Palladium layer and metallic gold layer; Wherein, This metal nickel dam covers on this circuit layer, and this Metal Palladium layer covers on this metal nickel dam, and the metallic gold layer covers on this Metal Palladium layer; The thickness of this Metal Palladium layer is between 0.01 to 0.15 μ m, and the thickness of this metallic gold layer is between 0.03 to 0.05 μ m.
This circuit layer only is arranged on a side of this insulated substrate, and this circuit layer comprises copper foil layer and top circuit layer, and wherein, this copper foil layer is arranged on this insulated substrate, and this top circuit layer is arranged on this copper foil layer top.
This circuit layer is arranged on the upper surface and the lower surface of this insulated substrate simultaneously; This circuit layer comprises copper foil layer, heavy copper layer, coating and top circuit layer; Wherein, this copper foil layer is arranged on this insulated substrate, and this heavy copper layer is arranged on this copper foil layer; This coating is arranged on this heavy copper layer, and this top circuit layer is arranged on this coating top.
Beneficial effect of the present invention is: mainly towards the production management manufacturing process system of PCB industry, it can be transplanted to the production management manufacturing process system and the upgrading of its industry to technology of the present invention very easily.The present invention is controlled to be framework with unique production procedure; Advanced person's sheet material, printing ink, chemical medicinal liquid control technology knowledge combined apply to effectively be made up of three major parts in the whole PCB production and processing, be respectively: material is selected control system, work flow control system, working process parameter control system.Wherein, material selection control system mainly is to combine the effect of experiment to reach required supplied materials to material different according to its characteristics knot to control.The work flow control system is with each production stage optimization sorting, and the production procedure that only in this way reaches of formulating standard can be satisfied production requirement.Processing was not returned and deviation occurred in working process parameter control system side was each link from the variation standard of many factors to spendable scope.Can in the process of printed circuit board (PCB) being plated soft gold, between nickel dam and gold layer, the Metal Palladium layer be set through method of the present invention and layer structure, can reduce the thickness of gold layer greatly through the Metal Palladium layer that adds, thereby reach the effect that reduces material cost.
Description of drawings
Fig. 1 is the structural representation of copper-clad laminated board in the method for the present invention.
Fig. 2 is the structural representation of first coating and second coating in the method for the present invention.
Fig. 3 is the formation sketch map of circuit in the method for the present invention.
Fig. 4 is the formation sketch map of etching protective film in the method for the present invention.
Fig. 5 is the structural representation of external circuit in the method for the present invention.
Fig. 6 is the structural representation of conductive layer in the method for the present invention.
Fig. 7 only is arranged on the structural representation of insulated substrate one side for circuit layer in the layer structure of the present invention.
Fig. 8 is arranged on the structural representation of insulated substrate both sides for circuit layer in the layer structure of the present invention.
Fig. 9 is the structural representation of conductive layer in the layer structure of the present invention.
Embodiment
Shown in Fig. 1 to 6, a kind of method that the Metal Palladium layer is set in the conductive layer of printed circuit board (PCB) is characterized in that, comprises the steps:
The first step, insulated substrate 10 is covered copper, apply Copper Foil 11, form copper-clad laminated board 12 in a side or the two sides of this insulated substrate 10.
Can be to cover copper or copper is covered in both sides specifically according to production needs decisions in a side of this insulated substrate 10.
If two-sided plating simultaneously when adopting the mode of electroplating to cover copper in the present invention owing to plating; Requiring the layer copper-plated while of thickening; Also can be at other one deck by thickening copper facing, if copper facing is too thick, the circuit that will influence is subsequently made; So be necessary, so in practical implementation, can utilize acid solution to subtract the copper operation with the copper plate attenuate.
Second the step, the copper-clad laminated board in the first step 12 is baked plate.
Copper-clad laminated board 12 is placed on continues roasting plate 4 hours in the environment of 160 ℃ to 190 ℃ of temperature.
Can the stress between Copper Foil 11 and the insulated substrate 10 be reduced through roasting plate, when following process, can not cause the distortion and the warpage of sheet material.
The 3rd step, in second step through the copper-clad laminated board 12 behind the roasting plate, the processing of holing successively, heavy copper operation, make the operating process that circuit, insulating barrier resistance weld and obtain semi-finished product plate body 30.
Specific operation process in the 3rd step can utilize multiple existing embodiment to implement, and no longer tired here stating only described a kind of preferable preferred implementation of the present invention as follows.
The processing of at first holing.
In practical implementation, can adopt the processing of holing of the mode of laser or machine drilling, after the boring processing, adopt chemical electroless plating copper mode to handle and on Copper Foil 11, form first coating 21, make both sides Copper Foil 11 mutual conduction, to accomplish heavy copper operation.
Electrolytic copper plating is carried out on the surface of this first coating 21 handle, on this first coating 21, form second coating 22.
For second coating, 22 circuit forming surfaces, on this second coating 22, attach the dry film 23 that contains emulsion at copper-clad laminated board 12.
Then, make public and video picture, be formed for forming the dry film peristome 24 of circuit through the optical treatment operation.
The electrolytic copper plating processing is carried out at the position 24 that needs is formed circuit, forms copper coating 25.
This sensitization of removing this copper coating 25 peripheries through the stripping process of prior art is with dry film 23, thereby accomplishes the operation of making circuit, obtains circuit 26.
On this circuit 26, attach the dry film 27 that contains emulsion once more.
After attaching dry film 27 once more, in order on this circuit 26 that forms through the optical treatment operation, to form external circuit, warp exposure and video picture operation are formed for forming the etching protective film 28 of external circuit.
Being used to of forming through the optical treatment operation constituted Copper Foil 11 beyond the etching protective film 28 of external circuit, first coating 21, second coating 22 and carry out etching; After forming external circuit 29, remove Copper Foil 11, first coating 21, second coating 22 of external circuit 29 peripheries through traditional stripping process.
In order to ensure mutually insulated between the etched circuit, carry out the printing process that PSR operation or polyimides are insulating material, carry out forming between the circuit beyond the surface treatment region insulating barrier 41 at needs.
The 4th step, circuit 26 and external circuit 29 positions of the semi-finished product plate body 30 in the 3rd step sink nickel, heavy palladium, turmeric operation successively, formation conductive layer 42.
In order to improve the conductivity of circuit 26 and external circuit 29, sink nickel, heavy palladium, turmeric operation successively, concrete production stage is:
Step 1, semi-finished product plate body 30 dropped in the cleaning slots clean; The effect of this step is to remove semi-finished product plate body 30 copper face slight oxidation thing and dirts, and air that is adsorbed in copper face and dirt are arranged, and reduces surface tension of liquid; Reach moistening effect; Make the soup of subsequent treatment be able to smoothly and the copper face effect, its chemical principle is following
The concentration of RCOOH is 80 to 120ml/L, and cleaning temperature is 40 to 50 ℃, and the processing time was controlled at 3 to 6 minutes.
The material of cleaning slot is selected PVC or P.P. for use in practical implementation, and heater is selected quartz or Teflon heater for use, when cleaning buried copper content reaches 500 ~ 1000ppm, need upgrade cleaning fluid.
Step 2, semi-finished product plate body 30 is taken out from cleaning slot, carry out little rotten processing after cleaning with clear water.
Little rotten effect of handling is to remove the copper face oxide, makes the little alligatoring of copper face, makes the electroless nickel layer in copper layer and the subsequent step that good adherence arranged.
In carrying out little rotten process of handling, select for use the mixing material of sodium peroxydisulfate and CP sulfuric acid to carry out little corruption, its chemical principle is following,
The consumption of sodium peroxydisulfate is 80 to 120 g/L; The consumption of CP sulfuric acid is 15 to 25ml/L, and temperature is controlled at 20 to 30 ℃, and the processing time was controlled at 1 to 2 minute; The little erosion amount of copper face is controlled at 20 to 40 μ m, when little rotten liquid copper content reaches 15 g/l, need upgrade little sanies.
Step 3, semi-finished product plate body 30 is taken out from little sanies, carry out pickling processes after cleaning with clear water, carry out preimpregnation after the cleaning.
Wherein, the effect of pickling is the copper face oxide of removing after little erosion, and the effect of preimpregnation is to keep the acidity in the activated bath in the following step, make copper face under oxide-free state, get into below activated bath in the step.
The concentration of control CP sulfuric acid is 40 ml/L when carrying out pickling processes, and the processing time was controlled at 1 to 1.5 minute, and its chemical principle is CuO+H
2SO
4→ CuSO
4+ H
2O.
The concentration of control hydrochloric acid is 30 ml/L when carrying out preimpregnation, and the preimpregnation time was controlled at 1 to 2 minute, and its chemical principle is CuO+HCI → CuCl
2+ H
2O.
The semi-finished product plate body 30 of step 4, process preimpregnation is directly inserted and is carried out activation act in the activated bath.
Activation act is the pre-treatment before semi-finished product plate body 30 does not have electrolytic nickel, and catalytic activation is carried out on the copper surface, and it specifically comprises replaces palladium and copper, makes the complete copper surface that is adsorbed on of palladium active nucleus.
Through activation act palladium catalysis nuclear optionally is adsorbed on the copper, lets no electrolytic nickel be plated in fully on the copper surface, and make separating out unusually on the resin reduce to minimum.
Can make copper layer and nickel dam in the subsequent step reach perfect adherence through activation act.
In the process of carrying out activation act, utilize hydrochloric acid palladium and hydrochloric acid to process activating solution and carry out activation act.
Its operation principle does, at copper face displacement (ionization trend Cu>Pd) last layer palladium, with the catalyst as the chemical nickel reaction, the catalytic active center of Pd has the performance of easy sorption hydrogen, and then can bring out the chemical nickel reaction, and its reaction principle does,
Anode reaction Cu → Cu
2++ 2 e-(E
0=-0.337V)
Cathode reaction Pd
2++ 2 e-→ Pd (E
0=0.987V)
Full response Cu+Pd
2+→ Cu
2++ Pd (E
0=0.65V)
The activation concrete steps do; At first in clean treatment trough, put into about 60% water of building the bath amount; Then the concentration according to 20ml/l adds hydrochloric acid; Concentration according to 100ml/l adds the hydrochloric acid palladium afterwards; Then add entry to fixed capacity, and fully stir, heating makes fluid temperature to 20 to 30 ℃; Handled 2 to 5 minutes, to accomplish activation process.
Can add interfacial agent to promote reaction speed, reaction effect in order to promote activation effect.
The semi-finished product plate body 30 of process activation processing gets into following step with the lifting product quality after can passing through washing and pickling again.
Step 5, to carry out the nickel plating operation through the semi-finished product plate body 30 of activation processing.
Nickel plating operation is that semi-finished product plate body 30 copper faces after activation plate layer of Ni/P alloy, as the layer that blocks that blocks migration between the Jin Yutong, diffusion.
Use following composition when carrying out the nickel plating operation, nickelous sulfate is in order to provide nickel ion, and inferior sodium phosphate is in order to provide electronics; Make nickel ion be reduced to metallic nickel, the misfit agent reduces free nickel ion concentration in order to form the wrong ion of nickel; Prevent that nickel hydroxide and phosphorous acid nickel from generating, increase and bathe stability, pH buffering that pH adjustment agent is in order to keep proper pH value; Stabilization agent reduces on colloidal particle or other particulate in order to prevent nickel, stablizes plating bath, prevents that plating bath from decomposing; Additive increases reduction efficiency in order to increase the negative potential on plated body surface, to make to open to plate to reach easily.
Its chemical principle does,
Dehydrogenation H
2PO
2 -→ HPO
2 -+ H
(on catalytic surface generation)
Oxidation HPO
2 -+ OH
-→ H
2PO
3 -+ e
-
Combine H+H → H again
2
Oxidation H+OH
-→ H
2O+e
-
Metal is separated out Ni
2 ++ 2e
-→ Ni
Hydrogen produces 2H
2O+2e
-→ H
2+ 2OH
-
Phosphorus eutectoid mNi
2 ++ H
2PO
2 -+ (2m+1) e
-→ NimP+2OH-
Reaction enclosure H
2O+H
2PO
2 -→ H
2+ H
2PO
3 -(hypophosphorous acid the oneself decompose)
The nickel plating step does, at first adds deionized water to cell body 2/3 position, then adds 18.75L/100L reducing agent, misfit agent, additive and evenly stirs, and the percentage by weight of reducing agent, misfit agent, additive is 1:1:1; Then add 6.25L/100L nickelous sulfate and evenly stirring; After add the 200ml/100L additive again and evenly stir; Long-pending , heats while stirring to 75 to 85 ℃ with deionized water adjustment tank liquor body; Open circulating filtration, the control time operated thereby accomplish nickel plating at 15 to 25 minutes.
In the nickel plating step, control the pH value all the time and be controlled at 4.5 ± 0.2, rising pH value reduces the sulfuric acid solution adjustment of pH value with 10 % with the adjustment of ammoniacal liquor (28%) solution.
Above-mentioned reducing agent is an inferior sodium phosphate, the misfit agent, and stabilization agent, additive can be selected existing on the market product.
After cleaning, step 6, the semi-finished product plate body 30 that nickel plating is operated to process plate the palladium operation, plating palladium layer on the nickel dam of semi-finished product plate body 30, and the thickness of palladium layer is between 0.01 to 0.15 μ m.
The plating bath of liquid composition that plates the palladium operation with operating condition does.
The content of metal Pd is controlled at 0.8 to 1.2g/L; Temperature is controlled at 50 to 54 ℃; Reductant concentration is controlled at 1.5 to 10g/L, and pH value is controlled at 7.3 to 7.9, and electroplating time was controlled at 3 to 10 minutes; It is 94 to 98% that metal Pd is separated out purity, and speed of separating out is 0.4 to 0.8 μ m/hr.
The concrete steps of plating palladium operation are that building the bath condition with 100L is example.
At first in electroplating bath, add pure water 40L, then, 50L is plated palladium stoste join in the electroplating bath; Add 2.5L palladium bulking liquor again, confirm that the pH value is 7.5 to 7.7, add 10% sulfuric acid in the time of extraneous and 30% potassium hydroxide is adjusted; At last, liquid measure is adjusted to 100L, the liquid temperature is adjusted to 50 to 54 ℃ with pure water; Slowly add reducing agent 300g while stirring, make it to dissolve fully, accomplished the plating palladium through 3 to 10 minutes and operate.
Step 7, carry out gold-plated operation after the semi-finished product plate body 30 through plating palladium operation cleaned, Gold plated Layer on the palladium layer of semi-finished product plate body 30, the thickness of gold layer is between 0.03 to 0.05 μ m.
The plating bath of liquid composition that carries out gold-plated operation with operating condition does.
The content of metallic gold is controlled at 1.5 to 2.5g/L, and temperature is controlled at 80 to 95 ℃, and pH value is controlled at 4.7 to 5.3, and speed of separating out is 0.3 to 0.4 μ m/20 branch, and the time was controlled at 15 to 20 minutes,
Plating
GoldThe concrete steps of operation are that building the bath condition with 100L is example.
At first, the 60L pure water is added electroplating bath, then add the 25L gold plating bath; 294 g potassium auricyanides (Au metal 2g/L) are added in the 5L temperature pure water, dissolve, then add in the electroplating bath; With pure water liquid measure is adjusted to 100L, confirm that pH value is whether in 4.7 to 5.3 scopes, if use 20% potassium hydroxide solution that goes beyond the scope is adjusted; After the pH adjustment, the liquid temperature rises when arriving 90 ℃, can operate.
As shown in Figs. 7-9, a kind of Metal Palladium layer structure of printed circuit board (PCB) conductive layer, it comprises insulated substrate 100, circuit layer 200 and conductive layer 300.
This circuit layer 200 is arranged on this insulated substrate 100, and this circuit layer 200 forms the integrated circuit of printed circuit board (PCB).
Can be as required in practical implementation, on the upper surface of this insulated substrate 100 or lower surface one side, this circuit layer 200 is set, also can be simultaneously on the upper surface of this insulated substrate 100 and lower surface one side, this circuit layer 200 be set.
This conductive layer 300 is arranged on this circuit layer 200.
One side of this circuit layer 200 is connected with this insulated substrate 100, and an other side of this circuit layer 200 is connected with this conductive layer 300.
Wrap up through this conductive layer 300 and 100 pairs of these circuit layers 200 of this insulated substrate.
Comprise metal nickel dam 301, Metal Palladium layer 302 and metallic gold layer 303 through this conductive layer 300,
Wherein, this metal nickel dam 301 covers on this circuit layer 200, and this Metal Palladium layer 302 covers on this metal nickel dam 301, and metallic gold layer 303 covers on this Metal Palladium layer 302.
That is to say that these Metal Palladium layer 302 isolation are arranged between this metal nickel dam 301 and this metallic gold layer 303.
In practical implementation, the thickness of this Metal Palladium layer 302 is between 0.01 to 0.15 μ m, and the thickness of this metallic gold layer 303 is between 0.03 to 0.05 μ m.
In practical implementation; 200 of this circuit layers are arranged on a side of this insulated substrate 100, and this circuit layer 200 comprises copper foil layer 201 and top circuit layer 202, wherein; This copper foil layer 201 is arranged on this insulated substrate 100, and this top circuit layer 202 is arranged on this copper foil layer 201 tops.
This circuit layer 200 is arranged on the upper surface and the lower surface of this insulated substrate 100 simultaneously; This circuit layer 200 comprises copper foil layer 201, heavy copper layer 203, coating 204 and top circuit layer 202; Wherein, this copper foil layer 201 is arranged on this insulated substrate 100, and this heavy copper layer 203 is arranged on this copper foil layer 201; This coating 204 is arranged on this heavy copper layer 203, and this top circuit layer 202 is arranged on this coating 204 tops.
Claims (10)
1. the method that the Metal Palladium layer is set in the conductive layer of printed circuit board (PCB) is characterized in that, comprises the steps:
The first step, insulated substrate is covered copper,, forms copper-clad laminated board at the surface applied Copper Foil of this insulated substrate,
Second step, the copper-clad laminated board in the first step bake plate, copper-clad laminated board is placed on continues in the environment of 160 ℃ to 190 ℃ of temperature to bake plate 4 hours,
The 3rd step, in second step through the copper-clad laminated board behind the roasting plate, the processing of holing successively, heavy copper operation, make the operating process that circuit, insulating barrier resistance weld and obtain the semi-finished product plate body,
The 4th step, the circuit pack of semi-finished product plate body in the 3rd step sink nickel, heavy palladium, turmeric operation successively, in order to improve the conductivity of semi-finished product plate body circuit pack, sink nickel, heavy palladium, turmeric successively to operate, specifically production stage is:
Step 1, the semi-finished product plate body dropped in the cleaning slot clean, the effect of this step is to remove semi-finished product plate body copper face slight oxidation thing and dirt, and air that is adsorbed in copper face and dirt are arranged; Reduce surface tension of liquid, reach moistening effect, make the soup of subsequent treatment be able to smoothly and the copper face effect; Use RCOOH to clean, the concentration of RCOOH is 80 to 120ml/L, and cleaning temperature is 40 to 50 ℃; Processing time was controlled at 3 to 6 minutes
Step 2, the semi-finished product plate body is taken out from cleaning slot, carry out little rotten processing after cleaning with clear water, little rotten effect of handling is to remove the copper face oxide; Make the little alligatoring of copper face, make the electroless nickel layer in copper layer and the subsequent step that good adherence arranged, in carrying out little rotten process of handling, select for use the mixing material of sodium peroxydisulfate and CP sulfuric acid to carry out little corruption; The consumption of sodium peroxydisulfate is 80 to 120 g/L, and the consumption of CP sulfuric acid is 15 to 25ml/L, and temperature is controlled at 20 to 30 ℃; Processing time was controlled at 1 to 2 minute; The little erosion amount of copper face is controlled at 20 to 40 μ m, when little rotten liquid copper content reaches 15 g/l, need upgrade little sanies
Step 3, the semi-finished product plate body is taken out from little sanies, carry out pickling processes after cleaning with clear water, carry out preimpregnation after the cleaning; Wherein, the effect of pickling is the copper face oxide after the little erosion of removal, and the effect of preimpregnation is to keep the acidity in the activated bath in the following step; Make copper face under oxide-free state, get into below activated bath in the step; The concentration of control CP sulfuric acid is 40 ml/L when carrying out pickling processes, and the processing time was controlled at 1 to 1.5 minute, and the concentration of control hydrochloric acid is 30 ml/L when carrying out preimpregnation; The preimpregnation time was controlled at 1 to 2 minute
The semi-finished product plate body of step 4, process preimpregnation is directly inserted and is carried out activation act in the activated bath; Activation act is the pre-treatment before the semi-finished product plate body does not have electrolytic nickel, and catalytic activation is carried out on the copper surface, and it specifically comprises replaces palladium and copper; Make the complete copper surface that is adsorbed on of palladium active nucleus; Through activation act palladium catalysis nuclear optionally is adsorbed on the copper, lets no electrolytic nickel be plated in fully on the copper surface
Step 5, to carry out the nickel plating operation through the semi-finished product plate body of activation processing, the nickel plating operation is that the semi-finished product plate body copper face after activation plates one deck nickel, as the layer that blocks that blocks migration between the Jin Yutong, diffusion,
Step 6, plate the palladium operation after the semi-finished product plate body through nickel plating operation cleaned, plating palladium layer on the nickel dam of semi-finished product plate body, the thickness of palladium layer between 0.01 to 0.15 μ m,
Step 7, carry out gold-plated operation after the semi-finished product plate body through plating palladium operation cleaned, Gold plated Layer on the palladium layer of semi-finished product plate body, the thickness of gold layer is between 0.03 to 0.05 μ m.
2. a kind of method that the Metal Palladium layer is set in the conductive layer of printed circuit board (PCB) as claimed in claim 1 is characterized in that: the two sides at this insulated substrate in the first step apply Copper Foil, form copper-clad laminated board, and utilize acid solution to subtract the copper operation.
3. a kind of method that the Metal Palladium layer is set in the conductive layer of printed circuit board (PCB) as claimed in claim 2 is characterized in that: in the 3rd step, the concrete operations step does; The processing of at first holing after the boring processing, is adopted chemical electroless plating copper mode to handle and on Copper Foil, is formed first coating; Make both sides Copper Foil mutual conduction,, electrolytic copper plating is carried out on the surface of this first coating handle to accomplish heavy copper operation; On this first coating, form second coating,, on this second coating, attach the dry film that contains emulsion for second coating surface at copper-clad laminated board forms circuit; Then, make public and video picture, be formed for forming the dry film peristome of circuit through the optical treatment operation; The electrolytic copper plating processing is carried out at the position that needs is formed circuit, forms copper coating, removes this sensitization of this copper coating periphery through stripping process and uses dry film; Thereby accomplish the operation of making circuit, obtain circuit, on this circuit, attach the dry film that contains emulsion once more; After attaching dry film once more, in order on this circuit that forms through the optical treatment operation, to form external circuit, warp exposure and video picture operation are formed for forming the etching protective film of external circuit; The Copper Foil, first coating, second coating that being used to of forming through the optical treatment operation are constituted beyond the etching protective film of external circuit carry out etching; After forming external circuit, remove external circuit peripheral Copper Foil, first coating, second coating through stripping process, in order to ensure mutually insulated between the etched circuit; Carry out the printing process that PSR operation or polyimides are insulating material, carry out forming insulating barrier between the circuit beyond the surface treatment region at needs.
4. a kind of method that the Metal Palladium layer is set in the conductive layer of printed circuit board (PCB) as claimed in claim 1 is characterized in that: in the step 4 in the 4th step, in the process of carrying out activation act, utilize hydrochloric acid palladium and hydrochloric acid to process activating solution and carry out activation act; The activation concrete steps do, at first in treatment trough, put into about 60% and build the water of bath amount, and then the concentration according to 20ml/l adds hydrochloric acid; Concentration according to 100ml/l adds the hydrochloric acid palladium afterwards; Then add entry to fixed capacity, and fully stir, heating makes fluid temperature to 20 to 30 ℃; Handled 2 to 5 minutes, to accomplish activation process.
5. a kind of method that the Metal Palladium layer is set in the conductive layer of printed circuit board (PCB) as claimed in claim 1 is characterized in that: in the step 5 in the 4th step, use following composition when carrying out the nickel plating operation; Nickelous sulfate is in order to provide nickel ion, and inferior sodium phosphate makes nickel ion be reduced to metallic nickel in order to electronics to be provided; The misfit agent reduces free nickel ion concentration in order to form the wrong ion of nickel, prevents that nickel hydroxide and phosphorous acid nickel from generating; Increase and bathe stability, pH buffering, pH adjustment agent is in order to keep proper pH value, and stabilization agent reduces on colloidal particle or other particulate in order to prevent nickel; Stablize plating bath, prevent that plating bath from decomposing, additive is in order to increase the negative potential on plated body surface; Make and open the easy and increase reduction efficiency of plating
The nickel plating step does, at first adds deionized water to cell body 2/3 position, then adds 18.75L/100L reducing agent, misfit agent, additive and evenly stirs, and the percentage by weight of reducing agent, misfit agent, additive is 1:1:1; Then add 6.25L/100L nickelous sulfate and evenly stirring; After add the 200ml/100L additive again and evenly stir; Long-pending , heats while stirring to 75 to 85 ℃ with deionized water adjustment tank liquor body; Open circulating filtration, the control time operated thereby accomplish nickel plating at 15 to 25 minutes, in the nickel plating step, controlled the pH value all the time and was controlled at 4.5 ± 0.2, and rising pH value is adjusted with 28% ammonia spirit, reduced the sulfuric acid solution adjustment of pH value with 10 %.
6. a kind of method that the Metal Palladium layer is set in the conductive layer of printed circuit board (PCB) as claimed in claim 1 is characterized in that: in the step 6 in the 4th step, the plating bath of liquid composition that plates the palladium operation with operating condition does; The content of metal Pd is controlled at 0.8 to 1.2g/L; Temperature is controlled at 50 to 54 ℃, and reductant concentration is controlled at 1.5 to 10g/L, and pH value is controlled at 7.3 to 7.9; Electroplating time was controlled at 3 to 10 minutes; It is 94 to 98% that metal Pd is separated out purity, and speed of separating out is 0.4 to 0.8 μ m/hr
The concrete steps of plating palladium operation are that building the bath condition with 100L is example, at first in electroplating bath, adds pure water 40L; Then, 50L is plated palladium stoste join in the electroplating bath, add 2.5L palladium bulking liquor again; Confirm that pH value is 7.5 to 7.7, add 10% sulfuric acid in the time of extraneous and 30% potassium hydroxide is adjusted, at last; With pure water liquid measure is adjusted to 100L, the liquid temperature is adjusted to 50 to 54 ℃, slowly add reducing agent 300g while stir; Make it to dissolve fully, accomplished the plating palladium through 3 to 10 minutes and operate.
7. a kind of method that the Metal Palladium layer is set in the conductive layer of printed circuit board (PCB) as claimed in claim 1 is characterized in that: in the step 7 in the 4th step, the plating bath of liquid composition that carries out gold-plated operation with operating condition does; The content of metallic gold is controlled at 1.5 to 2.5g/L; Temperature is controlled at 80 to 95 ℃, and pH value is controlled at 4.7 to 5.3, and speed of separating out is 0.3 to 0.4 μ m/20 branch; Time was controlled at 15 to 20 minutes
The concrete steps of gold-plated operation are that building the bath condition with 100L is example, at first, the 60L pure water is added electroplating bath; Then add the 25L gold plating bath, 294 g potassium auricyanides (Au metal 2g/L) are added in the 5L temperature pure water, dissolve, then add in the electroplating bath; With pure water liquid measure is adjusted to 100L, confirm that pH value is whether in 4.7 to 5.3 scopes, if use 20% potassium hydroxide solution that goes beyond the scope is adjusted; After the pH adjustment, the liquid temperature rises when arriving 90 ℃, can operate.
8. the Metal Palladium layer structure of a printed circuit board (PCB) conductive layer, it is characterized in that: comprise insulated substrate, circuit layer and conductive layer, this circuit layer is arranged on this insulated substrate; This circuit layer forms the integrated circuit of printed circuit board (PCB); This conductive layer is arranged on this circuit layer, and a side of this circuit layer is connected with this insulated substrate, and an other side of this circuit layer is connected with this conductive layer; Through this conductive layer and this insulated substrate this circuit layer is wrapped up
This conductive layer comprises metal nickel dam, Metal Palladium layer and metallic gold layer; Wherein, This metal nickel dam covers on this circuit layer, and this Metal Palladium layer covers on this metal nickel dam, and the metallic gold layer covers on this Metal Palladium layer; The thickness of this Metal Palladium layer is between 0.01 to 0.15 μ m, and the thickness of this metallic gold layer is between 0.03 to 0.05 μ m.
9. the Metal Palladium layer structure of a kind of printed circuit board (PCB) conductive layer as claimed in claim 8; It is characterized in that: this circuit layer only is arranged on a side of this insulated substrate; This circuit layer comprises copper foil layer and top circuit layer; Wherein, this copper foil layer is arranged on this insulated substrate, and this top circuit layer is arranged on this copper foil layer top.
10. the Metal Palladium layer structure of a kind of printed circuit board (PCB) conductive layer as claimed in claim 8; It is characterized in that: this circuit layer is arranged on the upper surface and the lower surface of this insulated substrate simultaneously, and this circuit layer comprises copper foil layer, heavy copper layer, coating and top circuit layer, wherein; This copper foil layer is arranged on this insulated substrate; Should be arranged on this copper foil layer by heavy copper layer, this coating is arranged on this heavy copper layer, and this top circuit layer is arranged on this coating top.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4699697A (en) * | 1984-05-24 | 1987-10-13 | Electroplating Engineers Of Japan, Limited | High-purity palladium-nickel alloy plating solution and process |
| US20050082672A1 (en) * | 2003-10-17 | 2005-04-21 | Phoenix Precision Technology Corporation | Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same |
| CN101151399A (en) * | 2005-04-01 | 2008-03-26 | 日矿金属株式会社 | Plated base material |
| CN101469420A (en) * | 2007-04-16 | 2009-07-01 | 上村工业株式会社 | Electroless gold-plating method and electronic component |
| CN202857129U (en) * | 2012-09-11 | 2013-04-03 | 岳长来 | Structure of metal palladium layer in conducting layer of printed circuit board |
-
2012
- 2012-09-11 CN CN201210332993.3A patent/CN102802364B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4699697A (en) * | 1984-05-24 | 1987-10-13 | Electroplating Engineers Of Japan, Limited | High-purity palladium-nickel alloy plating solution and process |
| US20050082672A1 (en) * | 2003-10-17 | 2005-04-21 | Phoenix Precision Technology Corporation | Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same |
| CN101151399A (en) * | 2005-04-01 | 2008-03-26 | 日矿金属株式会社 | Plated base material |
| CN101469420A (en) * | 2007-04-16 | 2009-07-01 | 上村工业株式会社 | Electroless gold-plating method and electronic component |
| CN202857129U (en) * | 2012-09-11 | 2013-04-03 | 岳长来 | Structure of metal palladium layer in conducting layer of printed circuit board |
Cited By (21)
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